JP2009147375A5 - - Google Patents

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Publication number
JP2009147375A5
JP2009147375A5 JP2009070046A JP2009070046A JP2009147375A5 JP 2009147375 A5 JP2009147375 A5 JP 2009147375A5 JP 2009070046 A JP2009070046 A JP 2009070046A JP 2009070046 A JP2009070046 A JP 2009070046A JP 2009147375 A5 JP2009147375 A5 JP 2009147375A5
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JP
Japan
Prior art keywords
substrate
tray
support portion
plasma processing
electrodes
Prior art date
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Granted
Application number
JP2009070046A
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English (en)
Japanese (ja)
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JP2009147375A (ja
JP4781445B2 (ja
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Priority to JP2009070046A priority Critical patent/JP4781445B2/ja
Priority claimed from JP2009070046A external-priority patent/JP4781445B2/ja
Publication of JP2009147375A publication Critical patent/JP2009147375A/ja
Publication of JP2009147375A5 publication Critical patent/JP2009147375A5/ja
Application granted granted Critical
Publication of JP4781445B2 publication Critical patent/JP4781445B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2009070046A 2009-03-23 2009-03-23 プラズマ処理装置及びプラズマ処理方法 Expired - Lifetime JP4781445B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009070046A JP4781445B2 (ja) 2009-03-23 2009-03-23 プラズマ処理装置及びプラズマ処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009070046A JP4781445B2 (ja) 2009-03-23 2009-03-23 プラズマ処理装置及びプラズマ処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005297378A Division JP4361045B2 (ja) 2005-10-12 2005-10-12 プラズマ処理装置及びプラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2009147375A JP2009147375A (ja) 2009-07-02
JP2009147375A5 true JP2009147375A5 (enExample) 2010-10-21
JP4781445B2 JP4781445B2 (ja) 2011-09-28

Family

ID=40917547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009070046A Expired - Lifetime JP4781445B2 (ja) 2009-03-23 2009-03-23 プラズマ処理装置及びプラズマ処理方法

Country Status (1)

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JP (1) JP4781445B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5593384B2 (ja) 2010-06-01 2014-09-24 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
US9076827B2 (en) 2010-09-14 2015-07-07 Applied Materials, Inc. Transfer chamber metrology for improved device yield
US20120234229A1 (en) * 2011-03-16 2012-09-20 Applied Materials, Inc. Substrate support assembly for thin film deposition systems

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335616A (ja) * 1994-06-06 1995-12-22 Hitachi Ltd ウエハ処理装置
JP2000286328A (ja) * 1999-03-31 2000-10-13 Tokyo Electron Ltd ガス処理装置
JP4361045B2 (ja) * 2005-10-12 2009-11-11 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法

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