JP2009124622A - Ccd cooling structure, ccd camera, and ccd cooling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a CCD cooling structure capable of cooling a CCD effectively without giving a mechanical load to the CCD the position of which is adjusted in micron units. <P>SOLUTION: To dissipate heat emitted by a CCD 3 effectively, a heat sink 6 is attached to an attaching part of a color separation prism 2 to which the CCD 3 is adhered so that the surface of the heat sink 6 directly contacts the heat emitting plane of the CCD 3 in the way that they are pressed against each other with a uniform pressure by fixing with a spacer 7 having a spring 5. In this case, the spacer 7 is shaped so that it is fixed to a tap provided to the color separation prism 2 as an attaching part. Thus, the heat emitting plane of the CCD 3 comes into contact with the surface of the heat sink 6 constantly as uniform pressure making the contact to the CCD 3 not rigidly but by elasticity of the spring 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a CCD cooling structure, a CCD camera, and a CCD cooling method.

  In recent years, the pixel density of a CCD (Charge Coupled Device) has been increasing, and the requirement for the cooling performance of the device has become stricter year by year. Furthermore, it has become essential to avoid a cooling structure in which a mechanical load is applied to the CCD due to the effects of thermal expansion, vibration, etc. due to a temperature change and the CCD is displaced.

  For this reason, for example, in Japanese Patent Application Laid-Open No. 2007-123403 “Electronic Device” of Patent Document 1, in order to effectively remove noise emitted from the CCD sensor, a conductive heat sink disposed in contact with the CCD sensor is used. Have proposed a structure in which a leaf spring having conductivity is pressed and the leaf spring is connected to the ground layer of the CCD substrate. However, in the technique of this patent document 1, when a single-plate CCD is used, even if it is possible to prevent the displacement of the CCD in a specific direction by a leaf spring, a high resolution like that for broadcasting equipment can be achieved. In the case of the required three-plate CCD camera, there is a risk that the CCD will be displaced in either direction due to some external factors including the heat, shock, and vibration of the CCD, and the resolution will deteriorate. There is. Further, since the CCD lead terminal is soldered and a load is generated in a certain direction, there is a possibility that the problem of deterioration of the solder strength may occur at the same time.

Further, in Japanese Patent Application No. 2007-035101 “Semiconductor Package Mounting Structure” of Patent Document 2, a mounting board on which a heat radiating member for radiating heat of the generated semiconductor package is mounted is placed in contact with the semiconductor package. And the structure which mutually presses with an elastic body is proposed. However, as in the case of Patent Document 1, the technique disclosed in Patent Document 2 cannot prevent the displacement of the CCD in the case of a three-plate CCD camera that requires a high resolution for broadcasting equipment. There's a problem. Further, it is difficult to adjust the positions of the semiconductor package and the mounting substrate so as to press each other with a uniform force, and the vibration resistance characteristics are also weak.
JP 2007-123403 A (page 3-5) Japanese Patent Application No. 2007-035101 (page 2-3)

  As described above, in the prior art, there is a problem as a technique for effectively cooling the CCD while removing the cause of the CCD positional deviation as a CCD cooling structure, and particularly high resolution is required. There is a big problem in terms of CCD cooling technology applicable to a three-plate CCD camera for broadcasting equipment. Generally, a CCD has a dark current that increases at a high temperature, and image noise increases. Therefore, the CCD fixing unit is not displaced by external factors (temperature, vibration). It is important to cool.

  For this reason, a structure different from the above-mentioned Patent Documents 1 and 2 is shown in FIG. 3 with respect to the conventional structure used to make it applicable to a three-plate CCD camera without applying a mechanical load to the CCD. This will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a structure of a conventional CCD fixing portion, and FIG. 4 is an exploded view for explaining a manufacturing process of the conventional CCD fixing portion. As shown in FIGS. 3 and 4, the CCD fixing unit includes a CCD drive board 4, a heat radiation rubber 5a, a Peltier 8a, a heat sink 6, and a heat sink bracket 7a on the color separation prism 2 disposed on the front panel 1. It is formed by fixing with a cooling mechanism using each member.

  As shown in FIG. 3, the CCD 3 is imaged on the R, G, and B channels through the color separation prism 2. The position of the CCD 3 is adjusted in units of microns by a manipulator with a total of six axes including rotation angles (yawing, rolling, pitching) in addition to the X, Y, and Z axes. It is fixed to the adhesive.

  On the other hand, if the heat sink 6 is directly attached to the CCD 3 in order to dissipate the heat generated by the CCD 3, the fixing of the CCD 3 becomes rigid, so that when the temperature changes, the prism glass of the color separation prism 2 and the heat sink 6 As a result, mechanical stress is generated on the device fixing surface of the CCD 3 due to the difference in thermal expansion of the CCD 3. As a result, the position of the CCD 3 adjusted in units of folding angles and microns by the 6-axis control manipulator is shifted. There arises a problem that it becomes a cause of deterioration of the slab.

  Therefore, as shown in FIG. 3 and FIG. 4, heat radiation is performed between the CCD 3 and the heat sink 6 via a heat radiating rubber 5 a having cushioning properties, and the heat sink 6 is fixed via a heat sink bracket 7 a. The fixing unit provided in the color separation prism 2 is fixed with screws 9.

  However, in the conventional structure of the CCD fixing portion as described above, it is unavoidable that the problem that the cooling effect of the CCD 3 is lowered due to the thermal resistance of the heat radiation rubber 5a is accompanied.

  The present invention has been made in order to solve such a problem, and the CCD is adjusted effectively without applying mechanical stress that causes a positional shift to the CCD whose position is adjusted in units of microns. An object of the present invention is to provide a CCD cooling structure, a CCD camera, and a CCD cooling method that can be cooled.

  In other words, the present invention can cool the CCD effectively by attaching a heat sink for dissipating and cooling the generated heat of the CCD so as to be in close contact with the CCD via a spring and a spacer, not a rubber material. And that is the purpose.

  In order to solve the above-described problems, the CCD cooling structure, the CCD camera, and the CCD cooling method according to the present invention employ the following characteristic configuration.

  (1) A CCD cooling structure that cools a CCD (Charge Coupled Device) that is a solid-state imaging device, and that has a structure in which the heat dissipation surface of the CCD and the surface of the heat sink that is in direct contact are pressed against each other by the elastic force of a spring. .

  According to the CCD cooling structure, CCD camera, and CCD cooling method of the present invention, the following effects can be obtained.

  First, the surface of the heat sink can be brought into direct contact with the heat dissipation surface of the CCD, and the CCD can be effectively cooled.

  Second, the pressing force of the heat sink against the heat radiating surface of the CCD can be made uniform and adjustable at each position.

  Third, it is possible to prevent the position of the CCD from being displaced due to thermal expansion or vibration due to a temperature change, and to prevent deterioration of resolution.

  Hereinafter, preferred embodiments of a CCD cooling structure, a CCD camera, and a CCD cooling method according to the present invention will be described with reference to the accompanying drawings.

(Features of the present invention)
Prior to the description of the embodiments of the present invention, an outline of the features of the present invention will be described first. The present invention applies a non-uniform mechanical load to a CCD (charge coupled device or solid-state image pickup device) by using a heat sink (heat radiator) to cool the solid-state image pickup device or CCD (Charge Coupled Device). It is characterized in that it has a structure that can be mounted without dissipating the heat generated by the CCD effectively.

  In other words, since the heat sink (heatsink) is attached via a spring and does not adopt a structure that causes the CCD 3 to be rigidly fixed, it is affected by thermal expansion and vibration due to temperature changes. Since it has a structure that can prevent a mechanical load from being applied to the CCD fixed part that causes the position of the CCD that has been adjusted in units of microns to shift, it is possible to eliminate the cause of resolution degradation. It has become.

(Embodiment of the present invention)
Examples of the CCD cooling structure, the CCD camera, and the CCD cooling method according to the present invention are shown in FIGS. FIG. 1 is a sectional view showing an example of a CCD cooling structure according to the present invention, and FIG. 2 is an exploded view for explaining an example of a manufacturing process of the CCD cooling structure according to the present invention. As shown in FIGS. 1 and 2, the CCD fixing unit includes a heat sink 6 a, a CCD drive substrate 4, a heat sink 6 b, a washer 8, a spring 5, and a spacer 7 on the color separation prism 2 disposed on the front panel 1. It is formed by fixing in the form provided with the cooling mechanism using each of these members.

  As shown in FIG. 1, the CCD 3 is imaged on three channels of R, G, and B through the color separation prism 2. The position of the CCD 3 is adjusted in micron units by a manipulator with a total of six axes including rotation angles (yawing, rolling, pitching) in addition to the X, Y, and Z axes, and is a color separation prism. 2 is adhered and fixed.

  Further, in order to effectively dissipate the heat generated by the CCD 3, the mounting of the heat sinks 6a and 6b to the mounting portion of the color separation prism 2 to which the CCD 3 is bonded and fixed is a conventional technique as shown in FIGS. The surface of the heat sink 6a is fixed to the back surface (heat dissipating surface) of the CCD 3 by fixing it with the spacer 7 through the spring 5 instead of fixing with screws using the heat dissipating rubber or the heat sink bracket. In this structure, they can be brought into direct contact with each other with a uniform pressing force.

  Furthermore, the spacer 7 is shaped so that it can be fixed to a tap provided as an attachment portion on the color separation prism 2, so that the contact with the CCD 3 is not always rigid but by the elastic force of the spring 5. As a uniform pressing force, the heat radiation surface of the CCD 3 and the surface of the heat sink 6a can be brought into contact with each other. Here, by adjusting the sizes of the spring 5 and the spacer 7, it is possible to easily adjust the pressing force between the surface of the heat sink 6 a and the heat radiation surface of the CCD 3 to a desired value.

  Thus, the mechanical stress applied to the CCD 3 due to thermal expansion or vibration due to temperature change is absorbed by the elastic force of the spring 5, so that it is adjusted in units of microns, which is a problem in the prior art. It is possible to prevent the position of the placed CCD 3 from being shifted due to thermal expansion or vibration due to a temperature change, resulting in deterioration of resolution.

  That is, in the CCD cooling structure as shown in FIGS. 1 and 2, when cooling the CCD 3, the heat sink 6 (6 a, 6 b) is placed on the heat radiating surface of the CCD 3 without applying an uneven mechanical load to the CCD 3. It is possible to dissipate the heat generated by the CCD 3 effectively by attaching it in a direct contact state. Here, since the heat sink 6 (6a, 6b) is not attached to the rigid by using the spring 5, it is mechanically attached to the back surface of the CCD due to thermal expansion or vibration due to temperature change. A structure that does not give a load is possible.

  As described above, according to the embodiment of the present invention, the following effects can be obtained.

  First, the surface of the heat sink 6 (6a, 6b) can be brought into direct contact with the heat dissipation surface of the CCD 3, and the CCD 3 can be effectively cooled.

  Second, the pressing force of the heat sink 6 (6a, 6b) against the heat radiation surface of the CCD 3 can be made uniform and adjustable at each position.

  Third, it is possible to prevent the position of the CCD 3 from being shifted due to thermal expansion or vibration due to a temperature change, and to prevent deterioration of resolution.

  By adopting the CCD cooling structure according to the present invention as a three-channel CCD heat dissipation mechanism of R, G, B in an ultra-sensitive three-plate camera, an EM-CCD (Electron Multiplying CCD: It is also possible to commercialize a three-panel camera that employs an ultra-high sensitivity CCD).

  In other words, an EM-CCD (Electron Multiplying CCD) having an electron multiplying function generally has a self-cooling mechanism by incorporating a Peltier, but it is generated from the Peltier in order to maintain optimum image quality. It is necessary to efficiently dissipate heat, and a cooling structure that can withstand severe temperature changes and severe vibration conditions and obtain the maximum heat dissipation effect is essential. The CCD cooling structure can satisfy such requirements. In addition, the present invention has a structure that can remove a mechanical load on the CCD, and is a structure that is independent from the drive circuit board of the CCD and does not apply any load to the soldered portion.

The configuration of the preferred embodiment of the present invention has been described above. However, it should be noted that such examples are merely illustrative of the invention and do not limit the invention in any way. Those skilled in the art will readily understand that various modifications and changes can be made according to a specific application without departing from the gist of the present invention. For example, the embodiment of the present invention can be expressed as the following configuration in addition to the configuration (1) in the means for solving the problems.
(2) A spacer provided with the spring is fixed to a tap provided as an attachment portion of a color separation prism to which the CCD is fixed, so that the heat dissipation surface of the CCD and the surface of the heat sink are interposed through the spring. The CCD cooling structure according to the above (1), wherein the CCDs are brought into contact with each other so as to be pressed against each other.
(3) A CCD camera provided with a CCD as an image pickup device, wherein the CCD camera has the CCD cooling structure of (1) or (2) as a cooling structure for cooling the CCD.
(4) The CCD camera according to (3), wherein the CCD camera is a three-plate type CCD camera.
(5) A CCD cooling method for cooling a CCD (Charge Coupled Device), which is a solid-state imaging device, and cooling by bringing the heat dissipation surface of the CCD into contact with the surface of the heat sink that is in direct contact with the elastic force of the spring. CCD cooling method.
(6) The spacer provided with the spring is fixed to the tap of the color separation prism to which the CCD is fixed, and the heat dissipation surface of the CCD and the surface of the heat sink are brought into contact with each other so as to press each other. CCD cooling method.

It is sectional drawing which shows an example of the CCD cooling structure by this invention. It is an exploded view for demonstrating an example of the manufacturing process of the CCD cooling structure by this invention. It is sectional drawing which shows the structure of the conventional CCD fixing | fixed part. It is an exploded view for demonstrating the manufacturing process of the conventional CCD fixing | fixed part.

Explanation of symbols

1 Front panel 2 Color separation prism 3 CCD
4 CCD drive board 5 Spring 5a Heat radiation rubber 6 Heat sink 6a Heat sink 6b Heat sink 7 Spacer 7a Heat sink bracket 8 Washer 8a Peltier 9 Screw

Claims (6)

  A CCD cooling structure for cooling a CCD (Charge Coupled Device) which is a solid-state imaging device, wherein the CCD heat dissipation surface and the surface of the heat sink that is in direct contact with each other are pressed against each other by the elastic force of a spring. Cooling structure.   The spacer provided with the spring is fixed to the tap provided as the color separation prism mounting portion to which the CCD is fixed, so that the heat dissipation surface of the CCD and the surface of the heat sink are pressed against each other via the spring. The CCD cooling structure according to claim 1, wherein the CCD cooling structure is brought into contact with each other.   A CCD camera comprising a CCD as an imaging device, wherein the CCD cooling structure according to claim 1 or 2 is provided as a cooling structure for cooling the CCD.   4. The CCD camera according to claim 3, wherein the CCD camera is a three-plate type CCD camera.   A CCD cooling method for cooling a CCD (Charge Coupled Device), which is a solid-state image sensor, and cooling by bringing the heat sink surface of the CCD into contact with the surface of the heat sink that is in direct contact with the elastic force of the spring The CCD cooling method characterized.   The spacer including the spring is fixed to a tap of a color separation prism to which the CCD is fixed, and the heat dissipation surface of the CCD and the surface of the heat sink are brought into contact with each other so as to press each other. 5. The CCD cooling method according to 5.

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