JP2009054969A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009054969A5 JP2009054969A5 JP2007222917A JP2007222917A JP2009054969A5 JP 2009054969 A5 JP2009054969 A5 JP 2009054969A5 JP 2007222917 A JP2007222917 A JP 2007222917A JP 2007222917 A JP2007222917 A JP 2007222917A JP 2009054969 A5 JP2009054969 A5 JP 2009054969A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- resist
- terminal
- forming
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007222917A JP5043563B2 (ja) | 2007-08-29 | 2007-08-29 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007222917A JP5043563B2 (ja) | 2007-08-29 | 2007-08-29 | 配線基板及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012155863A Division JP5399539B2 (ja) | 2012-07-11 | 2012-07-11 | 配線基板及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009054969A JP2009054969A (ja) | 2009-03-12 |
JP2009054969A5 true JP2009054969A5 (ko) | 2010-07-29 |
JP5043563B2 JP5043563B2 (ja) | 2012-10-10 |
Family
ID=40505745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007222917A Active JP5043563B2 (ja) | 2007-08-29 | 2007-08-29 | 配線基板及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5043563B2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5342422B2 (ja) * | 2009-12-10 | 2013-11-13 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
CN102378484B (zh) * | 2010-08-13 | 2017-02-08 | 雅达电子有限公司 | 提高焊点可靠性方法、印刷电路板、封装器件及封装模块 |
CN105357900A (zh) * | 2015-12-03 | 2016-02-24 | 北京浩瀚深度信息技术股份有限公司 | 消除异形smd元器件回流焊接位移的pad设计方法 |
KR102519736B1 (ko) * | 2018-01-17 | 2023-04-11 | 주식회사 루멘스 | Led 디스플레이 모듈 |
US20210035898A1 (en) * | 2019-07-30 | 2021-02-04 | Powertech Technology Inc. | Package structure and manufacturing method thereof |
CN212303653U (zh) | 2020-03-26 | 2021-01-05 | 北京小米移动软件有限公司 | 芯片、电路板、电路板组件及电子设备 |
CN113921491A (zh) * | 2020-07-08 | 2022-01-11 | 北京小米移动软件有限公司 | 芯片、电路板及电子设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0846079A (ja) * | 1994-07-28 | 1996-02-16 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JPH11204570A (ja) * | 1998-01-08 | 1999-07-30 | Sumitomo Metal Smi Electron Devices Inc | 外部入出力端子 |
JP4366777B2 (ja) * | 1999-09-01 | 2009-11-18 | パナソニック株式会社 | 電子部品 |
JP2004200187A (ja) * | 2002-12-16 | 2004-07-15 | Nikon Corp | プリント配線板 |
JP4541763B2 (ja) * | 2004-01-19 | 2010-09-08 | 新光電気工業株式会社 | 回路基板の製造方法 |
JP2005244149A (ja) * | 2004-01-26 | 2005-09-08 | Kyocera Corp | 配線基板 |
-
2007
- 2007-08-29 JP JP2007222917A patent/JP5043563B2/ja active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2009054969A5 (ko) | ||
KR102198629B1 (ko) | 예비 형성된 비아를 갖는 매립 패키징 | |
TWI521618B (zh) | 配線基板及其製造方法 | |
JP5882390B2 (ja) | チップ/基板アセンブリを形成する方法 | |
US8089141B1 (en) | Semiconductor package having leadframe with exposed anchor pads | |
JP2006303360A5 (ko) | ||
JP2020529742A5 (ko) | ||
JP2007013092A5 (ko) | ||
JP2009194322A5 (ko) | ||
JP2005164601A5 (ko) | ||
JP2011258772A5 (ko) | ||
JP2010141018A5 (ko) | ||
JP2013118255A5 (ko) | ||
JP2008028361A5 (ko) | ||
CN105405835B (zh) | 中介基板及其制法 | |
JP2012256741A5 (ko) | ||
JP2010028601A5 (ko) | ||
JP2009110983A5 (ko) | ||
JP2012015504A5 (ko) | ||
JP2009081357A5 (ko) | ||
JP5043563B2 (ja) | 配線基板及びその製造方法 | |
JP2014501451A5 (ko) | ||
JP2007294488A5 (ko) | ||
JP2010153831A5 (ja) | 配線基板および半導体装置 | |
JP2009182274A5 (ko) |