JP2009062604A5 - - Google Patents

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Publication number
JP2009062604A5
JP2009062604A5 JP2007233724A JP2007233724A JP2009062604A5 JP 2009062604 A5 JP2009062604 A5 JP 2009062604A5 JP 2007233724 A JP2007233724 A JP 2007233724A JP 2007233724 A JP2007233724 A JP 2007233724A JP 2009062604 A5 JP2009062604 A5 JP 2009062604A5
Authority
JP
Japan
Prior art keywords
processing
processing chamber
performs
pvd
cvd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2007233724A
Other languages
Japanese (ja)
Other versions
JP2009062604A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007233724A priority Critical patent/JP2009062604A/en
Priority claimed from JP2007233724A external-priority patent/JP2009062604A/en
Priority to CN200880023081A priority patent/CN101688296A/en
Priority to PCT/JP2008/065672 priority patent/WO2009034869A1/en
Priority to KR1020097027030A priority patent/KR20100065127A/en
Priority to TW97134559A priority patent/TW200931577A/en
Publication of JP2009062604A publication Critical patent/JP2009062604A/en
Publication of JP2009062604A5 publication Critical patent/JP2009062604A5/ja
Ceased legal-status Critical Current

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Claims (1)

前記第1の処理チャンバはPVD処理を行うPVD処理チャンバであり、前記第2の処理チャンバはCVD処理を行うCVD処理チャンバであることを特徴とする請求項1に記載の真空処理システム。 The vacuum processing system according to claim 1, wherein the first processing chamber is a PVD processing chamber that performs PVD processing, and the second processing chamber is a CVD processing chamber that performs CVD processing.
JP2007233724A 2007-09-10 2007-09-10 Vacuum treatment system, and method for carrying substrate Ceased JP2009062604A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007233724A JP2009062604A (en) 2007-09-10 2007-09-10 Vacuum treatment system, and method for carrying substrate
CN200880023081A CN101688296A (en) 2007-09-10 2008-09-01 Vacuum processing system and substrate transfer method
PCT/JP2008/065672 WO2009034869A1 (en) 2007-09-10 2008-09-01 Vacuum processing system and substrate transfer method
KR1020097027030A KR20100065127A (en) 2007-09-10 2008-09-01 Vacuum processing system and substrate transfer method
TW97134559A TW200931577A (en) 2007-09-10 2008-09-09 Vacuum treatment system, and method for carrying substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007233724A JP2009062604A (en) 2007-09-10 2007-09-10 Vacuum treatment system, and method for carrying substrate

Publications (2)

Publication Number Publication Date
JP2009062604A JP2009062604A (en) 2009-03-26
JP2009062604A5 true JP2009062604A5 (en) 2010-08-26

Family

ID=40451878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007233724A Ceased JP2009062604A (en) 2007-09-10 2007-09-10 Vacuum treatment system, and method for carrying substrate

Country Status (5)

Country Link
JP (1) JP2009062604A (en)
KR (1) KR20100065127A (en)
CN (1) CN101688296A (en)
TW (1) TW200931577A (en)
WO (1) WO2009034869A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040538A1 (en) * 2009-10-02 2011-04-07 東京エレクトロン株式会社 Substrate processing system
TWI408766B (en) * 2009-11-12 2013-09-11 Hitachi High Tech Corp Vacuum processing device
CN101958231A (en) * 2010-05-06 2011-01-26 东莞宏威数码机械有限公司 Gaseous environment buffer device
KR20120015987A (en) * 2010-08-12 2012-02-22 삼성전자주식회사 System for treating substrates
JP5785712B2 (en) * 2010-12-28 2015-09-30 株式会社日立ハイテクノロジーズ Vacuum processing equipment
KR101254721B1 (en) * 2011-03-30 2013-04-15 삼성전자주식회사 EFEM Buffer Module
JP5750328B2 (en) * 2011-07-20 2015-07-22 株式会社ニューフレアテクノロジー Vapor phase growth method and vapor phase growth apparatus
JP5923288B2 (en) * 2011-12-01 2016-05-24 株式会社日立ハイテクノロジーズ Vacuum processing apparatus and operating method of vacuum processing apparatus
CN103184427A (en) * 2011-12-28 2013-07-03 绿种子科技(潍坊)有限公司 Thin film deposition apparatus and application method thereof
KR101318929B1 (en) * 2012-06-18 2013-10-17 주식회사 씨엘디 Apparatus for pressing a plate assembly
KR101375646B1 (en) * 2012-06-18 2014-03-18 주식회사 씨엘디 Apparatus for pressing a plate assembly and method thereof
JP6120621B2 (en) * 2013-03-14 2017-04-26 株式会社日立ハイテクノロジーズ Vacuum processing apparatus and operation method thereof
CN104421437B (en) * 2013-08-20 2017-10-17 中微半导体设备(上海)有限公司 Movable valve, portable shielding door and vacuum flush system
KR101649356B1 (en) * 2014-01-20 2016-08-18 주식회사 풍산 Semiconductor Substrate Processing Apparatus
JP2017028209A (en) * 2015-07-27 2017-02-02 東京エレクトロン株式会社 Substrate housing method and substrate processing device
JP6141479B1 (en) * 2016-03-18 2017-06-07 エスペック株式会社 Drying equipment
CN106229287B (en) * 2016-09-30 2019-04-05 厦门市三安光电科技有限公司 For shifting the transposition head of microcomponent and the transfer method of microcomponent
CN110835739A (en) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 7-cavity vertical PECVD-PVD integrated silicon wafer coating process
CN110835735A (en) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 8-cavity horizontal HWCVD-PVD integrated silicon wafer coating process
KR102618825B1 (en) * 2020-01-06 2023-12-27 삼성전자주식회사 Air lock device and control system for prevent gas leaking in bays
JP7386738B2 (en) * 2020-03-19 2023-11-27 東京エレクトロン株式会社 Substrate transport method and substrate processing equipment
JP7420350B2 (en) * 2020-04-24 2024-01-23 島根島津株式会社 Automatic storage module and automatic storage system
JP7344236B2 (en) * 2021-02-08 2023-09-13 キヤノントッキ株式会社 Transport device, film forming device and control method
CN113122812B (en) * 2021-04-20 2023-06-09 郑州航空工业管理学院 Physical vapor deposition material processing equipment
KR102452714B1 (en) * 2021-12-23 2022-10-07 주식회사 에이치피에스피 Chamber apparatus for both high pressure and vacuum process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793348B2 (en) * 1989-05-19 1995-10-09 アプライド マテリアルズ インコーポレーテッド Multi-chamber vacuum processing apparatus and multi-chamber vacuum semiconductor wafer processing apparatus
JPH04254349A (en) * 1991-02-06 1992-09-09 Sony Corp Multichamber process apparatus
JP3486821B2 (en) * 1994-01-21 2004-01-13 東京エレクトロン株式会社 Processing apparatus and method of transporting object to be processed in processing apparatus
JP2003060008A (en) * 2001-05-21 2003-02-28 Tokyo Electron Ltd Treatment apparatus, apparatus and method for transfer

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