JP2009181804A - シールド付き伝送線路 - Google Patents
シールド付き伝送線路 Download PDFInfo
- Publication number
- JP2009181804A JP2009181804A JP2008019639A JP2008019639A JP2009181804A JP 2009181804 A JP2009181804 A JP 2009181804A JP 2008019639 A JP2008019639 A JP 2008019639A JP 2008019639 A JP2008019639 A JP 2008019639A JP 2009181804 A JP2009181804 A JP 2009181804A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- loss
- shield
- transmission line
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 134
- 239000004020 conductor Substances 0.000 claims abstract description 733
- 239000000463 material Substances 0.000 claims abstract description 143
- 239000012212 insulator Substances 0.000 claims abstract description 15
- 230000005672 electromagnetic field Effects 0.000 claims description 95
- 238000007747 plating Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 210
- 238000009826 distribution Methods 0.000 description 51
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- 230000002238 attenuated effect Effects 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 230000002500 effect on skin Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910000975 Carbon steel Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000010962 carbon steel Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052752 metalloid Inorganic materials 0.000 description 4
- 150000002738 metalloids Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000009828 non-uniform distribution Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- 108010053070 Glutathione Disulfide Proteins 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- YPZRWBKMTBYPTK-BJDJZHNGSA-N glutathione disulfide Chemical compound OC(=O)[C@@H](N)CCC(=O)N[C@H](C(=O)NCC(O)=O)CSSC[C@@H](C(=O)NCC(O)=O)NC(=O)CC[C@H](N)C(O)=O YPZRWBKMTBYPTK-BJDJZHNGSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Insulated Conductors (AREA)
- Communication Cables (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008019639A JP2009181804A (ja) | 2008-01-30 | 2008-01-30 | シールド付き伝送線路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008019639A JP2009181804A (ja) | 2008-01-30 | 2008-01-30 | シールド付き伝送線路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009181804A true JP2009181804A (ja) | 2009-08-13 |
| JP2009181804A5 JP2009181804A5 (enrdf_load_stackoverflow) | 2011-03-10 |
Family
ID=41035609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008019639A Pending JP2009181804A (ja) | 2008-01-30 | 2008-01-30 | シールド付き伝送線路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009181804A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011086458A (ja) * | 2009-10-14 | 2011-04-28 | Hitachi Cable Ltd | 差動信号用ケーブル及びこれを用いた伝送ケーブル、並びに差動信号用ケーブルの製造方法 |
| WO2011136008A1 (ja) * | 2010-04-28 | 2011-11-03 | 古河電気工業株式会社 | 回転コネクタ装置 |
| WO2013153869A1 (ja) * | 2012-04-11 | 2013-10-17 | 株式会社日本マイクロニクス | 多層配線基板とその製造方法並びにプローブカード |
| CN106057297A (zh) * | 2016-07-27 | 2016-10-26 | 河北华通线缆集团股份有限公司 | 一种加强抗拉扁形视频电梯电缆及其生产工艺 |
| SE2250858A1 (en) * | 2022-07-07 | 2024-01-08 | Anders Hansson | A signal transmission device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09139122A (ja) * | 1995-11-14 | 1997-05-27 | Totoku Electric Co Ltd | 高周波用同軸ケーブルおよびその製造方法 |
| JP2007042569A (ja) * | 2004-11-16 | 2007-02-15 | Matsushita Electric Ind Co Ltd | 信号伝送ケーブルおよび信号伝送ケーブルの製造方法 |
| JP2007067004A (ja) * | 2005-08-29 | 2007-03-15 | Nec Toppan Circuit Solutions Inc | 印刷配線板及び半導体集積回路装置 |
-
2008
- 2008-01-30 JP JP2008019639A patent/JP2009181804A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09139122A (ja) * | 1995-11-14 | 1997-05-27 | Totoku Electric Co Ltd | 高周波用同軸ケーブルおよびその製造方法 |
| JP2007042569A (ja) * | 2004-11-16 | 2007-02-15 | Matsushita Electric Ind Co Ltd | 信号伝送ケーブルおよび信号伝送ケーブルの製造方法 |
| JP2007067004A (ja) * | 2005-08-29 | 2007-03-15 | Nec Toppan Circuit Solutions Inc | 印刷配線板及び半導体集積回路装置 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011086458A (ja) * | 2009-10-14 | 2011-04-28 | Hitachi Cable Ltd | 差動信号用ケーブル及びこれを用いた伝送ケーブル、並びに差動信号用ケーブルの製造方法 |
| WO2011136008A1 (ja) * | 2010-04-28 | 2011-11-03 | 古河電気工業株式会社 | 回転コネクタ装置 |
| JP5823380B2 (ja) * | 2010-04-28 | 2015-11-25 | 古河電気工業株式会社 | 回転コネクタ装置 |
| WO2013153869A1 (ja) * | 2012-04-11 | 2013-10-17 | 株式会社日本マイクロニクス | 多層配線基板とその製造方法並びにプローブカード |
| JP2013219287A (ja) * | 2012-04-11 | 2013-10-24 | Micronics Japan Co Ltd | 多層配線基板とその製造方法 |
| US9622344B2 (en) | 2012-04-11 | 2017-04-11 | Kabushiki Kaisha Nihon Micronics | Multilayer wiring board with enclosed Ur-variant dual conductive layer |
| CN106057297A (zh) * | 2016-07-27 | 2016-10-26 | 河北华通线缆集团股份有限公司 | 一种加强抗拉扁形视频电梯电缆及其生产工艺 |
| SE2250858A1 (en) * | 2022-07-07 | 2024-01-08 | Anders Hansson | A signal transmission device |
| SE545950C2 (en) * | 2022-07-07 | 2024-03-26 | Anders Hansson | A signal transmission device |
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