JP2009199951A - Image display device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device that suppresses the occurrence and progression of corrosion of inspection wires without increasing cost significantly; and to provide a method of manufacturing the same. <P>SOLUTION: The image display device includes: an insulating substrate having a primary side; a plurality of signal lines and scanning lines formed on the primary side of the insulating substrate; a display section having thin-film transistors and pixel electrodes provided at intersection points of the signal lines and scanning lines; a seal member formed around at least the display section on the primary side of the insulating substrate; an counter substrate which is disposed opposite to the primary side of the insulating substrate via the seal member and whose area opposite to the primary side is smaller than the primary side area; and a plurality of inspection wires with one end side electrically connected with each of the signal lines and scanning lines at a region not opposite to the counter substrate on the primary side of the insulating substrate and the other end side provided with a portion covered with the seal member, which is formed up to the edge of the insulating substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an image display device used for a personal computer, a mobile phone, and the like, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, an image display device including an organic EL display or the like as a display unit is provided with an insulating substrate on which a light emitting element is formed between a plurality of scanning lines and signal lines, and an insulating substrate is covered with a sealing material. The substrate and the counter substrate are bonded to each other, and the mother substrate formed thereby is cut into individual display devices.

  As an inspection method for such an image display device, it is usually performed before an optical inspection at each step in the process, an electrical inspection at the stage where the insulating substrate is completed, or a mounting component such as a driver is attached. Lighting inspection etc. are performed.

  This is to prevent waste of materials and work by flowing defective parts to the subsequent process. If there is a defect, it is discarded at that time or repaired by means such as laser. (For example, refer to Patent Document 1 and Patent Document 2).

In electrical inspection and lighting inspection, an inspection wiring electrically connected to the scanning line and the signal line and an inspection electrode for supplying electricity to the inspection wiring are formed on an insulating substrate, and a voltage is applied from the inspection electrode during the inspection. Is applied to perform a predetermined inspection. And after completion | finish of test | inspection, part of the insulating board | substrate with which the test electrode unnecessary for a product was formed is cut off, and an image display apparatus is produced (for example, refer patent document 3).
JP-A-11-212102 JP 2003-5205 A JP-A-1-130132

  In the above-described separation step, when a part of the insulating substrate is cut, the end face of the inspection wiring is exposed. On the cut end face, there is a problem that burrs are likely to occur at the time of cutting, and corrosion of the inspection wiring proceeds from the portion, and the life of the image display device is shortened.

  Such corrosion of the inspection wiring is more likely to proceed as the exposed area of the inspection wiring becomes larger. In order to prevent this, a method of covering the entire inspection wiring with a resin or the like can be considered. However, such a method increases the cost because a material cost for covering the inspection wiring is separately required. In addition, the manufacturing process becomes complicated and productivity is reduced.

  Therefore, in view of the above problems, the present invention provides an image display device and a method for manufacturing the same that suppress the occurrence and progression of corrosion of inspection wiring without greatly increasing the cost.

  An image display device according to the present invention includes an insulating substrate having a first surface, a plurality of signal lines and scanning lines formed on the first surface of the insulating substrate, and intersections of the signal lines and the scanning lines. A display unit having a thin film transistor and a pixel electrode, a sealing material formed on at least the periphery of the display unit on the first surface of the insulating substrate, and a second insulating layer formed on the insulating substrate through the sealing material. A counter substrate disposed opposite to the first surface and having an area of the surface facing the first surface smaller than an area of the first surface; and one end side of the counter substrate on the first surface of the insulating substrate; A plurality of inspection wirings that are electrically connected to the signal lines and the scanning lines in the non-facing region, and that have the other end side covered with the sealing material and the end of the insulating substrate. And having It is characterized by.

  In the above invention, it is preferable that the inspection wiring bends from a non-opposing region to the counter substrate on the first surface of the insulating substrate to a region where the sealing material is formed. .

  In the invention described above, the sealing material is preferably formed in a region where the first surface of the insulating substrate and the counter substrate face each other.

  Further, the method for manufacturing an image display device according to the present invention includes a plurality of signal lines and scanning lines on the first surface of the insulating substrate, and a plurality of inspections electrically connected to the signal lines and scanning lines, respectively. Forming a wiring, a test electrode electrically connected to the plurality of test wirings, a display unit having a thin film transistor and a pixel electrode provided at an intersection of the signal line and the scanning line, and a counter substrate And at least a part of the inspection wiring covered with the sealing material by a sealing material provided on the first surface at least around the display portion, and the inspection electrode. The method includes a step of performing a predetermined inspection by applying a voltage from and a step of separating the inspection electrode by cutting a part of the insulating substrate after the inspection is completed.

  Furthermore, in the above invention, it is preferable that in the step of forming the inspection wiring, the inspection wiring is formed so as to pass through a region facing the counter substrate on the first surface of the insulating substrate.

  According to the image display device of the present invention, it is possible to suppress the occurrence of corrosion from the exposed end face of the inspection wiring. Furthermore, since the contact area with the outside air can be reduced, the progress of corrosion of the inspection wiring can also be suppressed.

  Moreover, according to the manufacturing method of the image display device of the present invention, the inspection wiring can be suppressed near the cut portion of the insulating substrate by covering the inspection wiring with the sealing material. Therefore, a smoother cut surface can be obtained and the generation of burrs can be suppressed. Thereby, generation | occurrence | production of corrosion can be suppressed, without accompanying a big cost increase.

  Hereinafter, an image display device and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably. Further, the drawings are schematic diagrams for facilitating understanding of the present invention, and may differ from actual dimensions and scales.

(Image display device)
1 and 2 show an embodiment of an image display device according to the present invention, which is used as a display of a portable information terminal, for example. FIG. 1 is a top view through which a counter substrate of an image display device is transmitted (a view in which a first surface as a main surface of the insulating substrate 1 can be viewed from above). FIG. 2 is a cross-sectional view taken along the line AA in FIG.

  As shown in FIG. 1, the image display device includes an insulating substrate 1, a plurality of signal lines 3 and scanning lines 4 formed on a first surface that is a main surface of the insulating substrate 1, and signal lines 3. A display portion 5 having a thin film transistor and a pixel electrode provided at an intersection with the scanning line 4 (that is, between the signal line and the scanning line), and a counter substrate disposed opposite to the first surface of the insulating substrate 1 (FIG. 1). (Not shown).

  As the display unit 5, a liquid crystal display, an organic EL display, or the like having a thin film transistor and a pixel electrode provided at the intersection of the signal line 3 and the scanning line 4 can be used. In the present embodiment, an example in which the display unit 5 is an organic EL display will be described.

  The signal line 3 is connected to a display unit, which is an organic EL display, and distributes a data signal for light emission luminance to each pixel electrode. The scanning line 4 is provided so as to be substantially orthogonal to the signal line 3 and supplies a scanning signal to each pixel electrode. The scanning signal is a signal for controlling the timing for supplying the data signal to each pixel electrode via the signal line 3.

  In the description of the embodiment, the signal line 3 includes an X driver (data line driving circuit) for controlling the timing of supplying the data signal, and the scanning line 4 controls the timing of the scanning signal. It is assumed that a Y driver (scanning signal line driving circuit) is included.

  As the insulating substrate 1 and the counter substrate, for example, transparent glass or plastic can be used. When the display unit 5 is a top emission organic EL display, the insulating substrate 1 may not be transparent.

  The insulating substrate 1 and the counter substrate are bonded (bonded) in a state where the insulating substrate 1 and the counter substrate are arranged to face each other with a gap therebetween. Accordingly, the display unit 5 is disposed in a sealed space formed by the insulating substrate 1, the counter substrate, and the sealing material 6, and thus is sealed in a state where it is blocked from the outside air. As the sealing material 6, for example, a photocurable or thermosetting acrylic resin, epoxy resin, urethane resin, silicon resin, or the like can be used. The sealing material 6 may be formed at least around the display portion 5. For example, the sealing material 6 is filled between the insulating substrate 1 and the counter substrate and sealed so as to cover the entire surface of the display portion 5. Also good.

  The counter substrate has a counter surface having a smaller area than the first surface of the insulating substrate 1. For this reason, on the first surface of the insulating substrate 1, there is a non-facing region in which the counter substrate is not disposed to face.

  Further, a plurality of inspection wirings 10 whose one ends are electrically connected to the signal lines 3 and the scanning lines 4 are provided in a non-opposing region on the first surface of the insulating substrate 1 with respect to the counter substrate. Further, the other end side of the inspection wiring 10 has a portion covered with the sealing material 6 and is formed up to the end of the insulating substrate 1 (that is, the side surface of the insulating substrate 1).

  The inspection wiring 10 is for inspecting the drive of the display unit 5 before mounting the driving IC chip on the signal line 3 and the scanning line 4 in the manufacturing process of the image display device. At the time of inspection, the inspection wiring 10 is electrically connected to the inspection electrode formed on the insulating substrate 1, and the display unit 5 and the like are inspected by applying a predetermined voltage to the inspection electrode.

  After the inspection is completed, the inspection wiring 10 and the inspection electrode become unnecessary. Therefore, by cutting a part of the insulating substrate 1, a part of the inspection electrode and the inspection wiring 10 is separated. The remaining portion of the inspection wiring 10 remains in a region of the first surface of the insulating substrate 1 that does not face the counter substrate. However, the inspection wiring 10 is a conductive member that may be corroded by a metal such as Cu or Ag. Therefore, corrosion may occur due to burrs or the like on the cut end surface. Since the corrosion of the inspection wiring 10 proceeds rapidly at the place where the outside air is in contact, when the inspection wiring 10 is entirely exposed to the outside air, the signal wiring 3 or the signal line 3 is transmitted along the inspection wiring 10 remaining on the insulating substrate 1. The scanning line 4 is corroded. This shortens the life of the image display device.

  On the other hand, in the present invention, since the other end side of the inspection wiring 10 has a part covered with the sealing material 6, the area where the inspection wiring 10 is exposed to the outside air is small. Thereby, the progress speed of corrosion of the inspection wiring 10 can be suppressed, and the life of the image display device can be extended.

  Moreover, in one embodiment, the sealing material 6 is not protruded from the counter substrate to cover the test wiring 10, but the test wiring 10 is not opposed to the counter substrate on the first surface of the insulating substrate 1. It is bent from the facing area toward the area where the sealing material 6 is formed. Therefore, the inspection wiring 10 is covered with the sealing material 6 in a region where the insulating substrate 1 and the counter substrate face each other. As a result, the test wiring 10 is sufficiently covered with the sealing material 6 by pressure, so that the effect of suppressing the progress of corrosion of the test wiring 10 is improved.

  The effect will be specifically described with reference to FIG. The inspection wiring 10 formed on the first surface of the insulating substrate 1 is covered with a sealing material in a region where the first surface of the insulating substrate 1 and the counter substrate 2 face each other. That is, when the insulating substrate 1 and the counter substrate 2 are bonded (bonded) with the sealing material 6, the sealing material 6 is subjected to pressure from both substrates. Therefore, the sealing performance by the sealing material is improved as compared with the case where the inspection wiring is covered with the sealing material 6 in the non-facing region of the insulating substrate 1 facing the counter substrate 2. Thereby, the inhibitory effect of corrosion of the inspection wiring 10 is increased. Further, in the step of separating the inspection electrode from the insulating substrate 1, the inspection wiring 10 can be sufficiently pressed against the insulating substrate 1 in the vicinity of the cut portion. Therefore, the occurrence of burrs on the cut surface of the inspection wiring 10 can be reduced, and the occurrence of corrosion can be suppressed.

(Schematic configuration of organic EL display)
An organic EL display has a self-luminous light emitting element that emits light by flowing current through an organic material. A schematic configuration of an organic EL display used as the display unit 5 will be described below.

  FIG. 3 schematically shows a schematic configuration of a cross-sectional structure of the top emission type organic EL display used in the embodiment. The organic EL display includes, for example, a circuit layer 22 in which a pixel circuit including various transistors such as a thin film transistor is formed on an insulating substrate 1, a planarization layer 26 that covers the circuit layer 22, and the planarization layer 26. A pixel electrode layer 24 that is disposed above and has a plurality of organic EL elements is sequentially stacked. The circuit layer 22 and the pixel electrode layer 24 are provided in a contact hole of the planarization layer 26 and are electrically connected by a plurality of contact layers 23 (connection portions) made of a conductive material. The counter substrate 2 is disposed on the pixel circuit layer 24 via the sealant 6 or the gap 25 (the gap 25 in one embodiment). That is, the circuit layer 22, the contact layer 23, the pixel circuit layer 24, and the planarization layer 26 are disposed between the insulating substrate 1 and the counter substrate 2.

  The pixel circuit layer 24 has a configuration in which a plurality of organic EL elements (that is, light emitting elements) each having an anode electrode, a cathode electrode, and an organic layer disposed between both electrodes are disposed for each pixel. .

  The circuit layer 22 includes a plurality of pixel circuits that control light emission of the light emitting elements for each pixel. That is, the pixel circuits are arranged in units of pixels.

  Each light emitting element constituting the pixel circuit layer 24 and each pixel circuit constituting the circuit layer 22 are electrically connected by the contact layer 23, and light emitted from each light emitting element passes through the counter substrate 2. The light passes through and is emitted to the outside of the organic EL display as indicated by an arrow in FIG.

(Method for manufacturing image display device)
4 to 9 relate to an embodiment of a method for manufacturing an image display device according to the present invention.

  First, as shown in FIG. 4, the components of each image display device such as the scanning line 3, the signal line 4, and the display unit 5 are arranged in the vertical direction and the horizontal direction on the first surface that is the main surface of the insulating substrate 1. Place multiple.

  FIG. 5 is an enlarged view of the components of one image display device in FIG. If it demonstrates concretely using FIG. 5, it will be connected to the display part 5 which consists of an organic EL display, and the display part 5 which is the said organic EL display on the 1st surface of the insulating substrate 1 which consists of glass or a plastics. In addition, a signal line 3 that distributes a data signal for light emission luminance to each pixel electrode and a scanning line 4 that is provided so as to be substantially orthogonal to the signal line 3 and that supplies a scanning signal to each pixel electrode are formed. .

  Further, on the first surface of the insulating substrate 1, the inspection wiring 10 electrically connected to the signal line 3 and the scanning line 4 and the inspection electrode 11 for supplying electricity to the inspection wiring 10 are formed. The inspection wiring 10 and the inspection electrode 11 are for inspecting the image quality and the like of the display unit 5 before mounting the driving IC chip. Therefore, the inspection wiring 10 and the inspection electrode 11 become unnecessary after the inspection is completed.

  Here, the inspection wiring 10 is formed in a shape bent toward the periphery of the display unit 5 between the signal line 3 and the scanning line 4 and the inspection electrode 11. In other words, the inspection electrode 10 is formed by being routed around the display unit 5.

  Next, as shown in FIG. 6, a sealing material 6 made of, for example, photocurable or thermosetting acrylic resin, epoxy resin, urethane resin, silicon resin, or the like is applied around each of the plurality of display portions 5. . Thereby, the sealing material 6 covers a part of the inspection wiring formed by being drawn around the display unit 5. In this embodiment, the sealing material 6 covers only the periphery of the display unit 5, but it may be formed at least around the display unit 5, for example, applied so as to cover the entire surface of the display unit 5. Also good.

  Then, as shown in FIG. 7, the counter substrate 2 having substantially the same size as that of the insulating substrate 1 is placed on the sealing material 6 at once, and is disposed opposite to the insulating substrate 1 and bonded (bonded). As a result, the display unit 5 is sealed in a space formed by the insulating substrate 1, the counter substrate 2, and the sealing material 6. Sealing is preferably performed in a vacuum or in an inert gas atmosphere such as nitrogen gas or argon gas. Thereby, the deterioration of the display unit 5 due to oxidation or moisture can be suppressed.

  Thereafter, the insulating substrate 1 and the counter substrate 2 are cut along the BB line and the CC line, respectively, so as to be separated into the respective image display devices shown in FIG. Here, in one embodiment, the counter substrate 2 is cut so that the scanning lines 3, the signal lines 4, and the inspection electrodes 11 are exposed. However, the counter substrate 2 may be cut so that at least the inspection electrodes 11 are exposed. In this case, the counter substrate may be cut so that the scanning lines 3 and the signal lines 4 are exposed after a subsequent process, for example, an inspection process described later.

  Then, a voltage is applied to the inspection electrode 11 for each separated image display device, and a predetermined inspection such as an image quality inspection of the display unit 5 is performed. When a defect is found by this inspection, by discarding or repairing the defective product, it is possible to reduce unnecessary work in the subsequent process and improve the yield.

  After the predetermined inspection is completed, a part of the insulating substrate 1 including the inspection electrode 11 that is unnecessary for the finished product is cut out. In this case, the location for cutting the insulating substrate 1 is not particularly limited as long as the location includes the inspection electrode 11. Further, when cutting by dicing at a position including the sealing material 6, the sealing material may adhere to the cutting blade and the cutting force may be reduced, and it is necessary to cut a part of the counter substrate. Therefore, it is preferable to cut at the outer peripheral portion of the sealing material 6.

  In this embodiment, as shown in FIG. 8, the inspection wiring 10 is cut from the portion covered with the sealing material 6 (broken line portion) in the vicinity exposed to the outside, along the DD line. The insulating substrate 1 is cut in FIG. Thereby, the wiring board 10 can be sufficiently pressed against the insulating substrate 1 in the vicinity of the cut portion. Therefore, in the cutting process, the occurrence of burrs on the cut surface of the inspection wiring 10 can be reduced, and the occurrence of corrosion can be suppressed.

  Then, as shown in FIG. 9, a driving IC chip 7 is mounted on the scanning line 3 and the signal line 4 to produce an image display device. In the product, a predetermined signal and voltage are supplied to the scanning line 3 and the signal line 4 via the IC chip 7.

  In the above-described embodiment and example, an organic EL display has been described as an example of the display unit 5. However, the display unit 5 is not limited thereto, and for example, a plasma display or a liquid crystal display may be used. It is.

It is a top view of the image display apparatus which permeate | transmitted the counter substrate concerning one Embodiment. It is sectional drawing in the AA cross section in FIG. It is a schematic diagram of the cross-sectional structure of the organic EL display used for one Embodiment. It is process drawing of the manufacturing method of the image display apparatus in one Example. It is process drawing of the manufacturing method of the image display apparatus in one Example. It is process drawing of the manufacturing method of the image display apparatus in one Example. It is process drawing of the manufacturing method of the image display apparatus in one Example. It is process drawing of the manufacturing method of the image display apparatus in one Example. It is process drawing of the manufacturing method of the image display apparatus in one Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Opposite substrate 3 Signal line 4 Scan line 5 Display part 6 Sealing material 7 IC chip 10 Inspection wiring 11 Inspection electrode 22 Circuit layer 23 Contact layer 24 Pixel circuit layer 25 Air gap 26 Flattening layer

Claims (9)

An insulating substrate having a first surface;
A plurality of signal lines and scanning lines formed on the first surface of the insulating substrate;
A display unit having a thin film transistor and a pixel electrode provided at an intersection of the signal line and the scanning line;
A sealing material formed at least around the display portion on the first surface of the insulating substrate;
A counter substrate disposed opposite to the first surface of the insulating substrate via the sealing material and having an area of the surface facing the first surface smaller than the area of the first surface;
A portion where one end side is electrically connected to the signal line and the scanning line in a non-facing region on the first surface of the insulating substrate with respect to the counter substrate, and the other end side is covered with the sealing material And a plurality of inspection wirings formed to the end of the insulating substrate,
An image display device comprising:   2. The inspection wiring according to claim 1, wherein the inspection wiring is bent so as to be directed from a non-opposing region to the counter substrate on the first surface of the insulating substrate to a region where the sealing material is formed. The image display device described.   The image display device according to claim 1, wherein the sealing material is formed in a region where the first surface of the insulating substrate and the counter substrate face each other.   The image display device according to claim 1, wherein the sealing material is made of a photocurable or thermosetting resin.   The image display device according to claim 4, wherein the resin includes at least one of acrylic resin, epoxy resin, urethane resin, and silicon resin.   The image display device according to claim 1, wherein the display unit is an organic EL display. On the first surface of the insulating substrate, a plurality of signal lines and scanning lines, a plurality of inspection wirings electrically connected to the signal lines and the scanning lines, respectively, and the plurality of inspection wirings are electrically connected. Forming a test electrode and a display unit having a thin film transistor and a pixel electrode provided at an intersection of the signal line and the scanning line;
A counter substrate is disposed opposite to the first surface by a sealing material provided at least around the display unit on the first surface, and a part of the inspection wiring is covered with the sealing material;
Applying a voltage from the inspection electrode to perform a predetermined inspection;
After the completion of the inspection, cutting the inspection electrode by cutting a part of the insulating substrate;
An image display device manufacturing method comprising: In the step of forming the inspection wiring,
8. The method of manufacturing an image display device according to claim 7, wherein the inspection wiring is formed so as to pass through a region facing the counter substrate on the first surface of the insulating substrate.   The method for manufacturing an image display device according to claim 7, wherein the display unit is an organic EL display.

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