JP2009123656A5 - - Google Patents
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- Publication number
- JP2009123656A5 JP2009123656A5 JP2007299326A JP2007299326A JP2009123656A5 JP 2009123656 A5 JP2009123656 A5 JP 2009123656A5 JP 2007299326 A JP2007299326 A JP 2007299326A JP 2007299326 A JP2007299326 A JP 2007299326A JP 2009123656 A5 JP2009123656 A5 JP 2009123656A5
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- JP
- Japan
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007299326A JP5014080B2 (ja) | 2007-11-19 | 2007-11-19 | 面状ヒータ |
US12/270,094 US8071920B2 (en) | 2007-11-19 | 2008-11-13 | Planar heater |
TW97143807A TWI471054B (zh) | 2007-11-19 | 2008-11-13 | 平面狀加熱器 |
KR1020080114290A KR101470017B1 (ko) | 2007-11-19 | 2008-11-17 | 면상 히터 |
CN200810176276XA CN101442845B (zh) | 2007-11-19 | 2008-11-19 | 面状加热器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007299326A JP5014080B2 (ja) | 2007-11-19 | 2007-11-19 | 面状ヒータ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009123656A JP2009123656A (ja) | 2009-06-04 |
JP2009123656A5 true JP2009123656A5 (ja) | 2010-12-09 |
JP5014080B2 JP5014080B2 (ja) | 2012-08-29 |
Family
ID=40727041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007299326A Expired - Fee Related JP5014080B2 (ja) | 2007-11-19 | 2007-11-19 | 面状ヒータ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8071920B2 (ja) |
JP (1) | JP5014080B2 (ja) |
KR (1) | KR101470017B1 (ja) |
CN (1) | CN101442845B (ja) |
TW (1) | TWI471054B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4913695B2 (ja) * | 2007-09-20 | 2012-04-11 | 東京エレクトロン株式会社 | 基板処理装置及びそれに用いる基板載置台 |
JP2009231401A (ja) * | 2008-03-21 | 2009-10-08 | Tokyo Electron Ltd | 載置台構造及び熱処理装置 |
US9719169B2 (en) * | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
US10224182B2 (en) * | 2011-10-17 | 2019-03-05 | Novellus Systems, Inc. | Mechanical suppression of parasitic plasma in substrate processing chamber |
US9088085B2 (en) * | 2012-09-21 | 2015-07-21 | Novellus Systems, Inc. | High temperature electrode connections |
US10177014B2 (en) * | 2012-12-14 | 2019-01-08 | Applied Materials, Inc. | Thermal radiation barrier for substrate processing chamber components |
US9847222B2 (en) | 2013-10-25 | 2017-12-19 | Lam Research Corporation | Treatment for flowable dielectric deposition on substrate surfaces |
US10049921B2 (en) | 2014-08-20 | 2018-08-14 | Lam Research Corporation | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor |
US10388546B2 (en) | 2015-11-16 | 2019-08-20 | Lam Research Corporation | Apparatus for UV flowable dielectric |
US9916977B2 (en) | 2015-11-16 | 2018-03-13 | Lam Research Corporation | Low k dielectric deposition via UV driven photopolymerization |
US10674566B2 (en) * | 2017-03-02 | 2020-06-02 | Coorstek Kk | Planar heater |
US10147610B1 (en) | 2017-05-30 | 2018-12-04 | Lam Research Corporation | Substrate pedestal module including metallized ceramic tubes for RF and gas delivery |
CN207995432U (zh) * | 2018-04-13 | 2018-10-19 | 广州洲宗金属制品有限公司 | 一种钎焊式铝合金复合底板及发热盘 |
US11600470B2 (en) * | 2019-12-27 | 2023-03-07 | Applied Materials, Inc. | Targeted heat control systems |
US11699602B2 (en) * | 2020-07-07 | 2023-07-11 | Applied Materials, Inc. | Substrate support assemblies and components |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5478429A (en) * | 1993-01-20 | 1995-12-26 | Tokyo Electron Limited | Plasma process apparatus |
JP3165938B2 (ja) * | 1993-06-24 | 2001-05-14 | 東京エレクトロン株式会社 | ガス処理装置 |
CN1066903C (zh) * | 1995-07-26 | 2001-06-06 | 保定风帆集团有限责任公司 | 特种高温远红外定向强辐射器 |
US6066836A (en) * | 1996-09-23 | 2000-05-23 | Applied Materials, Inc. | High temperature resistive heater for a process chamber |
JPH11343571A (ja) * | 1998-05-29 | 1999-12-14 | Ngk Insulators Ltd | サセプター |
JP4641569B2 (ja) * | 1998-07-24 | 2011-03-02 | 日本碍子株式会社 | 窒化アルミニウム質焼結体、耐蝕性部材、金属埋設および半導体保持装置 |
JP3434721B2 (ja) * | 1998-11-30 | 2003-08-11 | 東芝セラミックス株式会社 | 封止端子 |
KR100334993B1 (ko) * | 1998-12-01 | 2002-05-02 | 추후제출 | 히터 |
JP4697909B2 (ja) * | 2000-05-25 | 2011-06-08 | コバレントマテリアル株式会社 | カーボンワイヤー発熱体封入ヒータ |
EP1349429A3 (en) * | 2002-03-25 | 2007-10-24 | Tokyo Electron Limited | Carbon wire heating object sealing heater and fluid heating apparatus using the same heater |
JP4083512B2 (ja) * | 2002-08-30 | 2008-04-30 | 東京エレクトロン株式会社 | 基板処理装置 |
CN2699613Y (zh) * | 2004-05-08 | 2005-05-11 | 戴国胜 | 一种远红外电热装置 |
JP4756695B2 (ja) * | 2006-02-20 | 2011-08-24 | コバレントマテリアル株式会社 | 面状ヒータ |
JP2007258585A (ja) * | 2006-03-24 | 2007-10-04 | Tokyo Electron Ltd | 基板載置機構および基板処理装置 |
JP4913695B2 (ja) * | 2007-09-20 | 2012-04-11 | 東京エレクトロン株式会社 | 基板処理装置及びそれに用いる基板載置台 |
-
2007
- 2007-11-19 JP JP2007299326A patent/JP5014080B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-13 US US12/270,094 patent/US8071920B2/en not_active Expired - Fee Related
- 2008-11-13 TW TW97143807A patent/TWI471054B/zh not_active IP Right Cessation
- 2008-11-17 KR KR1020080114290A patent/KR101470017B1/ko not_active IP Right Cessation
- 2008-11-19 CN CN200810176276XA patent/CN101442845B/zh not_active Expired - Fee Related
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