JP2009203414A5 - - Google Patents

Claims (7)

A thermosetting resin composition containing 20 to 200 parts by weight of a polysulfide-modified epoxy resin with respect to 100 parts by weight of a soluble polyimide having a phenolic hydroxyl group. The thermosetting resin composition according to claim 1, wherein the polysulfide-modified epoxy resin is represented by the general formula (1).

(In the formula, R ¹ represents a divalent organic group containing a bisphenol skeleton. M is ¹ to 3 independently for each repeating unit, and n is 1 to 50.) The thermosetting resin composition according to claim 1 or 2, wherein the soluble polyimide has a phenolic hydroxyl group of 0.55 mol / kg to 1.5 mol / kg. A soluble polyimide is polymerized from a tetracarboxylic dianhydride represented by the general formula (2) and at least a diamine represented by the general formula (3), the general formula (4), and the general formula (5). The tetracarboxylic dianhydride represented by (2) is A mole, the diamine represented by the general formula (3) is B mole, the diamine represented by the general formula (4) is C mole, and the general formula (5) When the diamine represented by is D mol, A / (B + C + D) = 1 to 1.2, B / (B + C + D) = 0.2 to 0.7 is satisfied, and at least a part of the end of the soluble polyimide is aniline. The thermosetting resin composition according to any one of claims 1 to 3, which is sealed with a derivative.

(Y in the general formula (3) is —CO—, —SO ₂ —, —O—, —S—, —CH ₂ —, —NHCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ). 1 represents one selected from the group consisting of _2- , —COO—, and a single bond, a in the general formula (4) is an integer of 0 to 5, and Z may be the same or different when plural. , —CO—, —SO ₂ —, —O—, —S—, —CH ₂ —, —NHCO—, —C (CH ₃ ) ₂ —, —C (CF ₃ ) ₂ —, —COO— and simple 1 represents one selected from the group consisting of a bond, M is an independent substituent, and one selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, a fluorinated alkyl group, an alkoxy group, or hydrogen. In the case of plural, they may be the same or different, R ^{2 in the} general formula (5) is an alkyl group having 1 to 3 carbon atoms, Represents one of aryl groups having one benzene ring, and in the case of plural, they may be the same or different, b and d are integers of 1 to 6, and c is an integer of 1 to 10.) Furthermore, the thermosetting resin composition in any one of Claims 1-4 containing at least 1 of an inorganic powder or a coloring agent. Hardened | cured material obtained by hardening the thermosetting resin composition in any one of Claims 1-5. A circuit board on which a wiring protective film is formed of the cured product according to claim 6.