JP2009065034A5 - - Google Patents
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- Publication number
- JP2009065034A5 JP2009065034A5 JP2007232675A JP2007232675A JP2009065034A5 JP 2009065034 A5 JP2009065034 A5 JP 2009065034A5 JP 2007232675 A JP2007232675 A JP 2007232675A JP 2007232675 A JP2007232675 A JP 2007232675A JP 2009065034 A5 JP2009065034 A5 JP 2009065034A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing
- semiconductor
- thickness
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 45
- 238000004519 manufacturing process Methods 0.000 claims 30
- 239000000945 filler Substances 0.000 claims 14
- 239000002245 particle Substances 0.000 claims 12
- 239000000463 material Substances 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000002313 adhesive film Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 3
- 238000009826 distribution Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007232675A JP5222508B2 (ja) | 2007-09-07 | 2007-09-07 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007232675A JP5222508B2 (ja) | 2007-09-07 | 2007-09-07 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009065034A JP2009065034A (ja) | 2009-03-26 |
| JP2009065034A5 true JP2009065034A5 (zh) | 2010-10-21 |
| JP5222508B2 JP5222508B2 (ja) | 2013-06-26 |
Family
ID=40559341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007232675A Expired - Fee Related JP5222508B2 (ja) | 2007-09-07 | 2007-09-07 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5222508B2 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111062A (ja) * | 2007-10-29 | 2009-05-21 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP2010245412A (ja) | 2009-04-09 | 2010-10-28 | Renesas Electronics Corp | 半導体集積回路装置の製造方法 |
| JP5433506B2 (ja) * | 2010-06-17 | 2014-03-05 | ラピスセミコンダクタ株式会社 | 半導体メモリ装置 |
| CN107706170A (zh) | 2016-08-09 | 2018-02-16 | 晟碟信息科技（上海）有限公司 | 垂直半导体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001200139A (ja) * | 1999-11-11 | 2001-07-24 | Shin Etsu Chem Co Ltd | 半導体封止用液状エポキシ樹脂組成物 |
| JP2001308262A (ja) * | 2000-04-26 | 2001-11-02 | Mitsubishi Electric Corp | 樹脂封止ｂｇａ型半導体装置 |
| JP2003160644A (ja) * | 2001-11-27 | 2003-06-03 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP2004221555A (ja) * | 2002-12-27 | 2004-08-05 | Sumitomo Bakelite Co Ltd | フィルム付き半導体素子、半導体装置およびそれらの製造方法 |
| WO2006109506A1 (ja) * | 2005-03-30 | 2006-10-19 | Nippon Steel Chemical Co., Ltd. | 半導体装置の製造方法及び半導体装置 |
| JP2007176978A (ja) * | 2005-12-27 | 2007-07-12 | Shin Etsu Chem Co Ltd | フリップチップ型半導体装置用液状エポキシ樹脂組成物及びフリップチップ型半導体装置 |
-
2007
- 2007-09-07 JP JP2007232675A patent/JP5222508B2/ja not_active Expired - Fee Related
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