JP2009072813A5 - - Google Patents

Download PDF

Info

Publication number
JP2009072813A5
JP2009072813A5 JP2007244520A JP2007244520A JP2009072813A5 JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5 JP 2007244520 A JP2007244520 A JP 2007244520A JP 2007244520 A JP2007244520 A JP 2007244520A JP 2009072813 A5 JP2009072813 A5 JP 2009072813A5
Authority
JP
Japan
Prior art keywords
bonding film
adherend
region
bonding
metal atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007244520A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009072813A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007244520A priority Critical patent/JP2009072813A/ja
Priority claimed from JP2007244520A external-priority patent/JP2009072813A/ja
Publication of JP2009072813A publication Critical patent/JP2009072813A/ja
Publication of JP2009072813A5 publication Critical patent/JP2009072813A5/ja
Withdrawn legal-status Critical Current

Links

JP2007244520A 2007-09-20 2007-09-20 接合方法および接合体 Withdrawn JP2009072813A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007244520A JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007244520A JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Publications (2)

Publication Number Publication Date
JP2009072813A JP2009072813A (ja) 2009-04-09
JP2009072813A5 true JP2009072813A5 (cg-RX-API-DMAC10.html) 2010-09-02

Family

ID=40608337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007244520A Withdrawn JP2009072813A (ja) 2007-09-20 2007-09-20 接合方法および接合体

Country Status (1)

Country Link
JP (1) JP2009072813A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014188536A (ja) * 2013-03-26 2014-10-06 National Institute For Materials Science 金属材の拡散接合方法および金属材の拡散接合装置
CN114999948A (zh) * 2022-06-06 2022-09-02 闽南师范大学 一种高真空磁控溅射热压键合一体机以及键合方法

Similar Documents

Publication Publication Date Title
JP2009073943A5 (cg-RX-API-DMAC10.html)
JP2007518865A5 (cg-RX-API-DMAC10.html)
US9266310B2 (en) Methods of joining device structures with adhesive
CN104409408B (zh) 一种刚性基板及柔性显示器的制作方法
JP2012524159A5 (cg-RX-API-DMAC10.html)
WO2008076390A3 (en) Dry adhesives and methods for making dry adhesives
JP2010082857A5 (cg-RX-API-DMAC10.html)
WO2009037797A1 (ja) 表示装置の製造方法及び積層構造体
JP2004503066A5 (cg-RX-API-DMAC10.html)
JP2013533605A5 (cg-RX-API-DMAC10.html)
JP2009529442A5 (cg-RX-API-DMAC10.html)
RU2013128449A (ru) Способ изготовления панели, включающей износостойкий слой, и панель
WO2010148398A3 (en) A thin-film device and method of fabricating the same
JP2009028923A5 (cg-RX-API-DMAC10.html)
JP2013139546A (ja) フィルムアセンブリと、フィルムアセンブリを取り付ける方法
WO2009069576A1 (ja) 粘着シート、その製造方法、およびその貼合方法
JP2015518270A5 (cg-RX-API-DMAC10.html)
EP2154710A3 (en) Substrate joining method and 3-D semiconductor device
JP2023027234A5 (cg-RX-API-DMAC10.html)
TW200629462A (en) Supporting plate attaching method
JP4633394B2 (ja) 剥離用プルタブ付両面接着テープの貼り付け方法
WO2006132382A3 (en) Method of manufacturing a film
JP2009076697A5 (cg-RX-API-DMAC10.html)
WO2009004789A1 (ja) ホログラムパターン形成方法、ホログラムパターン付きフィルム製造方法、積層フィルム、及び容器
JP2009046541A5 (cg-RX-API-DMAC10.html)