JP2009049139A - Metallized film capacitor - Google Patents

Metallized film capacitor Download PDF

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JP2009049139A
JP2009049139A JP2007213008A JP2007213008A JP2009049139A JP 2009049139 A JP2009049139 A JP 2009049139A JP 2007213008 A JP2007213008 A JP 2007213008A JP 2007213008 A JP2007213008 A JP 2007213008A JP 2009049139 A JP2009049139 A JP 2009049139A
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film
vapor deposition
layer
metallized film
metallized
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JP4915947B2 (en
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Kouji Takagaki
甲児 高垣
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Nichicon Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a metallized film capacitor the structure of which is simplified by improving humidity resistance of the smoothing capacitor of an inverter circuit for an automobile used under high temperatures and high humidity, and which is excellent in temperature cycle, self-healing, and windability, and stable in characteristics. <P>SOLUTION: This metallized film capacitor has a structure in which the vapor deposition thickness of a portion in the vicinity of the metallikon part of a metallized film is thicker than the thickness of a vapor deposition film in the non-vicinity part, a silicone based or a fluorine based oil layer is provided in the thick film part of the vapor deposition electrode in the vicinity of the metallikon part, and an oxide film layer is provided in the thin film part of the vapor deposition electrode in the non-vicinity of the metallikon part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、産業機器および自動車用等のインバータ回路の平滑用に使用する金属化フィルムコンデンサに関するものである。 The present invention relates to a metallized film capacitor used for smoothing inverter circuits for industrial equipment and automobiles.

従来の金属化フィルムコンデンサには、耐電圧性能と耐電流性能を向上させるために、図2(a)に示されるような、ポリプロピレン(以下、PPという)フィルム1のメタリコン部近傍部分の蒸着電極2の蒸着膜厚が厚く、メタリコン部近傍部分以外の蒸着電極3の蒸着膜厚が薄い構造の金属化フィルムが使用されている。
このような金属化フィルムを用いた金属化フィルムコンデンサにあっては、自己回復性能、耐湿性能の点からアルミニウム蒸着により形成された蒸着電極が一般に使用されている。
In a conventional metallized film capacitor, in order to improve withstand voltage performance and withstand current performance, a vapor deposition electrode in the vicinity of the metallicon portion of a polypropylene (hereinafter referred to as PP) film 1 as shown in FIG. A metallized film having a structure in which the vapor deposition film thickness of No. 2 is thick and the vapor deposition film thickness of the vapor deposition electrode 3 other than the vicinity of the metallicon part is thin is used.
In a metallized film capacitor using such a metallized film, a vapor deposition electrode formed by aluminum vapor deposition is generally used in terms of self-healing performance and moisture resistance.

しかし、自動車用としてインバータ回路の平滑用コンデンサは高温・高湿下で使用されるため、耐湿性能の要求が強く、この改善として図2(b)に示すようにPPフィルム1の片面に蒸着膜3を形成した後、SiOx皮膜層や反応性シリコーン膜等の保護皮膜層6を形成して外部からの湿度の侵入に対してアルミニウム蒸着膜が酸化劣化することを防止している(例えば、特許文献1、2参照)。 However, since the smoothing capacitor of the inverter circuit for automobiles is used at high temperature and high humidity, there is a strong demand for moisture resistance. As an improvement, a vapor deposition film is formed on one side of the PP film 1 as shown in FIG. 3 is formed, a protective film layer 6 such as a SiOx film layer or a reactive silicone film is formed to prevent the aluminum deposited film from being oxidized and deteriorated against the intrusion of humidity from the outside (for example, patents) References 1 and 2).

特開平10−083930号公報Japanese Patent Laid-Open No. 10-083930 特開2005−019836号公報JP 2005-019836 A

自動車用としてインバータ回路の平滑用等高温、高湿で使用される耐湿性能改善として、SiOxの保護皮膜層の場合20mg/mが限度で、これ以上では蒸着フィルムが変形しやすく適切でないとされている。
しかし、SiOxの保護皮膜層は20mg/mの場合でも、保護皮膜層は均一でなく、SiOx膜のない部分ができて耐湿性にばらつきが生じるが、これを例えば40mg/mとすると蒸着金属とほぼ同じ厚さになり、メタリコンを行うとメタリコンとの接触が悪くなり、過酷な温度サイクル試験では断線が発生するという問題がある。
As an improvement in moisture resistance performance for high-temperature and high-humidity applications such as smoothing inverter circuits for automobiles, the upper limit is 20 mg / m 2 for SiOx protective coating layers. ing.
However, even if the protective coating layer of SiOx is of 20 mg / m 2, the protective coating layer is not uniform, and although variations in the moisture resistance and be free portion of SiOx film, which, for example, a 40 mg / m 2 deposition There is a problem that when the metallicon is formed with the same thickness as the metal, the contact with the metallicon is deteriorated, and disconnection occurs in a severe temperature cycle test.

金属化フィルムコンデンサに使用される金属化フィルムは、分割電極の絶縁スリット部(図示せず)やメタリコン部近傍と幅方向反対側に絶縁マージン7を設けるが、この場合はフッ素系またはシリコーン系オイルを用いて蒸着金属が付着しないような方法をとっており、蒸着後は素子巻き取り性に影響しない、限られた量に制限している。
しかし、前記のように耐湿性改善のために反応性シリコーン膜の保護皮膜層6を形成した場合、自動車用等に用いる4μm以下の極薄の金属化フィルムでは、巻回時にフィルム(メタリコン部近傍部分以外の部分)がオイルで覆われると、フィルム間のすべりが悪くなり、巻回による皺が発生し、素子巻回が不可能であった。
The metallized film used for the metallized film capacitor is provided with an insulation margin 7 in the width direction opposite to the insulating slit part (not shown) of the split electrode and the metallicon part. In this case, fluorine-based or silicone-based oil is used. A method is employed in which the deposited metal does not adhere, and after deposition, the amount is limited to a limited amount that does not affect the element winding property.
However, when the protective coating layer 6 of the reactive silicone film is formed to improve the moisture resistance as described above, an extremely thin metallized film of 4 μm or less used for automobiles or the like is not suitable for the film (near the metallicon part). When the portion other than the portion was covered with oil, the slip between the films deteriorated, wrinkles due to winding occurred, and element winding was impossible.

本発明は、上述の従来の金属化フィルムコンデンサにおける問題を解決するもので、4μm以下の極薄蒸着フィルムであっても素子巻回が可能であり、また、90℃、90%RHの高温・高湿条件下での耐湿試験や、−40〜+120℃の温度サイクル試験でも安定した特性を確保することができる金属化フィルムコンデンサを提供することを課題とする。   The present invention solves the above-mentioned problems in the conventional metalized film capacitor, and the element can be wound even with an ultra-thin vapor-deposited film of 4 μm or less, and at a high temperature of 90 ° C. and 90% RH. It is an object of the present invention to provide a metallized film capacitor capable of ensuring stable characteristics even in a moisture resistance test under a high humidity condition and a temperature cycle test at −40 to + 120 ° C.

上記の課題を解決可能な本発明の金属化フィルムコンデンサは、誘電体フィルムの少なくとも片面に金属蒸着膜よりなる蒸着電極が設けられた金属化フィルムを巻回してコンデンサ素子が形成され、該コンデンサ素子の両端面にメタリコン部が形成され、前記メタリコン部近傍部分の蒸着膜厚が、メタリコン部近傍部分以外(メタリコン非近傍部分)の蒸着膜厚よりも大きい構造を有する金属化フィルムコンデンサにおいて、
前記メタリコン部近傍部分の蒸着電極表面に、シリコーン系オイルまたはフッ素系オイルのいずれかを塗布して形成されたオイル層が設けられ、前記メタリコン部近傍部分以外の蒸着電極表面には酸化物皮膜層が設けられていることを特徴とする。
The metallized film capacitor of the present invention capable of solving the above-mentioned problems is a capacitor element formed by winding a metallized film provided with a vapor deposition electrode made of a metal vapor deposition film on at least one surface of a dielectric film. In the metallized film capacitor having a structure in which the metallicon part is formed on both end faces of the metallized film, and the deposited film thickness in the vicinity of the metallized part is larger than the deposited film thickness in a part other than the vicinity of the metalizedon part (non-metallized part).
An oil layer formed by applying either silicone-based oil or fluorine-based oil is provided on the surface of the vapor deposition electrode near the metallicon part, and an oxide film layer is formed on the surface of the vapor deposition electrode other than the part near the metallicon part. Is provided.

また、本発明は、上記の金属化フィルムコンデンサにおいて、前記酸化物皮膜層の厚さが0.002〜0.030μmであることを特徴とする。
更に、本発明は、上記の金属化フィルムコンデンサにおいて、前記酸化物皮膜層が、アルミニウム酸化皮膜層、SiOx皮膜層および銅酸化皮膜層からなるグループより選ばれたものであることを特徴とする。
また、本発明は、上記の金属化フィルムコンデンサにおいて、前記誘電体フィルムがポリプロピレンフィルムであることを特徴とする。
さらに、本発明は、上記の金属化フィルムコンデンサにおいて、前記金属化フィルムの少なくとも片面の蒸着電極が複数個に分割され、該蒸着電極同士がヒューズにより接続されていることを特徴とする。
In the metallized film capacitor according to the present invention, the oxide film layer has a thickness of 0.002 to 0.030 μm.
Furthermore, the present invention is characterized in that, in the metallized film capacitor, the oxide film layer is selected from the group consisting of an aluminum oxide film layer, a SiOx film layer, and a copper oxide film layer.
According to the present invention, in the metallized film capacitor, the dielectric film is a polypropylene film.
Furthermore, the present invention is characterized in that in the metallized film capacitor described above, the vapor deposition electrodes on at least one side of the metallized film are divided into a plurality, and the vapor deposition electrodes are connected by a fuse.

本発明の金属化フィルムコンデンサでは、メタリコン部近傍部分の蒸着電極の蒸着膜厚が、メタリコン部近傍部分以外の蒸着膜厚よりも大きく、メタリコン部近傍部分の蒸着電極表面に、シリコーン系オイルまたはフッ素系オイルのいずれかを塗布することにより形成されたオイル層が設けられ、メタリコン近傍部分以外の蒸着電極表面に酸化物皮膜層が設けらることによって、
フィルム厚さが4μm以下の超薄型蒸着フィルムを用いた場合でも、コンデンサ素子として、巻回可能となり、さらに、90℃、90%RHの高温・高湿条件下での耐湿性能、−40〜+120℃の温度サイクル試験でも安定した特性を有する金属化フィルムコンデンサを提供することができる。
In the metallized film capacitor of the present invention, the vapor deposition film thickness of the vapor deposition electrode in the vicinity of the metallicon part is larger than the vapor deposition film thickness in the vicinity of the metallicon part. An oil layer formed by applying one of the system oils is provided, and by providing an oxide film layer on the surface of the vapor deposition electrode other than the vicinity of the metallicon,
Even when an ultra-thin vapor deposition film having a film thickness of 4 μm or less is used, it can be wound as a capacitor element, and further has a moisture resistance performance of 90 ° C. and 90% RH under high temperature and high humidity conditions. It is possible to provide a metallized film capacitor having stable characteristics even in a temperature cycle test at + 120 ° C.

本発明の金属化フィルムコンデンサにおける最良の形態について、図面を用いて説明する。図1は、本発明の金属化フィルムコンデンサに使用される金属化フィルムの層構成を示す図で、図3は、本発明の金属化フィルムコンデンサの内部構造を示す図である。
本発明における金属化フィルムは、図1に示されるように、誘電体フィルム(好ましくはPPフィルム)1の表面に設けられたメタリコン部近傍部分の蒸着電極部2の膜厚が、メタリコン非近傍部分(容量寄与部分)の蒸着電極部3よりも分厚くなっており、蒸着電極部2の幅方向反対側には絶縁マージン7が設けられている。
本発明におけるメタリコン部近傍部分の蒸着電極部2の抵抗値としては2.0〜10.0Ω/□が好ましく、メタリコン部非近傍部分の蒸着電極部3の抵抗値としては5.0〜20.0Ω/□が好ましい。
そして、メタリコン部近傍部分の蒸着電極部2の表面には、シリコーン系オイルまたはフッ素系オイルのいずれか一方を塗布することにより形成されたオイル層5が設けられており、また、メタリコン部非近傍部分の蒸着電極部3の表面には酸化物皮膜層4が形成されている。
本発明におけるオイル層5は、コンデンサ素子外部からの水分侵入を防止し、フィルムの耐湿性向上のために設けられる層であって、0.002〜0.050μmの厚さであることが好ましく、また、酸化物皮膜層4は、コンデンサ素子外部から侵入した水分と蒸着電極金属との電気化学反応を抑制し、耐湿性能を高めるために形成される層であって、0.002〜0.030μmの厚さであることが好ましい。
なお、上記オイル層5を形成するのに適したシリコーン系オイルとしては、ジメチルポリシロキサン、メチルフェニルポリシロキサン等が挙げられ、フッ素系オイルとしては、
パーフルオロオレフィン、パーフルオロアルキルポリエーテル等が挙げられる。
また、本発明において好ましい酸化物皮膜層4は、アルミニウム酸化皮膜層、SiOx皮膜層、銅酸化皮膜層である。
The best mode of the metallized film capacitor of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a layer structure of a metallized film used in the metallized film capacitor of the present invention, and FIG. 3 is a diagram showing an internal structure of the metallized film capacitor of the present invention.
As shown in FIG. 1, the metallized film in the present invention is such that the film thickness of the vapor deposition electrode part 2 in the vicinity of the metallicon part provided on the surface of the dielectric film (preferably PP film) 1 It is thicker than the vapor deposition electrode part 3 (capacity contributing part), and an insulation margin 7 is provided on the opposite side of the vapor deposition electrode part 2 in the width direction.
In the present invention, the resistance value of the vapor deposition electrode part 2 in the vicinity of the metallicon part is preferably 2.0 to 10.0 Ω / □, and the resistance value of the vapor deposition electrode part 3 in the non-near vicinity of the metallicon part is 5.0 to 20. 0Ω / □ is preferred.
And the oil layer 5 formed by apply | coating any one of a silicone type oil or a fluorine-type oil is provided in the surface of the vapor deposition electrode part 2 of the metallicon part vicinity part, Moreover, the metallicon part non-nearness An oxide film layer 4 is formed on the surface of the partial vapor deposition electrode portion 3.
The oil layer 5 in the present invention is a layer provided for preventing moisture from entering from the outside of the capacitor element and improving the moisture resistance of the film, and preferably has a thickness of 0.002 to 0.050 μm. The oxide film layer 4 is a layer formed in order to suppress the electrochemical reaction between moisture entering from the outside of the capacitor element and the vapor-deposited electrode metal and to improve the moisture resistance performance, and is 0.002 to 0.030 μm. It is preferable that it is the thickness of this.
Examples of the silicone oil suitable for forming the oil layer 5 include dimethylpolysiloxane, methylphenylpolysiloxane, and the like.
Examples include perfluoroolefin and perfluoroalkyl polyether.
Moreover, the oxide film layer 4 preferable in the present invention is an aluminum oxide film layer, a SiOx film layer, or a copper oxide film layer.

そして、本発明の金属化フィルムコンデンサは、図1に例示される層構成の金属化フィルムが巻回されてなるコンデンサ素子8の両端面に、メタリコン金属を溶射することによってメタリコン部を形成し、得られた複数個のコンデンサ素子に電極板9および引出端子10を接続してコンデンサユニットを形成し、このコンデンサユニットを、図3に示すように、外装ケース11内に収納した後、樹脂12を充填、硬化して得られる。
本発明では、金属化フィルムの少なくとも片面に設けられた蒸着電極が複数個に分割され、複数個に分割された蒸着電極がヒューズにより接続されている構造であっても良い。
以下、実施例により本発明をより具体的に説明するが、本発明はこれら実施例に限定されるものではない。
And the metallized film capacitor of this invention forms a metallicon part by spraying a metallicon metal on the both end surfaces of the capacitor | condenser element 8 by which the metallized film of the layer structure illustrated by FIG. 1 is wound, A capacitor unit is formed by connecting the electrode plate 9 and the lead terminal 10 to the obtained plurality of capacitor elements, and the capacitor unit is housed in an outer case 11 as shown in FIG. Obtained by filling and curing.
In this invention, the structure where the vapor deposition electrode provided in the at least single side | surface of the metallized film is divided | segmented into plurality, and the vapor deposition electrode divided into plurality is connected by the fuse may be sufficient.
EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples.

〔実施例1-1〜1-5、比較例1-1、1-2〕酸化物皮膜層厚さ比較、シリコーン系オイル使用
図1に示される層構成の金属化フィルムとして、厚さが4μm、幅100mmのPPフィルムにアルミニウム蒸着を行い絶縁マージン7を設け、メタリコン部近傍部分の蒸着電極部2の抵抗値を4Ω/□、メタリコン部非近傍部分の蒸着電極部3の抵抗値を10Ω/□とし、該金属化フィルムのメタリコン部近傍蒸着電極部2の厚膜部表面にシリコーン系オイルを塗布してオイル層5を形成した。
上記シリコーン系オイル層5の形成は、該オイルをエバポレータ中で加熱し、ノズルを介してメタリコン部近傍部分に噴出させ、厚さ0.002〜0.050μmとなるように加熱温度、時間を制御して付着させた。
また、該金属化フィルムのメタリコン部非近傍蒸着電極部3の薄膜部表面に、アルミニウムの酸化物皮膜層4として、皮膜厚さを変化させて0.001、0.002、0.005、0.010、0.020、0.030、0.050μmの酸化アルミニウム層をそれぞれ形成した。
上記アルミニウムの酸化物皮膜層の形成は、酸化性プラズマでアルミニウム蒸着膜を酸化させ、プラズマ発生電源の電圧・電流、通電時間により厚さを制御して行った。
このようにして得られた金属化フィルムを巻回してコンデンサ素子8を形成し、このコンデンサ素子の両端面にメタリコン金属を溶射してメタリコン部を形成し、図3に示すように、電極板9および引出端子10を接続して外装ケース11に収納し、エポキシ樹脂12を充填、硬化させて定格500V、350μFの本発明による金属化フィルムコンデンサを作製した。
[Examples 1-1 to 1-5, Comparative Examples 1-1 and 1-2] Oxide film layer thickness comparison, using silicone-based oil As a metallized film having a layer structure shown in FIG. , By depositing aluminum on a PP film having a width of 100 mm and providing an insulation margin 7, the resistance value of the vapor deposition electrode part 2 in the vicinity of the metallicon part is 4 Ω / □, and the resistance value of the vapor deposition electrode part 3 in the non-near part of the metallicon part is 10 Ω / The oil layer 5 was formed by applying silicone oil to the surface of the thick film portion of the vapor deposition electrode portion 2 near the metallicon portion of the metallized film.
The silicone oil layer 5 is formed by heating the oil in an evaporator and ejecting the oil to the vicinity of the metallicon part through a nozzle, and controlling the heating temperature and time so that the thickness becomes 0.002 to 0.050 μm. And attached.
Further, the film thickness of the metallized film non-near vapor deposition electrode part 3 of the metallized film is changed to 0.001, 0.002, 0.005, 0 by changing the film thickness as an aluminum oxide film layer 4. An aluminum oxide layer having a thickness of 0.010, 0.020, 0.030, and 0.050 μm was formed.
The aluminum oxide film layer was formed by oxidizing the aluminum vapor-deposited film with oxidizing plasma and controlling the thickness according to the voltage / current and energization time of the plasma generating power source.
The metallized film thus obtained is wound to form the capacitor element 8, and the metallicon metal is sprayed on both end faces of the capacitor element to form the metallicon part. As shown in FIG. The lead terminal 10 was connected and housed in the outer case 11, filled with epoxy resin 12, and cured to produce a metallized film capacitor rated at 500V and 350 μF according to the present invention.

(比較例1-3〜1-5)酸化物皮膜層厚さ比較、オイル使用なし
上記と同様の金属化フィルムを使用し、図2(b)に示すように、金属化フィルムのメタリコン部近傍蒸着電極部2の厚膜部表面およびメタリコン部非近傍蒸着電極部3の薄膜部表面に0.002、0.010、0.030μmの酸化アルミニウム層6を形成した。
図4に示すように、金属化フィルムを巻回した素子13にメタリコン部を形成し、電極板9、引出端子10を接続して外装ケース11に収納し、エポキシ樹脂12を充填、硬化させて、定格500V、350μFの金属化フィルムコンデンサ(従来品)を作製した。
(Comparative Examples 1-3 to 1-5) Oxide film layer thickness comparison, no oil used A metallized film similar to the above was used, and as shown in FIG. An aluminum oxide layer 6 having a thickness of 0.002, 0.010, and 0.030 μm was formed on the surface of the thick film portion of the vapor deposition electrode portion 2 and the thin film portion surface of the vapor deposition electrode portion 3 in the vicinity of the metallicon portion.
As shown in FIG. 4, a metallicon part is formed on the element 13 wound with the metallized film, the electrode plate 9 and the lead terminal 10 are connected and housed in the outer case 11, filled with epoxy resin 12, and cured. A metallized film capacitor (conventional product) having a rating of 500 V and 350 μF was produced.

(比較例1-6)酸化物皮膜層なし、シリコーン系オイル使用
上記と同様の金属化フィルムを使用し、図2(c)に示すように、金属化フィルムのメタリコン部近傍蒸着電極部2の厚膜部表面およびメタリコン部非近傍蒸着電極部3の薄膜部表面にシリコーン系オイル層5を形成した。
図4に示すように、該金属化フィルムを巻回した素子13にメタリコン部を形成し、電極板9、引出端子10を接続して外装ケース11に収納し、エポキシ樹脂12を充填、硬化させて、定格500V、350μFの金属化フィルムコンデンサ(従来品)を作製した。
(Comparative Example 1-6) No oxide film layer, use of silicone-based oil Using a metallized film similar to the above, as shown in FIG. A silicone-based oil layer 5 was formed on the surface of the thick film part and on the surface of the thin film part of the vapor deposition electrode part 3 near the metallicon part.
As shown in FIG. 4, a metallicon part is formed on the element 13 wound with the metallized film, the electrode plate 9 and the lead terminal 10 are connected and accommodated in the outer case 11, and the epoxy resin 12 is filled and cured. Thus, a metallized film capacitor (conventional product) having a rating of 500 V and 350 μF was produced.

〔実施例2-1〜2-5、比較例2-1、2-2〕酸化物皮膜層厚さ比較、フッ素系オイル使用
金属化フィルムのメタリコン部近傍蒸着電極部(厚膜部)2の表面にフッ素系オイルを塗布してオイル層5を形成した以外は、上記実施例1-1〜1-5、比較例1-1、1-2と同様にして、定格500V、350μFの本発明による金属化フィルムコンデンサを作製した。
[Examples 2-1 to 2-5, Comparative Examples 2-1 and 2-2] Oxide film layer thickness comparison, use of fluorine-based oil The present invention having a rating of 500 V and 350 μF, in the same manner as in Examples 1-1 to 1-5 and Comparative Examples 1-1 and 1-2, except that the oil layer 5 was formed by applying fluorine oil on the surface. A metallized film capacitor was prepared.

(比較例2-3)酸化物皮膜層なし、フッ素系オイル使用
金属化フィルムのメタリコン部近傍蒸着電極部(厚膜部)2の表面にフッ素系オイルを塗布してオイル層5を形成した以外は、上記比較例1-6と同様にして、DC500V、350μFの本発明による金属化フィルムコンデンサを作製した。
(Comparative Example 2-3) No oxide film layer, use of fluorine-based oil Except that the oil layer 5 was formed by applying fluorine-based oil to the surface of the metallized portion near the metallized portion of the metallized film (thick film portion) 2 Produced a metallized film capacitor of DC500V, 350 μF according to the present invention in the same manner as Comparative Example 1-6.

上記コンデンサ試料を耐湿負荷試験として90℃、90%RH、DC500Vを印加、温度サイクル試験として−40〜+120℃、2000サイクルを行い、自己回復性は温度100℃で電圧をDC1000Vから100Vずつステップアップし、各電圧に10分間保持した。また、巻き取り性は素子巻回時の巻回皺の発生有無により判定した。 The capacitor sample is subjected to 90 ° C, 90% RH, and DC500V as a moisture resistance load test, and is subjected to -40 to + 120 ° C and 2000 cycles as a temperature cycle test, and the self-recovery is stepped up from DC1000V to 100V at a temperature of 100 ° C. And held at each voltage for 10 minutes. Further, the winding property was determined by the presence / absence of winding wrinkles during element winding.

試験の結果、耐湿負荷試験では静電容量減少が5%以下、温度サイクル試験ではtanδ変化が初期値比10%以下、自己回復性はDC1500Vまで印加して試料5個全て端子間ショートがないこと、巻き取り性は素子巻回時に皺発生がないことを基準に評価を行った。
この評価結果を以下の表1に示す。
As a result of the test, the decrease in capacitance is 5% or less in the moisture resistance load test, the change in tan δ is 10% or less in the temperature cycle test, the self-healing property is applied up to 1500V DC, and there is no short-circuit between all five samples. The winding property was evaluated on the basis that no wrinkle was generated when the element was wound.
The evaluation results are shown in Table 1 below.

Figure 2009049139
Figure 2009049139

[酸化物皮膜層厚さ比較]
表1より明らかなように、耐湿試験で、酸化皮膜層が0.001μmでは皮膜が薄く、大気中の水分が透過して蒸着金属を劣化させるため、シリコーン系、フッ素系とも、容量減少が発生する(比較例1-1、2-1)。
また、自己回復性試験で酸化皮膜が0.050μmでは皮膜が厚過ぎ、誘電体が局部破壊した時に蒸着電極の飛散を妨げるため、シリコーン系、フッ素系とも、ショート不良が発生する(比較例1-2、2-2)。
温度サイクル試験においては、実施例1-1〜1-5、2-1〜2-5、比較例1-1、1-2、2-1、2-2とも、メタリコン部近傍部分にシリコーン系、フッ素系のオイル層が設けられ、メタリコン部非近傍部分に酸化皮膜層が設けられているために2000サイクル後でも特性変化がなく、巻き取り性も良好であった。
これに対して、比較例1-1、2-1ではメタリコン近傍部分、メタリコン非近傍部分の蒸着電極部表面に酸化皮膜層が形成されているが、この層が0.001μmでは層厚さが薄いため、耐湿試験で容量減少が発生し、0.050μmでは分厚過ぎて、メタリコンとの接触が不安定で、温度サイクル試験でtanδが増大し、特性が不安定であった。
[Comparison of oxide film layer thickness]
As is clear from Table 1, in the moisture resistance test, when the oxide film layer is 0.001 μm, the film is thin and moisture in the air permeates to degrade the deposited metal, resulting in a decrease in capacity in both silicone and fluorine systems. (Comparative Examples 1-1 and 2-1).
Also, in the self-healing test, when the oxide film is 0.050 μm, the film is too thick and prevents the evaporation electrode from scattering when the dielectric is locally broken. -2, 2-2).
In the temperature cycle test, Examples 1-1 to 1-5, 2-1 to 2-5, and Comparative Examples 1-1, 1-2, 2-1, 2-2 are both silicone-based in the vicinity of the metallicon part. Further, since a fluorine-based oil layer was provided and an oxide film layer was provided in the non-proximal part of the metallicon part, there was no change in characteristics even after 2000 cycles, and the winding property was good.
On the other hand, in Comparative Examples 1-1 and 2-1, an oxide film layer is formed on the surface of the vapor deposition electrode part in the vicinity of the metallicon and in the non-metallicon non-proximal part. When this layer is 0.001 μm, the layer thickness is Since it was thin, capacity reduction occurred in the moisture resistance test, and the thickness was too thick at 0.050 μm, the contact with the metallicon was unstable, tan δ increased in the temperature cycle test, and the characteristics were unstable.

[オイル層の形成部分の比較]
また、比較例1-6、2-3ではメタリコン部近傍部分、メタリコン部非近傍部分の蒸着電極部表面に酸化皮膜層に代わり、シリコーン系またはフッ素系オイル層を形成しているため、耐湿試験、温度サイクル試験、自己回復性試験では特性の安定化が得られるが、蒸着電極表面にオイル層が形成されているためにフィルムのすべり性が悪く、巻き取り時に皺が発生し作業性が低下した。
なお、オイル層の厚さは0.002〜0.050μmの範囲が適当である。0.002μm未満の場合、耐湿性、温度サイクル性の改善効果がなく、0.050μmを超えると、メタリコン部非近傍蒸着電極部にまでオイル層が拡がってしまうため、巻き取り性が悪化する。
[Comparison of oil layer formation part]
Further, in Comparative Examples 1-6 and 2-3, a silicon-based or fluorine-based oil layer is formed instead of the oxide film layer on the surface of the vapor deposition electrode portion in the vicinity of the metallicon portion and in the non-near portion of the metallicon portion. In the temperature cycle test and self-recovery test, stabilization of the characteristics can be obtained, but the oil layer is formed on the surface of the vapor deposition electrode, so the slipping property of the film is poor, and wrinkles occur during winding and workability is reduced. did.
In addition, the range of 0.002-0.050 micrometer is suitable for the thickness of an oil layer. When the thickness is less than 0.002 μm, there is no effect of improving moisture resistance and temperature cycleability. When the thickness exceeds 0.050 μm, the oil layer spreads to the non-near vapor deposition electrode portion, so that the winding property is deteriorated.

上記表1の試験結果から、金属化フィルムのメタリコン部近傍蒸着電極部2の厚膜部にシリコーン系またはフッ素系オイル層を形成し、該金属化フィルムのメタリコン部非近傍蒸着電極部3の薄膜部に0.002〜0.030μmの酸化皮膜層を形成すると、耐湿性、温度サイクル、自己回復性、巻き取り性共に良好であり、特性の安定したコンデンサが得られることがわかる。   From the test results in Table 1 above, a silicone-based or fluorine-based oil layer is formed on the thick film portion of the metallized film near the vapor deposition electrode part 2 of the metallized film, and the thin film of the metallized film non-near vapor deposition electrode part 3 of the metallized film. It can be seen that when an oxide film layer having a thickness of 0.002 to 0.030 μm is formed on the part, the moisture resistance, temperature cycle, self-recovery property and winding property are good, and a capacitor with stable characteristics can be obtained.

なお、実施例でアルミ蒸着電極の場合の例を示したが、亜鉛、アルミニウム/亜鉛の合金の電極を設けた場合でも、メタリコン近傍の蒸着電極表面にシリコーン系またはフッ素系オイルを、メタリコン部非近傍蒸着電極表面にアルミニウム酸化皮膜層を設けた場合でも、同様の結果が得られることが確認できた。
さらに、上記試験では酸化皮膜層をアルミニウム酸化皮膜としたが、SiOx、銅酸化皮膜でも同様の結果が得られることが確認された。
In addition, although the example in the case of an aluminum vapor deposition electrode was shown in the Example, even when an electrode of zinc or an aluminum / zinc alloy is provided, a silicone-based or fluorine-based oil is applied to the surface of the vapor deposition electrode near the metallicon, and the metallicon part non- It was confirmed that the same results were obtained even when an aluminum oxide film layer was provided on the surface of the nearby vapor deposition electrode.
Furthermore, although the oxide film layer was an aluminum oxide film in the above test, it was confirmed that similar results were obtained with SiOx and a copper oxide film.

耐湿性が改善された本発明における金属化PPフィルムの層構成を示す図である。It is a figure which shows the layer structure of the metallization PP film in this invention in which moisture resistance was improved. 従来の金属化フィルムの層構成を示す図である。It is a figure which shows the layer structure of the conventional metallized film. 耐湿性が改善された本発明の金属化フィルムコンデンサの内部構造を示す図である。It is a figure which shows the internal structure of the metallized film capacitor of this invention with which moisture resistance was improved. 従来のコンデンサの内部構造を示す図である。It is a figure which shows the internal structure of the conventional capacitor | condenser.

符号の説明Explanation of symbols

1 誘電体フィルム(PPフィルム)
2 メタリコン近傍部分の蒸着電極部
3 メタリコン非近傍部分の蒸着電極部
4 酸化物皮膜層
5 オイル層
6 保護皮膜層
7 絶縁マージン部
8 本発明によるコンデンサ素子
9 電極板
10 引出端子
11 外装ケース
12 樹脂
13 従来のコンデンサ素子
1 Dielectric film (PP film)
DESCRIPTION OF SYMBOLS 2 Vapor deposition electrode part of the vicinity of the metallicon 3 Vapor deposition electrode part of the non-metallicon vicinity part 4 Oxide film layer 5 Oil layer 6 Protective film layer 7 Insulation margin part 8 Capacitor element according to the present invention 9 Electrode plate 10 Lead terminal 11 Exterior case 12 Resin 13 Conventional capacitor elements

Claims (5)

誘電体フィルムの少なくとも片面に金属蒸着膜よりなる蒸着電極が設けられた金属化フィルムを巻回してコンデンサ素子が形成され、該コンデンサ素子の両端面にメタリコン部が形成され、前記メタリコン部近傍部分の蒸着膜厚が、メタリコン部近傍部分以外の蒸着膜厚よりも大きい構造を有する金属化フィルムコンデンサにおいて、
前記メタリコン部近傍部分の蒸着電極の表面に、シリコーン系オイルまたはフッ素系オイルのいずれかを塗布して形成されたオイル層が設けられ、前記メタリコン部近傍部分以外の蒸着電極表面には酸化物皮膜層が設けられていることを特徴とする金属化フィルムコンデンサ。
A capacitor element is formed by winding a metallized film provided with a vapor deposition electrode made of a metal vapor deposition film on at least one surface of the dielectric film. Metallicon portions are formed on both end surfaces of the capacitor element. In the metallized film capacitor having a structure in which the deposited film thickness is larger than the deposited film thickness other than the vicinity of the metallicon part,
An oil layer formed by applying either silicone-based oil or fluorine-based oil is provided on the surface of the vapor deposition electrode in the vicinity of the metallicon portion, and an oxide film is formed on the surface of the vapor deposition electrode other than in the vicinity of the metallicon portion. A metallized film capacitor, characterized in that a layer is provided.
前記酸化物皮膜層の厚さが0.002〜0.030μmであることを特徴とする請求項1記載の金属化フィルムコンデンサ。 2. The metallized film capacitor according to claim 1, wherein the oxide film layer has a thickness of 0.002 to 0.030 [mu] m. 前記酸化物皮膜層が、アルミニウム酸化皮膜層、SiOx皮膜層、および銅酸化皮膜層からなるグループより選ばれたものであることを特徴とする請求項1または2に記載の金属化フィルムコンデンサ。 3. The metallized film capacitor according to claim 1, wherein the oxide film layer is selected from the group consisting of an aluminum oxide film layer, a SiOx film layer, and a copper oxide film layer. 前記誘電体フィルムがポリプロピレンフィルムであることを特徴とする請求項1〜3のいずれか1項に記載の金属化フィルムコンデンサ。 The metallized film capacitor according to claim 1, wherein the dielectric film is a polypropylene film. 前記金属化フィルムの少なくとも片面の蒸着電極が複数個に分割され、該蒸着電極同士がヒューズにより接続されていることを特徴とする請求項1〜4のいずれか1項に記載の金属化フィルムコンデンサ。 5. The metallized film capacitor according to claim 1, wherein the vapor deposition electrodes on at least one side of the metallized film are divided into a plurality, and the vapor deposition electrodes are connected to each other by a fuse. .
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