JP2008248240A5 - - Google Patents

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JP2008248240A5
JP2008248240A5 JP2008056266A JP2008056266A JP2008248240A5 JP 2008248240 A5 JP2008248240 A5 JP 2008248240A5 JP 2008056266 A JP2008056266 A JP 2008056266A JP 2008056266 A JP2008056266 A JP 2008056266A JP 2008248240 A5 JP2008248240 A5 JP 2008248240A5
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general formula
polyurethane resin
resin composition
composition according
thermosetting polyurethane
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JP2008056266A
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JP2008248240A (en
JP5104411B2 (en
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Claims (13)

下記一般式（１）および／または下記一般式（２）で表される構造を有するポリウレタン樹脂（Ａ）と、エポキシ樹脂（Ｂ）と、フェノキシ樹脂（Ｃ）とを含有することを特徴とする熱硬化性ポリウレタン樹脂組成物。
Figure 2008248240
Figure 2008248240
 （式中、Ｘは１分子中に２個以上のフェノール性水酸基を有するフェノール系化合物から２個のフェノール性水酸基を除いた残基を示す。） It contains a polyurethane resin (A) having a structure represented by the following general formula (1) and / or the following general formula (2), an epoxy resin (B), and a phenoxy resin (C). Thermosetting polyurethane resin composition.
Figure 2008248240
Figure 2008248240
 (In the formula, X represents a residue obtained by removing two phenolic hydroxyl groups from a phenolic compound having two or more phenolic hydroxyl groups in one molecule.) 前記一般式（１）および／または一般式（２）中のＸが一般式（５）、一般式（７）および一般式（９）で示される構造の群から選ばれる一種以上の構造である請求項１記載の熱硬化性ポリウレタン樹脂組成物。
Figure 2008248240
 （式中Ｒ１は、直接結合あるいは２価の連結基であり、Ｒ２は同一でも異なっていても良く、水素原子または炭素原子数１〜１８のアルキル基を示す。）
Figure 2008248240
 （式中Ｒ３は、水素原子または炭素原子数１〜１８のアルキル基または下記一般式（８）で示される構造を示す。）
Figure 2008248240
Figure 2008248240
 X in the general formula (1) and / or the general formula (2) is one or more structures selected from the group of structures represented by the general formula (5), the general formula (7), and the general formula (9). The thermosetting polyurethane resin composition according to claim 1.
Figure 2008248240
 (In the formula, R 1 is a direct bond or a divalent linking group, and R 2 may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms.)
Figure 2008248240
 (In the formula, R 3 represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, or a structure represented by the following general formula (8).)
Figure 2008248240
Figure 2008248240
 前記一般式（１）および／または一般式（２）中のＸが一般式（６）で示される構造である請求項１記載の熱硬化性ポリウレタン樹脂組成物。
Figure 2008248240
 （式中Ｒ１は、直接結合あるいは２価の連結基であり、Ｒ２は同一でも異なっていても良く、水素原子または炭素原子数１〜１８のアルキル基を示す。ａとｂとｃとの合計は１以上である。） The thermosetting polyurethane resin composition according to claim 1, wherein X in the general formula (1) and / or the general formula (2) has a structure represented by the general formula (6).
Figure 2008248240
 (In the formula, R 1 is a direct bond or a divalent linking group, and R 2 may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms. A, b and c; The sum of is 1 or more.) 前記一般式（６）中のＲ１がメチレン基および／または下記一般式（１１）で示される構造である請求項３記載の熱硬化性ポリウレタン樹脂組成物。
Figure 2008248240
 The thermosetting polyurethane resin composition according to claim 3, wherein R 1 in the general formula (6) has a methylene group and / or a structure represented by the following general formula (11).
Figure 2008248240
 前記ポリウレタン樹脂（Ａ）が下記構造（１５）にて分岐している請求項１記載の熱硬化性ポリウレタン樹脂組成物。
Figure 2008248240
 （式中Ｒ５はジイソシアネート化合物からイソシアネート基を除いた残基構造を示す。） The thermosetting polyurethane resin composition according to claim 1, wherein the polyurethane resin (A) is branched by the following structure (15).
Figure 2008248240
 (In the formula, R5 represents a residue structure obtained by removing an isocyanate group from a diisocyanate compound.) 前記エポキシ樹脂（Ｂ）が芳香族系エポキシ樹脂である請求項１〜５のいずれか１項記載の熱硬化性ポリウレタン樹脂組成物。 The thermosetting polyurethane resin composition according to any one of claims 1 to 5 , wherein the epoxy resin (B) is an aromatic epoxy resin. 前記芳香族系エポキシ樹脂がノボラック型エポキシ樹脂である請求項６記載の熱硬化性ポリウレタン樹脂組成物。 The thermosetting polyurethane resin composition according to claim 6 , wherein the aromatic epoxy resin is a novolac type epoxy resin. 前記フェノキシ樹脂（Ｃ）がビスフェノールＳ骨格またはナフタレン骨格を含有するフェノキシ樹脂である請求項１〜５のいずれか１項記載の熱硬化性ポリウレタン樹脂組成物。 The phenoxy resin (C) is according to claim 1 any one thermosetting polyurethane resin composition according 5 is phenoxy resin containing a bisphenol S skeleton or naphthalene skeleton. 前記フェノキシ樹脂（Ｃ）がビスフェノールＳ骨格およびナフタレン骨格を含有するフェノキシ樹脂である請求項１〜５のいずれか１項記載の熱硬化性ポリウレタン樹脂組成物。 The thermosetting polyurethane resin composition according to any one of claims 1 to 5 , wherein the phenoxy resin (C) is a phenoxy resin containing a bisphenol S skeleton and a naphthalene skeleton. 前記フェノキシ樹脂（Ｃ）が更にビフェニル骨格を含有するフェノキシ樹脂である請求項８または９に記載の熱硬化性ポリウレタン樹脂組成物。 The thermosetting polyurethane resin composition according to claim 8 or 9 , wherein the phenoxy resin (C) is a phenoxy resin further containing a biphenyl skeleton. 前記フェノキシ樹脂（Ｃ）が重量平均分子量５，０００〜２００，０００のフェノキシ樹脂である請求項８〜１０のいずれか１項記載のポリウレタン樹脂組成物。 The polyurethane resin composition according to any one of claims 8 to 10 , wherein the phenoxy resin (C) is a phenoxy resin having a weight average molecular weight of 5,000 to 200,000. 硬化触媒を含有する請求項１〜５のいずれか１項記載の熱硬化性ポリウレタン樹脂組成物。 The thermosetting polyurethane resin composition according to any one of claims 1 to 5 , comprising a curing catalyst. 更に、ウレタン化触媒を含有する請求項１〜５のいずれか１項記載の熱硬化性ポリウレタン樹脂組成物。 Furthermore, the thermosetting polyurethane resin composition of any one of Claims 1-5 containing a urethanization catalyst.
JP2008056266A 2007-03-07 2008-03-06 Thermosetting polyurethane resin composition Active JP5104411B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008056266A JP5104411B2 (en) 2007-03-07 2008-03-06 Thermosetting polyurethane resin composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007057130 2007-03-07
JP2007057130 2007-03-07
JP2008056266A JP5104411B2 (en) 2007-03-07 2008-03-06 Thermosetting polyurethane resin composition

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JP2008248240A JP2008248240A (en) 2008-10-16
JP2008248240A5 true JP2008248240A5 (en) 2012-09-06
JP5104411B2 JP5104411B2 (en) 2012-12-19

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5233329B2 (en) * 2007-03-13 2013-07-10 Ｄｉｃ株式会社 Thermosetting polyimide resin composition
JP5130795B2 (en) * 2007-06-14 2013-01-30 Ｄｉｃ株式会社 Thermosetting polyimide resin composition
DE102010041247A1 (en) * 2010-09-23 2012-03-29 Evonik Degussa Gmbh Process for the preparation of storage-stable polyurethane prepregs and molded articles made therefrom of polyurethane composition in solution
JP6353670B2 (en) * 2013-05-08 2018-07-04 昭和電工パッケージング株式会社 Molding packaging material
JP6499860B2 (en) * 2014-12-25 2019-04-10 大日精化工業株式会社 adhesive
JP6578100B2 (en) * 2014-12-25 2019-09-18 日東シンコー株式会社 Insulating paper
JP7256022B2 (en) * 2019-02-05 2023-04-11 日東シンコー株式会社 Thermosetting adhesive and adhesive sheet
US20230250234A1 (en) * 2020-06-16 2023-08-10 Sumitomo Electric Industries, Ltd. Resin composition, self-fusing insulated electric wire and wire bundle

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JPS5494526A (en) * 1978-01-04 1979-07-26 Toyo Kohan Co Ltd Adhesive for polyolefin resin coated metal plate

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