JP2009123938A5 - - Google Patents
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- Publication number
- JP2009123938A5 JP2009123938A5 JP2007296522A JP2007296522A JP2009123938A5 JP 2009123938 A5 JP2009123938 A5 JP 2009123938A5 JP 2007296522 A JP2007296522 A JP 2007296522A JP 2007296522 A JP2007296522 A JP 2007296522A JP 2009123938 A5 JP2009123938 A5 JP 2009123938A5
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- anode
- comb
- chip
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 64
- 239000007787 solid Substances 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 230000001808 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 239000007784 solid electrolyte Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 18
- 230000001070 adhesive Effects 0.000 description 18
- 230000000694 effects Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001052 transient Effects 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007296522A JP5034887B2 (ja) | 2007-11-15 | 2007-11-15 | チップ形固体電解コンデンサ |
| US12/678,529 US8421557B2 (en) | 2007-11-15 | 2008-11-12 | Chip-type solid electrolytic capacitor and chip-type filter |
| CN2008801161709A CN101861632B (zh) | 2007-11-15 | 2008-11-12 | 片式固体电解电容器和片式滤波器 |
| PCT/JP2008/003269 WO2009063618A1 (ja) | 2007-11-15 | 2008-11-12 | チップ形固体電解コンデンサとチップ形フィルタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007296522A JP5034887B2 (ja) | 2007-11-15 | 2007-11-15 | チップ形固体電解コンデンサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009123938A JP2009123938A (ja) | 2009-06-04 |
| JP2009123938A5 true JP2009123938A5 (zh) | 2010-12-09 |
| JP5034887B2 JP5034887B2 (ja) | 2012-09-26 |
Family
ID=40815770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007296522A Expired - Fee Related JP5034887B2 (ja) | 2007-11-15 | 2007-11-15 | チップ形固体電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5034887B2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021085555A1 (ja) * | 2019-10-31 | 2021-05-06 | パナソニックＩｐマネジメント株式会社 | 電解コンデンサ |
| JPWO2021172236A1 (zh) * | 2020-02-28 | 2021-09-02 | ||
| US20230119189A1 (en) * | 2020-03-31 | 2023-04-20 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4524873B2 (ja) * | 1999-12-10 | 2010-08-18 | 株式会社村田製作所 | 積層型固体電解コンデンサ |
| JP2003142347A (ja) * | 2001-11-02 | 2003-05-16 | Rohm Co Ltd | 固体電解コンデンサの構造及びその製造方法 |
| JP4366055B2 (ja) * | 2002-08-01 | 2009-11-18 | ローム株式会社 | 固体電解コンデンサの製造方法 |
| JP2005269293A (ja) * | 2004-03-19 | 2005-09-29 | Sanyo Electric Co Ltd | デカップリングデバイス |
| JP4872365B2 (ja) * | 2005-05-23 | 2012-02-08 | パナソニック株式会社 | チップ形固体電解コンデンサ |
-
2007
- 2007-11-15 JP JP2007296522A patent/JP5034887B2/ja not_active Expired - Fee Related
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