JP2009135458A5 - - Google Patents
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- Publication number
- JP2009135458A5 JP2009135458A5 JP2008273591A JP2008273591A JP2009135458A5 JP 2009135458 A5 JP2009135458 A5 JP 2009135458A5 JP 2008273591 A JP2008273591 A JP 2008273591A JP 2008273591 A JP2008273591 A JP 2008273591A JP 2009135458 A5 JP2009135458 A5 JP 2009135458A5
- Authority
- JP
- Japan
- Prior art keywords
- protruding electrode
- electrode
- insulating resin
- covering
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 26
- 239000011347 resin Substances 0.000 claims 17
- 229920005989 resin Polymers 0.000 claims 17
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 4
- 230000000875 corresponding Effects 0.000 claims 3
- 238000002788 crimping Methods 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008273591A JP4698722B2 (ja) | 2007-11-08 | 2008-10-23 | 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器 |
US12/266,907 US8129846B2 (en) | 2007-11-08 | 2008-11-07 | Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device |
CN2008102463746A CN101488487B (zh) | 2007-11-08 | 2008-11-10 | 元件搭载用基板、半导体组件及其制造方法及便携式设备 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007291342 | 2007-11-08 | ||
JP2007291342 | 2007-11-08 | ||
JP2008273591A JP4698722B2 (ja) | 2007-11-08 | 2008-10-23 | 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010271794A Division JP5295211B2 (ja) | 2007-11-08 | 2010-12-06 | 半導体モジュールの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009135458A JP2009135458A (ja) | 2009-06-18 |
JP2009135458A5 true JP2009135458A5 (zh) | 2010-05-13 |
JP4698722B2 JP4698722B2 (ja) | 2011-06-08 |
Family
ID=40867002
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008273591A Expired - Fee Related JP4698722B2 (ja) | 2007-11-08 | 2008-10-23 | 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器 |
JP2010271794A Active JP5295211B2 (ja) | 2007-11-08 | 2010-12-06 | 半導体モジュールの製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010271794A Active JP5295211B2 (ja) | 2007-11-08 | 2010-12-06 | 半導体モジュールの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP4698722B2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5002633B2 (ja) * | 2009-09-30 | 2012-08-15 | 三洋電機株式会社 | 半導体モジュールおよび携帯機器 |
US9455162B2 (en) * | 2013-03-14 | 2016-09-27 | Invensas Corporation | Low cost interposer and method of fabrication |
JP6102398B2 (ja) * | 2013-03-26 | 2017-03-29 | セイコーエプソン株式会社 | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5823943B2 (ja) * | 1975-07-16 | 1983-05-18 | 松下電器産業株式会社 | 絶縁体の貫通電極形成方法 |
JP3474936B2 (ja) * | 1994-10-07 | 2003-12-08 | 株式会社東芝 | 実装用印刷配線板およびその製造方法 |
JP2001326459A (ja) * | 2000-05-16 | 2001-11-22 | North:Kk | 配線回路基板とその製造方法 |
JP4568215B2 (ja) * | 2005-11-30 | 2010-10-27 | 三洋電機株式会社 | 回路装置および回路装置の製造方法 |
-
2008
- 2008-10-23 JP JP2008273591A patent/JP4698722B2/ja not_active Expired - Fee Related
-
2010
- 2010-12-06 JP JP2010271794A patent/JP5295211B2/ja active Active
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