JP2009070921A5 - - Google Patents

Claims (10)

In an insulating resin sheet containing a glass fiber woven fabric composed of a warp yarn and a weft yarn and an insulating resin composition, in the warp yarn when the glass fiber woven fabric is arbitrarily cut in a direction perpendicular to the warp yarn An insulating resin sheet containing a glass fiber woven fabric, wherein the number of voids present is from 0.1 to 10 per 100,000 warp yarns. The insulating resin sheet with a glass fiber woven fabric according to claim 1, wherein the voids present in the warp yarn are substantially cylindrical, and the maximum diameter of each void is 0.01 µm or more and 1.2 µm or less. The insulating resin sheet with a glass fiber woven fabric according to claim 1 or 2, wherein the length of the gap existing in the warp yarn in the warp yarn direction is 200 mm or less. The insulating resin sheet with glass fiber woven fabric according to any one of claims 1 to 3, wherein a linear expansion coefficient of the glass fiber constituting the glass fiber woven fabric is 1 ppm / ° C to 10 ppm / ° C. 5. The insulating resin sheet with glass fiber woven fabric according to claim 1, wherein the glass fiber woven fabric has a thickness of 10 μm to 100 μm and a mass of 10 g / m ^{2 to} 110 g / m ² . The glass fiber woven fabric contains at least 50% by weight to 75% by weight SiO ₂ , 5% by weight to 30% by weight Al ₂ O ₃ , and 20% by weight or less MgO in the glass. The insulating resin sheet containing a glass fiber woven fabric according to any one of 1 to 5 . The glass fiber woven fabric, at least, glass fiber woven fabric containing insulation resin sheet according to any one of claims 1 to 6 in which 0.1 wt% or more than 2 wt% of TiO ₂ in the glass. One or more insulating resin sheets with glass fiber woven fabric according to any one of claims 1 to 7 are stacked, and a copper foil is disposed on at least one outer surface of the insulating resin sheet with glass fiber woven fabric and heated. A laminated board formed by pressure molding. Multilayer printed wiring board formed by using the laminate according to the glass fiber woven fabric containing insulating resin sheet and / or claim 8 as claimed in any one of claims 1 to 7. A semiconductor device comprising a semiconductor element mounted on the multilayer printed wiring board according to claim 9 .