JP2019052315A5 - - Google Patents
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- JP2019052315A5 JP2019052315A5 JP2018213673A JP2018213673A JP2019052315A5 JP 2019052315 A5 JP2019052315 A5 JP 2019052315A5 JP 2018213673 A JP2018213673 A JP 2018213673A JP 2018213673 A JP2018213673 A JP 2018213673A JP 2019052315 A5 JP2019052315 A5 JP 2019052315A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- group
- compound
- ring
- alicyclic epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 150000001875 compounds Chemical class 0.000 claims 7
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 125000002723 alicyclic group Chemical group 0.000 claims 5
- 125000004185 ester group Chemical group 0.000 claims 5
- 150000001336 alkenes Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 125000004122 cyclic group Chemical group 0.000 claims 4
- 230000003287 optical Effects 0.000 claims 4
- 125000004432 carbon atoms Chemical group C* 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims 1
- 230000000977 initiatory Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
Description
以下、実施例により本発明をより具体的に説明するが、本発明はこれらの実施例により限定されるものではない。なお、実施例2及び3は参考例として記載するものである。
EXAMPLES Hereinafter, the present invention will be more specifically described by way of examples, but the present invention is not limited by these examples. In addition, Example 2 and 3 are described as a reference example.
Claims (10)
エステル基を有しない脂環エポキシ化合物(A)が、エポキシ化された環状オレフィン基を少なくとも2個有する化合物であり、
芳香環を有するカチオン重合性化合物(B)が下記式(b1)
で表される化合物であり、
エステル基を有しない脂環エポキシ化合物(A)及び芳香環を有するカチオン重合性化合物(B)の総量(100重量%)に対するエステル基を有しない脂環エポキシ化合物(A)の割合が、10〜40重量%であり、
硬化性組成物の総量(100重量%)に対するエステル基を有しない脂環エポキシ化合物(A)及び芳香環を有するカチオン重合性化合物(B)の総量の割合が、80重量%以上、100重量%未満であることを特徴とする硬化性組成物。 A curable composition comprising an alicyclic epoxy compound (A) having no ester group, a cationically polymerizable compound (B) having an aromatic ring, and a thermal cationic curing agent (C) ,
No an ester group alicyclic epoxy compound (A) is a compound having at least two epoxidized cyclic olefin groups,
The cationically polymerizable compound (B) having an aromatic ring is represented by the following formula (b1)
Is a compound represented by
The ratio of the alicyclic epoxy compound (A) having no ester group to the total amount (100% by weight) of the alicyclic epoxy compound (A) having no ester group and the cationically polymerizable compound (B) having an aromatic ring is 10 to 10 40% by weight,
The ratio of the total of the alicyclic epoxy compound (A) having no ester group and the cationically polymerizable compound (B) having an aromatic ring to the total amount (100% by weight) of the curable composition is 80% by weight or more and 100% by weight A curable composition characterized by being less than.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013029688 | 2013-02-19 | ||
JP2013029688 | 2013-02-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501397A Division JP6474719B2 (en) | 2013-02-19 | 2014-02-10 | Curable composition, cured product thereof, optical member, and optical apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019052315A JP2019052315A (en) | 2019-04-04 |
JP2019052315A5 true JP2019052315A5 (en) | 2019-06-27 |
JP6700369B2 JP6700369B2 (en) | 2020-05-27 |
Family
ID=51391138
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501397A Active JP6474719B2 (en) | 2013-02-19 | 2014-02-10 | Curable composition, cured product thereof, optical member, and optical apparatus |
JP2018213673A Active JP6700369B2 (en) | 2013-02-19 | 2018-11-14 | Curable composition, cured product thereof, optical member, and optical device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015501397A Active JP6474719B2 (en) | 2013-02-19 | 2014-02-10 | Curable composition, cured product thereof, optical member, and optical apparatus |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6474719B2 (en) |
KR (1) | KR101839196B1 (en) |
CN (1) | CN104981496B (en) |
TW (1) | TWI652302B (en) |
WO (1) | WO2014129343A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102131201B1 (en) * | 2013-02-19 | 2020-07-07 | 주식회사 다이셀 | Curable composition for wafer level lens, manufacturing method for wafer level lens, wafer level lens, and optical device |
JP6653990B2 (en) * | 2014-10-27 | 2020-02-26 | 三星エスディアイ株式会社SAMSUNG SDI Co., LTD. | Polarizing plate and image display device having the same |
WO2017033056A1 (en) | 2015-08-27 | 2017-03-02 | Toray Industries, Inc. | Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom |
JP6935260B2 (en) * | 2017-07-31 | 2021-09-15 | 東京応化工業株式会社 | Curable composition, cured film, display panel or OLED lighting, and method for producing cured product |
KR102293898B1 (en) | 2019-09-16 | 2021-08-26 | 주식회사 트리엘 | Novel Triazine Derivatives and Thermo-curable or Photosensitive Composition Comprising the Same |
CN110927201B (en) * | 2019-12-11 | 2020-10-16 | 北京理工大学 | DIC-based thermal expansion phase change measurement method |
JP2021167396A (en) * | 2020-04-10 | 2021-10-21 | 東京応化工業株式会社 | Method for producing laminate, method for producing micro-lens, method for producing cmos image sensor, and curable composition |
Family Cites Families (23)
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JPH0657103A (en) * | 1992-08-11 | 1994-03-01 | Yokohama Rubber Co Ltd:The | Photocurable resin composition |
JP2004163490A (en) * | 2002-11-11 | 2004-06-10 | Nippon Sheet Glass Co Ltd | Optical element and its manufacturing method |
JP2004163491A (en) * | 2002-11-11 | 2004-06-10 | Nippon Sheet Glass Co Ltd | Optical element and its manufacturing method |
JP2004204228A (en) * | 2002-12-13 | 2004-07-22 | Daicel Chem Ind Ltd | Curable epoxy resin composition and cured material |
JP3973611B2 (en) * | 2003-08-25 | 2007-09-12 | ダイセル化学工業株式会社 | Thermosetting epoxy resin composition and transparent material |
JP4723272B2 (en) * | 2004-04-02 | 2011-07-13 | 大阪瓦斯株式会社 | Photopolymerizable resin composition and cured product thereof |
JP5354868B2 (en) * | 2006-07-06 | 2013-11-27 | 株式会社ダイセル | Method for producing alicyclic diepoxy compound, method for producing epoxy resin composition, and method for producing cured product |
JP5078289B2 (en) * | 2006-06-23 | 2012-11-21 | 株式会社日本触媒 | Resin composition and method for producing the same |
JP5226223B2 (en) * | 2007-01-31 | 2013-07-03 | 株式会社ダイセル | Transparent encapsulant and transparent encapsulant |
JP5289713B2 (en) * | 2007-02-01 | 2013-09-11 | 株式会社ダイセル | Curable resin composition and cured product thereof |
JP5248790B2 (en) * | 2007-03-02 | 2013-07-31 | 株式会社ダイセル | Epoxy resin composition for fiber reinforced composite material and fiber reinforced composite material |
KR101031272B1 (en) * | 2007-05-24 | 2011-04-29 | 스미토모 베이클라이트 가부시키가이샤 | Transparent composite sheet |
JP2009084310A (en) * | 2007-09-27 | 2009-04-23 | Nippon Shokubai Co Ltd | Thermo- or photo-curable resin composition, optical material and optical member |
EP2185621A1 (en) * | 2007-09-27 | 2010-05-19 | Nippon Shokubai Co., Ltd. | Curable resin composition for molded bodies, molded body, and production method thereof |
JP2010128568A (en) * | 2008-11-25 | 2010-06-10 | Canon Inc | Print system |
JP5443772B2 (en) * | 2009-01-21 | 2014-03-19 | パナソニック株式会社 | Resin composition for composite optical element and composite optical element |
JP5229165B2 (en) | 2009-09-02 | 2013-07-03 | 住友ベークライト株式会社 | Epoxy resin composition, transparent composite sheet and display element substrate |
JP5486891B2 (en) * | 2009-10-08 | 2014-05-07 | 三菱レイヨン株式会社 | Chain curable resin composition and fiber reinforced composite material |
JP2011132416A (en) * | 2009-12-25 | 2011-07-07 | Nagase Chemtex Corp | Thermocurable resin composition and organic-inorganic composite resin |
WO2012020688A1 (en) * | 2010-08-12 | 2012-02-16 | ダイセル化学工業株式会社 | Low moisture permeability resin composition and hardened material thereof |
JP5665445B2 (en) * | 2010-09-13 | 2015-02-04 | キヤノン株式会社 | Organic-inorganic composite composition and optical element |
JP2012209453A (en) * | 2011-03-30 | 2012-10-25 | Sumitomo Bakelite Co Ltd | Liquid resin composition, semiconductor package, and manufacturing method of semiconductor package |
JP2013091710A (en) * | 2011-10-25 | 2013-05-16 | Sumitomo Bakelite Co Ltd | Transparent resin composite, transparent composite sheet, and transparent substrate for display element |
-
2014
- 2014-02-10 CN CN201480007982.5A patent/CN104981496B/en active Active
- 2014-02-10 KR KR1020157022701A patent/KR101839196B1/en active IP Right Grant
- 2014-02-10 JP JP2015501397A patent/JP6474719B2/en active Active
- 2014-02-10 WO PCT/JP2014/053014 patent/WO2014129343A1/en active Application Filing
- 2014-02-18 TW TW103105292A patent/TWI652302B/en active
-
2018
- 2018-11-14 JP JP2018213673A patent/JP6700369B2/en active Active
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