TWI444248B - 化學機械研磨方法 - Google Patents

化學機械研磨方法 Download PDF

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Publication number
TWI444248B
TWI444248B TW097130775A TW97130775A TWI444248B TW I444248 B TWI444248 B TW I444248B TW 097130775 A TW097130775 A TW 097130775A TW 97130775 A TW97130775 A TW 97130775A TW I444248 B TWI444248 B TW I444248B
Authority
TW
Taiwan
Prior art keywords
polishing pad
shape memory
substrate
abrasive
abrasive layer
Prior art date
Application number
TW097130775A
Other languages
English (en)
Chinese (zh)
Other versions
TW200914200A (en
Inventor
葛列格里Ｐ 莫唐尼
拉菲帢爪Ｖ 帕拉帕西
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/838,954 external-priority patent/US7458885B1/en
Priority claimed from US12/103,232 external-priority patent/US8257142B2/en
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW200914200A publication Critical patent/TW200914200A/zh
Application granted granted Critical
Publication of TWI444248B publication Critical patent/TWI444248B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097130775A 2007-08-15 2008-08-13 化學機械研磨方法 TWI444248B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/838,954 US7458885B1 (en) 2007-08-15 2007-08-15 Chemical mechanical polishing pad and methods of making and using same
US12/103,232 US8257142B2 (en) 2008-04-15 2008-04-15 Chemical mechanical polishing method

Publications (2)

Publication Number Publication Date
TW200914200A TW200914200A (en) 2009-04-01
TWI444248B true TWI444248B (zh) 2014-07-11

Family

ID=40032701

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130775A TWI444248B (zh) 2007-08-15 2008-08-13 化學機械研磨方法

Country Status (4)

Country Link
EP (1) EP2025455A3 (https=)
JP (1) JP5226427B2 (https=)
KR (1) KR101453565B1 (https=)
TW (1) TWI444248B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9754846B2 (en) * 2014-06-23 2017-09-05 Applied Materials, Inc. Inductive monitoring of conductive trench depth
WO2016048043A1 (ko) * 2014-09-23 2016-03-31 영창케미칼 주식회사 화학적 기계적 연마용 연마패드의 그루브 측정 장치 및 이를 포함하는 화학적 기계적 연마 장치
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
JP7066608B2 (ja) * 2015-09-25 2022-05-13 シーエムシー マテリアルズ，インコーポレイティド 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668273B2 (ja) * 1989-12-08 1997-10-27 株式会社エース電研 研磨装置および研磨方法
JPH08323614A (ja) * 1995-05-30 1996-12-10 Sony Corp 化学的機械研磨方法および装置
JP3732404B2 (ja) * 1998-02-23 2006-01-05 ニーモサイエンス ゲーエムベーハー 形状記憶ポリマー組成物、形状記憶製品を形成する方法、および形状を記憶する組成物を形成する方法
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
JP4131632B2 (ja) 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US7235488B2 (en) * 2002-08-28 2007-06-26 Micron Technology, Inc. In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging
US7901770B2 (en) 2003-11-04 2011-03-08 Boston Scientific Scimed, Inc. Embolic compositions
US20060286906A1 (en) * 2005-06-21 2006-12-21 Cabot Microelectronics Corporation Polishing pad comprising magnetically sensitive particles and method for the use thereof
US8192257B2 (en) 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads

Also Published As

Publication number Publication date
KR20090018010A (ko) 2009-02-19
JP5226427B2 (ja) 2013-07-03
JP2009045736A (ja) 2009-03-05
TW200914200A (en) 2009-04-01
EP2025455A3 (en) 2017-04-26
KR101453565B1 (ko) 2014-10-21
EP2025455A2 (en) 2009-02-18

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