WO2009063618A1 - チップ形固体電解コンデンサとチップ形フィルタ - Google Patents
チップ形固体電解コンデンサとチップ形フィルタ Download PDFInfo
- Publication number
- WO2009063618A1 WO2009063618A1 PCT/JP2008/003269 JP2008003269W WO2009063618A1 WO 2009063618 A1 WO2009063618 A1 WO 2009063618A1 JP 2008003269 W JP2008003269 W JP 2008003269W WO 2009063618 A1 WO2009063618 A1 WO 2009063618A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- electrolytic capacitor
- solid electrolytic
- type
- type filter
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 6
- 239000007787 solid Substances 0.000 title abstract 6
- 238000010030 laminating Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0014—Capacitor filters, i.e. capacitors whose parasitic inductance is of relevance to consider it as filter
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801161709A CN101861632B (zh) | 2007-11-15 | 2008-11-12 | 片式固体电解电容器和片式滤波器 |
US12/678,529 US8421557B2 (en) | 2007-11-15 | 2008-11-12 | Chip-type solid electrolytic capacitor and chip-type filter |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-296522 | 2007-11-15 | ||
JP2007-296521 | 2007-11-15 | ||
JP2007296522A JP5034887B2 (ja) | 2007-11-15 | 2007-11-15 | チップ形固体電解コンデンサ |
JP2007296521A JP5034886B2 (ja) | 2007-11-15 | 2007-11-15 | チップ形固体電解コンデンサ |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009063618A1 true WO2009063618A1 (ja) | 2009-05-22 |
Family
ID=40638473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/003269 WO2009063618A1 (ja) | 2007-11-15 | 2008-11-12 | チップ形固体電解コンデンサとチップ形フィルタ |
Country Status (3)
Country | Link |
---|---|
US (1) | US8421557B2 (ja) |
CN (1) | CN101861632B (ja) |
WO (1) | WO2009063618A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140078647A1 (en) * | 2012-09-14 | 2014-03-20 | Apaq Technology Co., Ltd. | Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same |
WO2014174833A1 (ja) * | 2013-04-26 | 2014-10-30 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ及びそれを用いた実装体 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492254B (zh) * | 2010-12-28 | 2015-07-11 | Ind Tech Res Inst | 去耦合元件 |
US9098237B2 (en) * | 2011-08-31 | 2015-08-04 | Apple Inc. | Systems and methods for coupling electrically isolated sections of an electronic device |
TWI511172B (zh) | 2011-11-10 | 2015-12-01 | 財團法人工業技術研究院 | 去耦合元件及其製造方法 |
JP5879491B2 (ja) * | 2012-02-28 | 2016-03-08 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ |
TWI443698B (zh) * | 2012-09-13 | 2014-07-01 | Ind Tech Res Inst | 去耦合元件及其製造方法 |
JPWO2017163571A1 (ja) * | 2016-03-25 | 2019-01-31 | パナソニックIpマネジメント株式会社 | 電解コンデンサ |
WO2018180437A1 (ja) * | 2017-03-29 | 2018-10-04 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサおよびその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230156A (ja) * | 1999-12-10 | 2001-08-24 | Showa Denko Kk | 積層型固体電解コンデンサ |
JP2003142347A (ja) * | 2001-11-02 | 2003-05-16 | Rohm Co Ltd | 固体電解コンデンサの構造及びその製造方法 |
JP2004071634A (ja) * | 2002-08-01 | 2004-03-04 | Rohm Co Ltd | 固体電解コンデンサ用コンデンサ素子の製造方法及びこのコンデンサ素子を使用した固体電解コンデンサの製造方法 |
JP2005269293A (ja) * | 2004-03-19 | 2005-09-29 | Sanyo Electric Co Ltd | デカップリングデバイス |
JP2007005760A (ja) * | 2005-05-23 | 2007-01-11 | Matsushita Electric Ind Co Ltd | チップ形固体電解コンデンサ |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6421227B2 (en) | 1999-12-10 | 2002-07-16 | Showa Denko K.K. | Solid electrolytic multilayer capacitor |
AU2003244256A1 (en) * | 2002-06-18 | 2003-12-31 | Tdk Corporation | Solid electroytic capacitor and production method therefor |
-
2008
- 2008-11-12 CN CN2008801161709A patent/CN101861632B/zh not_active Expired - Fee Related
- 2008-11-12 US US12/678,529 patent/US8421557B2/en active Active
- 2008-11-12 WO PCT/JP2008/003269 patent/WO2009063618A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001230156A (ja) * | 1999-12-10 | 2001-08-24 | Showa Denko Kk | 積層型固体電解コンデンサ |
JP2003142347A (ja) * | 2001-11-02 | 2003-05-16 | Rohm Co Ltd | 固体電解コンデンサの構造及びその製造方法 |
JP2004071634A (ja) * | 2002-08-01 | 2004-03-04 | Rohm Co Ltd | 固体電解コンデンサ用コンデンサ素子の製造方法及びこのコンデンサ素子を使用した固体電解コンデンサの製造方法 |
JP2005269293A (ja) * | 2004-03-19 | 2005-09-29 | Sanyo Electric Co Ltd | デカップリングデバイス |
JP2007005760A (ja) * | 2005-05-23 | 2007-01-11 | Matsushita Electric Ind Co Ltd | チップ形固体電解コンデンサ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140078647A1 (en) * | 2012-09-14 | 2014-03-20 | Apaq Technology Co., Ltd. | Stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins and method of manufacturing the same |
WO2014174833A1 (ja) * | 2013-04-26 | 2014-10-30 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ及びそれを用いた実装体 |
US9490077B2 (en) | 2013-04-26 | 2016-11-08 | Panasonic Intellectual Property Management Co., Ltd. | Solid electrolytic capacitor and mounting assembly |
JPWO2014174833A1 (ja) * | 2013-04-26 | 2017-02-23 | パナソニックIpマネジメント株式会社 | 固体電解コンデンサ及びそれを用いた実装体 |
Also Published As
Publication number | Publication date |
---|---|
US20100214038A1 (en) | 2010-08-26 |
CN101861632A (zh) | 2010-10-13 |
US8421557B2 (en) | 2013-04-16 |
CN101861632B (zh) | 2012-08-08 |
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