JP2009033061A - Light-emitting device and imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of acquiring high directivity even when it is miniaturized and thinned. <P>SOLUTION: The surface-mounting type LED (light-emitting device) 100 includes: a substrate 1 to which an LED element 10 is attached; a reflective frame 20 which is so mounted on a top surface of the substrate 1 as to surround the LED element 10 in plane view and has an inner side surface 21a acting as a reflective surface; and a translucent member 30 arranged in a region inside the reflective frame 20 on the top surface of the substrate 1 while separated from the inner side surface 21a of the reflective frame 20. The translucent member 30 includes a reflective surface 32a which is so inclined as to reflect the light from the LED element 10 in a direction of the reflective surface of the reflective frame 20. The reflective surface 32a is constituted by an inclined plane 32 of an almost inverted cone-like recessed portion 31 provided to the upper part of the translucent member 30. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device and an imaging device, and more particularly, to a light emitting device including a reflective frame that reflects light from a light emitting element, and an imaging device including the light emitting device.

  A light emitting device equipped with a light emitting element such as an LED (Light Emitting Diode) element is generally smaller, more resistant to vibration, has a longer life, and has better visibility than a conventional light bulb. And it has the characteristic that power consumption is small. For this reason, in recent years, the above light emitting devices are also used for strobe light sources of camera-equipped mobile phones, medical lighting, automobile headlights, and the like.

  Such a light emitting device is required to have high directivity (narrow directivity) depending on the application. For example, when the light emitting device is used in a strobe light source such as a mobile phone with a camera (imaging device) or an electronic still camera (imaging device), it is necessary to emit light with a strong light amount in a specific direction. High directivity (narrow directivity) is required. Here, in order to give the light emitting device directivity in a specific direction, it is effective to attach a reflection frame body that reflects light from the light emitting element to the light emitting device. For this reason, conventionally, there has been known a light-emitting device capable of obtaining high directivity by including a reflection frame that reflects light from a light-emitting element (see, for example, Patent Document 1).

Patent Document 1 includes a substrate on which a light emitting element is mounted on an upper surface, and a reflection frame body that is attached to an outer peripheral portion of the upper surface of the substrate so as to surround the light emitting element, and an inner periphery of the reflection frame body. There is disclosed a light emitting device in which a surface is composed of a lower first inner peripheral surface and an upper second inner peripheral surface having different inclination angles. In this light emitting device, when the angles formed by the lower first inner peripheral surface and the upper second inner peripheral surface and the upper surface of the substrate are θ1 and θ2, respectively, the reflection frame is set so that θ1 <θ2. The inner peripheral surface of the body is configured. For this reason, the light emitted from the light emitting element in the lateral direction or the lower direction is efficiently reflected upward by the lower first inner peripheral surface with a small inclination angle, and the light traveling obliquely upward is The light is effectively reflected in the light emitting axis direction of the light emitting device on the upper second inner peripheral surface having a large inclination angle. Thereby, since the light from a light emitting element is reflected by the internal peripheral surface of a reflective frame, and is radiate | emitted in a specific direction, high directivity is acquired. In the light emitting device described in Patent Document 1, a translucent member is provided inside the reflective frame so as to cover a part of the inner peripheral surface (reflective surface) of the reflective frame.
JP 2005-159090 A

  On the other hand, in recent years, in electronic devices such as camera-equipped mobile phones and electronic still cameras, the trend toward smaller and thinner devices is increasing. For this reason, light-emitting devices mounted on these devices are also required to be reduced in size and thickness.

  However, in the conventional light emitting device described in Patent Document 1, when the thickness of the reflecting frame is reduced for downsizing and thinning, light from the light emitting element is emitted from the inner peripheral surface of the reflecting frame. There is an inconvenience that it is difficult to reflect efficiently. For this reason, when the conventional light emitting device is reduced in size and thickness, there is a problem that it becomes difficult to obtain high directivity (narrow directivity).

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a light emitting device capable of obtaining high directivity even when it is reduced in size and thickness. It is to be.

  Another object of the present invention is to provide an imaging device including a strobe light source that can emit light with a strong light quantity in a specific direction.

  In order to achieve the above object, a light-emitting device of the present invention is mounted on a substrate on which a light-emitting element is mounted and on the upper surface of the substrate so as to surround the light-emitting element when viewed in plan, and an inner peripheral surface is a first reflecting surface. And a translucent member disposed on the inner surface of the reflective frame on the upper surface of the substrate and spaced from the inner peripheral surface of the reflective frame. And the translucent member contains the 2nd reflective surface inclined so that the light from a light emitting element might be reflected in the direction of the 1st reflective surface of a reflective frame.

  According to this configuration, the light from the light emitting element is reflected in the direction of the first reflecting surface of the reflecting frame by the second reflecting surface of the translucent member, so that the light in the lateral direction becomes strong. For this reason, even when the thickness of the reflecting frame is reduced in order to reduce the size and thickness of the light emitting device, the light from the light emitting element can be efficiently incident on the first reflecting surface of the reflecting frame. Thereby, since the light from the light emitting element can be efficiently reflected by the first reflecting surface of the reflecting frame body and emitted in a specific direction, the light emitting device can have directivity in the specific direction. . Therefore, even when the light emitting device is reduced in size and thickness, high directivity (narrow directivity) can be obtained. Note that by having high directivity (narrow directivity), light can be emitted with a strong light quantity in a specific direction.

  Further, in the above-described configuration, since the translucent member is disposed apart from the inner peripheral surface of the reflection frame, unlike the case where the first reflection surface of the reflection frame is covered with the translucent member. The light incident on the first reflecting surface of the reflecting frame can be efficiently reflected in a specific direction. That is, when the reflective surface (first reflective surface) of the reflective frame is covered with the translucent member, the light reflected by the reflective surface (first reflective surface) travels through the translucent member. When the light is emitted from the translucent member to the outside, a part thereof is refracted and reflected at the interface between the translucent member and the air layer. For this reason, there arises a disadvantage that it is difficult to efficiently reflect light incident on the first reflecting surface in a specific direction. On the other hand, in the above-described configuration in which the translucent member is disposed apart from the inner peripheral surface of the reflection frame body, it is possible to suppress the occurrence of the above-described inconvenience, so that the incident light enters the first reflection surface of the reflection frame body. The reflected light can be efficiently reflected in a specific direction.

  In the light emitting device of the present invention, preferably, a concave portion including an inclined surface is provided on an upper portion of the translucent member, and the second reflecting surface is constituted by the inclined surface of the concave portion. If comprised in this way, the 2nd reflective surface inclined so that the light from a light emitting element may be reflected in the direction of the 1st reflective surface of a reflective frame can be easily formed in a translucent member.

  In this case, preferably, the inclined surface of the concave portion is formed so as to be inclined from the outer peripheral edge portion on the upper side of the translucent member toward a predetermined point of the translucent member. If comprised in this way, since it can suppress that the light which injects into the 1st reflective surface of a reflective frame body becomes non-uniform | heterogenous, light emission nonuniformity is suppressed, obtaining high directivity (narrow directivity). be able to.

  Further, in the configuration in which the concave portion is formed in the upper portion of the translucent member, preferably, a metal film is formed on the inner surface of the concave portion. If comprised in this way, the reflectance of the 2nd reflective surface of a translucent member can be raised, Therefore The light from a light emitting element can be efficiently reflected by a 2nd reflective surface. For this reason, even when the thickness of the reflecting frame is reduced in order to reduce the size and thickness of the light emitting device, the light from the light emitting element can be incident on the first reflecting surface of the reflecting frame more efficiently. Thereby, the light from a light emitting element can be more efficiently reflected by the 1st reflective surface of a reflective frame, and can be radiate | emitted in a specific direction.

  In the light emitting device of the present invention, preferably, a hole is formed in a predetermined region inside the reflection frame on the substrate, and a phosphor that converts the wavelength of light from the light emitting element is formed in the hole. Scattered phosphor layers are embedded, and the light emitting element is sealed in the hole of the substrate by the phosphor layer. If comprised in this way, since a light emitting element is arrange | positioned in the hole of a board | substrate, size reduction and thickness reduction of a light-emitting device can be achieved easily. Also, with this configuration, the phosphor layer that seals the light emitting element is embedded in the hole of the substrate, so that the wavelength of light from the light emitting element can be converted by the phosphor, and the light emitting element and the fluorescent layer can be converted. A light emitter composed of a body layer can be provided inside the substrate.

  Here, the phosphor that has received the light from the light emitting element converts the wavelength of the light, and at the same time, the phosphor itself emits light by light energy. For this reason, since the phosphors scattered in the phosphor layer also serve as a light emission source, light is emitted in all directions. As a result, in general, in a light emitting device including a phosphor that converts the wavelength of light, it is difficult to obtain high directivity (narrow directivity). On the other hand, in the above-described configuration, since the light emitter composed of the light emitting element and the phosphor layer is provided in the hole of the substrate, the light emission source can be provided in a partial region of the substrate. For this reason, even if a phosphor that converts the wavelength of light is provided, the light from the light emitting element can be efficiently reflected by the second reflecting surface toward the first reflecting surface of the reflecting frame. Can be emitted in a specific direction by the first reflecting surface of the reflecting frame. Thereby, high directivity (narrow directivity) can be obtained. That is, even when the phosphor layer in which the phosphors are scattered is provided, the above-described inconvenience can be suppressed.

  In the above configuration, since the phosphor layer is embedded in the hole of the substrate, the formation region of the phosphor layer can be reduced. For this reason, variation in the distance (path length) between the phosphors scattered in the phosphor layer and the light emitting elements sealed in the phosphor layer can be reduced. As a result, variations in wavelength conversion efficiency can be reduced, so that luminance unevenness can also be reduced.

  In this case, the translucent member is disposed on the upper surface of the phosphor layer that seals the light emitting element so as to cover the upper surface of the phosphor layer. If comprised in this way, the light from the light emitting element wavelength-converted with the fluorescent substance layer can be more efficiently reflected by the 2nd reflective surface of a translucent member.

  In the light emitting device of the present invention, it is preferable that the upper surface of the reflective frame is positioned above the translucent member. If comprised in this way, since the light which progresses diagonally upward emitted from the light emitting element can be reliably reflected by the 1st reflective surface of a reflective frame body, it is easy to have high directivity (narrow directivity). Can be obtained.

  In the light emitting device of the present invention, preferably, the reflection frame is configured so that the opening width increases upward. If comprised in this way, high directivity (narrow directivity) can be obtained more easily.

  In the light emitting device of the present invention, the light emitting element may be composed of a light emitting diode element.

  The imaging device of the present invention is an imaging device using any of the light-emitting devices described above as a strobe light source.

  As described above, according to the present invention, it is possible to easily obtain a light-emitting device capable of obtaining high directivity even when it is downsized and thinned.

  Further, according to the present invention, it is possible to easily obtain an imaging apparatus including a strobe light source that can emit light with a strong light amount in a specific direction.

Embodiments of the present invention will be described below with reference to the drawings. In the following first to third embodiments, an example in which the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.
(First embodiment)
FIG. 1 is a cross-sectional perspective view of a surface-mounted LED according to a first embodiment of the present invention. FIG. 2 is an overall perspective view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. FIG. 3 is a plan view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. 4 and 5 are diagrams for explaining the structure of the surface-mounted LED according to the first embodiment. First, the structure of the surface-mounted LED 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the surface-mounted LED 100 according to the first embodiment includes a substrate 1, a light-emitting diode element (LED element) 10 attached to the substrate 1, and a plan view on the substrate 1. A reflecting frame 20 fixed so as to surround the LED element 10 and a translucent member 30 provided inside the reflecting frame 20 are provided. The LED element 10 is an example of the “light emitting element” in the present invention.

  Moreover, the board | substrate 1 is equipped with the insulating base material 2 comprised from glass epoxy, a liquid crystal polymer (Liquid Crystal Polymer: LCP), etc., as shown in FIG. As shown in FIGS. 4 and 5, the insulating base material 2 has a length of about 3.5 mm in the X direction and a length of about 3 mm in the Y direction orthogonal to the X direction as seen in a plan view. It is formed in the square shape which has. Moreover, as shown in FIGS. 1-3, the hole 3 penetrated in the thickness direction is formed in the area | region of the center part of the insulation base material 2 (board | substrate 1).

  Also, as shown in FIGS. 3 and 4, a plurality of upper surface side conductor layers 4 having a predetermined pattern shape are formed on the upper surface of the insulating base 2. The plurality of upper surface side conductor layers 4 are arranged around the hole 3 when seen in a plan view. Specifically, three upper surface side conductor layers 4 are arranged on the Y1 direction side and the Y2 direction side with respect to the hole 3, respectively. Further, the plurality of upper surface side conductor layers 4 are arranged so as to be symmetric with respect to the center in the Y direction. Further, the plurality of upper surface side conductor layers 4 are arranged such that the Y1 direction side and the Y2 direction side with respect to the hole 3 are the anode side and the cathode side, respectively. Each of the plurality of upper surface side conductor layers 4 is electrically insulated and separated from each other. Further, a resist layer 5 (see FIGS. 1 and 4) is formed on the upper surface of the insulating base 2 so as to cover a part of the upper surface side conductor layer 4.

  Further, as shown in FIG. 5, a plurality of lower surface side conductor layers 6 having a predetermined pattern shape are formed on the lower surface of the insulating base material 2. The plurality of lower surface side conductor layers 6 are mainly divided into a heat radiating conductor layer 6a and a wiring conductor layer 6b. The plurality of lower surface side conductor layers 6 are electrically isolated from each other. As shown in FIGS. 1 and 5, the heat-dissipating conductor layer 6 a is formed on a wide area so as to close the hole 3 (see FIG. 1) on the central region of the insulating base 2. A conductor layer 7 connected to the heat radiating conductor layer 6 a is formed on the inner surface of the hole 3, and is formed on the upper surface of the insulating base 2 and in the region of the outer periphery of the hole 3. The conductor layer 8 connected with the conductor layer 7 is formed.

  On the other hand, three wiring conductor layers 6b are formed on the Y1 direction side and the Y2 direction side with respect to the heat radiation conductor layer 6a so as to correspond to the upper surface side conductor layer 4, respectively. The lower-surface-side wiring conductor layer 6b and the corresponding upper-surface-side conductor layer 4 are electrically connected to each other via the conductor layer 9 formed on the side surface of the insulating base 2. The conductor layer 6b for wiring has a function as an electrode terminal. Moreover, the upper surface side conductor layer 4, the lower surface side conductor layer 6, and the conductor layers 7-9 are each comprised from the material excellent in electrical conductivity and heat conductivity, such as copper.

  Further, as shown in FIGS. 2 and 3, the LED element 10 includes three LED elements 10, and has a predetermined interval in the X direction on the upper surface of the heat-dissipating conductor layer 6a (see FIG. 1). Are arranged apart from each other. That is, in the surface-mounted LED 100 according to the first embodiment, each of the three LED elements 10 is disposed in the hole 3 of the substrate 1 (insulating base material 2). The three LED elements 10 are composed of three types of LED elements 10 that emit red light, which is the three primary colors of light, an LED element 10 that emits green light, and an LED element 10 that emits blue light. . The LED element 10 that emits red light is made of, for example, an AlGaAs compound semiconductor, and the LED element 10 that emits green light is made of, for example, a GaAsP compound semiconductor. The LED element 10 that emits blue light is made of, for example, an InGaN-based compound semiconductor. Each of the three LED elements 10 is bonded to the heat radiation conductor layer 6 a by the adhesive layer 11.

  As shown in FIG. 1, the LED element 10 and the upper surface side conductor layer 4 are electrically connected to each other via a bonding wire 12. Thereby, by applying a voltage between the wiring conductor layers 6b, a current flows to the LED elements 10 via the bonding wires 12, and each LED element 10 emits light at a specific wavelength. And when these LED elements 10 light-emit simultaneously, the color is mixed and white light is radiate | emitted. The heat generated by the light emission of the LED element 10 is radiated from the heat radiating conductor layer 6a. Further, when the heat-dissipating conductor layer 6a is in thermal contact with a heat sink portion of a circuit board (not shown), the heat dissipation effect is further promoted. Thereby, since the temperature rise of the LED element 10 is suppressed, the fall of the light emission characteristic of the LED element 10 resulting from the temperature rise of the LED element 10 is suppressed. The bonding wire 12 is composed of a fine metal wire such as Au or Al.

  Here, in 1st Embodiment, the LED element 10 is the inside of the hole 3 of the board | substrate 1 (insulating base material 2) by the fluorescent substance layer 13 in which the fluorescent substance 13a which wavelength-converts the light from the LED element 10 was scattered. Is sealed. Thereby, in 1st Embodiment, the white light excellent in color reproducibility is obtained by wavelength-converting the light from the LED element 10 with the fluorescent substance 13a. In this case, the color can be finely adjusted by adjusting the amount of the phosphor 13a. The LED element 10 and the phosphor layer 13 constitute a light emitter. The phosphors 13 a that convert the wavelength of light from the LED elements 10 are scattered only in the phosphor layer 13.

  In the first embodiment, the LED element 10 is configured such that the upper surface thereof is located below the upper surface of the substrate 1, and the phosphor layer 13 is substantially flush with the upper surface of the substrate 1. It is comprised so that it may become. That is, in the first embodiment, a light emitting body composed of the LED element 10 and the phosphor layer 13 is provided inside the substrate 1. Thereby, a light emission source is provided in a partial region of the substrate 1 (a region where the hole 3 is formed).

  The reflection frame 20 is made of an epoxy resin or the like, and is formed in a planar shape having almost the same size as the substrate 1 (insulating base material 2). Specifically, as shown in FIG. 3, the reflection frame 20 has a rectangular shape having a length of about 3.5 mm in the X direction and a length of about 3 mm in the Y direction when seen in a plan view. Is formed. The reflective frame 20 is formed to a thickness of about 0.6 mm to about 0.8 mm. The reflection frame 20 is fixed on the substrate 1 by a resin adhesive 14 (see FIG. 1).

  As shown in FIGS. 1 and 2, an opening 21 that penetrates from the upper surface to the lower surface is formed in the central portion of the reflection frame body 20. The opening 21 is configured such that the inner side surface 21a functions as a reflection surface that reflects the light emitted from the LED element 10. Further, the surface of the inner side surface 21a of the opening 21 is subjected to silver plating processing or the like in order to increase the reflectance. As shown in FIG. 3, the opening 21 is formed in a substantially circular shape when the inner side surface 21 a is seen in plan view in order to uniformly collect the light emitted from the LED element 10. Further, as shown in FIG. 1, the opening 21 is formed so as to expand in a taper shape above the opening 21. That is, the reflection frame 20 is configured such that the opening width widens upward. Thus, the inner surface 21a of the opening 21 is configured to be able to efficiently reflect the light emitted from the LED element 10 upward. The inner side surface 21a is an example of the “first reflecting surface” and the “inner peripheral surface” in the present invention.

  The translucent member 30 is made of a highly transparent silicon resin or epoxy resin, and is formed in a substantially cylindrical shape. The translucent member 30 is disposed on the inner region of the reflective frame 20 so as to be separated from the inner side surface (reflective surface) 21 a of the reflective frame 20. Specifically, as shown in FIG. 3, the translucent member 30 is formed on the upper surface of the substrate 1 at a predetermined distance from the inner side surface 21 a of the reflection frame body 20 as viewed in plan. It arrange | positions so that it may be located in the center part of the opening part 21 of this.

  Here, in 1st Embodiment, as shown in FIG. 1, the reflective surface which reflects the light from LED element 10 in the direction of the inner surface (reflective surface) 21a of the reflective frame body 20 on the upper part of the translucent member 30. As shown in FIG. 32a is formed. The reflective surface 32a is an example of the “second reflective surface” in the present invention. The reflective surface 32 a of the translucent member 30 is configured by the inclined surface 32 of the concave portion 31 provided on the upper portion of the translucent member 30. Further, the recess 31 of the translucent member 30 is formed in a substantially inverted conical shape on the upper surface portion of the translucent member 30. That is, the concave portion 31 of the translucent member 30 is formed so as to be inclined from the outer peripheral edge portion 33 on the upper side of the translucent member 30 toward a predetermined one point G in the central portion. In addition, the inclined surface 32 of the recess 31 has a predetermined surface with respect to the upper surface of the substrate 1 so as to reflect light from the LED element 10 (light emitting body) in the direction of the inner surface (reflecting surface) 21a of the reflecting frame body 20. It is inclined at an angle. The translucent member 30 having the above-described configuration covers the upper surface of the phosphor layer 13 and is formed on the substrate 1 so as to seal the remaining portion of the bonding wire 12 that is not sealed by the phosphor layer 13. Arranged.

  Further, the surface-mounted LED 100 according to the first embodiment is configured such that the upper surface of the reflective frame 20 is positioned above the translucent member 30. That is, the reflection surface 32 a of the translucent member 30 is located below the upper surface of the reflection frame body 20.

  In the configuration of the first embodiment described above, as shown in FIG. 1, the light emitted from the LED element 10 enters the translucent member 30 disposed above the phosphor layer 13 and is translucent. It will go through the member 30. A part of the light emitted from the LED element 10 is transmitted upward through the inclined surface 32 of the recess 31. Further, the light that travels obliquely upward emitted from the LED element 10 is caused by the difference in refractive index at the interface between the inclined surface 32 of the recess 31 and the air layer, and the inner surface (reflective surface) of the reflective frame 20. Reflected in the direction of 21a. The light reflected in the direction of the inner side surface (reflective surface) 21a of the reflective frame body 20 is incident on the inner side surface (reflective surface) 21a of the reflective frame member 20, and the inner side surface (reflective surface) of the reflective frame body 20 is reflected. Reflected by 21a and emitted upward.

  Unlike the configuration of the first embodiment described above, when the reflective surface 32a is not formed on the upper part of the translucent member 30, light that travels obliquely upward emitted from the LED element 10 is translucent. The light passes through the member 30 and is emitted in the direction of an arrow H indicated by a two-dot chain line. For this reason, in this case, it becomes difficult to suppress the spread of light, and it becomes difficult to obtain high directivity.

  In the first embodiment, as described above, the light from the LED element 10 is reflected in the direction of the inner side surface (reflective surface) 21a of the reflective frame 20 by the reflective surface 32a of the translucent member 30, so that the horizontal direction The light to becomes stronger. For this reason, even when the thickness of the reflective frame body 20 is reduced in order to reduce the size and thickness of the surface-mounted LED 100, the light from the LED element 10 is efficiently applied to the inner side surface (reflective surface) 21a of the reflective frame body 20. It can be made incident. Thereby, since the light from the LED element 10 can be efficiently reflected by the inner surface (reflecting surface) 21a of the reflecting frame 20 and emitted upward, the spread of the light can be suppressed. That is, the surface mount LED 100 can be given directivity in a specific direction. Therefore, even when the surface-mounted LED 100 is reduced in size and thickness, high directivity (narrow directivity) can be obtained.

  Further, in the first embodiment, the translucent member 30 is disposed away from the inner peripheral surface of the reflective frame body 20, and therefore the inner surface (reflective surface) of the reflective frame body 20 by the translucent member 30. Unlike the case where 21a is covered, the light incident on the inner side surface (reflection surface) 21a of the reflection frame 20 can be efficiently reflected upward.

  In the first embodiment, the inclined surface 32 of the recess 31 is formed so as to be inclined from the outer peripheral edge 33 on the upper side of the translucent member 30 toward a predetermined point G of the translucent member 30. Since the light incident on the inner surface (reflective surface) 21a of the reflection frame 20 can be suppressed from becoming non-uniform, it is possible to suppress uneven light emission while obtaining high directivity (narrow directivity). it can.

  In the first embodiment, the hole 3 is formed in a predetermined region inside the reflection frame 20 on the substrate 1 (insulating base material 2), and the wavelength of the light from the LED element 10 is converted into the hole 3. By embedding the phosphor layer 13 in which the phosphors 13 a are scattered and sealing the LED element 10 in the hole 3 of the substrate 1 with the phosphor layer 13, the surface-mounted LED 100 can be easily downsized, Thinning can be achieved.

  In the first embodiment, the phosphor layer 13 that seals the LED element 10 is embedded in the hole 3 of the substrate 1, so that the wavelength of light from the LED element 10 can be converted by the phosphor 13 a. In addition, a light emitter composed of the LED element 10 and the phosphor layer 13 can be provided inside the substrate 1. Thereby, since a light emission source can be provided in a partial region of the substrate 1, even if the phosphor 13a that converts the wavelength of light is provided, the light from the LED element 10 is efficiently reflected by the translucent member 30. The surface 32a can be reflected in the direction of the inner surface (reflective surface) 21a of the reflective frame 20. Therefore, since the light from the LED element 10 can be emitted in a specific direction by the inner side surface (reflection surface) 21a of the reflection frame body 20, high directivity (narrow directivity) can be obtained.

  In the configuration of the first embodiment described above, since the phosphor layer 13 is embedded in the hole 3 of the substrate 1, the formation region of the phosphor layer 13 can be reduced. For this reason, the dispersion | variation in the distance (path length) of the fluorescent substance 13a scattered in the fluorescent substance layer 13 and the LED element 10 sealed by the fluorescent substance layer 13 can be made small. As a result, variations in wavelength conversion efficiency can be reduced, so that luminance unevenness can also be reduced.

  In the first embodiment, the translucent member 30 is disposed so as to cover the upper surface of the phosphor layer 13, so that the light from the LED element 10 wavelength-converted by the phosphor layer 13 can be further improved in efficiency. The light can be reflected by the reflecting surface 32 a of the translucent member 30.

  Further, in the first embodiment, by configuring the upper surface of the reflection frame 20 to be located above the translucent member 30, the light traveling obliquely upward emitted from the LED element 10 is reliably ensured. Since it can be reflected upward by the inner side surface (reflective surface) 21a of the reflective frame body 20, high directivity (narrow directivity) can be easily obtained.

  FIG. 6 is a cross-sectional perspective view of a surface-mounted LED according to a modification of the first embodiment. Next, with reference to FIG. 6, the structure of the surface-mounted LED 200 according to the modification of the first embodiment will be described.

  In the surface-mounted LED 200 according to the modification of the first embodiment, in addition to the configuration of the first embodiment, a metal film 34 is formed on the inner surface of the recess 31 provided in the upper part of the translucent member 30. . The metal coating 34 is made of a metal material such as aluminum or copper, and is formed by, for example, a plating method or a vapor deposition method.

  In the configuration of the modified example of the first embodiment described above, unlike the first embodiment, the light that has reached the reflection surface 32 a of the translucent member 30 does not pass through the translucent member 30 and is the reflective frame 20. Is reflected in the direction of the inner side surface (reflection surface) 21a. Then, the light reflected in the direction of the inner side surface (reflective surface) 21a of the reflective frame body 20 is incident on the inner side surface (reflective surface) 21a of the reflective frame body 20 and at the same time, the inner side surface (reflective surface) of the reflective frame body 20 is reflected. Surface) 21a and reflected upward.

  The remaining configuration of the surface-mounted LED 200 according to the modification of the first embodiment is the same as that of the first embodiment.

  In the modified example of the first embodiment, as described above, by forming the metal coating 34 on the inner surface of the recess 31, the reflectance of the reflecting surface 32a of the translucent member 30 can be increased. Light from the element 10 can be efficiently reflected by the reflecting surface 32a. For this reason, even when the thickness of the reflective frame 20 is reduced in order to reduce the size and thickness of the surface-mounted LED 200, the inner surface (reflective surface) of the light from the LED element 10 is more efficiently transmitted. 21a. Thereby, the light from the LED element 10 can be more efficiently reflected by the inner side surface (reflective surface) 21a of the reflection frame 20 and emitted in a specific direction.

The remaining effects of the surface-mounted LED 200 according to the modification of the first embodiment are the same as those of the first embodiment.
(Second Embodiment)
FIG. 7 is a front view of a camera-equipped mobile phone according to the second embodiment of the present invention. FIG. 8 is a rear view of the camera-equipped mobile phone shown in FIG. 7 according to the second embodiment of the present invention. Next, the structure of the camera-equipped mobile phone 300 according to the second embodiment will be described with reference to FIGS.

  As shown in FIG. 7, on the front face of the camera-equipped mobile phone 300 according to the second embodiment, a liquid crystal display unit 301 for displaying information such as characters, numbers, and images, and for inputting a telephone number and various settings. The operation key 302, the microphone 303 for inputting the voice during the call, the speaker 304 for outputting the voice during the call, and the incoming LED (incoming light emitting diode) 305 are arranged. Further, as shown in FIG. 8, an imaging device 310 and a speaker 313 for alerting an incoming call by ringing a ringtone are arranged on the back surface of the camera-equipped mobile phone 300. Further, a battery cover 314 for protecting an internal battery (not shown) is provided on the back surface of the camera-equipped mobile phone 300.

  In addition, the imaging device 310 includes an imaging device (not shown) configured by a CCD image sensor and the like, an imaging unit 311 configured by a lens group 311a, a strobe 312 and the like. The surface mounted LED 100 of the first embodiment is used as the light source of the strobe 312. Thus, even when the camera-equipped mobile phone 300 is thinned, it is possible to suppress the light amount of the strobe 312 from being weakened. The light source of the strobe 312 can be the surface-mounted LED 200 according to the modification of the first embodiment.

  The camera function of the camera-equipped mobile phone 300 can be used by pressing a predetermined key of the operation key 302 on the front side. For example, the camera function is selected by pressing a predetermined key, and the predetermined key of the operation key 302 is assigned to the shutter key. Then, at the timing when the shutter key is pressed, the subject image is captured and the captured subject image is displayed on the liquid crystal display unit 301. At this time, the strobe 312 can be made to emit light in a dark place such as indoors.

  In the second embodiment, as described above, the surface-mounted LED 100 of the first embodiment or the surface-mounted LED 200 according to the modification of the first embodiment is used as the light source of the strobe 312, thereby reducing the size and thickness. Even in this case, it is possible to easily obtain the camera-equipped mobile phone 300 including the strobe light source that can emit light with a strong light amount in a specific direction.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example in which the present invention is applied to the surface-mounted LED is shown. However, the present invention is not limited to this, and the present invention is applied to light emitting devices other than the surface-mounted LED. May be.

  Moreover, in the said 1st and 2nd embodiment, although the example which provided the substantially inverted conical recessed part was shown in the translucent member, this invention is not restricted to this, If it is a recessed part containing an inclined surface, a recessed part The shape may be other than a substantially inverted conical shape. For example, the shape of the recess may be an inverted quadrangular pyramid.

  Moreover, in the said 1st and 2nd embodiment, while providing the recessed part in the translucent member and having formed the reflective surface by the inclined surface of the recessed part, this invention is not limited to this, A translucent member is shown. You may form a reflective surface, without providing a recessed part in this. For example, when femtosecond (one thousandth of a second) pulsed laser light is collected in a translucent member, the energy density becomes extremely large near the focal point, and cavities and voids are formed inside the translucent member. The Using this phenomenon, a reflective surface may be formed on the translucent member.

  Moreover, in the said 1st and 2nd embodiment, although the example which comprised the translucent member in the substantially cylindrical shape was shown, this invention is not restricted to this, A translucent member is substantially square other than substantially cylindrical shape. It may be a shape such as a shape.

  Moreover, although the example which formed the metal film on the inner surface of a recessed part was shown in the said 1st and 2nd embodiment, this invention is not restricted to this, You may comprise so that the inner side of a recessed part may be embedded with a metal member. Good. Moreover, you may comprise so that the inner side of a recessed part may be embedded with the material which has a refractive index different from a translucent member.

  In the first and second embodiments, the example in which the opening of the reflection frame is formed so as to be tapered upward is shown. However, the present invention is not limited to this, and the opening of the reflection frame is provided. You may form so that a part may spread in a mortar shape toward upper direction.

  In the first and second embodiments, the example in which the opening of the reflection frame is formed in a substantially circular shape when viewed in plan is shown. However, the present invention is not limited to this, and the opening of the reflection frame is used. May be formed in a shape other than a substantially circular shape when viewed in a plan view. As the shape other than the substantially circular shape, for example, a quadrangular shape can be considered.

  Moreover, in the said 1st and 2nd embodiment, although the example which comprised the thickness of the reflective frame to about 0.6 mm-about 0.8 mm was shown, this invention is not restricted to this, The thickness of a reflective frame is shown. , 0.6 mm or less.

  Further, in the first and second embodiments, the example in which the surface-mounted LED is provided with the phosphor layer is shown, but the present invention is not limited to this, and the surface-mounted LED is not provided with the phosphor layer. May be.

  Moreover, in the said 1st and 2nd embodiment, although the example which comprised the reflective frame body from a silicon resin, an epoxy resin, etc. was shown, this invention is not limited to this, A reflective frame body other than a silicon resin or an epoxy resin is shown. You may comprise from a material. For example, the reflection frame body may be made of a metal material mainly composed of aluminum, or the reflection frame body may be made of pure Al, magnesium, and other metal materials. Moreover, you may comprise a reflective frame body from ceramic materials other than a metal material. Further, the reflection frame body may be made of a material in which a metal is dispersed in a resin.

  Moreover, in the said 1st and 2nd embodiment, although the example which attached three LED elements to the board | substrate was shown, this invention is not restricted to this, One, two, or four or more LED elements May be attached to the substrate.

  In the first and second embodiments, the example in which the LED element, which is an example of the light emitting element, is provided in the surface mount type LED is shown. However, the present invention is not limited to this, and the organic EL element other than the LED element, etc. The light emitting element may be provided in a surface mount type LED.

  In the second embodiment, the example in which the light-emitting device (surface-mounted LED) according to the present invention is used as the strobe light source of the camera-equipped cellular phone is shown. However, the present invention is not limited to this, and other than the camera-equipped cellular phone. The light emitting device (surface mounted LED) of the present invention may be used in a strobe light source such as an electronic still camera (digital camera). Note that the light emitting device (surface mounted LED) of the present invention can also be used for a light source other than a strobe.

1 is a cross-sectional perspective view of a surface-mounted LED according to a first embodiment of the present invention. FIG. 2 is an overall perspective view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. 1. FIG. 2 is a plan view of the surface-mounted LED according to the first embodiment of the present invention shown in FIG. 1. It is the top view which abbreviate | omitted and showed a part of surface mount type LED by 1st Embodiment of this invention shown in FIG. It is the top view which looked at the surface mount type LED by 1st Embodiment of this invention shown in FIG. 1 from the lower surface side. It is a section perspective view of surface mount type LED by the modification of a 1st embodiment. It is a front view of the mobile telephone with a camera by 2nd Embodiment of this invention. FIG. 8 is a rear view of the camera-equipped mobile phone shown in FIG. 7 according to the second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Insulation base material 3 Hole part 4 Upper surface side conductor layer 6 Lower surface side conductor layer 6a Conductor layer for heat dissipation 6b Conductor layer for wiring 10 LED element (light emitting element)
13 Phosphor Layer 13a Phosphor 20 Reflecting Frame 21 Opening 21a Inner Side (First Reflecting Surface, Inner Perimeter)
30 translucent member 31 concave portion 32 inclined surface 32a reflective surface (second reflective surface)
33 Outer peripheral edge 34 Metal coating 100, 200 Surface mount type LED (light emitting device)
300 Mobile Phone with Camera 310 Imaging Device 311 Imaging Unit 312 Strobe

Claims (10)

A substrate with a light emitting element attached thereto;
A reflective frame that is mounted on the upper surface of the substrate so as to surround the light emitting element when seen in a plan view, and has an inner peripheral surface as a first reflective surface;
A translucent member disposed on the inner surface of the reflective frame on the upper surface of the substrate and spaced from the inner peripheral surface of the reflective frame;
The light transmitting device, wherein the light transmissive member includes a second reflecting surface inclined so as to reflect light from the light emitting element in a direction of the first reflecting surface of the reflecting frame. The upper part of the translucent member is provided with a recess including an inclined surface,
The light emitting device according to claim 1, wherein the second reflecting surface is configured by an inclined surface of the concave portion.   The inclined surface of the concave portion is formed so as to be inclined from an outer peripheral edge portion on an upper side of the translucent member toward a predetermined point of the translucent member. The light emitting device described.   The light emitting device according to claim 2, wherein a metal film is formed on the inner surface of the recess. A hole is formed in a predetermined region inside the reflection frame on the substrate, and a phosphor layer in which phosphors for wavelength-converting light from the light emitting element are scattered in the hole. Embedded,
The light emitting device according to claim 1, wherein the light emitting element is sealed in the hole of the substrate by the phosphor layer.   The said translucent member is arrange | positioned so that the upper surface of the said phosphor layer may be covered on the upper surface of the said phosphor layer which seals the said light emitting element. Light emitting device.   The light emitting device according to any one of claims 1 to 6, wherein an upper surface of the reflective frame is configured to be positioned above the translucent member.   The light-emitting device according to claim 1, wherein the reflection frame is configured so that an opening width widens upward.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode element.   An imaging apparatus using the light-emitting device according to claim 1 as a strobe light source.

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