TW200929302A - Intermediate for touch switch, and manufacturing method of intermediate for touch switch - Google Patents

Abstract

To provide an intermediate for a touch switch of a capacitance type capable of achieving the reduction of cost and the improvement of reliability. The intermediate for the touch switch is provided with a base body 2, and a transparent conductive film 3 formed on one face of the base body 2. The transparent conductive film 3 has a transparent conductive layer pasted by in-mold molding on one face of the base body 2 molded by in-mold molding by the use of an in-mold film having the transparent conductive layer on a base film, and at the same time, with its end 3a in an exposed state, a coated area 3b except the end 3a is covered with the base film.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an intermediate body for a capacitive touch switch including a base portion and a transparent conductive film formed on the surface of the base portion, and a method for manufacturing the touch A method for manufacturing an intermediate for a touch switch for controlling an intermediate for a switch. [Prior Art]

Lu In recent years, many types of electrical equipment such as portable information terminals or cash automatic teller machines have touch-operated operating units that can be input by touching (touching) fingertips. The touch-type operation unit is configured by disposing a transparent conductive film on one surface of a light-transmitting substrate, and includes a touch switch (touch panel) mounted on a display such as a crt or an LCD. In addition, according to the change A of the electrostatic capacitance, the electrostatic electric valley type touch-open relationship for detecting the presence or absence of the touch 35 or the touch position is performed, and the surface on which the transparent conductive film is disposed is located on the side of the display side where the transparent conductive film is not provided (touch Touch the touch surface of the fingertip); install it on the side of the watch. At this time, the transparent conductive medium is easily damaged by the peeling of the transparent conductive film, and is also susceptible to (four) ringing due to changes in temperature or humidity. Because of these factors, the surface resistance value of the transparent conductive film, that is, the characteristics of the touch switch (antenna characteristics, etc.), changes, and there is a problem that an error occurs. In the case of a touch switch capable of solving the above-described defective If shape, a touch-opening relationship is known in which a transparent substrate or a protective layer is disposed on a transparent conductive film (for example, as disclosed in Japanese Laid-Open Patent Publication No. Hei No. 5 324203 Touch panel). At this time, the touch surface (4) disclosed in the above publication is provided by making the material of the material

2186-9909-PF 5 200929302 The glass substrate of the transparent conductive film, the protective film and the electrode terminal, and the glass substrate provided with the glare preventing film and the protective film are bonded to each other. (Patent Document 1) Japanese Laid-Open Patent Publication No. Hei No. 5-324203 (pages 2 to 3, FIG. 1) [Explanation] (Problems to be solved by the invention) ❹ However, the above touch panel has the following problems. produce. That is, the touch panel is constructed by laminating two glass substrates. Therefore, there is a need for a step of bonding the touch panel, and therefore there is a problem that the manufacturing steps are complicated and the manufacturing is difficult to reduce. The present invention has been made in view of the above problems, and its main object is to provide a method for manufacturing a touch switch intermediate body and a touch switch intermediate body which can realize cost reduction. (Means for Solving the Problem) φ In order to achieve the above object, the intermediate system for a touch switch of the present invention includes a base portion; and an intermediate body for an electrostatic electric valley touch switch formed on a transparent conductive film on one surface of the base portion Wherein the transparent conductive film is attached to the one surface of the base portion formed by in-mold molding using an in-mold film having a transparent conductive layer on a base film, and is pasted by the in-mold forming method The transparent conductive layer is formed, and in a state where the electrode formation region of the transparent conductive film is exposed, a region other than the electrode formation region is covered by the base film. In addition, the manufacturing method of the intermediate body for a touch switch of the present invention is for manufacturing a capacitive touch switch including a base portion; and a transparent conductive film formed on one surface of the base portion, for use in 2186-9909-PF 6 200929302 A manufacturing method of a touch switch for an intermediate body, wherein a resin is injected from a cavity of an in-mold forming mold in a state in which an in-mold film having a transparent conductive layer is sandwiched on a base sheet In the in-mold forming process, the base portion is formed, and the transparent conductive layer is bonded to one surface of the base portion by the in-mold forming method, and after the transparent conductive film is formed, the substrate is thinned. The portion = 0 is cut away to expose the electrode formation region of the transparent conductive film, and is maintained in a state in which a region other than the electrode formation region is covered by the base film. At this time, the aforementioned in-mold method may be used to form the in-mold method for forming the slit for cutting the predetermined portion of the base film from the other portion, and then the predetermined portion may be cut along the slit. (Effect of the Invention) According to the intermediate body for a touch switch of the present invention and the method for manufacturing an intermediate e body for a touch switch, the in-mold method is applied to one side of the base portion by in-mold forming using an in-mold film. The electrode formation region of the transparent conductive film formed by the transparent conductive layer of the film is exposed, and the base film is covered with a region other than the electrode formation region in the moon-transparent conductive film, thereby being different from the conventional touch panel and the manufacturing method' The complicated steps of bonding the two glass substrates can be omitted, so that the manufacturing steps can be simplified, and as a result, the manufacturing cost can be reduced. Further, in the conventional touch panel and the manufacturing method, since the two glass substrates are attached to each other without a gap, a high degree of technology is required, so that a gap is easily formed between the two, and it is difficult to change the surrounding environment due to temperature or humidity. Shadow

2186-9909-PF 7 200929302 The suppression is very small, and it is difficult to achieve a touch panel with very little error and reliability. In the method of manufacturing the intermediate body for a touch switch and the intermediate body for a touch switch, the transparent conductive film is sandwiched between the base portion and the base film in a state of a gap. Therefore, the method for manufacturing an intermediate body for a touch switch, an intermediate body, and a touch switch can be compared with a conventional touch panel and a manufacturing method in which a gap is formed between two glass substrates. The effect of the change in the surrounding environment such as temperature or humidity is suppressed to a very small level. As a result, a touch switch having a very small error and high reliability can be constructed. Further, in a conventional touch panel and a manufacturing method, since a glass substrate is used, it is suitable for an input device of a device that is relatively large and installed in a specific place, but in the case of an input device of a portable device, There is a problem of a large weight, or a problem that is easily broken due to dropping or impact. In contrast, in the intermediate body for a touch switch and the method for manufacturing a touch switch intermediate body, the base portion is formed of a resin by in-mold molding. Therefore, according to the method for manufacturing the intermediate body for a touch switch and the intermediate body for a touch switch, a touch switch which is light in weight and is not easily broken can be constructed. Further, according to the method for producing an intermediate body for a touch switch of the present invention, after the in-mold forming method is performed using an in-mold film in which a base film is formed with a slit, the predetermined portion of the base film is cut along the slit to make the transparent conductive The electrode formation region of the film is exposed, whereby a predetermined portion of the base film can be easily cut without using a cutting tool, and as a result, the manufacturing efficiency can be sufficiently improved. [Embodiment] 2186-9909-PF 8 200929302 The best mode of the method for manufacturing the intermediate body for a touch switch and the intermediate body for a touch switch of the present invention will be described. First, an intermediate body for a touch switch which is an example of an intermediate body for a touch switch of the present invention will be described with reference to the drawings! (The following is also referred to simply as "intermediate 1"). The intermediates in Figure 1 2! For example, the intermediate body used in the capacitive touch switch functioning as a touch-type operation unit such as an electric device includes the base portion 2, the transparent conductive film 3, and the protective layer 4 as shown in the figure. The configuration is carried out by in-mold forming using the in-mold method (dish 1 (1) mold 1 2 (refer to Fig. 3: hereinafter, simply referred to as "mold 1 2"). As shown in FIGS. 1 and 2, the base portion 2 is formed in, for example, a rectangular plate shape, and a resin having transparency is emitted by cavity 1〇2 & (refer to the first drawing) of the mold 102 (for example, The acrylic conductive film 3 is formed by an in-mold method, and the transparent conductive layer 33 in the strip-shaped in-mold film 30 (refer to Fig. 6) to be described later is cut out. A part of the base portion 2 is formed to be attached to the surface 2a of the base portion 2. The protective layer 4 is formed by the portion of the base film 31 in the in-mold film 3, as shown in Fig. 2 'covering transparent conductive except for forming an electrode for connecting the driving circuit other than e to the transparent conductive film 3 The end portion 3a (the electrode formation region in the present invention) other than the end portion 3a (the electrode formation region in the present invention) is disposed on the transparent conductive film 3. That is, in the intermediate body 1 for the touch switch, the system is transparently conductive. The end 3a of the membrane 3 is at the base

2186-9909 'PF 9 200929302 In a state in which the end portion 2c of the body portion 2 is exposed, the covering region 3b is covered by the base film 31. At this time, the hot-melt resin layer 34 of the in-mold film 30 is present between the transparent conductive film 3 and one surface 2a of the base portion 2, and the in-mold method is present between the protective film 4 and the transparent conductive film 3. The anchor layer 32 of the film 3 is omitted, but its illustration is omitted in Fig. 2. Here, the material or formation method of the base film 31 (i.e., the protective film 4), the anchor layer 32, the transparent conductive layer 33 (i.e., the transparent conductive layer 3), and the heat-fusible resin layer 34 will be described in detail later. Next, the configuration of the manufacturing apparatus 1A will be described with reference to the drawings. As shown in Fig. 3, the manufacturing apparatus 1〇1 includes a mold 1 2, an in-mold film moving device 103, and an injection molding machine 1〇4. Mold 1 2 In accordance with the method for producing an intermediate body for a touch switch of the present invention, a mold of the intermediate body i, including a fixed side mold lu and a movable side mold 121, can be produced by in-mold forming. At this time, the mold 丨〇 2 can form four intermediates in a single forming step (! 射 shot) by the injection molding machine 104! (take 4) to form. Further, in the state in which the mold 〇 2 is sandwiched between the in-mold film 30 which is moved by the in-mold film moving device 1 3 (see FIG. 1), the main portion 113 of the fixed side mold 1 is attached. The main body portion 123 of the moving side mold 121 is configured to be engageable. As shown in Fig. 4, the fixed side mold U1 includes a base portion 112 and a main body portion 113. The base cymbal 112 is formed as a plate & and is configured to be attachable to a fixed side mounting portion (not shown) of the injection molding machine 104. The main body portion 113 is fixed to the base portion 112, and is configured to be movable with the movable side mold 121 in the state of the inner mold film 30 as shown in Fig. 1 . 123 joined. As shown in Fig. 5, the moving side mold 121 includes a base portion 122, a main body portion 123, a spacer block 124, and an eject plate 125. The base portion 122 is formed in a plate shape and is configured to be attached to a moving side mounting portion (not shown) of the injection molding machine 104. The main body portion 123 is fixed to the base portion i 22 through the spacer block 1 24 . Further, as shown in Figs. 5 and 9, a concave portion 123b having four φ forming cavities 1〇2a is formed in the mold surface 123a of the main body portion 123. Further, the main body portion 123 is formed with a flow path (runner) for connecting a sprue U3b (see FIG. 4) of the fixed side mold U1 to a gate i23c formed at the edge of the concave portion 123b. The groove 123d). The top plate 125 is disposed between the base portion 122 and the main body portion 123, and is moved between the base portion 122 and the main body portion 123 by the injection molding machine 1A4, thereby causing the ejection pin outside the drawing. (eject pin) is ejected toward the front of the body portion 123. As shown in Fig. 3, the in-mold film moving device 1〇3 is interposed between the fixed side jaw mold U1 and the moving side mold 121, and is subjected to in-mold forming once (one shot), even if the in-mold method is used. The film 3 is moved by a predetermined length (for example, the length L shown in Figs. 7 and 8). * As shown in Fig. 6, the in-mold film 3 is composed of the above-mentioned base film 31, the anchor layer 32, the transparent conductive layer 33, and the heat-fusible resin layer%. The base film 31 is a resin film having transparency and flexibility and is formed in a belt shape. In this case, a material such as polyethylene terephthalate (PET), a polythene film such as polyethylene or polypropylene, a polycarbon film, or a nylon may be used as the material of the base film 31. Film, acrylic film, 2186'9909-PF 11 200929302 viscose (cellophane) film and norbornene film (JSR (share) system "ART0N丨r訏 scratch * description, " booklet display) For example, the thickness of the base film 31 is preferably w ΛΛ ΛΛ ΛΛ ΛΛ u , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Further, as shown in the seventh and eighth figures, + # + _, the base film 31 is formed with a circular hole 31a and a substantially rectangular hole 31c which is substantially rectangular. The hole 31a is a hole for performing the positioning of the in-mold film 3 of the die I 1 〇 2 during the in-mold forming process, for example, by the molding process in the i-step forming step. The inner film moves the f 1G3 and the area of the length L of the movement is formed by *. In addition, the hole 31 c is formed to be formed by the forming step of the time The four intermediates 1 are separated from each other, and three holes are formed in the above-mentioned area A. At this time, as shown in Fig. 8, each of the holes 31 c is formed with a cavity 102a of each edge portion and the mold i 〇 2 (at In the figure, the size and the position of the edge are defined as the same position. In the figure, in order to easily understand, it is easy to understand a point which is a part of the edge of the model. The chain line is shown in each of the holes 31c. Further, as shown in the figure, the base film 31 is formed to cut a part thereof (corresponding to a predetermined portion in the present invention, the end portion 4a of the protective film 4 to be described later). The slit layer 31 is a layer having a peeling property. For example, a liquid in which various thermosetting hard coat agents such as an anthrone-based, acrylic, or melamine-based hard coat agent are dissolved in a solvent is applied onto the base film 31. In this case, it is preferable to use an anthrone-based hard coating agent which is excellent in terms of high hardness, and it is also possible to use a radically polymerizable hard such as an unsaturated polyester resin or an acrylic resin. Cationic polymerization of coating agents, epoxy and ethylene-based mysteries Hard coating agent

2186-9909-PF 12 200929302 Various UV curing hard coating agents are used instead of thermosetting hard coating agents. In this case, an acrylic acid-based radical polymerizable hard coating agent which is excellent in curing reactivity and surface hardness is preferably used. Further, as shown in Fig. 8, the anchor layer 32 is formed between the portions of the respective faces of the base film 31: in a strip shape.

The transparent conductive layer 33 is a film having transparency and conductivity, and is formed on the staggered layer 32, that is, between the portions where the above-mentioned respective holes are formed. In the case of the transparent conductive & 33 material, tin-doped indium oxide (ITG), gallium-doped indium oxide, and zinc-doped oxidized oxidized granules, strontium-doped tin oxide (ΑΤ0) can be used. And fluorine-doped oxidized kick (FT0) and other tin oxide particles, doped aluminum oxide (), gallium-doped zinc oxide (GZ0), fluorine-doped zinc oxide, indium-doped zinc oxide and doped Zinc oxide fine particles such as zinc oxide of boron, and various conductive inorganic fine particles such as oxidized ore. At this time, it is preferable to use ΙΤ0 in terms of excellent conductivity. Alternatively, it is also possible to apply a crucible or an AT crucible to a surface of a transparent microparticle such as a sulfuric acid lock. Further, the particles of the fine particles may be arbitrarily defined in accordance with the required optical characteristics and electrical characteristics. However, in order to obtain good optical characteristics (haze), it is preferably specified below, and is specified to be 1 nm. To (10) (10) is more preferable, and it is more preferably 5 nm to 1 〇〇 nm. . The hot-melt resin layer 34 is formed by laminating a resin material which is formed in a molten state at a predetermined temperature (for example, about 9 (TC) in a molten state on the transparent conductive layer 33. The hot-melt resin is used. For the resin material used for the layer μ, it can be used: polyester resin, propylene glycol

2186-9909-PF 13 200929302 曰, epoxy resin, polycarbonate resin, polyolefin resin, nitrocellulose resin, polyamine vinegar resin, chlorinated rubber resin, polyamine resin and A polyvinyl chloride-vinyl acetate copolymer or the like. Among these, it is preferable to use a resin which is a resin of the base portion 2 (an example of an acrylic resin), which is good for the meltability of the heat-fusible resin layer 34. At this time, in the formation of the hot-melt resin layer 34, when the molten hot-melt resin layer 34 is coated with a resin on the transparent conductive φ layer 33, between the fine particles constituting the transparent conductive layer 33 The gap contains Han resin. Therefore, in the in-mold film 3, the transparent conductive layer is formed to have flexibility. In the injection molding machine 104, an injection molding machine of a horizontal type includes, for example, a fixed side mounting portion, a moving side mounting portion, a mold closing mechanism, an injection mechanism, and an ejection mechanism (none of which are shown). . Next, a step of manufacturing the intermediate intermediate body 1 using the manufacturing apparatus 1〇1 (mold 1〇2) and the manufacturing method of the intermediate body for a touch switch according to the present invention will be described with reference to the drawings. First, as shown in Fig. 3, the fixed side mold 111 and the movable side mold 121 of the mold 1 2 are attached to the fixed side mounting portion and the moving side mounting portion outside the drawing in the injection molding machine 1 to 4, respectively. Next, the base film 3A is opposed to the die face 13a of the fixed side die 111 (see FIGS. 4 and 9), and the in-mold film 30 is placed in the in-mold film moving device 1〇3 to be in-mold. The film moving device 1〇3 is actuated. At this time, the in-mold film moving device is interposed between the fixed side mold U1 and the moving side mold 121 of the mold 102, and the in-mold film 30 is moved by a predetermined length. The injection molding machine 1〇4 2186-9909-PF 14 200929302 is activated. At this time, the mold closing mechanism of the injection molding machine 104 moves the moving side mounting portion toward the fixed side mounting portion as shown in FIG. 10, whereby the fixed side mold 111 and the moving side mold i21 are sandwiched between the molds and the molds. Engaged in each other in the state of 3G. Next, the resin in the flowing state is pressure-fed by the injection mechanism of the injection molding machine 1A4. At this time, the resin to be pressure-fed by the injection molding machine 104 is ejected into the cavity 102a by the gate 123c formed in the main body portion 123 of the moving side mold 121 through the sprue 113b and the runner. Then, the in-mold film 30 is pressed against the mold surface 113a of the main body portion 113 of the fixed side mold 1U constituting the cavity i〇2a, and the gate portion 123c is filled with the resin surface of the cavity 102a. The cavity is 1〇2a. Further, the heat-fusible resin layer 34 of the in-mold film 3 is melted by the heat of the resin to be ejected, and is formed into a phase fusion state with the resin. Therefore, the transparent conductive layer 33 is bonded to the one surface 2a of the base portion 2 after the formation through the heat-fusible resin layer 34. Then, after a predetermined cooling time has elapsed, the mold closing mechanism of the injection molding machine 1〇4 moves the moving-side mounting portion in a direction away from the fixed-side mounting portion, thereby releasing the engagement between the fixed-side mold 111 and the moving-side mold 121. 'The moving side mold 121 is separated from the fixed side mold 111. At this time, the molded article (four base portions 2) formed by curing the resin to be ejected and the in-mold film 30 are separated from the movable side mold 121 by the fixed side mold 111. Next, the injection molding machine The ejecting mechanism of the 104 moves the top plate 12 5 of the moving side mold 121 toward the main body portion 1 2 3 side, thereby ejecting the ejecting pin outside the drawing toward the front of the main body portion 123, together with the in-mold film 3〇2186- 9909-PF 15 200929302 - The four base portions 2 in a state in which the movable side molds 121 are taken out and connected through the in-mold film 3 are attached. Then, the in-mold film moving device 103 moves the in-mold film 3 to a predetermined length. Next, for example, the in-mold film 30 is cut at the broken line portion shown in Fig. 11. As a result, as shown in Fig. 12, the four base portions 2 in the state in which the in-mold film 30 (i.e., the transparent conductive film 3 and the protective film 4) which are cut are pasted are cut away. Next, as shown in Fig. 13, the end portion 4a of the protective film 4 (base film 31) is cut out. Thereby, the end portion 3a of the transparent conductive film 3 (transparent conductive layer 33) under the end portion 4a is exposed. Further, the covering region 3b other than the end portion 3a of the transparent conductive film 3 is maintained in a state covered by the protective film 4 (base film 31). The above is the completion of the production of the intermediate 1. At this time, in the in-mold film 3, the slit 31d is formed in advance on the base film 31, so that the end portion 4a of the protective film 4 can be easily cut without using a cutting tool. Further, the transparent conductive film 3 (transparent conductive layer 33) is surely bonded (adhered) to one surface 2a of the base portion 2 by the heat-fusible resin layer 34. Therefore, the end of the protective film 4 is surely prevented. When the portion 4a is cut, the transparent conductive film 3 is peeled off from the base portion 2. Further, in the method for producing an intermediate body for a touch switch, a part of the underlying film 31 of the in-mold film 30 is used as the protective film 4, and the covered region 3b of the transparent conductive film 3 is protected by the protection. The film 4 is covered. Therefore, unlike the conventional touch panel and manufacturing method, the complicated steps for bonding two glass substrates can be omitted, so that the manufacturing process can be reduced by simplifying the process results. In addition, in the conventional touch panel and the manufacturer 2186-9909-PF 16 200929302, since the two glass substrates are required to be bonded without gaps, a high degree of technology is required, so that it is easy to create a gap between the two, and it is difficult to apply temperature. The influence of changes in the surrounding environment such as humidity is suppressed to a very small extent, and as a result, it is difficult to realize a touch panel having a very small error and reliability. On the other hand, in the method for manufacturing the intermediate body 1 and the intermediate body for a touch switch, the in-mold film 3 密 in which the base film 31 and the transparent conductive layer 33 are in close contact with each other via the anchor layer 32 is used in the mold. The method is formed in close contact with one surface 2a of the base portion 2 to be disposed. That is, the transparent conductive film 3 is sandwiched by the base portion 2 and the protective film 4 in a state where there is no gap. Therefore, unlike the conventional touch panel and the manufacturing method in which a gap is formed between two glass substrates, the influence due to changes in the surrounding environment such as temperature or humidity can be suppressed to a very small extent, and the result can be constituted. A touch switch with very few errors and high reliability. Further, in the conventional touch panel and the manufacturing method, since the glass substrate is used, it is suitable for an input device of a large-sized device such as an ATM and installed in a specific place, but the input device of the portable device may have An m problem with a large weight, or a problem that is easily broken due to dropping or impact. On the other hand, in the intermediate body 1 and the method for manufacturing the intermediate body for a touch switch,

The inner portion is formed and the base portion 2 is formed in a tree shape. Therefore, the intermediate body J and the method for manufacturing the intermediate body for the touch switch can constitute a touch switch which is light in weight and is not easily broken. Next, the other surface 2b (surface formed as a touch surface: see Fig. 2) of the base portion 2 in the intermediate i is subjected to a hard coating process for preventing damage and a reflection preventing process. Then, a metal film is formed as an electrode at the end portion 3& of the transparent conductive film 3 exposed at the end portion 2c of the base portion 2, and the electrode 2186-9909-PF 17 200929302 is connected to the driving circuit. The touch switch is completed by the above. As described above, according to the intermediate method and the method for producing an intermediate for a touch switch, the transparent conductive layer 33 is bonded to one surface 2a of the base portion 2 by in-mold molding using the in-mold film 30. The end portion 3a of the transparent conductive film 3 is exposed, and the covering region 3b of the transparent conductive film 3 is covered by the base film 31, which is different from the conventional touch panel and the manufacturing method, and can be omitted for bonding two glasses. The complicated steps of the substrate can simplify the process, and as a result, the manufacturing cost can be reduced. Further, according to the method for producing the intermediate body 1 and the intermediate body for a touch switch, since the transparent conductive film 3 is sandwiched by the base portion 2 and the protective film 4 without a gap, there are two sheets of glass. A conventional touch panel and a manufacturing method in which a gap is formed between the substrates can suppress the influence of changes in the surrounding environment such as temperature or humidity to a very small extent, and as a result, a touch with little error and high reliability can be formed. Control switch. Further, according to the method for producing the intermediate body and the intermediate body for a touch switch, unlike the conventional touch panel and the manufacturing method using the glass substrate, since the base portion 2 is formed of resin by in-mold molding, It can form a touch switch that is light in weight and not easily damaged. Further, according to the method for manufacturing an intermediate body for a touch switch, after the in-mold forming method is performed using the in-mold film 30 having the slit 31d formed in the base film 31, the end portion 4a of the protective film 4 is cut along the slit 31d. Further, the end portion 3a of the transparent conductive crucible 3 is exposed, whereby the end portion 4a of the protective film 4 can be easily cut without using a cutting device, and as a result, the manufacturing efficiency can be sufficiently improved. However, the present invention is not limited to the above configuration. For example, the above-described needle 2186-9909-PF 18 200929302 describes an example including the base portion 2 which is formed in a rectangular plate shape, but the shape of the base portion 2 can be limited to any shape, and is not limited thereto. For example, a base portion having a curved shape may be used, or a base portion having a shape in which a plurality of plate-like panels are connected may be used. In the above, the in-mold method is used to form an in-mold method after the in-mold method is used, and the in-mold film 3 is cut, but it may be cut into the base portion beforehand. The in-mold film 30 of the size and shape of 2 is subjected to in-mold forming. [Simple description of the diagram] Figure 1 shows the intermediates for touch switches! A perspective view of the composition. Fig. 2 is a side view of the intermediate body 1 for a touch switch. Fig. 3 is a view showing the configuration of the manufacturing apparatus 1〇1. Fig. 4 is a perspective view of the fixed side mold u丨. φ Fig. 5 is a perspective view of the moving side mold 121. Fig. 6 is a cross-sectional view showing the in-mold film 30. Fig. 7 is a plan view of the in-mold film 3〇. Fig. 8 is a plan view showing the configuration of a region a of the in-mold film 30. Figure 9 is a cross-sectional view of the mold 1 〇 2 . The first drawing is a cross-sectional view showing a state in which the fixed side mold U1 and the moving side mold ι21 are joined. Figure 11 is a plan view of the intermediate 1 before cutting. 2186-9909-PF 19 200929302 Fig. 12 is a plan view of the intermediate body 1 after cutting. Fig. 13 is a perspective view showing a state in which the end portion 4a of the protective film 4 is cut out. [Description of main component symbols] 1 Intermediate body for touch switch 2 Base portion 2a One surface 2b of base portion 2 The other surface of base portion 2® 2c End portion 3 of base portion 2 Transparent conductive film 3a End portion 3b Covered area 4 Protective film 4a end portion 30 in-mold film _ 31 base film _ 31 a hole 31c hole 3Id slit 32 anchor layer 33 transparent conductive layer 34 heat-meltable resin layer 101 manufacturing apparatus 102 mold (in-mold mold) 2186-9909-PF 20 200929302 102a cavity 103 in-mold film moving device 104 injection molding machine 111 fixed side mold 112 base portion 113 main body portion 113a of fixed side mold 111 mold surface 113b sprue® 121 moving side mold 122 base portion 123 moving side mold 121 body portion 123a mold surface 123b recess portion 123c gate 123d groove A 124 spacer block body reference 125 top plate 2186-9909-PF 21

Claims (1)

200929302 X. Patent application scope: 1. An intermediate for a touch switch, which is a system of a (four) eve system, including a base portion and a transparent conductive film formed on one side of the base, J烀冤电今The touch switch is characterized in that: the transparent conductive film is formed by removing the formed base portion by using a mold η of an in-mold film having a transparent conductive layer on the base film. One side of the transparent conductive layer which is bonded by the in-mold opening ν, and under the side of the electrode forming region where the transparent conductive film is exposed, is covered by the base film except the electrode. Areas outside the area. 2. A method of manufacturing an intermediate body for a touch switch, comprising: an intermediate body for a capacitive touch switch comprising: a base portion and a transparent conductive film formed on one surface of the base portion, wherein: Forming the base portion by the in-mold forming method of the mold-injecting resin for the in-mold forming mold in a state in which the in-mold film having the transparent conductive layer is sandwiched on the base film, and by the in-mold method Forming and bonding the transparent conductive layer to the surface of the base portion, thereby forming the transparent conductive film and then cutting away a predetermined portion of the base thin film to expose the electrode forming region of the transparent conductive film, and maintaining The state of the region other than the electrode formation region is covered by the base film. 3. The method of manufacturing a touch switch device according to claim 2, wherein the predetermined portion 2186-9909-PF 22 200929302 of the base film is cut away from other portions. After the in-mold forming film is formed by the in-mold film forming the slit, the predetermined portion is cut along the slit. 2186-9909-PF 23