JP2009152235A5 - - Google Patents
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- Publication number
- JP2009152235A5 JP2009152235A5 JP2007326184A JP2007326184A JP2009152235A5 JP 2009152235 A5 JP2009152235 A5 JP 2009152235A5 JP 2007326184 A JP2007326184 A JP 2007326184A JP 2007326184 A JP2007326184 A JP 2007326184A JP 2009152235 A5 JP2009152235 A5 JP 2009152235A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326184A JP2009152235A (ja) | 2007-12-18 | 2007-12-18 | 強誘電体積層構造及びその製造方法、電界効果トランジスタ及びその製造方法、並びに強誘電体キャパシタ及びその製造方法 |
US12/328,275 US20090152607A1 (en) | 2007-12-18 | 2008-12-04 | Ferroelectric stacked-layer structure, field effect transistor, and ferroelectric capacitor and fabrication methods thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007326184A JP2009152235A (ja) | 2007-12-18 | 2007-12-18 | 強誘電体積層構造及びその製造方法、電界効果トランジスタ及びその製造方法、並びに強誘電体キャパシタ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009152235A JP2009152235A (ja) | 2009-07-09 |
JP2009152235A5 true JP2009152235A5 (ja) | 2010-08-05 |
Family
ID=40752047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007326184A Withdrawn JP2009152235A (ja) | 2007-12-18 | 2007-12-18 | 強誘電体積層構造及びその製造方法、電界効果トランジスタ及びその製造方法、並びに強誘電体キャパシタ及びその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090152607A1 (ja) |
JP (1) | JP2009152235A (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101413273B1 (ko) * | 2007-10-31 | 2014-06-27 | 삼성디스플레이 주식회사 | 광 검출 장치 |
US8164234B2 (en) * | 2009-02-26 | 2012-04-24 | Fujifilm Corporation | Sputtered piezoelectric material |
TWI425559B (zh) * | 2009-09-17 | 2014-02-01 | Univ Nat Chiao Tung | 以單晶氧化物作為基板成長纖鋅礦結構半導體非極性m面磊晶層之方法 |
JP4724258B2 (ja) | 2009-10-29 | 2011-07-13 | パナソニック株式会社 | 半導体記憶装置を駆動する方法 |
JP5899519B2 (ja) * | 2009-11-05 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
WO2011062029A1 (en) * | 2009-11-18 | 2011-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Memory device |
KR101894400B1 (ko) | 2009-12-28 | 2018-09-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치와 반도체 장치 |
US8780629B2 (en) | 2010-01-15 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
KR102542681B1 (ko) * | 2010-01-20 | 2023-06-14 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 전자 기기 |
TWI657565B (zh) | 2011-01-14 | 2019-04-21 | 日商半導體能源研究所股份有限公司 | 半導體記憶裝置 |
US10079053B2 (en) | 2011-04-22 | 2018-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and memory device |
US8916434B2 (en) | 2012-05-11 | 2014-12-23 | Cypress Semiconductor Corporation | Enhanced hydrogen barrier encapsulation method for the control of hydrogen induced degradation of ferroelectric capacitors in an F-RAM process |
DE102014109147A1 (de) * | 2014-06-30 | 2015-12-31 | Infineon Technologies Ag | Feldeffekthalbleiter-Bauelement sowie Verfahren zu dessen Betrieb und Herstellung |
KR101892632B1 (ko) * | 2017-03-09 | 2018-10-04 | 한국과학기술연구원 | 백금족 산화물과 주석 산화물의 화합물을 갖는 반도체 메모리 소자 및 그 제조방법 |
US10962497B2 (en) * | 2017-12-19 | 2021-03-30 | International Business Machines Corporation | Sensors based on negative capacitance field effect transistors |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5077270A (en) * | 1987-03-26 | 1991-12-31 | Matsushita Electric Industrial Co., Ltd. | Elements comprising a film of a perovskite compound whose crystallographic axes are oriented and a method of making such elements |
JP3033067B2 (ja) * | 1992-10-05 | 2000-04-17 | 富士ゼロックス株式会社 | 多層強誘電体導膜の製造方法 |
US5453661A (en) * | 1994-04-15 | 1995-09-26 | Mcnc | Thin film ferroelectric flat panel display devices, and methods for operating and fabricating same |
JP3480624B2 (ja) * | 1995-06-09 | 2003-12-22 | シャープ株式会社 | 強誘電体薄膜被覆基板、その製造方法、及びキャパシタ構造素子 |
JP3103916B2 (ja) * | 1997-07-09 | 2000-10-30 | ソニー株式会社 | 強誘電体キャパシタおよびその製造方法並びにそれを用いたメモリセル |
KR100420121B1 (ko) * | 2001-06-21 | 2004-03-02 | 삼성전자주식회사 | 강유전막을 평탄화막으로 이용하는 강유전체 메모리 장치 및 그 제조방법 |
US6534326B1 (en) * | 2002-03-13 | 2003-03-18 | Sharp Laboratories Of America, Inc. | Method of minimizing leakage current and improving breakdown voltage of polycrystalline memory thin films |
US7153706B2 (en) * | 2004-04-21 | 2006-12-26 | Texas Instruments Incorporated | Ferroelectric capacitor having a substantially planar dielectric layer and a method of manufacture therefor |
KR100785458B1 (ko) * | 2005-05-18 | 2007-12-13 | 삼성전자주식회사 | 강유전체 박막의 제조 방법 및 이를 이용한 반도체 장치의제조 방법 |
-
2007
- 2007-12-18 JP JP2007326184A patent/JP2009152235A/ja not_active Withdrawn
-
2008
- 2008-12-04 US US12/328,275 patent/US20090152607A1/en not_active Abandoned
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