JP2009135458A5 - - Google Patents

Download PDF

Info

Publication number
JP2009135458A5
JP2009135458A5 JP2008273591A JP2008273591A JP2009135458A5 JP 2009135458 A5 JP2009135458 A5 JP 2009135458A5 JP 2008273591 A JP2008273591 A JP 2008273591A JP 2008273591 A JP2008273591 A JP 2008273591A JP 2009135458 A5 JP2009135458 A5 JP 2009135458A5
Authority
JP
Japan
Prior art keywords
protruding electrode
electrode
insulating resin
covering
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008273591A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135458A (ja
JP4698722B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008273591A priority Critical patent/JP4698722B2/ja
Priority claimed from JP2008273591A external-priority patent/JP4698722B2/ja
Priority to US12/266,907 priority patent/US8129846B2/en
Priority to CN2008102463746A priority patent/CN101488487B/zh
Publication of JP2009135458A publication Critical patent/JP2009135458A/ja
Publication of JP2009135458A5 publication Critical patent/JP2009135458A5/ja
Application granted granted Critical
Publication of JP4698722B2 publication Critical patent/JP4698722B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008273591A 2007-11-08 2008-10-23 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器 Expired - Fee Related JP4698722B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008273591A JP4698722B2 (ja) 2007-11-08 2008-10-23 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器
US12/266,907 US8129846B2 (en) 2007-11-08 2008-11-07 Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
CN2008102463746A CN101488487B (zh) 2007-11-08 2008-11-10 元件搭载用基板、半导体组件及其制造方法及便携式设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007291342 2007-11-08
JP2007291342 2007-11-08
JP2008273591A JP4698722B2 (ja) 2007-11-08 2008-10-23 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010271794A Division JP5295211B2 (ja) 2007-11-08 2010-12-06 半導体モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2009135458A JP2009135458A (ja) 2009-06-18
JP2009135458A5 true JP2009135458A5 (zh) 2010-05-13
JP4698722B2 JP4698722B2 (ja) 2011-06-08

Family

ID=40867002

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008273591A Expired - Fee Related JP4698722B2 (ja) 2007-11-08 2008-10-23 素子搭載用基板、半導体モジュールおよびその製造方法、ならびに携帯機器
JP2010271794A Active JP5295211B2 (ja) 2007-11-08 2010-12-06 半導体モジュールの製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010271794A Active JP5295211B2 (ja) 2007-11-08 2010-12-06 半導体モジュールの製造方法

Country Status (1)

Country Link
JP (2) JP4698722B2 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5002633B2 (ja) * 2009-09-30 2012-08-15 三洋電機株式会社 半導体モジュールおよび携帯機器
US9455162B2 (en) * 2013-03-14 2016-09-27 Invensas Corporation Low cost interposer and method of fabrication
JP6102398B2 (ja) * 2013-03-26 2017-03-29 セイコーエプソン株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823943B2 (ja) * 1975-07-16 1983-05-18 松下電器産業株式会社 絶縁体の貫通電極形成方法
JP3474936B2 (ja) * 1994-10-07 2003-12-08 株式会社東芝 実装用印刷配線板およびその製造方法
JP2001326459A (ja) * 2000-05-16 2001-11-22 North:Kk 配線回路基板とその製造方法
JP4568215B2 (ja) * 2005-11-30 2010-10-27 三洋電機株式会社 回路装置および回路装置の製造方法

Similar Documents

Publication Publication Date Title
JP2008160160A5 (zh)
JP2009194322A5 (zh)
JP2008277742A5 (zh)
JP2008537333A5 (zh)
WO2009011077A1 (ja) 半導体装置及びその製造方法
WO2009002381A3 (en) Mold compound circuit structure for enhanced electrical and thermal performance
JP2010087221A5 (zh)
JP2010251552A5 (zh)
JP2008028361A5 (zh)
JP2009027039A5 (zh)
JP2013004881A5 (zh)
WO2012074783A3 (en) Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
JP2013254830A5 (zh)
JP2011009514A5 (zh)
JP2006253289A5 (zh)
JP2007267113A5 (zh)
JP2016096292A5 (zh)
JP2009182272A5 (zh)
JP2008084959A5 (zh)
JP2012015504A5 (zh)
JP2018125349A5 (zh)
JP2010123592A5 (zh)
JP2010219513A5 (zh)
JP2009246174A5 (zh)
JP2009194189A5 (zh)