JP2009186705A - Inspection method of electro-optic device and inspection device of electro-optic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method and device of an electro-optic device, exactly detecting whether an undivided part exists on one large substrate after dividing one large substrate when the electro-optic device is segmented from an object to which a pair of large substrates are stuck together. <P>SOLUTION: The present invention is the inspection method of the electro-optic device obtained by dividing a large stuck substrate constituted by sticking a first large substrate and a second large substrate together along a plurality of predetermined division scheduled lines, and is characterized in that the curvature shape of the large stuck substrate is measured after a first division process of dividing either one of the first large substrate or the second large substrate of the large stuck substrates along the plurality of predetermined division scheduled lines, and whether undivided part exists in the first division process based on the curvature shape. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inspection method for an electro-optical device cut out from a pair of large substrates bonded together and an inspection device for an electro-optical device.

  A transmissive liquid crystal display device as an example of an electro-optical device includes a liquid crystal sandwiched between a pair of translucent substrates made of glass, quartz, or the like. For example, when the liquid crystal display device is configured to include a pair of glass substrates, the glass substrate used in the liquid crystal display device is one large-sized substrate that is larger than the final size of the liquid crystal display device. It may be formed by cutting out from.

  For example, as disclosed in JP 2005-266684 A and WO 2003/006391, as a method for manufacturing an electro-optical device in which an electro-optical material is sandwiched between a pair of substrates, a pair of large-sized substrates is used. There is known a so-called large-size bonding method in which an electro-optic material is sandwiched between two large-sized substrates and then the paired large-sized substrates are separated.

  A scribing method is known as a method of cutting a large glass substrate into a predetermined size. In the scribing method, a linear flaw (scribe line) is made on the glass surface by the edge of the scribe blade or laser light, and the glass surface opposite to the flaw is pressed with a jig to give bending stress to the glass. The glass is divided by generating cracks in the thickness direction starting from scratches.

The scribing method is widely used in the manufacturing process of electro-optical devices because it can be executed in a shorter time than other methods even if the large-sized glass substrate is large and the distance to be divided is long. .
JP 2005-266684 A WO 2003/006391 Publication

  The method of dividing large-sized glass by the scribe method is more likely to vary in the scribe line formation conditions, the pressure conditions of pressing the glass with a jig, etc., compared to other methods of dividing the glass by dicing or etching. Crack residue may occur.

  However, when a pair of large-sized substrates are bonded together but cracks remain when one large-sized substrate is divided, the other large-sized substrate is not yet divided, so that one substrate is divided. Even if it is not divided, it is difficult to detect the remaining crack because it is not separated and has the same appearance.

  If the other substrate is divided by the scribing method with a crack remaining on one of the substrates, the accuracy of the dividing position is deteriorated, causing a defect.

  The present invention has been made in view of the above problems, and in the case where an electro-optical device is cut out from a pair of large substrates bonded together, after one large substrate is divided, the one large substrate is cracked. It is an object of the present invention to provide an inspection method for an electro-optical device and an inspection device for an electro-optical device capable of accurately detecting whether or not there is a remainder.

  According to an inspection method for an electro-optical device according to the present invention, an electro-optical device in which a first substrate and a second substrate are bonded together, a first large-sized substrate including a plurality of the first substrates, and the An inspection method for an electro-optical device, which is obtained by dividing a large-sized bonded substrate formed by bonding a plurality of second substrates formed with a plurality of second substrates along a plurality of predetermined dividing lines. The large-sized bonded substrate after the first dividing step of dividing one of the first large-sized substrate and the second large-sized substrate along the predetermined plurality of dividing lines. It is characterized by measuring the warp shape and determining based on the warp shape whether there is any remaining crack in the first dividing step.

  The inspection apparatus for an electro-optical device according to the present invention includes an electro-optical device in which a first substrate and a second substrate are bonded together, and a first large-sized substrate in which a plurality of the first substrates are configured. An inspection apparatus for an electro-optical device obtained by dividing a large-sized bonded substrate formed by bonding a second large-sized substrate on which a plurality of the second substrates are formed along a plurality of predetermined dividing lines. Then, after the first dividing step of dividing one of the first large-sized substrate and the second large-sized substrate of the large-sized bonded substrate along the predetermined plurality of dividing lines, the large-sized bonding is performed. The warping shape of the laminated substrate is measured, and based on the warping shape, it is determined whether or not there is a remaining crack in the first dividing step.

  According to such a configuration of the present invention, it is possible to detect the remaining crack of the first large-sized substrate.

  Further, in the present invention, it is preferable that the measurement of the warped shape of the large-sized bonded substrate is performed on a straight line that intersects all the predetermined plurality of dividing lines.

  According to such a configuration, it is only necessary to measure the warped shape of the large-sized bonded substrate in only one straight line, and it is possible to reduce the time required for inspection.

  In the present invention, the predetermined plurality of planned dividing lines include a plurality of first divided planned lines and a plurality of second divided planned lines orthogonal to the first divided planned lines. The measurement of the warped shape of the bonded substrate is performed on at least two straight lines, ie, a straight line intersecting all of the first planned dividing lines and a straight line intersecting at least all the second planned dividing lines. Features.

  According to such a configuration, when the electro-optical device is cut out in a matrix form from the large-sized bonded substrate, it is possible to detect the remaining cracks in two orthogonal planned dividing lines.

  Further, the present invention provides the first dividing step when a difference between a warped shape of the large-sized bonded substrate and a quadratic curve approximating the warped shape of the large-sized bonded substrate is a predetermined value or more. It is characterized in that it is determined that there is a remaining crack in.

  According to such a configuration, it is possible to quantitatively detect the remaining cracks of the first large-sized substrate, and it is possible to prevent the occurrence of defects during division.

  Embodiments of the present invention will be described below with reference to the drawings. In the embodiments described below, the present invention is applied to an inspection method and an inspection apparatus used in a manufacturing process of a transmissive liquid crystal display device as an electro-optical device.

  In each drawing used for the following description, the scale is different for each component in order to make each component large enough to be recognized on the drawing. It is not limited only to the quantity of the component described in the figure, the shape of the component, the ratio of the size of the component, and the relative positional relationship of each component.

  First, the configuration of the electro-optical device according to the present embodiment will be described with reference to FIGS. 1, 2, and 3. In this embodiment, as an example of an electro-optical device, a transmissive liquid crystal panel of a TFT (Thin Film Transistor) active matrix driving system with a built-in driving circuit is taken as an example.

  FIG. 1 is a plan view of an electro-optical device in which a TFT array substrate is viewed from the side of a counter substrate together with each component configured thereon. 2 is a cross-sectional view taken along the line HH ′ of FIG. FIG. 3 is an equivalent circuit of various elements, wirings, and the like in a plurality of pixels formed in a matrix that forms an image display region of the electro-optical device.

  As shown in FIGS. 1 and 2, the electro-optical device 100 according to the present embodiment includes a TFT array substrate 10 (first substrate) and a counter substrate 20 (second substrate) which are a pair of substrates disposed to face each other. A liquid crystal 50 as an electro-optical material is sandwiched between the substrate and the substrate. The TFT array substrate 10 and the counter substrate 20 are substantially rectangular flat plates having translucency made of glass, quartz, translucent ceramic, or the like. The TFT array substrate 10 and the counter substrate 20 are bonded and bonded together by a frame-shaped sealing material 52 provided in a sealing region located around the image display region 10a. In the sealing material 52, gap materials such as glass fibers or glass beads are arranged in a dispersed manner so that the distance between the TFT array substrate 10 and the counter substrate 20 is a predetermined value. The liquid crystal 50 is filled in a region surrounded by the sealing material 52, the TFT array substrate 10, and the counter substrate 20.

  In the present embodiment, the TFT array substrate 10 is formed to have a shape larger than that of the counter substrate 20 in plan view. Here, the viewpoint viewed in a plane is a viewpoint in which the electro-optical device 100 is parallel to the normal line of the TFT array substrate 10 and viewed from the side of the counter substrate 20, and is the same viewpoint as in FIG. Point to. As shown in FIGS. 1 and 2, in a state where the TFT array substrate 10 and the counter substrate 20 are positioned and bonded via the sealing material 52, the TFT array substrate 10 is along one side as viewed in a plan view. The region has a protruding portion 110 that protrudes outward from the counter substrate 20.

  The data line driving circuit 101 and the external conduction terminal 102 (conduction terminal portion) are located outside the seal region where the sealing material 52 of the TFT array substrate 10 is disposed and along the one side where the overhang portion 110 is formed. ) Is provided.

  The external conduction terminal 102 is exposed on the surface on the liquid crystal 50 side of the projecting portion 110 of the TFT array substrate 10. The external conduction terminal 102 is formed of a patterned conductive film, and has the purpose of electrically connecting the electro-optical device 100 and the external device. The outermost surface portion of the external conductive terminal 102 is formed of a conductive film made of, for example, Al (aluminum) or ITO (Indium Tin Oxide).

  The external conduction terminal 102 is not limited to the present embodiment, and other examples include Ti (titanium), Cr (chromium), W (tungsten), Ta (tantalum), Mo (molybdenum), Cu (copper), and Au. It may be constituted by a metal simple substance including (gold) or the like, an alloy and a metal silicide, a conductive layer made of polysilicon or the like, or a laminate of these.

  For example, although not illustrated, the electro-optical device 100 and the electro-optical device 100 are connected to the external conductive terminal 102 via the flexible printed board by connecting the flexible printed board via an anisotropic conductive adhesive or the like. Electrical connection with an external device such as a control circuit to be controlled is performed.

  A light-shielding frame light-shielding film 53 that defines a frame region as the edge of the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the frame-shaped sealing material 52 is disposed. Yes. In other words, in the electro-optical device 10 according to the present embodiment, when viewed from the center of the image display area 10a, the area beyond the frame light shielding film 53 is defined as a non-display area. A part or all of the frame light shielding film 53 may be provided on the TFT array substrate 10 side.

  The scanning line driving circuit 104 is provided in a region covered with the frame light-shielding film 53 along two sides adjacent to one side where the overhang portion 110 is formed. In addition, a plurality of wirings 105 are provided in a region that is along the side facing the one side where the projecting portion 110 of the TFT array substrate 10 is formed and is covered with the frame light shielding film 53. The two scanning line driving circuits 104 are electrically connected to each other by the wiring 105.

  Further, at least one corner portion of the counter substrate 20 is provided with a vertical conductive material 106 that functions as a vertical conductive terminal for electrical connection between the TFT array substrate 10 and the counter substrate 20. On the other hand, the TFT array substrate 10 is provided with vertical conduction terminals in a region corresponding to these vertical conduction members 106. Electrical connection is made between the TFT array substrate 10 and the counter substrate 20 via the vertical conductive member 106 and the vertical conductive terminal.

  Although not shown in the figure, on the surface of the TFT array substrate 10 on the liquid crystal 50 side and in the image display area 10a, wiring corresponding to scanning lines and data lines, and intersections of scanning lines and data lines are provided. A TFT, which is a pixel switching element, is formed with a laminated structure. As shown in FIG. 2, a plurality of pixel electrodes 9a are formed on the surface of the TFT array substrate 10 on the liquid crystal 50 side corresponding to the TFTs, and an alignment film 16 is formed on the pixel electrodes 9a. ing.

The alignment film 16 is made of an organic material or an inorganic material and regulates the alignment state of the liquid crystal 50. When the alignment film 16 is made of an organic material, the alignment film 16 is formed by performing a rubbing process on a resin film made of polyimide, for example. When the alignment film 16 is made of an inorganic material, the alignment film 16 is made of an inorganic material such as SiO ₂ , SiO, or MgF ₂ and has a predetermined angle with respect to the surface of the TFT array substrate 10 on the liquid crystal 50 side. It is formed by a so-called oblique deposition method in which an inorganic material such as SiO ₂ , SiO, or MgF ₂ is deposited.

On the other hand, on the surface of the counter substrate 20 on the liquid crystal 50 side, in addition to the counter electrode 21, a lattice-shaped or stripe-shaped light shielding film 23 and an alignment film 22 are formed on the uppermost layer. Similar to the alignment film 16, the alignment film 22 is a film that is made of an organic material or an inorganic material and regulates the alignment state of the liquid crystal 50. When the alignment film 22 is made of an organic material, the alignment film 22 is formed by performing a rubbing process on a resin film made of polyimide, for example. When the alignment film 22 is made of an inorganic material, the alignment film 22 is made of an inorganic material such as SiO ₂ , SiO, or MgF ₂ , and has a predetermined angle with respect to the surface of the TFT array substrate 10 on the liquid crystal 50 side. It is formed by a so-called oblique deposition method in which an inorganic material such as SiO ₂ , SiO, or MgF ₂ is deposited.

  The liquid crystal 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films 16 and 22.

  Next, the electrical configuration of the electro-optical device 100 described above will be described with reference to FIG. As shown in FIG. 3, a plurality of pixels formed in a matrix that form the image display region 10a of the electro-optical device 100 according to the present embodiment are used for switching control of the pixel electrode 9a and the pixel electrode 9a, respectively. TFT 30 is formed.

  The scanning line 11 a is electrically connected to the gate 3 a of the TFT 30. The scanning signals G1, G2,..., Gm are sequentially supplied to the scanning line 11a at a predetermined timing by the scanning line driving circuit 104. By supplying a scanning signal to the gate 3a through the scanning line 11a, the plurality of TFTs 30 electrically connected to the scanning line 11a are turned on.

  A data line 6 a to which an image signal is supplied is electrically connected to the source of the TFT 30, and a pixel electrode 9 a is electrically connected to the drain of the TFT 30. Image data S1, S2,..., Sn are sequentially supplied to the data line 6a at a predetermined timing by the data line driving circuit 101. Here, the image signals S1, S2,..., Sn supplied to the data line 6a are at a predetermined level to be written in the pixel electrode 9a electrically connected to the TFT 30 which is turned on by the supply of the scanning signal. It is a signal having the potential of

  In accordance with the potential difference between the pixel electrode 9a to which the image signals S1, S2,..., Sn are written and the counter electrode 21 formed on the counter substrate, that is, the voltage applied to the liquid crystal 50, the molecular assembly of the liquid crystal 50. The orientation and order of the material changes. Thereby, the light transmitted through the liquid crystal 50 is modulated, and gradation display in the pixel becomes possible. In the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel, and in the normally black mode, the light is incident according to the voltage applied in units of each pixel. The transmittance for light is increased.

  In addition, one electrode of the storage capacitor 70 is electrically connected to the pixel electrode 9a in order to lengthen the holding time of the image signal in each pixel. The other electrode of the storage capacitor 70 is electrically connected to a capacitor wiring 400 provided side by side with the scanning line 11a and having a predetermined potential.

  On the TFT array substrate 10 described above, in addition to the data line driving circuit 101, the scanning line driving circuit 104, etc., a sampling circuit for sampling the image signal on the image signal line and supplying it to the data line, a plurality of data lines A precharge circuit for supplying a precharge signal of a predetermined voltage level prior to the image signal, an inspection circuit for inspecting quality, defects, etc. of the electro-optical device 100 during manufacture or at the time of shipment. Also good.

  A method for manufacturing the electro-optical device 100 according to the present embodiment having the above-described configuration will be described below with reference to FIGS.

  FIG. 4 is a diagram illustrating a state before the electro-optical device is cut out from the large-sized substrate. FIG. 5 is a flowchart for explaining a manufacturing process of the electro-optical device. 6 to 11 are diagrams for explaining each step in order with respect to the VI-VI cross section in FIG. 4.

  In each drawing, the direction of gravity in the manufacturing process of the electro-optical device 100 of the present embodiment is not particularly shown. That is, the arrangement of each component in each figure shows a relative positional relationship, and does not show a vertical relationship in gravity.

  The electro-optical device 100 according to the present embodiment is formed by dividing a plurality of components to be the electro-optical device 100 into individual pieces after being integrally formed. In other words, the electro-optical device 100 is formed by a method of performing multi-face drawing from a large-sized bonded substrate in which a pair of large-sized substrates are bonded.

  Schematically, as shown in FIG. 4, the large-sized bonded substrate 60 is formed in a state in which the laminated structure constituting the plurality of TFT array substrates 10 is arranged in a matrix on the mother substrate 35 that is the first large-sized substrate. Similarly, a laminated structure constituting a plurality of counter substrates 20 is formed in a matrix on the counter mother substrate 40, which is a second large substrate, and the mother substrate 35 and the counter mother substrate 40 are sealed. It is formed by bonding through the material 52.

  In the present embodiment, the mother substrate 35 has a wafer-like substantially disk shape having an orientation flat (hereinafter abbreviated as orientation flat) 35c. In the following description, an axis parallel to the orientation flat 35c on the surface of the mother substrate 35 facing the opposite-side mother substrate 40 is an X axis, and an axis orthogonal to the X axis on the surface is a Y axis. An axis orthogonal to the X axis and the Y axis is taken as a Z axis.

  The plurality of stacked structures 10b formed on the mother substrate 35 are arranged in a matrix along the X axis and the Y axis on the surface of the mother substrate 35 that faces the opposite mother substrate.

  Then, a plurality of first dividing lines 130 extending substantially parallel to the X axis so as to follow the outer shape of the plurality of TFT array substrates 10, and a Y axis substantially corresponding to the outer shape of the TFT array substrate 10. The electro-optical device 100 described above is cut out by dividing both the mother substrate 35 and the opposed mother substrate 40 with the plurality of second dividing lines 140 extending in parallel.

  In this embodiment, the mother substrate 35 and the opposing mother substrate 40 are substantially disk-shaped, but the shapes of the mother substrate 35 and the opposing mother substrate 40 are not limited to these shapes. For example, at least one of the mother substrate 35 and the opposed-side mother substrate 40 may be configured by a rectangular flat plate.

  Details of the method for manufacturing the electro-optical device 100 according to this embodiment will be described below with reference to the flowchart of FIG.

  First, in step S01, as shown in FIG. 6, a laminated structure in which a plurality of laminated structures 10b are formed on one surface of a mother substrate 35 and arranged in a matrix at predetermined intervals in the row and column directions. A forming step is performed.

  Here, as described above, the stacked structure 10b is formed on the surface of the TFT array substrate 10 on the liquid crystal 50 side, and includes the alignment film 16, the pixel electrode 9a, the scanning line 11a, the data line 6a, and the capacitor wiring 400. , A storage capacitor 70, a TFT 30, an external conduction terminal 102, and the like.

  The detailed process for forming the laminated structure 10b is the same as the manufacturing process of a known liquid crystal display device, and thus the description thereof is omitted.

  Next, in step S02, as shown in FIG. 7, a bonding step of bonding the opposing mother substrate 40 on which the laminated structure to be the plurality of opposing substrates 20 is formed to the mother substrate 35 through the sealing material 52 is performed. carry out. Here, the laminated structure formed on the counter-side mother substrate 40 includes the counter electrode 21 and the alignment film 22.

  In step S02, a liquid crystal filling step for filling the liquid crystal 50 between the mother substrate 35 and the opposing mother substrate 40 is performed simultaneously with the bonding step. In the present embodiment, a frame-shaped sealing material 52 is formed on each of the plurality of laminated structures 10 b, and a predetermined amount of liquid crystal 50 is dropped into a region surrounded by the frame-shaped sealing material 52, and then the opposing mother A so-called liquid crystal dropping method in which the substrate 40 is bonded is used.

  The method of filling the liquid crystal 50 between the TFT array substrate 10 and the counter substrate 20 is not limited to this liquid crystal dropping method, and the TFT array substrate 10 and the counter substrate 20 are cut out in a bonded state. A so-called liquid crystal injection method in which liquid crystal is injected and sealed from an opening formed in the sealing material 52 later is not particularly limited.

  Next, in step S03, as shown in FIG. 8, a scribe line 131 is formed on the opposing mother substrate 40 along the first planned dividing line 130 and the second planned divided line 140 by a scribe blade, and the scribe line is formed. A counter substrate cutting step (first cutting step) is performed in which a crack 132 with the line 131 as a base point is generated to divide the counter-side mother substrate 40. This process of generating cracks based on the scribe line is referred to as break processing.

  The method of dividing the opposed mother substrate 40 along the first dividing line 130 and the second dividing line 140 in the counter substrate dividing step is to form a scribe line by irradiating laser light. Laser scribing may be used.

  Next, in step S04, it is determined whether or not the opposing mother substrate 40 is divided along all the first planned dividing lines 130 and the second planned divided lines 140 by a method described in detail later. Conduct crack residue inspection process.

  If it is determined in step S04 that there is a remaining crack in the opposing mother substrate 40, the process returns to step S03, and the break process is performed again on the planned dividing line in which the remaining crack exists, step S04. Repeat the remaining crack inspection process.

  On the other hand, if it is determined in step S04 that there is no remaining crack of the opposing mother substrate 40, the process proceeds to step S06.

  Next, in step S06, as shown in FIG. 9, a scribe line 133 is formed on the mother substrate 35 along the first scheduled dividing line 130 and the second scheduled divided line 140 by a scribe blade, and the scribe line 133 is formed. An element substrate cutting step is performed in which the crack 134 is generated as a starting point and the mother substrate 35 is cut.

  By this element substrate dividing step, as shown in FIG. 10, the large bonded substrate 60 formed by bonding the mother substrate 35 and the opposed mother substrate 40 is divided into a plurality of pieces 100a. The individual piece 100 a is different from the configuration of the electro-optical device 100 described above in that the overlapping portion 111 extends from the counter substrate 20 in a direction opposite to the protruding portion 110.

  The method of dividing the mother substrate 35 along the first dividing line 130 and the second dividing line 140 in the element substrate dividing step is a method of forming a scribe line by irradiating laser light. Also good.

  Next, in step S07, as shown in FIG. 11, an overlapping partial cutting step of dividing the overlapping portion 111 extending from the counter substrate 20 of the piece 100a from the counter substrate 20 is performed. As a result, the above-described electro-optical device 100 is cut out from the large-sized bonded substrate 60.

  Next, the crack remaining inspection process in step S04, which is an inspection method for the electro-optical device of this embodiment, will be described in detail with reference to the flowchart of FIG. This remaining crack inspection process is performed by, for example, an automated inspection apparatus.

  In the crack remaining inspection process, first, in step S11, using a contact or non-contact type displacement sensor, for example, a laser displacement meter, in a direction substantially parallel to the X axis of the large bonded substrate 60 after the opposing substrate cutting process. Measure the warp shape.

  The measurement of the warp shape in the direction substantially parallel to the X-axis of the large-sized bonded substrate 60 is performed on a straight line that intersects all the second scheduled cutting lines 140 as indicated by a straight line L1 in FIG. The straight line L1 preferably passes through the vicinity of the center of the large-sized bonded substrate 60.

  In addition, at least one point of measurement of the warped shape of the large-sized bonded substrate 60 on the straight line L1 is provided in a range sandwiched between the two second dividing lines 140.

  For example, in the case of the large-sized bonded substrate 60 having a shape as shown in FIG. 13, in step S11, the large-sized bonded substrate 60 is placed on the reference plane, and the large-sized bonded substrate 60 is measured at four measurement points MX1 to MX4. The height of the surface of the bonded substrate board 60 from the reference plane is measured, and the warped shape in the direction substantially parallel to the X axis of the large-sized bonded substrate 60 is measured.

  Next, in step S12, a warp shape in a direction substantially parallel to the Y axis of the large bonded substrate 60 after the counter substrate cutting process is measured using a contact type or non-contact type displacement sensor, for example, a laser displacement meter. To do.

  The measurement of the warp shape in the direction substantially parallel to the Y axis of the large-sized bonded substrate 60 is performed on a straight line that intersects all the first dividing lines 130 as indicated by a straight line L2 in FIG. The straight line L2 preferably passes through the vicinity of the center of the large-sized bonded substrate 60.

  In addition, at least one point of measurement of the warped shape of the large-sized bonded substrate 60 on the straight line L2 is provided in a range sandwiched between the two first dividing lines 130.

  For example, in the case of the large bonded substrate 60 having a shape as shown in FIG. 13, in step S12, the large bonded substrate 60 is placed on the reference plane, and the five large measurement substrates MY1 to MY5 are large. The height of the surface of the bonded substrate board 60 from the reference plane is measured, and the warped shape in the direction substantially parallel to the Y axis of the large-sized bonded substrate 60 is measured.

  Needless to say, the measurement of the warped shape of the large-sized bonded substrate is not limited to the displacement sensor, and a known measuring device such as a three-dimensional shape measuring device may be used.

  Next, in step S13, an approximate quadratic curve PX that approximates the measurement results at the plurality of measurement points MX acquired in step S11 is calculated by a known method such as a least square method. Similarly, an approximate quadratic curve PY that approximates the measurement results at the plurality of measurement points MY acquired in step S12 is calculated by a known method such as a least square method.

  For example, approximate quadratic curves PX and PY that approximate the measurement results at the measurement points MX1 to MX4 and MY1 to MY5 in FIG. 13 are calculated.

  Next, in step S14, the measurement results at the plurality of measurement points MX and MY are compared with the approximate curves PX and PY. In step S15, when the measurement results at at least one measurement point MX and MY are separated from the approximate curves PX and PY by a predetermined value or more, respectively, it is determined that there remains a crack in the large-sized bonded substrate 60. .

  On the other hand, if the deviation of the measurement results at the measurement points MX and MY from the approximate curves PX and PY is smaller than a predetermined value, it is determined that there is no crack residue on the large-sized bonded substrate 60.

  Here, the large-sized bonded substrate 60 in which the mother substrate 35 having the laminated structure formed on the surface and the opposing mother substrate 40 are bonded together is caused by internal stress such as thermal stress when the laminated structure is formed or bonded. Generally, distortion occurs. Here, when the internal stress acts uniformly in the plane of the large-sized bonded substrate 60, the large-sized bonded substrate 60 ideally has a warped shape along a quadratic curve.

  This is the same when the opposite-side mother substrate 40 of the large-sized bonded substrate 60 is divided along all the first dividing line 130 and all the second dividing line 140. When there is no crack residue in the counter substrate cutting step, the warped shape of the large-sized bonded substrate 60 ideally approximates a quadratic curve.

  However, in the counter substrate cutting step, when a crack remains in at least one of the first planned split line 130 and the second planned split line 140, the stress that tends to warp the mother substrate 35 is the counter side mother substrate. Since it becomes non-uniform due to the influence of the 40 undivided region, the warped shape of the large-sized bonded substrate 60 deviates from the quadratic curve when there is a crack remaining in the counter substrate cutting step.

  For example, when a remaining crack occurs in the first planned split line 130 between the measurement points MY2 and MY3, the measurement results near the measurement points MY2 and MY3 deviate from the approximate curve PY.

  As described above, in the inspection method of the electro-optical device according to the present embodiment, the opposing mother substrate 40 of the large-sized bonded substrate 60 in which the mother substrate 35 formed with the laminated structure and the opposing mother substrate 40 are bonded together is obtained. Since it is possible to determine whether or not there is a crack remaining on the opposing mother substrate 40 by measuring the warped shape of the large-sized bonded substrate 60 after dividing along a predetermined plurality of dividing lines. is there.

  It should be noted that the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. An inspection method for an optical device and an inspection device for an electro-optical device are also included in the technical scope of the present invention.

  For example, in the above-described embodiment, the transmissive liquid crystal panel of the active matrix driving system using the TFT has been described as the electro-optical device 100. However, the present invention is not limited to this, and the switching element is a TFD (Thin Film). The present invention can also be applied to an active-matrix drive type electro-optical device using Diode and a passive matrix drive method (also referred to as a simple matrix drive method). In addition, the present invention is not limited to a transmissive electro-optical device, and the present invention can also be applied to a reflective, transflective, self-luminous, or other electro-optical device.

  For example, the present invention relates to LCOS (Liquid Crystal On Silicon), electroluminescence devices, in particular, organic electroluminescence devices, inorganic electroluminescence devices, plasma display devices, FED (Field Emission Display) devices, SED (Surface-Condition Electron). -It can be applied to an inspection method and an inspection apparatus for various electro-optical devices such as an Emitter Display device, an LED (light emitting diode) display device, an electrophoretic display device, or a device using a liquid crystal shutter.

FIG. 3 is a plan view of the electro-optical device when the TFT array substrate is viewed from the counter substrate side together with the components configured thereon. It is HH 'sectional drawing of FIG. It is an equivalent circuit of various elements and wirings in a plurality of pixels constituting the image display area. It is a figure explaining the state before cutting out an electro-optical apparatus from a large format board | substrate. 6 is a flowchart illustrating a manufacturing process of an electro-optical device. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. FIG. 5 is a diagram for explaining each step in order with respect to the VII-VII cross section in FIG. 4. It is a flowchart of a crack remainder inspection process. It is a figure explaining the measurement point of curvature shape.

Explanation of symbols

10 TFT array substrate, 20 counter substrate, 60 large-sized bonded substrate, 130 first dividing line, 140 second dividing line, MX1 to 4 measuring points, MY1 to 5 measuring points

Claims (5)

An electro-optical device in which a first substrate and a second substrate are bonded to each other, a first large substrate in which a plurality of the first substrates are configured, and a second in which a plurality of the second substrates are formed. An inspection method for an electro-optical device obtained by dividing a large-sized bonded substrate formed by bonding a large-sized substrate along a plurality of predetermined dividing lines,
After the first dividing step of dividing one of the first large-sized substrate and the second large-sized substrate along the predetermined plurality of dividing lines, the large-sized bonded substrate Measure warpage shape,
An inspection method for an electro-optical device, characterized in that, based on the warped shape, it is determined whether or not there is a remaining crack in the first dividing step.   2. The method for inspecting an electro-optical device according to claim 1, wherein the warp shape of the large-sized bonded substrate is measured on a straight line that intersects all the predetermined plurality of dividing lines. The predetermined plurality of dividing lines include a plurality of first dividing lines and a plurality of second dividing lines orthogonal to the first dividing lines,
The measurement of the warped shape of the large-sized bonded substrate is performed on two straight lines, that is, a straight line intersecting at least all of the first planned dividing lines and a straight line intersecting at least all the second planned dividing lines. The inspection method for an electro-optical device according to claim 1.   When the difference between the warped shape of the large-sized bonded substrate and the quadratic curve approximating the warped shape of the large-sized bonded substrate is equal to or greater than a predetermined value, there is a remaining crack in the first dividing step. 4. The inspection method for an electro-optical device according to claim 1, wherein the determination is performed. An electro-optical device in which a first substrate and a second substrate are bonded to each other, a first large substrate in which a plurality of the first substrates are configured, and a second in which a plurality of the second substrates are formed. An inspection apparatus for an electro-optical device obtained by dividing a large-sized bonded substrate formed by bonding with a large-sized substrate along a plurality of predetermined dividing lines,
After the first dividing step of dividing one of the first large-sized substrate and the second large-sized substrate along the predetermined plurality of dividing lines, the large-sized bonded substrate Measure warpage shape,
An inspection apparatus for an electro-optical device, characterized in that, based on the warped shape, it is determined whether or not there is a remaining crack in the first dividing step.

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