JP2009064693A - Intermediate for touch switch, and manufacturing method of intermediate for touch switch - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an intermediate for a touch switch of a capacitance type capable of achieving the reduction of cost and the improvement of reliability. <P>SOLUTION: The intermediate for the touch switch is provided with a base body 2, and a transparent conductive film 3 formed on one face of the base body 2. The transparent conductive film 3 has a transparent conductive layer pasted by in-mold molding on one face of the base body 2 molded by in-mold molding by the use of an in-mold film having the transparent conductive layer on a base film, and at the same time, with its end 3a in an exposed state, a coated area 3b except the end 3a is covered with the base film. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a capacitive touch switch intermediate body including a base portion and a transparent conductive film formed on one surface of the base portion, and a touch switch intermediate manufacturing method for manufacturing the touch switch intermediate body. It is about.

2. Description of the Related Art In recent years, many electric devices such as portable information terminals and automatic teller machines are provided with touch-type operation units that allow input by touching (touching) a fingertip. This touch-type operation unit is configured by disposing a transparent conductive film on one surface of a light-transmitting base unit, and includes a touch switch (touch panel) attached on a display such as a CRT or LCD. ing. In addition, a capacitive touch switch that detects the presence or absence of a touch or a touch position based on a change in capacitance is such that the surface on which the transparent conductive film is disposed is located on the display side and the transparent conductive film is disposed. It is attached so that the surface that is not touched (the touch surface on which the fingertip can be touched) is located on the front side. In this case, in a state where the transparent conductive film is exposed, the transparent conductive film is easily damaged, and is also easily affected by surrounding environmental changes such as temperature and humidity. For this reason, due to these, the surface electrical resistance value of the transparent conductive film, that is, the touch switch characteristics (antenna characteristics, etc.) may change, causing a malfunction. As a touch switch that can eliminate such inconvenience, a touch switch in which a transparent substrate or a protective layer is disposed on a transparent conductive film (for example, a touch panel disclosed in JP-A-5-324203) is known. Yes. In this case, the touch panel disclosed in the above publication uses a transparent adhesive to attach a glass substrate provided with a transparent conductive film, a protective film and an electrode terminal, and a glass substrate provided with a glare prevention film and a protective film. It is constituted by.
JP-A-5-324203 (page 2-3, FIG. 1)

  However, the above touch panel has the following problems. That is, this touch panel is configured by bonding two glass substrates. For this reason, this touch panel has a problem that the manufacturing process is complicated and the manufacturing cost is difficult to reduce because the bonding process is necessary.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a touch switch intermediate body and a touch switch intermediate manufacturing method capable of realizing cost reduction.

  To achieve the above object, an intermediate for a touch switch according to the present invention is a capacitive touch switch intermediate including a base portion and a transparent conductive film formed on one surface of the base portion. The transparent conductive film is the transparent conductive layer bonded by the in-mold molding to the one surface of the base portion formed by the in-mold molding using the in-mold film having the transparent conductive layer on the base film. In addition, a region excluding the electrode formation region is covered with the base film in a state where the electrode formation region of the transparent conductive film is exposed.

  Further, the touch switch intermediate manufacturing method according to the present invention is for a touch switch for manufacturing a capacitive touch switch intermediate including a base portion and a transparent conductive film formed on one surface of the base portion. An intermediate manufacturing method, wherein the base portion is molded by in-mold molding in which a resin is injected into a cavity of an in-mold molding mold in which an in-mold film having a transparent conductive layer is sandwiched between base films. In addition, after forming the transparent conductive film by bonding the transparent conductive layer to one surface of the base portion by the in-mold molding, a predetermined portion of the base film is separated to expose an electrode formation region of the transparent conductive film And the region excluding the electrode formation region is kept covered with the base film.

  In this case, after performing the in-mold molding using the in-mold film in which the notch for separating the predetermined part of the base film from the other part is formed, the predetermined part is separated along the notch. Can do.

  According to the touch switch intermediate and the touch switch intermediate manufacturing method according to the present invention, the transparent conductive layer of the in-mold film is formed on one surface of the base portion by in-mold molding using the in-mold film. Unlike the conventional touch panel and the manufacturing method, the electrode film forming region of the transparent conductive film is exposed and the region excluding the electrode forming region in the transparent conductive film is covered with the base film. Since the process can be omitted, the manufacturing process can be simplified, and the manufacturing cost can be reduced. In addition, since the conventional touch panel and manufacturing method require advanced technology to bond both glass substrates without gaps, gaps are likely to occur between them, and the effects of changes in the surrounding environment such as temperature and humidity are sufficient. As a result that it is difficult to reduce the number, it is difficult to realize a highly reliable touch panel with sufficiently few malfunctions. On the other hand, in this touch switch intermediate and the touch switch intermediate manufacturing method, the transparent conductive film is sandwiched between the base portion and the base film without any gap. Therefore, according to the touch switch intermediate and the touch switch intermediate manufacturing method, compared with the conventional touch panel and the manufacturing method in which a gap may be generated between the two glass substrates, the temperature, humidity, and the like. As a result of being able to suppress the influence due to the surrounding environment change to a sufficiently low level, it is possible to configure a touch switch with a sufficiently low malfunction and a high reliability. Furthermore, since the conventional touch panel and the manufacturing method use a glass substrate, the touch panel is relatively large and is suitable for use in an input device of equipment installed at a specific location such as an ATM. As an input device of a type device, there are a problem that the weight is increased and a problem that it is easily damaged by dropping or impact. On the other hand, in the touch switch intermediate and the touch switch intermediate manufacturing method, the base portion can be formed of resin by in-mold molding. Therefore, according to the touch switch intermediate body and the touch switch intermediate manufacturing method, a touch switch that is light in weight and hardly damaged can be configured.

  Moreover, according to the intermediate manufacturing method for a touch switch according to the present invention, after performing in-mold molding using the in-mold film in which the base film is cut, a predetermined portion of the base film is cut along the cut. By exposing the electrode forming region of the transparent conductive film, it is possible to easily cut a predetermined portion of the base film without using a cutting tool, and as a result, manufacturing efficiency can be sufficiently improved.

  Hereinafter, the best mode of an intermediate for touch switch and a method for manufacturing an intermediate for touch switch according to the present invention will be described with reference to the accompanying drawings.

  First, a configuration of a touch switch intermediate 1 (hereinafter also simply referred to as “intermediate 1”) as an example of a touch switch intermediate according to the present invention will be described with reference to the drawings.

  An intermediate body 1 shown in FIGS. 1 and 2 is an intermediate body used for, for example, a capacitive touch switch that functions as a touch-type operation unit in an electric device or the like. As shown in FIG. 2, comprising a transparent conductive film 3 and a protective film 4, and is manufactured by in-mold molding using an in-mold mold 102 (see FIG. 3; hereinafter, also simply referred to as “mold 102”).

  As shown in FIGS. 1 and 2, the base portion 2 is configured in a rectangular plate shape, for example, and injects a transparent resin (an acrylic resin as an example) into the cavity 102 a (see FIG. 10) of the mold 102. It is formed by.

  The transparent conductive film 3 is formed by bonding a part of the transparent conductive layer 33 cut out in a band-shaped in-mold film 30 (see FIG. 6), which will be described later, to the one surface 2a of the base portion 2 by in-mold molding ( Arranged). The protective film 4 is constituted by a part of the base film 31 cut out of the in-mold film 30 and connects the driving circuit and the transparent conductive film 3 outside the figure as shown in FIGS. The transparent conductive film 3 is disposed on the transparent conductive film 3 so as to cover the covering region 3b except the end 3a (electrode forming region in the present invention) of the transparent conductive film 3 on which the electrode is formed. That is, in the touch switch intermediate 1, the covering region 3 b is covered with the base film 31 in a state where the end 3 a of the transparent conductive film 3 is exposed at the end 2 c of the base 2. In this case, the heat-meltable resin layer 34 of the in-mold film 30 exists between the transparent conductive film 3 and the one surface 2 a of the base portion 2, and the in-mold film is interposed between the protective film 4 and the transparent conductive film 3. There are 30 anchor layers 32, which are not shown in FIGS. The materials and forming methods of the base film 31 (that is, the protective film 4), the anchor layer 32, the transparent conductive layer 33 (that is, the transparent conductive film 3), and the hot-melt resin layer 34 will be described in detail later.

  Next, the configuration of the manufacturing apparatus 101 will be described with reference to the drawings.

  As shown in FIG. 3, the manufacturing apparatus 101 includes a mold 102, an in-mold film moving apparatus 103, and an injection molding machine 104. The mold 102 is a mold capable of manufacturing the intermediate body 1 by in-mold molding according to the touch switch intermediate manufacturing method according to the present invention, and includes a fixed-side mold 111 and a moving-side mold 121. ing. In this case, the mold 102 is configured such that four intermediate bodies 1 can be molded (four pieces) in one molding step (one shot) by the injection molding machine 104. In addition, the mold 102 is sandwiched between the in-mold film 30 moved by the in-mold film moving device 103 (see FIG. 10), and the main body 113 of the fixed mold 111 and the main body of the moving mold 121 are inserted. 123 can be joined.

  As shown in FIG. 4, the fixed-side mold 111 includes a base portion 112 and a main body portion 113. The base portion 112 is formed in a plate shape and is configured to be attachable to a fixed side attachment portion (not shown) of the injection molding machine 104. The main body portion 113 is fixed to the base portion 112 and is configured to be able to be joined to the main body portion 123 of the moving-side mold 121 with the in-mold film 30 sandwiched therebetween as shown in FIG.

  As shown in FIG. 5, the moving-side mold 121 includes a base portion 122, a main body portion 123, a spacer block 124, and an eject plate 125. The base part 122 is formed in a plate shape and is configured to be attachable to a moving side attaching part (not shown) in the injection molding machine 104. The main body portion 123 is fixed to the base portion 122 via the spacer block 124. Further, as shown in FIGS. 5 and 9, four recesses 123b constituting the cavity 102a are formed on the mold surface 123a of the main body 123. The main body 123 is formed with a groove 123d that constitutes a runner that connects the sprue 113b (see FIG. 4) of the fixed mold 111 and the gate 123c formed at the edge of the recess 123b. The eject plate 125 is disposed between the base portion 122 and the main body portion 123, and is moved between the base portion 122 and the main body portion 123 by the injection molding machine 104. It protrudes in front of the part 123.

  As shown in FIG. 3, the in-mold film moving apparatus 103 has a predetermined length (for example, for each in-mold molding (one shot) between the fixed-side mold 111 and the moving-side mold 121 (for example, The in-mold film 30 is moved by the length L) shown in FIGS.

  Here, as shown in FIG. 6, the in-mold film 30 includes the base film 31, the anchor layer 32, the transparent conductive layer 33, and the hot-melt resin layer 34. The base film 31 is a resin film having transparency and flexibility, and is formed in a strip shape. In this case, as the material of the base film 31, a polyester film such as polyethylene terephthalate (PET), a polyolefin film such as polyethylene or polypropylene, a polycarbonate film, a nylon film, an acrylic film, a cellophane film, and a norbornene film (for example, JSR ( "Arton" (registered trademark) manufactured by Co., Ltd. Further, the thickness of the base film 31 is preferably 5 to 100 μm, and more preferably 15 to 75 μm in view of ease of handling and molding stability.

  7 and 8, the base film 31 is formed with a circular hole 31a and a substantially rectangular hole 31c. In this case, the hole 31a is a hole for positioning the in-mold film 30 with respect to the mold 102 at the time of in-mold molding. For example, the hole 31a is moved by the in-mold film moving device 103 in one molding process. Four each are formed in the region A corresponding to the length L. The holes 31c are holes for separating the four intermediate bodies 1 formed in one molding step, and are formed in the above-described region A by three. In this case, as shown in FIG. 8, the size of each hole 31c is such that each edge and the edge of the cavity 102a of the mold 102 (shown by a one-dot chain line) are at the same position. The formation position is defined. In the figure, in order to facilitate understanding, a one-dot chain line showing a part of the edge of the cavity 102a is shown on each hole 31c. Further, as shown in the figure, the base film 31 is formed with a cut 31d for cutting out a part thereof (corresponding to a predetermined portion in the present invention and an end 4a of a protective film 4 described later).

  The anchor layer 32 is a layer having releasability. For example, a liquid obtained by dissolving various thermosetting hard coat agents such as silicone, acrylic and melamine in a solvent is applied on the base film 31. It is formed by drying. In this case, it is preferable to use a silicone-based hard coating agent that is excellent in that high hardness can be obtained. Also, various ultraviolet curable hard coating agents such as unsaturated polyester resin-based and acrylic-based radical polymerizable hard coating agents, and epoxy-based and vinyl ether-based cationic polymerizable hard coating agents such as thermosetting hard coating agents. It can replace with and can also be used. In this case, it is desirable to use an acrylic radical polymerizable hard coating agent which is excellent in terms of curing reactivity and surface hardness. Further, as shown in FIG. 8, the anchor layer 32 is formed in a band shape between the portions where the holes 31 c are formed on one surface of the base film 31.

  The transparent conductive layer 33 is a thin film having transparency and conductivity, and is formed in a band shape on the anchor layer 32, that is, between the formation portions of the holes 31c described above. Examples of the material of the transparent conductive layer 33 include fine particles of indium oxide such as tin-doped indium oxide (ITO), gallium-doped indium oxide and zinc-doped indium oxide, antimony-doped tin oxide (ATO), and fluorine-doped tin oxide (FTO). Tin oxide fine particles, aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO), fluorine-doped zinc oxide, indium-doped zinc oxide, boron-doped zinc oxide and other zinc oxide fine particles, and various conductive materials such as cadmium oxide Inorganic fine particles can be used. In this case, it is preferable to use ITO in terms of obtaining excellent conductivity. Or what coated ITO and ATO on the surface of fine particles which have transparency, such as barium sulfate, can also be used. The particle diameter of these fine particles can be arbitrarily defined according to the required optical characteristics and electrical characteristics, but in order to obtain good optical characteristics (haze value), it is specified to be 1.0 μm or less. Is more preferable, and it is more preferably specified in the range of 1 nm to 100 nm, and further preferably in the range of 5 nm to 100 nm.

  The heat-meltable resin layer 34 is formed by applying a resin material that is in a molten state at a predetermined temperature (for example, about 90 ° C.) on the transparent conductive layer 33 in a molten state. Resin materials used for the heat-meltable resin layer 34 include polyester resins, acrylic resins, epoxy resins, polycarbonate resins, olefin resins, nitrified cotton resins, polyurethane resins, chlorinated rubber resins, and polyamide resins. And vinyl chloride-vinyl acetate copolymer and the like can be used. Among these, it is preferable to use a resin having good compatibility with the resin (for example, acrylic resin) constituting the base portion 2 as the resin for the hot-melt resin layer 34. In this case, in the formation process of the heat-meltable resin layer 34, when the above-described molten resin for the heat-meltable resin layer 34 is applied on the transparent conductive layer 33, the particles between the fine particles constituting the transparent conductive layer 33 are used. The gap is impregnated with resin. For this reason, in this in-mold film 30, the transparent conductive layer 33 is configured with flexibility.

  The injection molding machine 104 is a horizontal injection molding machine as an example, and includes a fixed side mounting portion, a moving side mounting portion, a mold clamping mechanism, an injection mechanism, an ejection mechanism (all not shown), and the like. ing.

  Next, the process of manufacturing the intermediate body 1 according to the touch switch intermediate manufacturing method according to the present invention using the manufacturing apparatus 101 (mold 102) will be described with reference to the drawings.

  First, as shown in FIG. 3, the fixed side mold 111 and the movable side mold 121 of the mold 102 are respectively attached to the fixed side mounting part and the moving side mounting part outside the figure in the injection molding machine 104. Next, the in-mold film 30 is set on the in-mold film moving device 103 so that the base film 31 faces the mold surface 113a (see FIGS. 4 and 9) of the fixed-side mold 111, and the in-mold film is moved. The device 103 is activated. At this time, the in-mold film moving device 103 moves the in-mold film 30 by a predetermined length between the stationary mold 111 and the movable mold 121 of the mold 102. Subsequently, the injection molding machine 104 is operated. At this time, the mold clamping mechanism of the injection molding machine 104 moves the moving side mounting portion toward the fixed side mounting portion, so that the fixed side mold 111 and the moving side mold 121 are moved as shown in FIG. They are bonded to each other with the in-mold film 30 sandwiched therebetween.

  Next, the injection mechanism of the injection molding machine 104 pumps the resin in a fluid state. At this time, the resin pumped from the injection molding machine 104 passes through the sprue 113b and the runner, and is injected into the cavity 102a from the gate 123c formed in the main body 123 of the moving side mold 121. Subsequently, the resin injected from the gate 123c into the cavity 102a is filled into the cavity 102a while pressing the in-mold film 30 against the mold surface 113a of the main body 113 of the stationary mold 111 constituting the cavity 102a. Moreover, the heat-meltable resin layer 34 of the in-mold film 30 is melted by the heat of the injected resin and becomes compatible with the resin. For this reason, the transparent conductive layer 33 is reliably bonded to the one surface 2a of the base portion 2 after molding via the hot-melt resin layer 34.

  Next, after a predetermined cooling time has elapsed, the fixed-side mold 111 and the movable-side mold 121 are moved by moving the moving-side mounting portion in a direction in which the mold clamping mechanism of the injection molding machine 104 moves away from the fixed-side mounting portion. And the moving side mold 121 is separated from the fixed side mold 111. At this time, the molded product (four base portions 2) and the in-mold film 30 formed by solidifying the injected resin are separated from the fixed mold 111 together with the moving mold 121. Subsequently, when the ejection mechanism of the injection molding machine 104 moves the ejection plate 125 of the movable mold 121 to the main body portion 123 side, an unillustrated ejection pin is projected forward of the main body portion 123, and the in-mold film The four base portions 2 connected through 30 are taken out of the moving mold 121 together with the in-mold film 30.

  Next, the in-mold film moving device 103 moves the in-mold film 30 by a predetermined length. Subsequently, for example, the in-mold film 30 is cut at a broken line portion shown in FIG. Thereby, as shown in FIG. 12, the four base | substrate parts 2 of the state to which the cut | disconnected in-mold film 30 (namely, the transparent conductive film 3 and the protective film 4) adhered was cut | disconnected. Next, as shown in FIG. 13, the end 4a of the protective film 4 (base film 31) is cut off. Thereby, the edge part 3a of the transparent conductive film 3 (transparent conductive layer 33) located under the edge part 4a is exposed. Moreover, the covering region 3b except the end 3a in the transparent conductive film 3 is maintained in a state covered with the protective film 4 (base film 31). Thus, the production of the intermediate 1 is completed.

  In this case, in this in-mold film 30, since the cut 31d is previously formed in the base film 31, the end 4a of the protective film 4 can be easily cut without using a cutting tool. Further, the transparent conductive film 3 (transparent conductive layer 33) is securely bonded (attached) to the one surface 2 a of the base portion 2 by the heat-meltable resin layer 34. For this reason, the situation where the transparent conductive film 3 is peeled off from the base portion 2 along with the cutting off of the end portion 4a of the protective film 4 is reliably prevented.

  Further, in this touch switch intermediate manufacturing method, a part of the base film 31 cut out of the in-mold film 30 is used as the protective film 4, and the covering region 3 b of the transparent conductive film 3 is covered with the protective film 4. For this reason, unlike the conventional touch panel and the manufacturing method, since the complicated process of bonding two glass substrates can be omitted, the manufacturing process can be simplified and the manufacturing cost can be reduced. Yes. In addition, since the conventional touch panel and manufacturing method require advanced technology to bond both glass substrates without gaps, gaps are likely to occur between them, and the effects of changes in the surrounding environment such as temperature and humidity are sufficient. As a result that it is difficult to reduce the number, it is difficult to realize a highly reliable touch panel with sufficiently few malfunctions. In contrast, in the intermediate body 1 and the touch switch intermediate manufacturing method, the in-mold film 30 in which the base film 31 and the transparent conductive layer 33 are in close contact with each other via the anchor layer 32 is formed by in-mold molding. 2 is arranged in close contact with one surface 2a. That is, the transparent conductive film 3 is sandwiched between the base portion 2 and the protective film 4 without a gap. For this reason, unlike conventional touch panels and manufacturing methods that may cause a gap between two glass substrates, the effects of changes in the surrounding environment such as temperature and humidity can be suppressed to a sufficiently low level. It is possible to construct a highly reliable touch switch that operates sufficiently little. Furthermore, since the conventional touch panel and the manufacturing method use a glass substrate, the touch panel is relatively large and is suitable for use in an input device of equipment installed at a specific location such as an ATM. As an input device of a type device, there are a problem that the weight is increased and a problem that it is easily damaged by dropping or impact. On the other hand, in the intermediate body 1 and the touch switch intermediate manufacturing method, the base portion 2 is formed of resin by in-mold molding. Therefore, according to this intermediate body 1 and this touch switch intermediate manufacturing method, it is possible to constitute a touch switch that is light in weight and hardly damaged.

  Subsequently, the other surface 2b (surface to be a touch surface: refer to FIG. 2) of the base body 2 in the intermediate body 1 is subjected to hard coat processing for preventing scratches and antireflection processing. Next, a metal film is formed on the end portion 3a of the transparent conductive film 3 exposed at the end portion 2c of the base portion 2 to form an electrode, and this electrode is connected to a driving circuit. Thus, the touch switch is completed.

  Thus, according to the intermediate body 1 and the touch switch intermediate manufacturing method, the transparent conductive layer 33 is formed by bonding the transparent conductive layer 33 to the one surface 2a of the base portion 2 by in-mold molding using the in-mold film 30. Unlike the conventional touch panel and the manufacturing method, the complicated process of bonding two glass substrates by exposing the end 3a of the conductive film 3 and covering the covering region 3b of the transparent conductive film 3 with the base film 31. Since the manufacturing process can be simplified, the manufacturing cost can be reduced. Moreover, according to this intermediate body 1 and the touch switch intermediate manufacturing method, since the transparent conductive film 3 is sandwiched between the base portion 2 and the protective film 4 without a gap, it is interposed between the two glass substrates. Compared to conventional touch panels and manufacturing methods that may cause gaps, the effects of changes in the surrounding environment such as temperature and humidity can be suppressed to a sufficiently low level. A switch can be configured. Furthermore, according to the intermediate body 1 and the touch switch intermediate manufacturing method, unlike the conventional touch panel and manufacturing method using a glass substrate, the base portion 2 can be formed of resin by in-mold molding. It is possible to construct a touch switch that is light and difficult to break.

  Further, according to this touch switch intermediate manufacturing method, after performing in-mold molding using the in-mold film 30 in which the cut 31d is formed in the base film 31, the end 4a of the protective film 4 is cut along the cut 31d. By separating and exposing the end portion 3a of the transparent conductive film 3, the end portion 4a of the protective film 4 can be easily cut without using a cutting tool, thereby sufficiently improving the manufacturing efficiency. Can do.

  In addition, this invention is not limited to said structure. For example, although the example provided with the base part 2 configured in the shape of a rectangular plate has been described above, the shape of the base part 2 is not limited to this and can be defined as an arbitrary shape. For example, a curved base portion may be employed, or a base portion having a shape in which a plurality of plate-like panels are connected may be employed.

  Further, the example of cutting the in-mold film 30 after performing the in-mold molding using the strip-shaped in-mold film 30 is described above. However, the in-mold film 30 previously cut into a size and a shape sandwiched between the base portions 2 is described. It is also possible to perform in-mold molding using.

It is a perspective view which shows the structure of the intermediate body 1 for touch switches. It is a side view of the intermediate body 1 for touch switches. 1 is a configuration diagram showing a configuration of a manufacturing apparatus 101. FIG. 3 is a perspective view of a fixed side mold 111. FIG. 3 is a perspective view of a moving side mold 121. FIG. 2 is a cross-sectional view of an in-mold film 30. FIG. 2 is a plan view of an in-mold film 30. FIG. 4 is a plan view showing a configuration of one region A of the in-mold film 30. FIG. 2 is a sectional view of a mold 102. FIG. It is sectional drawing of the state which joined the stationary side metal mold | die 111 and the movement side metal mold | die 121. FIG. It is a top view of intermediate body 1 before separation. It is a top view of intermediate body 1 after separation. It is a perspective view in the state where end 4a of protective film 4 is cut off.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Intermediate body for touch switches 2 Base part 2a One surface 3 Transparent electrically conductive film 3a End part 3b Covering area 4 Protective film 4a End part 30 In-mold film 31 Base film 31d Cut 33 Transparent conductive layer

Claims (3)

A capacitive touch switch intermediate comprising a base portion and a transparent conductive film formed on one surface of the base portion,
The said transparent conductive film is comprised with the said transparent conductive layer bonded by the said in-mold shaping | molding on the said one surface of the said base | substrate part shape | molded by the in-mold shaping | molding using the in-mold film which has a transparent conductive layer on a base film. And an intermediate for a touch switch in which a region excluding the electrode forming region is covered with the base film in a state where the electrode forming region of the transparent conductive film is exposed. A touch switch intermediate manufacturing method for manufacturing a capacitive touch switch intermediate comprising a base portion and a transparent conductive film formed on one surface of the base portion,
The base portion is formed by in-mold molding in which a resin is injected into a cavity of an in-mold molding die in which an in-mold film having a transparent conductive layer is sandwiched on a base film, and the base by the in-mold molding. After forming the transparent conductive film by pasting the transparent conductive layer on one surface of the part, a predetermined portion of the base film is cut off to expose the electrode forming region of the transparent conductive film and remove the electrode forming region A method for manufacturing an intermediate for a touch switch, wherein the region is maintained in a state covered with the base film.   The said predetermined part is cut | disconnected along the said notch, after performing the said in-mold shaping | molding using the said in-mold film in which the notch for separating the said predetermined part of the said base film from another part was formed. Of manufacturing an intermediate for touch switch.

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