JP2019052315A5 - - Google Patents

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JP2019052315A5
JP2019052315A5 JP2018213673A JP2018213673A JP2019052315A5 JP 2019052315 A5 JP2019052315 A5 JP 2019052315A5 JP 2018213673 A JP2018213673 A JP 2018213673A JP 2018213673 A JP2018213673 A JP 2018213673A JP 2019052315 A5 JP2019052315 A5 JP 2019052315A5
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curable composition
group
compound
ring
alicyclic epoxy
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以下、実施例により本発明をより具体的に説明するが、本発明はこれらの実施例により限定されるものではない。なお、実施例２及び３は参考例として記載するものである。
EXAMPLES Hereinafter, the present invention will be more specifically described by way of examples, but the present invention is not limited by these examples. In addition, Example 2 and 3 are described as a reference example.

Claims (10)

エステル基を有しない脂環エポキシ化合物（Ａ）、芳香環を有するカチオン重合性化合物（Ｂ）、及び熱カチオン硬化剤（Ｃ）を含む硬化性組成物であって、
エステル基を有しない脂環エポキシ化合物（Ａ）が、エポキシ化された環状オレフィン基を少なくとも２個有する化合物であり、
芳香環を有するカチオン重合性化合物（Ｂ）が下記式（ｂ１）
Figure 2019052315
 （式中、Ｒ1〜Ｒ5、Ｒ7〜Ｒ11は、同一又は異なって、水素原子又は炭素数１〜６のアルキル基を示す。環Ｚ1、環Ｚ2は、同一又は異なって、芳香族炭素環を示す。Ｒ6、Ｒ12は、同一又は異なって、炭素数１〜１０のアルキレン基を示す。ｐ１、ｐ２は、同一又は異なって、０以上の整数である。フルオレン環、環Ｚ 1 、環Ｚ 2 は、置換基を有していてもよい）
で表される化合物であり、
エステル基を有しない脂環エポキシ化合物（Ａ）及び芳香環を有するカチオン重合性化合物（Ｂ）の総量（１００重量％）に対するエステル基を有しない脂環エポキシ化合物（Ａ）の割合が、１０〜４０重量％であり、
硬化性組成物の総量（１００重量％）に対するエステル基を有しない脂環エポキシ化合物（Ａ）及び芳香環を有するカチオン重合性化合物（Ｂ）の総量の割合が、８０重量％以上、１００重量％未満であることを特徴とする硬化性組成物。 A curable composition comprising an alicyclic epoxy compound (A) having no ester group, a cationically polymerizable compound (B) having an aromatic ring, and a thermal cationic curing agent (C) ,
No an ester group alicyclic epoxy compound (A) is a compound having at least two epoxidized cyclic olefin groups,
The cationically polymerizable compound (B) having an aromatic ring is represented by the following formula (b1)
Figure 2019052315
 (Wherein, R 1 to R 5 and R 7 to R 11 are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Ring Z 1 and ring Z 2 are the same or different, R 6 and R 12 are the same or different and each represents an alkylene group having 1 to 10 carbon atoms, p 1 and p 2 are the same or different and each represents an integer of 0 or more, and a fluorene ring, Ring Z 1 and ring Z 2 may have a substituent )
Is a compound represented by
The ratio of the alicyclic epoxy compound (A) having no ester group to the total amount (100% by weight) of the alicyclic epoxy compound (A) having no ester group and the cationically polymerizable compound (B) having an aromatic ring is 10 to 10 40% by weight,
The ratio of the total of the alicyclic epoxy compound (A) having no ester group and the cationically polymerizable compound (B) having an aromatic ring to the total amount (100% by weight) of the curable composition is 80% by weight or more and 100% by weight A curable composition characterized by being less than. エポキシ化された環状オレフィン基が、炭素数５〜１２の環状オレフィン基がエポキシ化された基である請求項１に記載の硬化性組成物。   The curable composition according to claim 1, wherein the epoxidized cyclic olefin group is a group in which a cyclic olefin group having 5 to 12 carbon atoms is epoxidized. エステル基を有しない脂環エポキシ化合物（Ａ）が、エポキシ化された環状オレフィン基の少なくとも２個が単結合又は２価の炭化水素基で結合された構造を有する化合物である請求項１又は２に記載の硬化性組成物。   The alicyclic epoxy compound (A) having no ester group is a compound having a structure in which at least two of epoxidized cyclic olefin groups are bonded by a single bond or a divalent hydrocarbon group. The curable composition as described in-. 硬化開始温度が６０〜１５０℃である請求項１〜３のいずれか１項に記載の硬化性組成物。   The curable composition according to any one of claims 1 to 3, which has a curing initiation temperature of 60 to 150 ° C. 硬化させて得られる硬化物のアッベ数が３５以下である請求項１〜４のいずれか１項に記載の硬化性組成物。   The curable composition according to any one of claims 1 to 4, wherein an Abbe number of a cured product obtained by curing is 35 or less. さらに、カチオン硬化性官能基を有する離型剤を含む請求項１〜５のいずれか１項に記載の硬化性組成物。   Furthermore, the curable composition of any one of Claims 1-5 containing the mold release agent which has a cationically curable functional group. 光学部材形成用組成物である請求項１〜６のいずれか１項に記載の硬化性組成物。   The curable composition according to any one of claims 1 to 6, which is a composition for forming an optical member. 請求項１〜７のいずれか１項に記載の硬化性組成物を硬化させて得られる硬化物。   The hardened | cured material obtained by hardening the curable composition of any one of Claims 1-7. 請求項７に記載の硬化性組成物を硬化させて得られる硬化物を有する光学部材。   An optical member having a cured product obtained by curing the curable composition according to claim 7. 請求項９に記載の光学部材を有する光学装置。   An optical apparatus comprising the optical member according to claim 9.
JP2018213673A 2013-02-19 2018-11-14 Curable composition, cured product thereof, optical member, and optical device Active JP6700369B2 (en)

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