JP2009073943A5 - - Google Patents

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Publication number
JP2009073943A5
JP2009073943A5 JP2007244521A JP2007244521A JP2009073943A5 JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5 JP 2007244521 A JP2007244521 A JP 2007244521A JP 2007244521 A JP2007244521 A JP 2007244521A JP 2009073943 A5 JP2009073943 A5 JP 2009073943A5
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JP
Japan
Prior art keywords
bonding film
adherend
region
bonding
metal atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007244521A
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English (en)
Japanese (ja)
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JP2009073943A (ja
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Publication date
Application filed filed Critical
Priority to JP2007244521A priority Critical patent/JP2009073943A/ja
Priority claimed from JP2007244521A external-priority patent/JP2009073943A/ja
Publication of JP2009073943A publication Critical patent/JP2009073943A/ja
Publication of JP2009073943A5 publication Critical patent/JP2009073943A5/ja
Withdrawn legal-status Critical Current

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JP2007244521A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009073943A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244521A JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009073943A JP2009073943A (ja) 2009-04-09
JP2009073943A5 true JP2009073943A5 (cg-RX-API-DMAC10.html) 2010-09-02

Family

ID=40609243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244521A Withdrawn JP2009073943A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

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JP (1) JP2009073943A (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569358B2 (ja) * 2015-07-29 2019-09-04 セイコーエプソン株式会社 電子デバイス、液体噴射ヘッド、および、電子デバイスの製造方法
KR101888097B1 (ko) * 2017-06-13 2018-08-14 호서대학교 산학협력단 유기발광 다이오드 봉지구조체 및 그 제조방법
GB2573278A (en) * 2018-04-25 2019-11-06 Saralon Gmbh Method of electrically connecting two surfaces
JPWO2022038875A1 (cg-RX-API-DMAC10.html) * 2020-08-20 2022-02-24
WO2022038876A1 (ja) * 2020-08-20 2022-02-24 長瀬産業株式会社 高分子フィルムと銅箔の接合方法、高分子フィルム積層体および高分子フィルム積層体を備えるデバイス
CN114891449B (zh) * 2022-04-25 2024-02-02 歌尔股份有限公司 一种激光胶膜粘接工艺方法以及智能手表
CN117628023A (zh) * 2022-08-11 2024-03-01 北京小米移动软件有限公司 手表装配方法和可穿戴设备
CN115775722B (zh) * 2022-09-08 2025-11-18 武汉新芯集成电路股份有限公司 键合装置及键合方法
CN116241535A (zh) * 2023-01-06 2023-06-09 歌尔股份有限公司 屏幕粘接方法及电子设备

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