JP2009105352A - Operation device, and component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an operation device and a component mounting device whose components can be easily maintained. <P>SOLUTION: When an operator stops operation of the component mounting device and maintains components of the component mounting device, for example, when the operator wants to maintain first, second and third conveying mechanisms 2, 3 and 4 conveying a substrate, the operator is able to perform the maintenance by entering a work space S formed in a component mounting device body 1 without moving to the back side of the component mounting device. Further, when the operator wants to maintain right and left, and front and rear wafer tables 6 in the work space S, first and second beams 20 and 22, first and second mounting heads 25 and 28 fitted with suction nozzles 24 and 27 and recognition cameras 29 and 30, a replacing mechanism 35, an elevator mechanism 36, etc., the operator is able to perform the maintenance by entering the work space S. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a working device that performs a predetermined work on a work member by a work head, and a component mounting device that takes out a component from a component supply unit by the mounting head and mounts the component on the mounted member.

  A component mounting apparatus, which is one of this type of working device, is disclosed in, for example, Patent Document 1, but includes a mounting head having a plurality of bonding nozzles that suck and hold components such as bare chips, and moves in the X-axis direction. A bonding nozzle of a mounting head picks up a component from a wafer on a mounting table that moves in the Y-axis direction and rotates by θ, and the component is mounted on a mounting substrate or lead frame that is a mounted member that has been transported by a transport chute.

In general, in this type of component mounting apparatus, when performing maintenance such as a component supply unit that supplies components and a conveyance unit that conveys a mounted member, the outside of the rectangular outer shape of the component mounting device, for example, Has been done.
JP 2004-363607 A

  However, maintenance can only be performed from the outside of the component mounting device, and once the operator finishes the maintenance on the front side of the component mounting device, it may be troublesome to turn to the back side, which can be very cumbersome. Sometimes, the back side is installed adjacent to the wall of the building, which makes maintenance difficult.

  Therefore, an object of the present invention is to provide a working apparatus and a component mounting apparatus that can easily maintain each component of the apparatus.

  For this reason, the first invention is characterized in that in the working device that performs a predetermined work on the work member, a working space is formed by which the worker can enter the device.

  According to a second aspect of the present invention, in a component mounting apparatus in which a component is taken out from a component supply unit by a mounting head and mounted on a member to be mounted, a work space that allows an operator to enter the apparatus is formed.

  According to a third aspect, in the second aspect, the component supply unit is provided on the left and right, and the work space is formed between the component supply units.

  According to a fourth invention, in the second invention, a plurality of the component supply units are provided on the left and right sides of the front part of the apparatus, and a transport mechanism for transporting the mounted member is provided on the rear part. A space is formed.

  According to a fifth invention, in the second invention, the component supply section is provided on the left and right and front and rear sides, and the work space is formed between the left and right component supply sections.

  The present invention can provide a working apparatus and a component mounting apparatus that can easily maintain each component of the apparatus.

  Hereinafter, referring to the accompanying drawings, as a working device for performing a predetermined work on a work member by a work head, a first work stage having an application head such as an adhesive and a plurality of each having a mounting head An embodiment of a component mounting apparatus including the second work stage will be described. This component mounting apparatus mounts various electronic components on a printed circuit board or a lead frame that is a mounted member.

  FIG. 1 is a schematic plan view of a component mounting apparatus. The component mounting apparatus main body 1 includes three substrates a, b, and c, which are mounted members on which each component is mounted, independently transporting in the X-axis direction. First, second and third transport mechanisms (transport means) 2, 3 and 4 are provided as transport means.

  The first, second and third transport mechanisms (transport means) 2, 3 and 4 are a first work stage (A) which is an adhesive application unit and a plurality of second components which are component mounting units, respectively. The work stages (B) and (C) are provided.

  Further, reference numeral 5 denotes a diced left and right semiconductor wafers (hereinafter referred to as “wafer”), which is a group of parts in which a large number of parts are gathered, and a part such as a die taken out from this wafer is hereinafter referred to as “part”. The wafer 5 is disposed in the front-rear direction on each of the left and right sides of the component mounting apparatus. Reference numeral 6 denotes a front and rear wafer table for supporting a wafer ring 7 (which is a component holding jig) to which a sheet having left and right front and rear wafers 5 attached is attached.

  Further, at the front (lower side in FIG. 1) intermediate position of the component mounting apparatus main body 1, the right front and rear wafer tables 6 provided along the moving directions of the first beam 20 and the second beam 22 described later, respectively. The center in the component mounting apparatus main body 1 is cut out to form a recess 10 so that a work space S can be formed between the left and right front and rear wafer tables 6. That is, the worker can enter the work space S formed up to the component mounting apparatus main body 1 and perform various maintenance.

  Reference numeral 11 denotes a first guide. The first guide 11 is supported by the component mounting apparatus main body 1 extending in a direction in which the longitudinal direction intersects the substrate a, b and c in the direction perpendicular to the conveyance direction. An application (work) head 12 is slidably supported on the first guide 11 by a linear motor 13. For example, the coating head 13 is provided with a coating nozzle 14 that discharges a highly viscous adhesive and a substrate recognition camera 15. The recognition camera 15 captures images of marks (not shown) provided on the substrates a, b, and c that are transported by the first, second, and third transport mechanisms (transport means) 2, 3, and 4.

  Reference numerals 18 and 19 denote second and third guides. The second and third guides 18 and 19 extend in a direction in which the longitudinal direction intersects perpendicularly with the conveying direction of the substrates a, b and c, and the component mounting apparatus. It is supported by the main body 1. Then, the first beam 20 is slid to the second guide 18 through the linear guides 17A and 17A by the operation of the linear motor 21 in the direction orthogonal to the longitudinal direction, and the second beam is passed to the third guide 19. 22 is slidably passed through a linear guide (not shown) by operation of the linear motor 23 in a direction perpendicular to the longitudinal direction.

  A first mounting head (mounting head) 25 having a suction nozzle 24 is disposed on the rear side surface of the first beam 20 along the first beam 20 by the linear motor 26 (substrates a, b, and c). In the same direction as the transport direction). On the rear side surface of the second beam 22, a second mounting head (mounting head) 28 having a suction nozzle 27 is placed along the second beam 22 by the linear motor 49 in the X-axis direction (substrates a, b and c). In the same direction as the transport direction).

  The first mounting head 25 is provided with a plurality of suction nozzles 24 for taking out components from the front and rear wafer tables 6 on the right, and images the individual components on each wafer table 6 at the end of the first mounting head 25. A recognition camera 29 is provided, and the second mounting head 28 is provided with a plurality of suction nozzles 27 for taking out components from the left and right wafer tables 6, and each wafer table 6 is provided at the end of the second mounting head 28. A recognition camera 30 is provided for imaging the individual components above.

  32 and 33 are four wafer supply devices provided on the right and left sides corresponding to each wafer table 6, a magazine 34 for storing a wafer ring 7 (which is a component holding jig) in a plurality of stages, and a wafer. In order to exchange the wafer ring 7 on the table 6 and the wafer ring 7 in the magazine 34 by an exchange mechanism 35 described later, an elevator mechanism 36 that is movable in the vertical direction is provided.

  The elevator mechanism 36 has a mounting plate 37 for mounting and supporting the magazine 34, a plurality of guide bars 38 provided on the lower surface of the mounting plate 37 and guided by guides (not shown), and a drive motor (not shown). 1), the bearing 39 is rotated and moved up and down.

  Next, the exchange mechanism 35 is provided along the first and second beams 20 and 22 on the lower surfaces of the first beam 20 and the second beam 22, respectively. This is for exchanging the wafer ring 7 in the corresponding magazine 34. That is, when the screw shaft 42 is rotated by the drive motor 41 and the nut 43 moves in the X direction, the chuck member (holding member) 45 fixed to the support member 44 fixed to the nut 43 is moved to each wafer table. 6 to and from the corresponding magazine 34. For this reason, the chuck member 45 having the pair of claws 46 grips the wafer ring 7 or releases the grip as the reciprocating movement is performed, thereby corresponding to the wafer ring 7 on each wafer table 6. The wafer ring 7 in the magazine 34 to be exchanged can be exchanged.

  As described above, since the exchange mechanism 35 is provided on the lower surfaces of the first beam 20 and the second beam 22, a structure for attaching the exchange mechanism 35 is not necessary. The space below the first beam 20 and the second beam 22 can be used effectively.

  Next, the operation of the above-described component mounting apparatus will be described below. The substrate a is moved in the X direction by the first transport mechanism (transport means) 2, and the coating head 12 is moved in the Y-axis direction by the operation of the linear motor 13, so that the substrate a positioned below the coating head 12 is moved. Then, an adhesive is discharged from the application nozzle 14 and applied.

In this coating process, first, the first transport mechanism (transport means) 2 is operated based on a signal from the control device, and the substrate a moves in the X-axis direction. Further, the operation of the linear motor 13 moves the coating head 12 above the substrate a, and the substrate recognition camera 15 positioned above the positioning mark on the substrate a images the positioning mark. Then, the recognition processing device performs recognition processing based on the imaging result, and the control device recognizes the position of the substrate a. Thereafter, the substrate a is moved in the left direction in FIG. 1 by the first transport mechanism (transport means) 2 and the coating head 12 is moved in the vertical direction in FIG. Based on the preset application position and the recognized position of the substrate a, the substrate a is gradually moved in the direction ■ and the application head 12 is moved in the Y-axis direction and lowered. Then, the application nozzle 14 discharges the adhesive and applies it onto the substrate a. Thereafter, the first transport mechanism (transport means) 2 and the linear motor 13 are operated so that the coating nozzles 14 are positioned at the respective coating positions on the substrate a, and the substrate a gradually moves in the axis direction and the coating head. 15 moves in the Y-axis direction, and the coating nozzle 14 moves up and down to sequentially apply the adhesive onto the upper surface of the substrate a.

  In addition, during the application process to the substrate a, the substrate b on the second transport mechanism 3 is mounted with components by the suction nozzle 24 of the first mounting head 25 on the work stage (B). That is, the first beam 20 moves in the Y-axis direction by the operation of the linear motor 21, and the first mounting head 25 moves in the X-axis direction along the first beam 20 by the operation of the linear motor 26. Then, by the movement of the first mounting head 25 in the X-axis direction and the Y-axis direction, first, the recognition camera 29 is positioned above the component to be picked up on any one of the wafers 5 on the right and the front, and images the component to be picked up. Based on the imaging and recognition results, the control device recognizes the position of the component.

  Based on the recognition result, the linear motors 21 and 26 are operated, the component to be picked up from the wafer 5 is positioned below the suction nozzle 24, and the suction nozzle 24 of the first mounting head 25 is moved up and down to suck the electronic component. Hold and take out. Thereafter, the linear motors 21 and 26 operate, the first mounting head 25 moves in the horizontal direction, and the first mounting head 25 passes above the first component recognition camera 31A and moves above the board b.

  Then, when the first mounting head 25 passes over the first component recognition camera 31A, the imaging result of the component imaged by the first component recognition camera 31A, that is, the position and orientation of the component sucked by the suction nozzle 24 is obtained. Based on this, the control device operates, the linear motors 21 and 26 are operated, the first mounting head 25 is moved in the X-axis direction and the Y-axis direction, and the suction nozzle 24 is lowered above the mounting position to lower the substrate b. The component is mounted on top. Thereafter, the first mounting head 25 reciprocates between the upper side of the wafer 5 and the upper side of the substrate b, and components are sequentially mounted on the substrate b. That is, the adhesive application process to the substrate a at the work stage (A) and the component mounting process to the board b at the work stage (B) are performed in parallel.

  Further, during the coating process on the substrate a, the substrate c on the third transport mechanism 4 is mounted with components by the suction nozzle 27 of the second mounting head 28 on the work stage (C). That is, the second beam 22 moves in the Y axis direction by the operation of the linear motor 23, and the second mounting head 28 moves in the X axis direction along the second beam 22 by the operation of the linear motor 49. Then, by the movement of the second mounting head 28 in the X-axis direction and the Y-axis direction, the recognition camera 30 is first positioned above the component to be picked up on any of the left and right wafers 5 and images the component to be picked up. Based on the imaging and recognition results, the control device recognizes the position of the component.

  Based on the recognition result, the linear motors 23 and 49 are operated, the component to be picked up from the wafer 5 is positioned below the suction nozzle 27, and the suction nozzle 27 of the second mounting head 28 is moved up and down to suck the electronic component. Hold and take out. Thereafter, the linear motors 23 and 49 operate, the second mounting head 28 moves in the horizontal direction, and the second mounting head 28 passes above the second component recognition camera 31B and moves above the board c.

  Then, when the second mounting head 28 passes above the second component recognition camera 31B, the imaging result of the component imaged by the second component recognition camera 31B, that is, the position and orientation of the component sucked by the suction nozzle 27 is obtained. Based on this, the control device is operated, the linear motors 23 and 49 are operated, the second mounting head 28 is moved in the X-axis direction and the Y-axis direction, and the suction nozzle 27 is lowered above the mounting position to lower the substrate c. The component is mounted on top. Thereafter, the second mounting head 28 reciprocates between the upper side of the wafer 5 and the upper side of the substrate c, and components are sequentially mounted on the substrate c.

  That is, an adhesive application process to the substrate a at the work stage (A), a component mounting process to the substrate b at the work stage (B), and a component mounting process to the substrate c at the work stage (C). Done in parallel.

  Thereafter, when the coating process at the work stage (A) is completed, the substrate a is moved to the work stage (B) by the first transport mechanism 2, and when the mounting process at the work stages (B) and (C) is completed. The substrate b is moved to the work stage (C) by the second transport mechanism 3, and the substrate c is moved to the work stage (D) by the third transport mechanism 4. The substrate c positioned on the work stage (D) is taken out from the third transport mechanism 4 by the operator.

  Next, a description will be given of the replacement operation of the wafer ring 7 when an instruction device (not shown) instructs to replace the wafer ring 7 on the wafer table 6 with the wafer ring 7 in the corresponding magazine 34.

  First, the corresponding elevator mechanism 36 is driven, the bearing 39 is rotated by the operation of the drive motor, the screw shaft 40 is moved up and down, and the stage that does not store the wafer ring 7 is placed in and out of the magazine. 34 is moved. Then, by rotating the screw shaft 42 by the operation of the drive motor 41 of the exchange mechanism 35 and moving the nut 43 in the X direction, the chuck member 45 fixed to the support member 44 fixed to the nut 43 is changed to each of the chuck members 45. The magazine 34 is moved to the magazine 34 corresponding to the wafer table 6 through the opening 18A of the second guide 18, and the wafer ring 7 removed from the wafer table 6 held by the chuck member 45 is opened by a pair of claws 46 to open the magazine. 34.

  Next, after the drive motor 41 is operated and the chuck member 45 is slightly retracted, the magazine 34, which has no collision problem, is moved up and down by the drive of the elevator mechanism 36 so that the new wafer ring 7 is put in and out. Move to. Then, the chuck member 45 is moved forward a little to close the pair of claws 46 so that the new wafer ring 7 is gripped.

  Then, the drive motor 41 is operated to retract the chuck member 45 to position the new wafer ring 7 held by the chuck member 45 above the wafer table 6, and then open the pair of claws 46 to open the new wafer ring 7. Is dropped onto the wafer table 6.

  Thereafter, the operator attaches and fixes the new wafer ring 7 to the wafer table 6 to prepare for taking out the parts.

  Even when a plurality of the wafer tables 6 are provided along the moving direction of the first beam 20 or the second beam 22, the wafer ring 7 is exchanged by moving the first beam 20 or the second beam 22. Therefore, it is possible to easily cope with a plurality of wafer tables 6.

  Further, it is not necessary to provide an exchange mechanism 35 for each wafer table 6 provided in the front-rear direction, the mechanism can be simplified, and the size of the apparatus in the front-rear direction can be reduced as much as possible to save space.

  Next, a case will be described in which the operation of the component mounting apparatus is stopped and an operator performs maintenance on each component of the component mounting apparatus. For example, when it is desired to maintain the first, second and third transport mechanisms 2, 3, 4 for transporting the board, the operator does not rotate to the back side of the component mounting apparatus, but forms it in the component mounting apparatus main body 1. Can be carried out by entering the work space S. Further, the front and rear wafer tables 6 on the left and right of the work space S, the first and second beams 20 and 22, the first and second mounting heads 25 to which the suction nozzles 24 and 27 and the recognition cameras 29 and 30 are attached, 28, the maintenance mechanism 35, the elevator mechanism 36, and the like can be maintained by the operator entering the work space S.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of a component mounting apparatus. It is a front view, such as a right exchange mechanism and a magazine. It is a left side view of the first mounting head and the beam.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus main body 2, 3, 4 1st, 2nd and 3rd conveyance mechanism 6 Wafer table 10 Recessed part 20, 22 1st and 2nd beam 24, 27 Adsorption nozzle 25, 28 1st and 2nd mounting head 29 , 30 Recognition camera 35 Exchange mechanism 36 Elevator mechanism S Work space

Claims (5)

  A working device for performing a predetermined work on a work member by a working head, wherein a working space is formed in which a worker can enter the device.   A component mounting apparatus in which a component is taken out from a component supply unit by a mounting head and mounted on a member to be mounted, and a working space is formed in which an operator can enter the apparatus.   The component mounting apparatus according to claim 2, wherein the component supply unit is provided on the left and right, and the work space is formed between the component supply units.   3. The apparatus according to claim 2, wherein a plurality of the component supply units are provided on the left and right sides of the front part of the apparatus, a transfer mechanism for transferring the mounted member is provided on the rear side, and the working space is formed between the left and right component supply units. The component mounting apparatus described in 1.   The component mounting apparatus according to claim 2, wherein the component supply unit is provided on the left and right and front and rear, and the work space is formed between the left and right component supply units.