JP2009045736A5 - - Google Patents

Download PDF

Info

Publication number
JP2009045736A5
JP2009045736A5 JP2008209143A JP2008209143A JP2009045736A5 JP 2009045736 A5 JP2009045736 A5 JP 2009045736A5 JP 2008209143 A JP2008209143 A JP 2008209143A JP 2008209143 A JP2008209143 A JP 2008209143A JP 2009045736 A5 JP2009045736 A5 JP 2009045736A5
Authority
JP
Japan
Prior art keywords
polishing
substrate
polishing pad
shape memory
rukoto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008209143A
Other languages
English (en)
Japanese (ja)
Other versions
JP5226427B2 (ja
JP2009045736A (ja
Filing date
Publication date
Priority claimed from US11/838,954 external-priority patent/US7458885B1/en
Priority claimed from US12/103,232 external-priority patent/US8257142B2/en
Application filed filed Critical
Publication of JP2009045736A publication Critical patent/JP2009045736A/ja
Publication of JP2009045736A5 publication Critical patent/JP2009045736A5/ja
Application granted granted Critical
Publication of JP5226427B2 publication Critical patent/JP5226427B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008209143A 2007-08-15 2008-08-15 化学機械研磨方法 Expired - Fee Related JP5226427B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/838,954 2007-08-15
US11/838,954 US7458885B1 (en) 2007-08-15 2007-08-15 Chemical mechanical polishing pad and methods of making and using same
US12/103,232 US8257142B2 (en) 2008-04-15 2008-04-15 Chemical mechanical polishing method
US12/103,232 2008-04-15

Publications (3)

Publication Number Publication Date
JP2009045736A JP2009045736A (ja) 2009-03-05
JP2009045736A5 true JP2009045736A5 (https=) 2011-10-06
JP5226427B2 JP5226427B2 (ja) 2013-07-03

Family

ID=40032701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008209143A Expired - Fee Related JP5226427B2 (ja) 2007-08-15 2008-08-15 化学機械研磨方法

Country Status (4)

Country Link
EP (1) EP2025455A3 (https=)
JP (1) JP5226427B2 (https=)
KR (1) KR101453565B1 (https=)
TW (1) TWI444248B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
WO2016048043A1 (ko) * 2014-09-23 2016-03-31 영창케미칼 주식회사 화학적 기계적 연마용 연마패드의 그루브 측정 장치 및 이를 포함하는 화학적 기계적 연마 장치
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
EP3352944B1 (en) * 2015-09-25 2022-10-26 CMC Materials, Inc. Polyurethane cmp pads having a high modulus ratio

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668273B2 (ja) * 1989-12-08 1997-10-27 株式会社エース電研 研磨装置および研磨方法
JPH08323614A (ja) * 1995-05-30 1996-12-10 Sony Corp 化学的機械研磨方法および装置
IL137878A0 (en) * 1998-02-23 2001-10-31 Mnemoscience Gmbh Shape memory polymers
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
JP4131632B2 (ja) 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US7235488B2 (en) * 2002-08-28 2007-06-26 Micron Technology, Inc. In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
US7901770B2 (en) 2003-11-04 2011-03-08 Boston Scientific Scimed, Inc. Embolic compositions
US20060286906A1 (en) * 2005-06-21 2006-12-21 Cabot Microelectronics Corporation Polishing pad comprising magnetically sensitive particles and method for the use thereof
US8192257B2 (en) 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads

Similar Documents

Publication Publication Date Title
JP2009056584A5 (https=)
JP2009045736A5 (https=)
JP2008253747A5 (https=)
ATE322959T1 (de) Polierartikel zum elektrochemisch-mechanischen polieren von substraten
Li et al. A periodic deformation mechanism of a soft actuator for crawling and grasping
JP2005526383A5 (https=)
CN101381597A (zh) 传热介质以及使用该传热介质的传热方法
US20220074668A1 (en) Adaptive baking method
CN106217234B (zh) 用于抛光衬底的系统和方法
SG159470A1 (en) Ceramic heater, method of manufacturing the same, and apparatus for forming a thin layer having the same
ATE410905T1 (de) Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung
CN105039981A (zh) 一种提高灯具散热器性能的方法
CN105425266B (zh) 一种光子晶体塑料闪烁体的制备方法
CN114383761B (zh) 具有单一方向导电功能的压力传感器及其制备方法和应用
CN1106046C (zh) 薄板状工件的热处理装置
CN203578136U (zh) 一种支撑机构及涂布支撑装置
KR20090018010A (ko) 화학적 기계적 연마 방법
TWI456355B (zh) 微影裝置及方法
DK1762157T3 (da) Böjeligt varmeapparat
JP2011152243A (ja) 生体温熱冷却装置
JP2008205416A (ja) 静電チャック
CN204256696U (zh) 玻璃鼠标垫
CN105666312A (zh) 晶片快速抛光装置及方法
CN214205872U (zh) 石墨烯发热碳膜
JP2005127737A (ja) 樹脂フィルムとゴムとの積層体の耐久試験方法