JP2009065093A5 - - Google Patents

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Publication number
JP2009065093A5
JP2009065093A5 JP2007233908A JP2007233908A JP2009065093A5 JP 2009065093 A5 JP2009065093 A5 JP 2009065093A5 JP 2007233908 A JP2007233908 A JP 2007233908A JP 2007233908 A JP2007233908 A JP 2007233908A JP 2009065093 A5 JP2009065093 A5 JP 2009065093A5
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JP
Japan
Prior art keywords
film
pattern
approximately
line
ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007233908A
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English (en)
Japanese (ja)
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JP2009065093A (ja
JP4621718B2 (ja
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Application filed filed Critical
Priority to JP2007233908A priority Critical patent/JP4621718B2/ja
Priority claimed from JP2007233908A external-priority patent/JP4621718B2/ja
Priority to US12/208,010 priority patent/US20090191712A1/en
Publication of JP2009065093A publication Critical patent/JP2009065093A/ja
Publication of JP2009065093A5 publication Critical patent/JP2009065093A5/ja
Application granted granted Critical
Publication of JP4621718B2 publication Critical patent/JP4621718B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007233908A 2007-09-10 2007-09-10 半導体装置の製造方法 Expired - Fee Related JP4621718B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007233908A JP4621718B2 (ja) 2007-09-10 2007-09-10 半導体装置の製造方法
US12/208,010 US20090191712A1 (en) 2007-09-10 2008-09-10 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007233908A JP4621718B2 (ja) 2007-09-10 2007-09-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2009065093A JP2009065093A (ja) 2009-03-26
JP2009065093A5 true JP2009065093A5 (https=) 2009-10-22
JP4621718B2 JP4621718B2 (ja) 2011-01-26

Family

ID=40559382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007233908A Expired - Fee Related JP4621718B2 (ja) 2007-09-10 2007-09-10 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20090191712A1 (https=)
JP (1) JP4621718B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901898B2 (ja) 2009-03-30 2012-03-21 株式会社東芝 半導体装置の製造方法
US9337197B1 (en) * 2014-10-28 2016-05-10 Globalfoundries Inc. Semiconductor structure having FinFET ultra thin body and methods of fabrication thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0472622A (ja) * 1990-07-13 1992-03-06 Hitachi Ltd 半導体装置およびその製造方法
JPH08306698A (ja) * 1995-05-10 1996-11-22 Casio Comput Co Ltd パターン形成方法
JP2002280388A (ja) * 2001-03-15 2002-09-27 Toshiba Corp 半導体装置の製造方法
DE10142590A1 (de) * 2001-08-31 2003-04-03 Infineon Technologies Ag Verfahren zur Seitenwandverstärkung von Resiststrukturen und zur Herstellung von Strukturen mit reduzierter Strukturgröße
JP2004014652A (ja) * 2002-06-04 2004-01-15 Ricoh Co Ltd 微細パターンの形成方法
US6867116B1 (en) * 2003-11-10 2005-03-15 Macronix International Co., Ltd. Fabrication method of sub-resolution pitch for integrated circuits
US7183205B2 (en) * 2004-06-08 2007-02-27 Macronix International Co., Ltd. Method of pitch dimension shrinkage
US7465525B2 (en) * 2005-05-10 2008-12-16 Lam Research Corporation Reticle alignment and overlay for multiple reticle process
JP4652140B2 (ja) * 2005-06-21 2011-03-16 東京エレクトロン株式会社 プラズマエッチング方法、制御プログラム、コンピュータ記憶媒体

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