JP2009188251A5 - - Google Patents

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Publication number
JP2009188251A5
JP2009188251A5 JP2008027735A JP2008027735A JP2009188251A5 JP 2009188251 A5 JP2009188251 A5 JP 2009188251A5 JP 2008027735 A JP2008027735 A JP 2008027735A JP 2008027735 A JP2008027735 A JP 2008027735A JP 2009188251 A5 JP2009188251 A5 JP 2009188251A5
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JP
Japan
Prior art keywords
pulse laser
laser
irradiation
evaluation sample
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008027735A
Other languages
English (en)
Japanese (ja)
Other versions
JP5498659B2 (ja
JP2009188251A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008027735A priority Critical patent/JP5498659B2/ja
Priority claimed from JP2008027735A external-priority patent/JP5498659B2/ja
Priority to US12/361,284 priority patent/US8045184B2/en
Publication of JP2009188251A publication Critical patent/JP2009188251A/ja
Publication of JP2009188251A5 publication Critical patent/JP2009188251A5/ja
Priority to US13/279,559 priority patent/US8144341B2/en
Priority to US13/428,297 priority patent/US8339613B2/en
Application granted granted Critical
Publication of JP5498659B2 publication Critical patent/JP5498659B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008027735A 2008-02-07 2008-02-07 レーザ照射位置安定性評価方法及びレーザ照射装置 Expired - Fee Related JP5498659B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008027735A JP5498659B2 (ja) 2008-02-07 2008-02-07 レーザ照射位置安定性評価方法及びレーザ照射装置
US12/361,284 US8045184B2 (en) 2008-02-07 2009-01-28 Making method of sample for evaluation of laser irradiation position and making apparatus thereof and evaluation method of stability of laser irradiation position and evaluation apparatus thereof
US13/279,559 US8144341B2 (en) 2008-02-07 2011-10-24 Making method of sample for evaluation of laser irradiation position and making apparatus thereof and evaluation method of stability of laser irradiation position and evaluation apparatus thereof
US13/428,297 US8339613B2 (en) 2008-02-07 2012-03-23 Making method of sample for evaluation of laser irradiation position and making apparatus thereof and evaluation method of stability of laser irradiation position and evaluation apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008027735A JP5498659B2 (ja) 2008-02-07 2008-02-07 レーザ照射位置安定性評価方法及びレーザ照射装置

Publications (3)

Publication Number Publication Date
JP2009188251A JP2009188251A (ja) 2009-08-20
JP2009188251A5 true JP2009188251A5 (https=) 2011-03-10
JP5498659B2 JP5498659B2 (ja) 2014-05-21

Family

ID=41012954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008027735A Expired - Fee Related JP5498659B2 (ja) 2008-02-07 2008-02-07 レーザ照射位置安定性評価方法及びレーザ照射装置

Country Status (2)

Country Link
US (3) US8045184B2 (https=)
JP (1) JP5498659B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5498659B2 (ja) * 2008-02-07 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射位置安定性評価方法及びレーザ照射装置
US8735207B2 (en) * 2011-04-05 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Method to avoid fixed pattern noise within backside illuminated (BSI) complementary metal-oxide-semiconductor (CMOS) sensor array
US9255915B2 (en) 2012-05-11 2016-02-09 Siemens Energy, Inc. Evaluating a process effect of surface presentation angle
US9835532B2 (en) * 2012-10-30 2017-12-05 The Penn State Research Foundation 3D laser ablation tomography and spectrographic analysis
US9437041B2 (en) 2012-10-30 2016-09-06 The Penn State Research Foundation 3D laser ablation tomography
WO2015100716A1 (zh) * 2014-01-02 2015-07-09 清华大学 一种评价激光器稳定性的方法
KR20170037633A (ko) * 2014-07-21 2017-04-04 어플라이드 머티어리얼스, 인코포레이티드 스캐닝형 펄스 어닐링 장치 및 방법
DE102014013160B4 (de) * 2014-09-11 2018-01-11 ProASSORT GmbH Verfahren und Vorrichtung zur Sortierung von wiederverwertbaren Rohstoffstücken
CN105471064A (zh) * 2016-02-01 2016-04-06 李良杰 运动发电机
US11909091B2 (en) 2020-05-19 2024-02-20 Kymeta Corporation Expansion compensation structure for an antenna

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US4689491A (en) * 1985-04-19 1987-08-25 Datasonics Corp. Semiconductor wafer scanning system
US5091963A (en) 1988-05-02 1992-02-25 The Standard Oil Company Method and apparatus for inspecting surfaces for contrast variations
JPH02260419A (ja) * 1989-03-30 1990-10-23 Matsushita Electric Ind Co Ltd レーザ照射方法
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JP3343492B2 (ja) * 1997-04-02 2002-11-11 シャープ株式会社 薄膜半導体装置の製造方法
JP3679558B2 (ja) 1997-07-31 2005-08-03 アルプス電気株式会社 境界線の検出方法およびこの検出方法を用いた磁気ヘッドの位置決め方法および位置決め装置
JP2000031229A (ja) 1998-07-14 2000-01-28 Toshiba Corp 半導体薄膜の検査方法及びそれを用いた半導体薄膜の製造方法
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JP5498659B2 (ja) * 2008-02-07 2014-05-21 株式会社半導体エネルギー研究所 レーザ照射位置安定性評価方法及びレーザ照射装置

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