JP2009031464A - Liquid crystal device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable conductive connection structure for preventing a counter substrate from being charged without increasing man-hours and cost in manufacturing a liquid crystal device having a pixel electrode and a common electrode arranged on one substrate. <P>SOLUTION: The liquid crystal device has a first substrate 21 and a second substrate 22 facing each other via a liquid crystal layer. The common electrode and the pixel electrode forming an electric field are disposed on the liquid crystal layer side surface of the first substrate 21, and an antistatic ITO film 24 is disposed on the side opposite to the liquid crystal layer of the second substrate 22. An FPC board 7 equipped with a ground wire is connected to the first substrate 21. The first substrate 21 and the second substrate 22 are contained in a conductive metal frame 5. One portion of the metal frame 5 is in contact with the ITO film 24, and the other portion 54b of the metal frame 5 is in contact with a ground terminal 59 of the FPC board 7. In this way, the ITO film 24 is connected with the ground potential via the metal frame 5, and charging of the substrate 22 is prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid crystal device that generates an electric field between two electrodes provided on a common substrate. The present invention also relates to an electronic device configured using the liquid crystal device.

  Currently, liquid crystal devices are widely used in electronic devices such as mobile phones, PDAs (Personal Digital Assistants), car navigation systems, and the like. For example, a liquid crystal device is used as a display unit for displaying various types of information regarding electronic devices as images. In recent years, with the increase in definition of the liquid crystal panel constituting the liquid crystal device, the drive circuit of the liquid crystal panel is wired with high density, and electronic components tend to be mounted with high density. In such a circuit board in which wiring and mounting are performed at a high density, it is difficult to form a wide ground wiring on the circuit board. When the ground wiring cannot be formed widely as described above, stable display quality may not be obtained due to intrusion from the outside of the liquid crystal device or unnecessary radiation waves (so-called noise) generated inside the device. .

  In order to prevent such deterioration in display quality due to noise, conventionally, a technique of connecting a metal shield case to a ground wiring of a circuit board is known (see, for example, Patent Document 1 or Patent Document 2). Patent Document 1 discloses a configuration in which a part of a metal shield case and a ground wiring of a circuit board are electrically connected via a sheet-like conductive member. In Patent Document 2, the ground wiring of the circuit board and the metal shield case are conductively connected via the chip component and the metal tape.

JP-A-10-268272 (page 4, FIG. 1) Japanese Patent Laid-Open No. 11-305205 (5th page, FIG. 1)

  Incidentally, as an operation mode of the liquid crystal device, an IPS (In-Plane Switching) mode, an FFS (Fringe Field Switching) mode, and the like are known. In a liquid crystal device employing these operation modes, a common electrode and a pair of pixel electrodes are provided on one of a pair of substrates facing each other with a liquid crystal layer interposed therebetween. By applying a voltage to these electrodes, an electric field generated by electric lines of force that exits from one substrate and enters the same substrate, and includes electric lines of force that are parallel to the substrate surface, is generated. Can be made. By controlling the orientation of the liquid crystal molecules in the liquid crystal layer by this electric field, light passing through the liquid crystal layer can be modulated. In this liquid crystal device, since liquid crystal molecules are driven by an electric field substantially parallel to the substrate, the alignment of the liquid crystal molecules is controlled in a plane substantially parallel to the substrate. For this reason, even if the viewing angle changes, the viewing angle of the liquid crystal molecules does not change. Therefore, the display according to the alignment control of the liquid crystal molecules can be viewed within a wide viewing angle range, so-called wide viewing angle.

  In such a liquid crystal device such as the IPS mode and the FFS mode, a pixel electrode that is an electrode constituting a pixel and a common electrode are provided on one substrate, and are not provided on the other substrate. Therefore, the other substrate on which no electrode is provided may be charged by external static electricity or the like. In this case, an unnecessary electric field may be generated between the one substrate provided with the electrode and the other substrate not provided with the electrode due to the charged charges. And the display of a liquid crystal device may become unstable by the influence of this unnecessary electric field.

  As a configuration for preventing such charging of the substrate, a configuration shown in FIG. 15 is conceivable in a conventional liquid crystal device. Explaining this configuration, a wiring substrate 207 having a ground wiring (not shown) is connected to a first substrate 201 which is one of a pair of substrates. The ground wiring is conductively connected to the wiring 203 on the first substrate 201. A conductive layer 204 is provided on the surface of the second substrate 202 which is the other substrate. The conductive layer 204 and the wiring 203 are connected using a conductive molding material 205. In this way, electric charges charged in the second substrate 202 can be released to the ground wiring. However, the mold material 205 is originally not used in an IPS mode or FFS mode liquid crystal device, and there is a problem that the number of manufacturing steps increases by using the mold material 205. In addition, there is a problem that the manufacturing cost including the component cost increases.

  Therefore, the inventors have made diligent efforts to prevent the substrate from being charged without increasing the number of manufacturing steps and the manufacturing cost. As a result, the inventors came up with a configuration that prevents the substrate from being charged by using a metal frame that is one of the members constituting the liquid crystal device. As described above, Patent Documents 1 and 2 disclose a configuration in which a metal shield case, which is a metal frame, is conductively connected to a ground wiring. However, the liquid crystal devices of Patent Document 1 and Patent Document 2 are intended to prevent deterioration in display quality due to noise in a vertical electric field type liquid crystal device, and prevent charging of a substrate in an IPS mode or FFS mode liquid crystal device. It is not intended to do.

  The present invention has been made in view of the above problems, and in a liquid crystal device in which a pair of electrodes is provided on one of a pair of substrates and an electric field is formed between the electrodes, the number of manufacturing steps and the manufacturing cost are achieved. The object is to prevent the substrate from being charged without increasing the thickness.

  In the liquid crystal device according to the present invention, an electric field is generated between a first substrate and a second substrate facing each other with a liquid crystal layer interposed therebetween, and a pixel electrode provided on the liquid crystal layer side of the first substrate and the pixel electrode. A common electrode to be formed; a conductive layer provided on the opposite side of the liquid crystal layer of the second substrate; a flexible substrate connected to the first substrate and provided with a ground wiring; the first substrate; And a conductive frame accommodating the second substrate. A part of the conductive frame is in contact with the conductive layer, and the other part of the conductive frame is in contact with a contact portion of the ground wiring of the flexible substrate.

  The liquid crystal device having this configuration is, for example, a liquid crystal device having a configuration such as an FFS mode or an IPS mode. In this liquid crystal device, a liquid crystal layer is disposed between a first substrate on which a pixel electrode and a common electrode are formed and a second substrate facing the first substrate, thereby forming a liquid crystal panel. Polarized light that controls the orientation of the liquid crystal molecules in the liquid crystal layer in a plane substantially parallel to the substrate and transmits the liquid crystal layer by forming an electric field between the pixel electrode and the common electrode provided on the first substrate. Display is performed by controlling. The conductive frame is a frame that houses the liquid crystal panel, and is a frame that protects the liquid crystal panel and improves the strength of the liquid crystal device.

  In the liquid crystal device according to the present invention, a part of the conductive frame is in contact with the conductive layer of the second substrate, and the other part of the conductive frame is in contact with the contact part of the ground wiring of the flexible substrate, for example, the terminal part. It was set as the structure to do. That is, the conductive layer of the second substrate and the ground wiring of the flexible substrate are conductively connected via the conductive frame. The conductive frame is a member generally used as a component constituting the liquid crystal device. By using this conductive frame, the conductive layer and the ground wiring of the flexible wiring board can be conductively connected without increasing the number of manufacturing steps and manufacturing cost of the liquid crystal device. This can prevent the second substrate from being charged by external static electricity or the like. As a result, an unnecessary electric field can be prevented from being generated between the first substrate and the second substrate, and display of the liquid crystal device can be prevented from becoming unstable.

  Next, in the liquid crystal device according to the present invention, it is preferable that the conductive frame and the contact portion of the ground wiring are in contact with each other at a plurality of locations. In this way, even if a conductive failure occurs in one conductive contact portion, normal conduction is ensured in the other conductive contact portion, and so-called redundant design is ensured.

  Next, the liquid crystal device according to the present invention can further include a resin frame accommodated in the conductive frame, and in this case, the contact portion of the ground wiring is the resin frame and the conductive frame. It is desirable to contact the conductive frame while being sandwiched between the two. The resin frame is a member that supports a liquid crystal panel, a lighting device, and the like. By arranging the ground wiring of the flexible substrate between the resin frame and the metal frame, the flexible substrate is sandwiched between the resin frame and the conductive frame, so that the conductive frame and the ground wiring are securely connected. Can touch.

  Next, in the liquid crystal device according to the present invention, the first substrate and the second substrate are disposed between the resin frame and the conductive frame, and the conductive frame engages with the resin frame. An engaging piece that has a base portion extending from the conductive frame and an engaging portion that bends and extends from the base portion, and the engaging portion includes the first substrate of the resin frame and the engaging portion. It is desirable that the surface opposite to the side where the second substrate is accommodated is engaged with the resin frame with the contact portion of the ground wiring interposed therebetween. Hereinafter, the side on which the first substrate and the second substrate are accommodated may be referred to as the front side of the resin frame, and the opposite side may be referred to as the back side of the resin frame. In the aspect of the present invention, the conductive frame is unlikely to float or come off from the resin frame by the engagement piece of the conductive frame engaging the resin frame. In addition, since the contact portion of the ground wiring is sandwiched between the resin frame and the engagement piece, the contact between the conductive frame and the ground wiring can be reliably maintained.

  In the aspect of the present invention, the contact portion of the ground wiring is configured to come into contact with the engagement piece on the surface on the back side of the resin frame. In order to arrange the contact portion of the ground wiring on the back surface of the resin frame, the flexible substrate on which the ground wiring is disposed is bent from the front side of the resin frame to the back side of the resin frame. When the engaging piece is engaged with the resin frame in a state where the flexible substrate is bent as described above, the repulsive force of the flexible substrate (that is, the force that the bent flexible substrate tries to return straight) The ground wiring is always pressed against the engaging portion of the conductive frame. As a result, the contact state between the conductive frame and the contact portion of the ground wiring can be accurately maintained without using a connection member such as a conductive adhesive or solder.

  Next, in the liquid crystal device according to the present invention in which the engagement piece is provided, it is desirable that the engagement piece of the conductive frame is provided in at least two places on one side of the conductive frame. According to this configuration, the conductive contact between the conductive frame and the ground wiring can be stably maintained. For example, even if one of the two ground wirings is disconnected or one of the two engaging pieces of the conductive frame is damaged, the ground wiring and the conductive frame It can be ensured by a normal wiring system that does not damage continuity.

  Next, in the liquid crystal device according to the present invention in which the engagement piece is provided, the contact portion of the ground wiring extends in a direction perpendicular to an end side of the first substrate to which the flexible substrate is connected. Desirably, the conductive frame engaging pieces are disposed on both sides of the first substrate, and the conductive frame engaging pieces are disposed on both sides of the first substrate. It is desirable that the contact portion of the wiring and the engaging piece of the conductive frame are in contact with each other on both sides of the center line. Currently, liquid crystal devices tend to be thin. Therefore, it can be considered that twisting occurs when the liquid crystal device is used. If two contact portions between the conductive frame and the ground wiring are provided at positions closer to one side than the center line of the first substrate (that is, when the two contact portions are close to each other). It is conceivable that contact between the two contact portions cannot be maintained by twisting the liquid crystal device.

  In the aspect of the present invention, the conductive frame and the ground wiring are brought into contact with each other at two positions on both sides of the center line of the first substrate. That is, the positions of the two contact portions are separated from each other. Therefore, even if the liquid crystal device is twisted, the contact between the conductive frame and the ground wiring can be maintained at any one contact portion. As a result, the certainty of contact between the conductive frame and the ground wiring can be improved. In addition, by arranging contact portions on both sides of the center line, the structure of the flexible substrate and the structure of the metal frame can be made symmetrical. If it carries out like this, the load concerning a conductive frame can be equalized.

  Next, in the liquid crystal device according to the present invention, the conductive layer has translucency, and the conductive layer is provided in a planar shape in a region covering at least an image display region on the surface of the second substrate. It is desirable that the planar portion of the frame and the planar portion of the conductive layer are in contact with each other in the plane area. If a light-transmitting conductive layer is used, the conductive layer can be provided on the surface of the second substrate without hindering the display of the liquid crystal device. In addition, since the conductive layer is provided in a planar shape in a region covering at least the display region on the surface of the second substrate, it is possible to reliably prevent charge from being charged in the display region of the second substrate.

  In the aspect of the present invention, the plane portion of the metal frame and the plane portion of the conductive layer are in contact with each other in the plane area. In the conventional liquid crystal device shown in FIG. 15, the conductive layer and the wiring substrate are connected via a molding material. This molding material is provided, for example, by dropping a small amount of liquid material on the substrate and then curing it. Therefore, the molding material is formed in a very small area (for example, a diameter of about 1 mm or less) on the substrate. On the other hand, in the liquid crystal device according to the aspect of the present invention, the planar portion of the conductive frame and the planar portion of the conductive layer are in contact with each other in the plane region on the second substrate. Conductive connection can be ensured in a wider area than in the past.

  Next, in the liquid crystal device having a configuration in which the planar portion of the conductive frame and the planar portion of the conductive layer are in contact with each other in the plane region, the conductive layer and the conductive frame are caused by the elastic force of the conductive frame. It is desirable that they are in contact with each other in the surface area. The conductive frame of the embodiment of the present invention is formed to a thickness that allows elastic deformation. Therefore, if the conductive frame is designed to be combined when it is pushed a little stronger into the resin frame, the conductive frame can be reliably brought into contact with the conductive layer.

  Next, in the liquid crystal device according to the present invention, the conductive layer provided on the second substrate is a film of ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). be able to. The ITO film and the IZO film are light-transmitting films and are generally used as conductive layers that form electrodes of a liquid crystal device. If the conductive layer of the second substrate is formed using these ITO film or IZO film, the same material as the electrode provided on the first substrate can be used, so that the conductive layer can be provided without increasing the component cost. it can. The conductive layer provided on the second substrate may be a polarizing layer having a transmission axis that selectively transmits polarized light modulated by the liquid crystal layer. The polarizing layer is used for displaying in a liquid crystal device. For example, a polarizing plate having conductivity can be used as the polarizing layer.

  Next, in the liquid crystal device according to the present invention, at least one optical sheet is provided on the conductive layer, and the conductive layer is exposed to the outside of the optical sheet from an edge of the outer periphery of the optical sheet, It is desirable that the conductive layer is in contact with the planar portion of the conductive frame in a planar area at a planar portion exposed to the outside of the optical sheet. The optical sheet is a sheet that adjusts the characteristics of light that has passed through the liquid crystal layer as needed by being provided in the display region of the liquid crystal device, and includes, for example, a polarizing plate. Since the conductive layer is exposed from the edge of the outer periphery of the optical sheet to the outside of the optical sheet, the conductive frame and the conductive layer can contact with each other in the surface area outside the outer periphery of the display area. The area in contact with the conductive layer can be widened.

  Next, in the liquid crystal device according to the present invention, the conductive frame may have four sides surrounding the image display area. That is, the conductive frame can have an opening having a frame-shaped peripheral portion surrounding the display region. The conductive layer is preferably in contact with the surfaces of the four sides of the conductive frame facing the second substrate. In this way, the conductive layer and the conductive frame can be brought into contact with each other over a wide area without hindering the display of the liquid crystal device.

  Next, in the liquid crystal device according to the present invention, the first substrate and the second substrate are disposed between the resin frame and the conductive frame, and the conductive frame surrounds the image display region 4. And at least one of the four sides of the conductive frame is provided with an engagement piece that engages with the resin frame, the engagement piece having a base extending from the conductive frame and the An engagement portion that bends and extends from the base portion, and the engagement portion sandwiches the contact portion of the ground wiring on the surface of the resin frame opposite to the side on which the first substrate and the second substrate are accommodated. It is desirable that the conductive layer is engaged with the resin frame, and the conductive layer is in contact with the conductive frame in a surface area at a side where the engagement piece is provided. The side where the engagement piece is provided is a portion where the conductive frame is firmly engaged with the resin frame compared to the other sides, and the conductive frame is less likely to float or come off from the resin frame. Part. If the conductive layer and the conductive frame are brought into contact with each other on this side, the contact state can be reliably maintained.

  Next, in the liquid crystal device according to the present invention, the conductive frame has four sides surrounding the image display area, and at least one of the four sides of the conductive frame has the resin frame. It is desirable that a fitting portion to be fitted is provided, and the conductive layer is in contact with the conductive frame in a surface area at a side where the fitting portion is provided. Similarly to the side provided with the engagement piece, the side where the fitting portion is provided is a portion in which the conductive frame is firmly engaged with the resin frame, and the conductive frame is It is a part that is difficult to float or come off from the resin frame. If the conductive layer and the conductive frame are brought into contact with each other on this side, the contact state can be reliably maintained.

  Next, an electronic apparatus according to the present invention includes the liquid crystal device having the above-described configuration. According to the liquid crystal device of the present invention, a part of the conductive frame is in contact with the conductive layer of the second substrate, and the other part of the conductive frame is in contact with the contact part of the ground wiring of the flexible substrate. Therefore, the conductive layer and the ground wiring of the flexible wiring board can be connected without increasing the number of manufacturing steps and the manufacturing cost of the liquid crystal device, and an electric field is generated between the first substrate and the second substrate. It is possible to easily prevent the display of the liquid crystal device from becoming unstable. Therefore, even in the electronic apparatus according to the present invention using the liquid crystal device, it is possible to easily prevent the display from becoming unstable due to the influence of external static electricity or the like.

(First Embodiment of Liquid Crystal Device)
Hereinafter, a liquid crystal device according to the present invention will be described based on embodiments. Of course, the present invention is not limited to this embodiment. In the following description, the drawings will be referred to as necessary, but in this drawing, in order to show the important components of the structure made up of a plurality of components in an easy-to-understand manner, May be indicated by dimensions.

FIG. 1 is an exploded perspective view showing a part of an embodiment of a liquid crystal device according to the present invention. FIG. 2 is a perspective view showing the liquid crystal device of FIG. 1 upside down. FIG. 3 is a cross-sectional view taken along the line Z _A -Z _A passing through the substantially central portion of the liquid crystal device in FIG. 4A and 4B are cross-sectional views according to the Z _D -Z _D line (shown by two upper and lower sides) on the short side on the near side of the liquid crystal device of FIG. In these drawings, the side indicated by the arrow A is the side on which the image is displayed, that is, the display surface side or the observation side, and the side indicated by the arrow B is the back side or the non-display surface side. In these drawings, an arrow X indicates a row direction in which a scanning line described later extends, and an arrow Y indicates a column direction in which a data line described later extends. The row direction X and the column direction Y are orthogonal to each other.

  In FIG. 1, the liquid crystal device 1 includes a liquid crystal panel 2 supported by a resin frame 4 and a metal frame 5 as a conductive frame fitted into the resin frame 4. As shown in FIG. 3, the lighting device 3 is fitted into the resin frame 4 on the back side (lower side of the figure) of the liquid crystal panel 2. Thus, the lighting device 3 is attached to the liquid crystal panel 2. The metal frame 5 accommodates the liquid crystal panel 2 and the illumination device 3 in a state assembled to the outside of the resin frame 4. In FIG. 1, a driving IC 6 is mounted on one side of the liquid crystal panel 2 on the near side of the figure. Further, an FPC (Flexible Printed Circuit) substrate 7 as a flexible substrate is connected to the side edge of the liquid crystal panel 2 on the side where the driving IC 6 is mounted.

  In FIG. 3, the illuminating device 3 includes an LED (Light Emitting Diode) 11 as a light source and a light guide 12 formed of a translucent resin. A plurality of LEDs 11 are provided in the direction perpendicular to the paper surface (the direction of transmitting through the paper surface), three in this embodiment. The light guide 12 is formed as a rectangular or square plate member having an area substantially equal to that of the liquid crystal panel 2. Light emitted from the LED 11 is taken into the light guide 12 from the light incident surface 12 a of the light guide 12, and is converted into planar light from the light output surface 12 b that is a surface facing the liquid crystal panel 2. Supplied to. The light source can also be constituted by a point light source other than the LED 11 or a linear light source such as a cold cathode tube.

  A light reflecting film 13 is provided on the back surface of the light guide 12 as viewed from the observation side indicated by the arrow A. In FIG. 2 which shows the state which looked at the liquid crystal device 1 from the back, the light reflection film 13 can be visually recognized largely. In FIG. 3, a light diffusion sheet 14 is provided between the liquid crystal panel 2 and the lighting device 3, that is, on the light emitting surface 12 b of the light guide 12, and two lens sheets 15 a and 15 b are provided thereon. Yes. The light diffusion sheet 14 has a function of diffusing light emitted from the light emitting surface 12b in a wide angle range. The lens sheets 15 a and 15 b have a function of directing the light diffused by the light diffusion sheet 14 toward the liquid crystal panel 2.

  Next, the liquid crystal panel 2 will be described. The liquid crystal panel 2 of the present embodiment is an active matrix type liquid crystal panel that is transmissive and capable of color display. As the switching element, a channel etch type single gate structure polysilicon TFT (Thin Film Transistor) element is used. Further, an FFS (Fringe Field Switching) mode is adopted as an operation mode.

  The liquid crystal panel 2 includes a first substrate 21 and a second substrate 22 that are bonded to each other with a rectangular or square seal member (not shown) that is rectangular or square when viewed from the direction of the arrow A. The first substrate 21 is an element substrate on which switching elements are formed. The second substrate 22 is a color filter substrate on which a color filter is formed. In the present embodiment, the color filter substrate 22 is disposed on the observation side, and the element substrate 21 is disposed on the back as viewed from the observation side.

  The element substrate 21 includes a first light-transmitting substrate 21 a that is rectangular or square when viewed from the observation side indicated by the arrow A. The first translucent substrate 21a is formed of, for example, translucent glass, translucent plastic, or the like. A polarizing plate 23a as a polarizing layer is attached to the outer surface of the first light-transmissive substrate 21a (that is, the side on which the arrow B is drawn).

  The color filter substrate 22 facing the element substrate 21 has a second transparent substrate 22a that is rectangular or square when viewed from the observation direction indicated by the arrow A. The second translucent substrate 22a is formed of, for example, translucent glass, translucent plastic, or the like. An ITO film 24 as a conductive layer is provided in a planar shape (so-called solid shape) on the outer surface (that is, the side on which the arrow A is drawn) of the second translucent substrate 22a. A polarizing plate 23b as a polarizing layer is attached to the top. If necessary, other appropriate optical elements such as a retardation plate can be provided in addition to the polarizing plate 23b.

  The liquid crystal panel 2 is an element that displays an image on the surface of the element substrate 21, and a region where the image is displayed is shown as an image display region V in FIG. 1. The ITO film 24 is provided on the outer surface of the second translucent substrate 22a so as to cover the image display region V. The ITO film 24 is formed in a larger area than the polarizing plate 23b provided thereon. That is, the ITO film 24 is exposed in a frame shape outward from the outer peripheral edge of the polarizing plate 23b.

Hereinafter, the internal structure of the liquid crystal panel 2 will be described with reference to FIGS. Figure 6 shows the internal cross-sectional structure of the liquid crystal panel 2 in a portion (portion indicated by the arrow Z _E) containing one sub-pixel of the liquid crystal panel 2 of Figure 3. Here, the sub-pixel is one of a plurality of dot areas constituting the image display area V, and is an area that is an on / off unit when displaying an image. FIG. 7 shows a planar structure of the element substrate viewed from the direction of arrow A in FIG.

  In FIG. 6, a gap having a predetermined thickness, that is, a so-called cell gap G is formed between the element substrate 21 and the color filter substrate 22. The thickness of the cell gap G is maintained by a gap material included in the sealing material and a spacer (not shown) placed on the surface of the element substrate 21 or the color filter substrate 22. The spacers may be formed by dispersing spherical members on the substrate 21 or the substrate 22, or may be formed on the substrate 21 or the substrate 22 by photolithography.

  A liquid crystal layer 25 is formed by injecting liquid crystal into the cell gap G. Although the characteristics of the liquid crystal layer 25 are not limited to special ones, in the present embodiment, nematic liquid crystal having positive dielectric anisotropy (Δε> 0) is used as the liquid crystal. Reference numeral 25a schematically shows liquid crystal molecules contained in the liquid crystal. The initial alignment of the liquid crystal molecules 25 a is set parallel to the element substrate 21 and the color filter substrate 22. Here, the term “parallel” includes the case where the liquid crystal molecules have a predetermined pretilt angle with respect to the substrate.

  A gate line 30 and a common line 31 are provided on the inner surface (that is, the liquid crystal side surface) of the first translucent substrate 21a. These lines extend in the direction perpendicular to the paper surface. As shown in FIG. 7, a plurality of gate lines 30 are formed extending in the row direction X in parallel with each other. A plurality of common lines 31 are formed extending in the row direction X in parallel with the gate lines 30. The gate line 30 functions as a scanning line.

  In FIG. 6, a substantially rectangular and planar (so-called solid) common electrode 32 is provided for each subpixel P on the substrate 21 a between the adjacent gate lines 30. The common electrode 32 is formed in a state where a part of the common electrode 32 overlaps the common line 31, whereby the common electrode 32 and the common line 31 are electrically connected.

  On the gate line 30, the common line 31, and the common electrode 32, a gate insulating film 33, which is a planar resin film covering them, is formed, and a source line 34 is formed on the gate insulating film 33 so as to extend in the column direction Y. Yes. The source line 34 functions as a data line. In FIG. 7, a rectangular region surrounded by the gate line 30 and the source line 34 is a subpixel P. Then, as shown in FIG. 1, an image display region V is formed by arranging a plurality of subpixels P in the row direction X and the column direction Y, respectively.

  In FIG. 7, a TFT element 36 which is an active element functioning as a switching element is provided in the vicinity of the intersection between the gate line 30 and the source line 34. The TFT element 36 is formed as a channel etch type polysilicon TFT having a bottom gate structure and a single gate structure. In FIG. 6, the TFT element 36 includes a gate electrode 30 a which is a part of the gate line 30, a gate insulating film 33, a semiconductor film 37 formed using polysilicon, a source electrode 38, and a drain electrode 39. And have. The source electrode 38 and the drain electrode 39 are electrode terminals of the TFT element 36 that is a switching element. The source electrode 38 is branched from the source line 34 as shown in FIG. Although the TFT element 36 of the present embodiment has a bottom gate structure, it may be a top gate structure.

  In FIG. 6, a passivation film (protective film) 40 which is a planar resin film for covering the TFT element 36 and the source line 34 is provided on the gate insulating film 33. The passivation film 40 is made of, for example, a photosensitive resin. A pixel electrode 41 is provided on the passivation film 40, and an alignment film 42 is provided thereon. In FIG. 7, the alignment film 42 is not shown. In FIG. 6, a through hole 43 is formed in the passivation film 40 in the upper region of the drain electrode 39 of the TFT element 36, and the pixel electrode 41 and the drain electrode 39 are conductively connected through the through hole 43.

  In the present embodiment, the source line 34 in FIG. 7 is a data line, the source electrode 38 of the TFT element 36 extends from the data line, and the drain electrode 39 of the TFT element 36 is connected to the pixel electrode 41. It has become. Alternatively, the data line 34 may be connected to the drain electrode of the TFT element, and the pixel electrode 41 may be connected to the source electrode of the TFT element.

In FIG. 6, the common electrode 32 and the pixel electrode 41 are formed of a light-transmitting metal oxide such as ITO or IZO. The passivation film 40 and the gate insulating film 33 each function as an interlayer insulating film provided between the common electrode 32 and the pixel electrode 41, and as an overcoat layer that is a resin film for covering other elements. Function. The passivation film 40 and the gate insulating film 33 are made of, for example, acrylic resin, SiN (silicon nitride), or SiO ₂ (silicon oxide). The alignment film 42 is made of, for example, polyimide.

  As shown in FIG. 7, the pixel electrode 41 is formed in a rectangular planar shape corresponding to the sub-pixel P, and has a plurality of slits, that is, gaps 45 therein. The gap 45 is a groove-like opening that penetrates the pixel electrode 41, and the passivation film 40 that is the lower layer of the pixel electrode 41 can be seen through the gap 45. The plurality of gaps 45 extend in parallel to the row direction X at intervals from each other along the column direction Y. Between these gaps 45, strip-shaped electrode linear portions 41a are formed.

  Note that the gap 45 and the electrode linear portion 41a shown in FIGS. 6 and 7 are schematically illustrated, and the actual numbers thereof may be different from those illustrated. Further, the gap 45 and the electrode linear portion 41a can be formed in a shape extending in a direction inclined by a predetermined angle with respect to the row direction X in relation to the rubbing direction. When the liquid crystal to be used is a negative liquid crystal, the gap 45 and the electrode linear portion 41a can be formed in a shape extending along the column direction Y. In the present embodiment, both short sides of the gap 45 are closed, but one of the short sides of the gap 45 can be open. In the open state, each of the plurality of electrode linear portions 41a is in a cantilever state, and has a comb-teeth shape as a whole. Also, both short sides of the gap 45 can be opened.

  In the liquid crystal panel 2 having the above-described configuration, as shown in FIG. 6, both the common electrode 32 and the pixel electrode 41 that are a pair of electrodes are provided on the element substrate 21 that is one substrate in the sub-pixel P. By applying a predetermined voltage between the electrodes, an electric field E is formed by lines of electric force that exit from the element substrate 21 and enter the same substrate 21. The electric field E is an electric field in a parallel direction and an oblique direction with respect to the substrates 21 and 22. By the electric field E, the orientation of the liquid crystal molecules 25 a in the liquid crystal layer 25 is controlled in a plane substantially parallel to the surface of the element substrate 21.

  Next, a colored film 46 constituting the color filter is formed on the inner surface (that is, the liquid crystal side surface) of the second light transmissive substrate 22a constituting the color filter substrate 22, and a light shielding film 47 is formed around the colored film 46. ing. Each colored film 46 is formed in a rectangular or square dot shape (that is, an island shape) corresponding to the sub-pixel P when viewed from the arrow A direction. A plurality of the colored films 46 are arranged in a matrix in the row direction X and the column direction Y. The light shielding film 47 is formed in a lattice shape surrounding the colored films 46.

  Each of the colored films 46 is set to an optical characteristic that allows one of R (red), G (green), and B (blue) to pass, and the colored films 46 of R, G, and B are arranged in a stripe arrangement. Yes. The stripe arrangement is an arrangement in which the same colors of R, G, and B are arranged in the column direction Y, and R, G, and B are alternately arranged in the row direction X one by one. Instead of the stripe arrangement, other arrangements such as a mosaic arrangement and a delta arrangement may be used. The light shielding film 47 is formed as a resin film by overlapping colored films 46 of different colors. However, the light shielding film 47 can also be formed of a metal film such as Cr (chromium). Note that the color of the colored film 46 may be four colors R, G1, G2, and B (G1 and G2 are green colors having different wavelengths) instead of the three colors R, G, and B. If four colored films are used, the color reproduction area on the NTSC ratio can be expanded, and each color tone can be expressed richly.

  An overcoat layer 48 is formed on the colored film 46 and the light shielding film 47, and an alignment film 49 is formed thereon. The overcoat layer 48 is a layer provided in a planar shape so as to cover the colored film 46 and the light shielding film 47. The colored film 46 is formed, for example, by mixing a pigment or a dye with a photosensitive resin material. The overcoat layer 48 is made of, for example, an acrylic resin. The alignment film 49 is made of polyimide. The overcoat layer 48 functions as a protective film that prevents the constituent material of the color filter from being mixed into the liquid crystal and a planarizing film that planarizes the surface of the color filter.

  The rubbing direction applied to the alignment film 49 on the color filter substrate 22 side and the alignment film 42 on the element substrate 21 side is an antiparallel direction along the row direction X. However, since the gap 45 is parallel to the row direction X in the present embodiment, the rubbing direction is a direction inclined by about 5 ° to 15 ° with respect to the row direction X. The transmission axes of the polarizing plate 23a on the element substrate 21 side and the polarizing plate 23b on the color filter substrate 22 side are perpendicular to each other, and the transmission axis of the polarizing plate 23b on the observation side is the rubbing direction of the alignment films 49 and 42. They are parallel and the transmission axis of the polarizing plate 23a on the back side of the observation is orthogonal to the rubbing direction.

  Since the film configuration in the sub-pixel P of the liquid crystal panel 2 is as described above, when the planar light L is supplied from the illumination device 3 to the liquid crystal panel 2 in FIG. 3, the pixel P is viewed from the back side in FIG. Light is supplied inside. In FIG. 6, when an off voltage is applied between the common electrode 32 and the pixel electrode 41, the polarized light transmitted through the liquid crystal layer 25 is absorbed by the polarizing plate 23b on the observation side and is prevented from going outside, thereby displaying black. Is done. When an on-voltage is applied between the common electrode 32 and the pixel electrode 41, the change transmitted through the liquid crystal layer 25 is transmitted through the polarizing plate 23b on the observation side and emitted to the outside, and white display is performed.

  By controlling the black display and the white display in each sub-pixel P, an image is displayed in the image display region V of FIG. At this time, a desired full-color image can be displayed by appropriately controlling the transmitted light intensities of R, G, and B. In the present embodiment, the orientation of the liquid crystal molecules 25a in the horizontal plane of the substrate is controlled according to the electric field formed substantially parallel to the surfaces of the substrates 21 and 22 when controlling black display and white display. In the case of the vertical electric field system represented by the Nematic type, a wider viewing angle characteristic can be realized as compared with the case where the orientation of liquid crystal molecules is controlled in the vertical plane of the substrate.

  In FIG. 3, the first light transmissive substrate 21 a constituting the element substrate 21 has a protruding portion 20 that protrudes to the outside of the color filter substrate 22 that is a counter substrate. The driving IC 6 is mounted on the surface of the overhang portion 20 on the color filter substrate 22 side by COG (Chip On Glass) technology using, for example, ACF (Anisotropic Conductive Film) (not shown). Has been. The driving IC 6 drives the liquid crystal panel 2 by outputting scanning signals and data signals to the electrodes in the liquid crystal panel 2.

  A connection terminal (not shown) is provided at the end of the overhang portion 20, and the FPC board 7 is connected to the portion where the connection terminal is formed by a conductive connection method such as ACF, soldering, heat sealing, or the like. Has been. A plurality of wirings (not shown) extending from the connection terminals are formed on the liquid crystal layer side of the overhang portion 20 and extend toward the inside of the liquid crystal panel 2, that is, toward the liquid crystal layer. This wiring is connected to a wiring connected to the TFT element, that is, a source line or a gate line. The FPC board 7 will be described in detail later.

  The resin frame 4 is a frame that supports the liquid crystal panel 2 and the lighting device 3. The resin frame 4 is a frame having an opening 4a of a size capable of accommodating the liquid crystal panel 2 on the inside as viewed in a plan view from the arrow A side in FIG. As shown in FIG. 3, the resin frame 4 accommodates the liquid crystal panel 2 on the side where the arrow A is drawn (that is, the observation side) and illuminates the side where the arrow B is drawn (that is, the side opposite to the observation side). The apparatus 3 is accommodated. In FIG. 1, the resin frame 4 is provided with protrusions 51 at predetermined positions on the side surfaces of both side edges 4 b extending in the longitudinal direction (column direction) Y.

  In FIG. 3, the liquid crystal panel 2 and the resin frame 4, and the lighting device 3 and the resin frame 4 are bonded to each other by a double-sided tape 8 that is an adhesive member in the peripheral frame region, and are positioned within the opening 4 a of the resin frame 4. Supported by immobility. As the resin frame 4 supports the liquid crystal panel 2 and the lighting device 3 in this way, the liquid crystal panel 2 and the lighting device 3 can be installed in a predetermined positional relationship, and they are protected from an external impact or the like. it can. The resin frame 4 can be formed by molding using, for example, plastic.

  Next, as shown in FIG. 1, the metal frame 5 is formed in a frame shape having a size that can accommodate the resin frame 4 in a state of supporting the liquid crystal panel 2 and the illumination device 3 (see FIG. 3). The metal frame 5 is formed of a metal having conductivity, such as stainless steel. The metal frame 5 is provided so as to cover the outer periphery of the liquid crystal panel 2 on the display surface side (arrow A side). The metal frame 5 is provided with an opening 5a, and the display realized in the image display surface by the liquid crystal panel 2 can be viewed through the opening 5a. A plurality of connecting holes 52 are provided at predetermined positions on both sides 5 b extending in the longitudinal direction (column direction) Y of the metal frame 5. When the resin frame 4 is accommodated in the metal frame 5 as indicated by an arrow C, these connection holes 52 are fitted to the protruding pieces 51 of the resin frame 4 to connect the metal frame 5 and the resin frame 4. It is a hole for fixing.

  An open portion 53 is provided on the side 5 c extending in the short direction (row direction) X of the metal frame 5 on the side corresponding to the FPC board 7. The opening 53 is provided at a position corresponding to the driving IC 6, and is configured such that the driving IC 6 does not interfere with the metal frame 5 in the state of FIG. 2 in which the resin frame 4 is accommodated in the metal frame 5. . In addition, engagement pieces 54 each having an L-shaped cross section are provided at the side edges of the metal frame 5 in the vicinity of both end portions of the opening 53. That is, two engagement pieces 54 are provided, one on each of the left and right sides of the center position of the short side 5c of the metal frame 5 on the FPC board side. These engagement pieces 54 function as elements for coupling the metal frame 5 to the resin frame 4 and, in addition, contact terminals that contact a ground wiring (wiring connected to the ground potential) of the FPC board 7 described later. It is.

  As shown in FIG. 4B, the engaging piece 54 includes a base portion 54a extending downward from the side edge of the metal frame 5 in a right angle direction, and an engaging portion 54b formed by bending the tip of the base portion 54a at a right angle. It is constituted by. In FIG. 1, when the metal frame 5 and the resin frame 4 are combined as shown by an arrow C, a recess 60 is provided in advance in the resin frame 4 at a position corresponding to the engagement piece 54. When the metal frame 5 is assembled to the resin frame 4, the engaging piece 54 is accommodated in the recess 60 as shown in the partially enlarged view of FIG. 2. 4B, the engaging portion 54b is engaged with the back surface of the resin frame 4 and presses the resin frame 4 with its own elastic force. As will be described in detail later, the extending portion 7e of the FPC board 7 is also accommodated in the recess 60 of the resin frame 4, and the engaging portion 54b is in a state where the extending portion 7e is interposed. The depression 60 is pressed.

  Next, the FPC board 7 connected to the liquid crystal panel 2 will be described in detail. Note that the FPC board 7 shown in FIG. 3 is in a state of being bent into a predetermined state for constituting the liquid crystal device. In the following description, when the FPC board 7 connected to the liquid crystal panel 2 is in the unfolded state before being bent, the surface of the liquid crystal panel 2 that displays an image (hereinafter sometimes referred to as a display surface). The surface of the FPC board 7 on the same side as the first surface S1 is referred to as the first surface S1, and is on the same side as the surface opposite to the surface on which the image of the liquid crystal panel 2 is displayed (hereinafter sometimes referred to as a non-display surface). A surface of a certain FPC board 7 is referred to as a second surface S2.

  The first surface S1 and the second surface S2 referred to here indicate the respective surfaces when the FPC board 7 is connected to the liquid crystal panel 2 and is in an unfolded state. It does not change even after the FPC board 7 is bent. That is, the first surface S1 of the FPC board 7 in the unfolded state is the first surface S1 even when the FPC board 7 is bent and faces the non-display surface side.

  FIG. 5A shows a state in which the FPC board 7 of FIG. 3 is unfolded from the second surface S2 side corresponding to the non-display surface side of the liquid crystal panel 2. FIG. FIG. 5B shows a state where the input terminal portion of the FPC board 7 shown in the upper part of FIG. 5A is folded toward the second surface S2. 5A and 5B, the liquid crystal panel 2 and the illumination device 3 connected to the FPC board 7 are indicated by chain lines.

  As shown in FIG. 5 (a), the FPC board 7 of the present embodiment has a circuit component mounting portion 7a located substantially at the center portion of the main body portion, an input having a shape that protrudes to the side of the main body portion and is bent at a right angle. The terminal portion 7b for use, the panel connection portion 7c located at the left end of the main body portion, and the LED mounting portion 7d located at the opposite end of the panel connection portion 7c. At both end portions of the LED mounting portion 7d, extending portions 7e that project toward the main body portion are formed. All these parts are integrally formed of a single substrate material. The circuit component mounting portion 7a is an area for mounting a plurality of circuit components necessary for driving the liquid crystal panel 2, and such a plurality of circuit components 55 are mounted in the circuit component mounting portion 7a. Yes. In the circuit component mounting portion 7a, wirings that connect the circuit components 55 to form a circuit are formed by patterning. An input terminal 56 to which an output terminal of an external device (for example, a control circuit of an electronic device such as a mobile phone or a touch panel) is connected is formed at the tip of the input terminal portion 7b. A signal output from an external device connected to the input terminal 56 is input to the driving IC 6 of the liquid crystal panel 2 via the FPC board 7 and used for display on the liquid crystal panel 2.

  The panel connection portion 7c is provided with wirings (not shown) extending from the circuit component mounting portion 7a, and these wirings are conductively connected to the connection terminals of the liquid crystal panel 2. The LED 11 as a light source is mounted on the LED mounting portion 7d. An opening 57 is formed between the circuit component mounting portion 7a and the LED mounting portion 7d. Both the circuit component 55 and the LED 11 are mounted on the first surface S1 (the back surface in the drawing) of the FPC board 7 corresponding to the display surface side of the liquid crystal panel 2. That is, the circuit component 55 and the LED 11 are mounted on one side with respect to the FPC board 7. If a circuit component or the like is mounted on one side, the SMT (Surface Mount Technology) process may be performed once, which can contribute to cost reduction.

  A ground wiring 58 connected to the reference ground potential of the control circuit is formed on the first surface S1 or the second surface S2 of the FPC board 7. One of the ground wirings 58 is connected to the input terminal 56, and the other extends to the extending portion 7 e extending from the LED mounting region 7 d to be a ground terminal 59. The ground terminal 59 is a terminal formed on the surface of the extended portion 7e, for example, on the second surface S2, and is formed by patterning integrally with the ground wiring 58, for example. The ground wiring 58 is formed on the FPC board 7 in a predetermined pattern between the input terminal 56 and the ground terminal 59, in this embodiment in a pattern indicated by a broken line in FIG. . One side of the ground wiring 58 is connected to the ground terminal of the external device via the input terminal 56, and the other side is connected to the ITO film 24 (see FIG. 1) in the liquid crystal panel 2 via the ground terminal 59 as described later. Is done. The reason why the ITO film 24 is connected to the ground potential is to prevent the color filter substrate 22 from being charged.

  The FPC board 7 is brought into an assembled state shown in FIG. 1 by bending a necessary portion from the developed state of FIG. Specifically, first, the input terminal portion 7b of FIG. 5A is bent toward the front side of the paper along a portion indicated by line CC, which is a portion close to the base portion with the main body portion. Then, the input terminal 56 is inserted into the opening 57 from the second surface S2 side of the FPC board 7 and passed through the first surface S1 side, whereby the state shown in FIG. Then, by bending the FPC board 7 so that the second surfaces S2 face each other along the line DD, which is a line located substantially at the center of the main body portion, the bent FPC shown in FIGS. A substrate 7 is formed. This state is a state in which the resin frame 4 and the lighting device 3 are not assembled to the non-display surface side of the liquid crystal panel 2 in FIGS. 3 and 4A.

  Next, in FIG. 3, the resin frame 4 is assembled on the non-display surface side of the liquid crystal panel 2, and the illumination device 3 is assembled on the non-display surface side of the resin frame 4. At this time, the extension portion 7e for the ground terminal in FIG. 5A protrudes to the outside of the resin frame 4 at the recess 60 of the resin frame 4 as shown in FIG. 4A. Next, as shown by an arrow C in FIG. 1, the metal frame 5 is assembled to the resin frame 4, and the liquid crystal panel 2 and the lighting device 3 are accommodated by the metal frame 5. At this time, the engaging piece 54 of the metal frame 5 is stored in the recess 60 of the resin frame 4 as shown in FIG. Further, as shown in FIG. 4B, the engaging portion 54 b of the engaging piece 54 pushes the extending portion 7 e and bends it along the shape of the recess 60 of the resin frame 4. As a result, the engaging portion 54b presses the extending portion 7e against the resin frame 4 in the recess 60, and the flat portion of the ground terminal 59 on the extending portion 7e and the flat portion of the engaging portion 54b have a predetermined pressing force. Underneath each other in a planar manner. The pressing force at this time is determined by the elastic force of the engagement piece 54 and the resin frame 4.

Next, a connection structure between the ITO film 24 on the color filter side substrate 22a of FIG. 1 and the ground wiring 58 of the FPC substrate 7 of FIG. 5A will be described with reference to FIG. In the present embodiment, the ITO film 24 and the ground wiring 58 are conductively connected by the metal frame 5 having conductivity. First, ITO film 24 and the gold frame 5 is in contact with the portion indicated by the arrow _{C 1.} Specifically, the frame-shaped peripheral portion of the opening 5a of the metal frame 5 and the frame-shaped portion of the ITO film 24 exposed to the outside from the polarizing plate 23b are under the elastic force of the metal frame 5 itself. They are in direct contact with each other. The frame-like portion where the ITO film 24 is exposed is a portion indicated by oblique lines in FIG. 1, that is, a portion exposed from the entire outer periphery of the polarizing plate 23b. Therefore, the metal frame 5 and the ITO film 24 are in surface contact with each other over a wide area in the hatched portion. It is not necessary to provide a conductive connection member such as solder at the contact portion between the metal frame 5 and the ITO film 24, and the metal frame 5 is fitted and fixed to the resin frame 4 to fix the metal frame 5 and the ITO film 24. The contact state with is maintained. The metal frame 5 is thick enough to be elastically deformed. Therefore, if the metal frame 5 is designed to be combined when the metal frame 5 is pushed into the resin frame 4 slightly, the opening 5a of the metal frame 5 is provided. This frame-shaped peripheral portion can be reliably brought into contact with the frame-shaped peripheral portion of the ITO film 24.

Then, the metal frame 5 of the ground terminal 59 and FIG as a contact portion which is an end portion of the ground wiring 58 of the FPC substrate 7 of FIG. 5 (a) 4 (b) , a portion indicated by an arrow C ₂ engaged The engaging portion 54b of the joining piece 54 is in contact with the engaging portion of the resin frame recess 60. Specifically, the engaging portion 54b of the engaging piece 54 of the metal frame 5 and the ground terminal 59 are in direct contact with each other in the planar region, and electrical conduction is established. The ground terminals 59 are provided at two locations on both sides of the FPC board 7 as shown in the partially enlarged view of FIG. Two engaging pieces 54 are also provided corresponding to the position of the ground terminal 59. In this manner, the ground terminal 59 and the engagement piece 54 of the metal frame 5 come into contact with each other at two locations on one side of the resin frame 4, so that the ITO film 24 and the ground wiring 58 can be more reliably electrically connected. Can be contacted. For example, even if one of the two ground wirings 58 in FIG. 5A is broken or one of the two engaging pieces 54 of the metal frame 5 in FIG. A normal wiring system in which the continuity between the terminal 59 and the metal frame 5 is not damaged can be secured. Thereby, a so-called redundant design is realized. In particular, in this embodiment, since the conductive portions between the engagement pieces 54 and the ground terminals 59 are provided on both sides of the center line in the row direction X (center line extending in the column direction Y) of the liquid crystal panel 2, the liquid crystal panel Stable conduction is ensured even against an external force that twists 2.

  Further, the base material of the FPC board 7, such as polyimide, generates a reaction force that attempts to return to its original shape when bent. That is, an elastic force is generated to return in the direction of arrow F in FIG. For this reason, in the assembled state of the liquid crystal device, the ground terminal 59 is always applied in the direction indicated by the arrow F, that is, the direction pressed against the engaging portion 54b of the engaging piece 54 of the metal frame 5, so The contact state between the engagement piece 54 and the ground terminal 59 can always be maintained without using a material.

  By the way, in the liquid crystal device of this embodiment in the FFS mode, in FIG. 6, the pixel electrode 41 and the common electrode 32 that are electrodes constituting the subpixel P are provided on the common element substrate 21, and the color filter substrate 22 is provided. Are not provided with electrodes. For this reason, if no measures are taken, the color filter substrate 22 is charged by, for example, external static electricity. Then, an unnecessary electric field is generated between the element substrate 21 and the color filter substrate 22, and the liquid crystal molecules 25a of the liquid crystal layer 25 provided between the element substrate 21 and the color filter substrate 22 are affected by the electric field. As a result, there is a problem that the liquid crystal panel 2 cannot perform proper display.

  In order to solve this problem, in the conventional FFS mode liquid crystal device, as shown in FIG. 15, for example, a conductive film 204 is provided on the outer surface of the color filter substrate 202 in a planar shape (so-called solid shape). A configuration is adopted in which the substrate is prevented from being charged by conductively connecting 204 and the ground wiring using a molding material 205. However, the mold material 205 was originally a material that was not used as an element constituting the FFS mode liquid crystal device. Therefore, there is a problem that the number of manufacturing steps and the manufacturing cost increase by using the molding material 205.

In contrast, in the liquid crystal device of this embodiment, as shown in FIG. 4 (b), in contact with a portion part of the metal frame 5 is shown by ITO film 24 and the arrow C ₁ of the color filter substrate 22, the metal frame other portions of the 5 is configured to contact the portion indicated by the arrow C ₂ to the ground terminal 59 of the FPC board 7. That is, the ITO film 24 of the color filter substrate 22 and the ground terminal 59 of the FPC substrate 7 are conductively connected via the metal frame 5. Since the metal frame 5 is a member that is generally used as a component constituting the liquid crystal device, by using the metal frame 5 as a conductive connection element, without increasing the number of manufacturing steps and manufacturing cost of the liquid crystal device 1, The ITO film 24 and the ground wiring 58 (see FIG. 5A) of the FPC board 7 can be conducted. In this way, it is possible to prevent the color filter substrate 22 from being charged by external static electricity or the like. As a result, generation of an unnecessary electric field between the element substrate 21 and the color filter substrate 22 can be prevented, and display of the liquid crystal device can be prevented from becoming unstable. The conductive connection structure using the metal frame 5 can be realized very easily compared to the conductive connection structure using the mold material.

  In the above description, in FIG. 1, the recess 60 for accommodating the engagement piece 54 is provided in the side surface portion of the resin frame 4 at a position corresponding to the engagement piece 54 of the metal frame 5. The side surface portion of the resin frame 4 may be in a uniform flat state without any depressions. However, in this case, after the metal frame 5 is assembled to the resin frame 4, the engagement piece 54 may be displaced on the side surface of the resin frame 4. In order to suppress this shift, it is desirable that a recess 60 for accommodating the engagement piece 54 is provided on the side surface of the resin frame 4.

(Second Embodiment of Liquid Crystal Device)
Next, another embodiment of the liquid crystal device according to the present invention will be described. Since the overall configuration of the liquid crystal device of this embodiment can be substantially the same as that of the first embodiment shown in FIGS. 1 and 2, the overall configuration of this embodiment is not shown. . FIG. 8 shows a cross-sectional structure of the liquid crystal device according to the present embodiment, which corresponds to the cross-sectional structure of the Z _A -Z _A line portion of FIG. FIG. 9B corresponds to the cross-sectional structure of the Z _D -Z _D line portion of FIG. FIG. 9A shows the structure in the previous step in which the structure of FIG. 9B is formed. FIG. 10 is a plan view of the state in which the FPC board of FIG. 8 is unfolded as viewed from the image display surface side. In the present embodiment, the configuration of the FPC board is different from that of the first embodiment. Hereinafter, this embodiment will be described in detail with the difference and the center. 8, 9, and 10, the same components as those of the liquid crystal device 1 illustrated in FIG. 3 are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the configuration of the liquid crystal panel 2, the lighting device 3, the resin frame 4 and the metal frame 5 is the same as that of the embodiment of FIG. FPC substrate 67 of the present embodiment, as shown in plan view in FIG. 10, is formed in a symmetrical shape with respect to the center line L _C itself. PCT substrate 67 has a center line L _C of itself is connected to the liquid crystal panel 2 so as to substantially coincide with the center line extending in the column direction Y of the liquid crystal panel 2. The FPC board 67 has parts of a component mounting part 67a located at the center part, an input terminal part 67b located at the tip part, and a panel connection part 67c located at the tip of the side connected to the liquid crystal panel 2. is doing. At both ends of the component mounting portion 67a, extending portions 67e extending to the side opposite to the end connected to the liquid crystal panel 2 are provided. In the present embodiment, the LED 11 is mounted on the component mounting portion 67 a in the same manner as the circuit component 55 for driving the liquid crystal panel 2. The surface of the liquid crystal panel 2 shown in FIG. 10 is the surface on which the image is displayed (that is, the display surface), the surface of the FPC board 67 on the same side as the display surface is the first surface S1, and the back surface thereof. Is the second surface S2. Both the LED 11 and the circuit component 55 are mounted on the second surface S2. Also in this case, the LED 11 and the circuit component 55 are mounted on one side.

A ground terminal 69 is formed on the first surface S1 of each of the left and right extending portions 67e. These ground terminals 69 are provided on right and left sides in the boundary center line L _C. An input terminal 66 is provided on the second surface S2 of the input terminal portion 67b. Grant wiring 68 connecting the left and right ground terminals 69 and input terminals 66, respectively provided on the right and left sides in the boundary center line L _C. One of the ground wirings 68 is connected to a ground terminal of an external device through an input terminal 66, and the other is connected to an antistatic conductive film (described later) of the liquid crystal panel 2 through a ground terminal 69.

  The FPC board 67 is brought into the assembled state shown in FIG. 8 by bending necessary portions from the developed state shown in FIG. Specifically, first, in the portion E in the vicinity of the panel connection portion 67c in FIG. 10, the FPC board 67 is bent to the side opposite to the display surface side of the liquid crystal panel 2 as shown in FIG. Next, a portion F in the vicinity of the circuit component mounting portion 67a in FIG. 10 is bent so that the input terminal 66 protrudes outside the metal frame 5 as shown in FIG. At this time, the light emitting surface 11 a of the LED 11 is disposed at a position facing the light incident surface 12 a of the light guide 12. Next, the resin frame 4 is assembled on the non-display surface side of the liquid crystal panel 2, and the illumination device 3 is assembled on the resin frame 4 on the non-display surface side of the liquid crystal panel 2. At this time, as shown in FIG. 9A, the two left and right extending portions 67e in FIG. 10 are projected to the outside of the resin frame 4 by the action of its own elastic force at the recess 60 of the resin frame 4. It has become.

  Next, in FIG. 8, the metal frame 5 is fitted on the outside of the resin frame 4. At this time, as shown in FIG. 9B, the engaging portion 54 b of the engaging piece 54 of the metal frame 5 pushes the extending portion 67 e and bends it along the shape of the recess 60 of the resin frame 4. As a result, the engaging portion 54b presses the extending portion 67e against the resin frame 4 in the recess 60, and the flat portion of the ground terminal 69 and the flat portion of the engaging portion 54b on the extending portion 67e have a predetermined pressing force. Underneath each other in a planar manner. The pressing force at this time is determined by the elastic force of the engagement piece 54 and the resin frame 4.

In the liquid crystal device of the present embodiment, as shown in FIG. 9 (b), in contact with the frame-like portion in which a part of the metal frame 5 is shown by ITO film 24 and the arrow C ₁ of the color filter substrate 22, the metal frame 5 other portions of the configured to contact the portion indicated by the arrow C ₂ to the ground terminal 69 of the FPC board 67. That is, the ITO film 24 of the color filter substrate 22 and the ground terminal 69 of the FPC substrate 67 are conductively connected via the metal frame 5. Since the metal frame 5 is a member generally used as a component constituting the liquid crystal device, the use of the metal frame 5 as a conductive connecting element does not increase the number of manufacturing steps or the manufacturing cost of the liquid crystal device 1. The ITO film 24 and the ground wiring 68 (see FIG. 10) of the FPC board 67 can be connected. In this way, the color filter substrate 22 can be prevented from being charged by external static electricity or the like, and an unnecessary electric field can be prevented from being generated between the element substrate 21 and the color filter substrate 22. It is possible to prevent the display from becoming unstable. The conductive connection structure using the metal frame 5 is very easy compared to the conductive connection structure using the mold material.

(Third embodiment of liquid crystal device)
Next, still another embodiment of the liquid crystal device according to the present invention will be described. FIG. 11 shows an enlarged cross-sectional structure of the main part of the liquid crystal device of this embodiment. In FIG. 11, the same components as those of the liquid crystal device 1 according to the first embodiment shown in FIGS. 3 and 4 are denoted by the same reference numerals, and the description thereof is omitted.

  Since the overall configuration of the liquid crystal device of this embodiment can be substantially the same as that of the first embodiment shown in FIGS. 1 and 2, the overall configuration of this embodiment is not shown. . However, in the metal frame 5 used in the present embodiment, the engagement piece 54 has only the base portion 54a which is the first bent portion in FIG. 2 and does not have the engagement portion 54b which is the second bent portion. It has become. That is, the engaging piece 54 is a protruding piece simply bent at a right angle. On the side surface of the resin frame 4 at a position corresponding to the engagement piece 54, a recess for accommodating the engagement piece 54 may or may not be provided. Assume that the shape, circuit configuration, and wiring configuration of the FPC board 77 used in this embodiment are the same as those of the FPC board 67 used in the second embodiment shown in FIG.

  In the embodiment shown in FIG. 4B, the ground terminal 59 of the FPC board 7 is an engagement piece of the metal frame 5 on the side opposite to the display surface side of the resin frame 4 (that is, the side on which the arrow B is drawn). 54 is in contact with the engaging portion 54b. On the other hand, in the liquid crystal device of the present embodiment shown in FIG. 11, the ground terminal 69 of the FPC board 77 is in contact with the engagement piece 54 of the metal frame 5 on the side surface instead of the opposite surface of the resin frame 4. Yes. Also in this configuration, the ground terminal 69 and the engagement piece 54 of the metal frame 5 can directly contact each other in the surface area, and conduction between both can be ensured. In the present embodiment in which the ground terminal 69 and the metal frame 5 are electrically connected to each other at the side surface portion of the resin frame 4, the ground terminal 69 and the engagement piece 54 of the metal frame 5 are contacted with each other in a grounded manner. It is desirable to increase the area of the terminal 69. For example, the thickness of the entire module including the liquid crystal panel 2, the resin frame 4, and the metal frame 5 is preferably 1.5 mm or more.

(Fourth Embodiment of Liquid Crystal Device)
Next, still another embodiment of the liquid crystal device according to the present invention will be described. FIG. 12 shows an enlarged cross-sectional structure of the main part of the liquid crystal device of this embodiment. In the present embodiment, the configuration of the metal frame is mainly different from that of the first embodiment. Hereinafter, the liquid crystal device of this embodiment will be described in detail. In FIG. 12, the same components as those of the liquid crystal device 1 shown in FIGS. 3 and 4B are denoted by the same reference numerals, and description thereof will be omitted.

In the embodiment shown in FIG. 4B, the ground terminal 59 of the FPC board 7 wraps around on the side opposite to the display surface side of the resin frame 4, and the ground terminal 59 and the metal frame 5 on the side opposite to the display surface side. The engaging portion 54 is in contact. In contrast, in the present embodiment, as shown in FIG. 12, the metal frame 85 is in contact image display surface side of the liquid crystal panel 2, that is, in the portion indicated by an arrow C ₃ of the first surface S1 side of the FPC board 87 . According to the configuration of the present embodiment, the ground terminals 59 and 69 such as the extending portion 7e of the FPC board 7 in FIGS. 5A and 5B and the extending portion 67e of the FPC board 67 in FIG. Therefore, the shape of the FPC board 87 can be simplified. In the contact portion indicated by an arrow C _3, FPC board 87 might often not supported by the resin frame. Therefore, there may be a case where sufficient pressing force cannot be secured between the metal frame 85 and the FPC board 87 by bending the FPC board 87 in the direction of arrow G (downward in the figure). In such a case, it is desirable that the contact portion (arrow C ₃ ) between the metal frame 85 and the FPC board 87 is conductively bonded with, for example, a conductive adhesive or conductively connected with a conductive connecting member such as solder.

(Other embodiments)
The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications can be made within the scope of the invention described in the claims.
For example, in each of the above embodiments, the ITO film 24 is provided as an antistatic conductive layer provided on the image display surface side of the color filter substrate 22 of FIG. It can replace with this structure and can form the polarizing plate 23b with the polarizing plate provided with electroconductivity, and can use this polarizing plate as a conductive layer for antistatic. With this configuration, the ITO film as a part can be omitted, and the cost can be reduced.

  In each of the above embodiments, the FFS mode is exemplified as the operation mode of the liquid crystal panel. However, if the liquid crystal panel has a configuration in which the pixel electrode and the common electrode are provided on the element substrate and the electrode is not provided on the color filter substrate, the FFS mode is used. It is not limited to the mode. For example, the IPS mode can be adopted as the operation mode. As shown in FIG. 6, in the case of the FFS mode, the pixel electrode 41 and the common electrode 32 have portions that overlap each other in plan view from the direction of the arrow A, but in the IPS mode, the pixel electrode and the common electrode are planar. It has a structure that does not overlap visually.

  In each of the above embodiments, a transmissive liquid crystal panel has been exemplified. However, the present invention can be applied to a reflective liquid crystal panel and a reflective transflective liquid crystal panel other than the transmissive liquid crystal panel. In the above embodiment, a liquid crystal device using a three-terminal TFT element as an example of the switching element is illustrated. However, the present invention is applied to a liquid crystal device using a two-terminal TFD (Thin Film Diode) element instead. It can also be applied.

(First Embodiment of Electronic Device)
Next, an embodiment of an electronic device according to the present invention will be described. In addition, this embodiment shows an example of this invention and this invention is not limited to this embodiment. FIG. 13 shows an embodiment of an electronic apparatus according to the invention. The electronic device shown here includes a liquid crystal device 101 and a control circuit 102 that controls the liquid crystal device 101. The liquid crystal device 101 includes a liquid crystal panel 103 and a drive circuit 104. The control circuit 102 includes a display information output source 105, a display information processing circuit 106, a power supply circuit 107, and a timing generator 108.

  The display information output source 105 includes a memory such as a RAM (Random Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and various clock signals generated by the timing generator 108. The display information processing circuit 106 is supplied with display information such as a predetermined format image signal.

  The display information processing circuit 106 includes a number of well-known circuits such as an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, a clamp circuit, and the like, executes processing of input display information, and converts an image signal into a clock signal CLK. At the same time, it is supplied to the drive circuit 104. Here, the drive circuit 104 is a generic term for an inspection circuit and the like together with a scanning line drive circuit and a data line drive circuit. The power supply circuit 107 supplies a predetermined power supply voltage to each of the above components.

  The liquid crystal device 101 is configured using, for example, the FFS mode liquid crystal device 1 shown in FIG. According to this liquid crystal device 1, in FIG. 4B, the peripheral frame-like portion of the opening 5a of the metal frame 5 is in contact with the ITO film 24 of the color filter substrate 22 in the frame-shaped surface region. Since the combined piece 54 is configured to come into contact with the ground terminal 59 of the FPC board 7 in a planar shape, the ITO film 24 and the ground wiring 58 of the FPC board 7 (FIG. 5) without increasing the number of manufacturing steps and the manufacturing cost of the liquid crystal device 1. (See (a)) can be conductively connected, the color filter substrate 22 can be prevented from being charged, and the display of the liquid crystal device can be prevented from becoming unstable. Therefore, even in the electronic apparatus of this embodiment using the liquid crystal device 1, it is possible to prevent the display from becoming unstable due to the influence of external static electricity or the like. Moreover, the configuration for that is very simple.

(Second Embodiment of Electronic Device)
FIG. 14 shows a mobile phone which is another embodiment of the electronic apparatus according to the invention. A cellular phone 110 shown here includes a main body 111 and a display body 112 that can be opened and closed with respect to the main body 111. The display unit 112 is provided with a display device 113 and a receiver 114. Various displays relating to telephone communication are displayed on the display screen 115 of the display device 113. A control unit for controlling the operation of the display device 113 is stored inside the main body unit 111 or the display body unit 112 as a part of the control unit that controls the entire mobile phone or separately from the control unit. The The main body 111 is provided with an operation button 116 and a transmitter 117.

  The display device 113 is configured using, for example, the FFS mode liquid crystal device 1 shown in FIG. According to this liquid crystal device 1, in FIG. 4B, the peripheral frame-like portion of the opening 5a of the metal frame 5 is in contact with the ITO film 24 of the color filter substrate 22 in the frame-shaped surface region. Since the combined piece 54 is configured to come into contact with the ground terminal 59 of the FPC board 7 in a planar shape, the ITO film 24 and the ground wiring 58 of the FPC board 7 (FIG. 5) without increasing the number of manufacturing steps and the manufacturing cost of the liquid crystal device 1. (See (a)) can be conductively connected, the color filter substrate 22 can be prevented from being charged, and the display of the liquid crystal device can be prevented from becoming unstable. Therefore, even in the electronic apparatus of this embodiment using the liquid crystal device 1, it is possible to prevent the display from becoming unstable due to the influence of external static electricity or the like. Moreover, the configuration for that is very simple.

The electronic device of the present invention has been described with reference to the preferred embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made within the scope of the invention described in the claims.
For example, the present invention is not limited to a mobile phone, but a personal computer, a liquid crystal television, a viewfinder type or a monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone device, The present invention can be applied to various electronic devices such as a POS terminal, a digital still camera, and an electronic book.

1 is an exploded perspective view showing an embodiment of a liquid crystal device according to the present invention. It is the perspective view at the time of inverting the liquid crystal device of FIG. 1 and seeing from the back side, and the elements on larger scale of the principal part. It is a sectional view of a liquid crystal device in accordance with the _Z A -Z _A line of FIG. It is a sectional view taken along Z _D -Z _D line in FIG. 1, (b) is after completion of the liquid crystal device state, shows (a) the pre-completed state. It is a top view of an FPC board, (a) shows the state where the FPC board was developed, and (b) shows the state where the input terminal part was bent. It is sectional drawing which shows the internal structure of a liquid crystal panel. FIG. 7 is a plan view of an element substrate viewed from the direction of arrow A in FIG. 6. It is sectional drawing which shows other embodiment of the liquid crystal device which concerns on this invention. FIG. 9 is an enlarged cross-sectional view illustrating a main part of the liquid crystal device in FIG. 8, (b) shows a state after completion of the liquid crystal device, and (a) shows a state before completion. It is a top view which shows the FPC board | substrate used with the liquid crystal device of FIG. It is sectional drawing which shows the principal part of other embodiment of the liquid crystal device which concerns on this invention. It is sectional drawing which shows the principal part of other embodiment of the liquid crystal device which concerns on this invention. It is a circuit block diagram which shows one Embodiment of the electronic device which concerns on this invention. It is a perspective view which shows the mobile telephone which is other Embodiment of the electronic device which concerns on this invention. It is sectional drawing which shows the principal part of an example of the conventional liquid crystal device.

Explanation of symbols

1. 1. liquid crystal device 2. Liquid crystal panel 3. lighting device; Resin frame,
5,85. Gold frame (conductive frame), 5a. Opening, 6. Driving IC,
7, 67, 77, 87. 10. FPC board (flexible board), LED, 12. Light guide,
13. 14. light reflecting film; Light diffusion sheet, 15a, 15b. Lens sheet,
20. 20. Overhang part Element substrate (first substrate), 21a. A first translucent substrate,
22. Color filter substrate (second substrate), 22a. A second translucent substrate,
23a, 23b. Polarizing plate, 24. ITO film (conductive layer), 25. Liquid crystal layer,
25a. Liquid crystal molecules, 30. Gate line (scanning line), 30a. Gate electrode,
31. Common line, 32. Common electrode, 33. Gate insulation film,
34. Source line (data line), 36. TFT element 37. Semiconductor film,
38. Source electrode, 39. Drain electrode, 40. Passivation film,
41. Pixel electrode, 42. Alignment film, 43. Through hole, 45. gap,
46. Colored film, 47. Light shielding film, 48. Overcoat layer, 49. Alignment film,
51. Protrusion, 52. Connecting hole, 53. Open part, 54. Engagement piece (contact terminal),
55. Circuit components 56, 66. 57. input terminal Opening, 58. Ground wiring,
59, 69. 101. ground terminal (contact portion) Liquid crystal device, 102. Control circuit,
103. Liquid crystal panel, 104. Drive circuit, 110. Mobile phones (electronic devices),
111. Body part, 112. Display body part, 113. Display device (liquid crystal device),
G. Cell gap, P.I. Sub-pixels, V. Image display area

Claims (10)

A first substrate and a second substrate facing each other across a liquid crystal layer;
A common electrode that forms an electric field between the pixel electrode provided on the liquid crystal layer side of the first substrate and the pixel electrode;
A conductive layer provided on the opposite side of the second substrate from the liquid crystal layer;
A flexible substrate connected to the first substrate and provided with a ground wiring;
A conductive frame containing the first substrate and the second substrate,
A part of the conductive frame is in contact with the conductive layer, and the other part of the conductive frame is in contact with a contact portion of a ground wiring of the flexible substrate. The liquid crystal device according to claim 1.
The liquid crystal device, wherein the conductive frame and the contact portion of the ground wiring are in contact with each other at a plurality of locations. The liquid crystal device according to claim 1 or 2,
A resin frame accommodated in the conductive frame;
The liquid crystal device according to claim 1, wherein the contact portion of the ground wiring is in contact with the conductive frame while being sandwiched between the resin frame and the conductive frame. The liquid crystal device according to claim 3.
The first substrate and the second substrate are disposed between the resin frame and the conductive frame,
The conductive frame is provided with an engagement piece that engages with the resin frame,
The engagement piece has a base portion extending from the conductive frame and an engagement portion extending bent from the base portion,
The engaging portion engages with the resin frame with the contact portion of the ground wiring interposed between the surface of the resin frame opposite to the side on which the first substrate and the second substrate are accommodated. Liquid crystal device. The liquid crystal device according to claim 1, wherein:
The conductive layer has translucency,
The conductive layer is provided in a planar shape in a region covering at least the image display region on the surface of the second substrate,
The liquid crystal device according to claim 1, wherein the planar portion of the conductive frame and the planar portion of the conductive layer are in contact with each other in a plane region.   6. The liquid crystal device according to claim 1, wherein the conductive layer provided on the second substrate is an indium tin oxide film.   6. The liquid crystal device according to claim 1, wherein the conductive layer provided on the second substrate is a polarizing layer having a transmission axis that selectively transmits polarized light modulated by the liquid crystal layer. A characteristic liquid crystal device. The liquid crystal device according to any one of claims 1 to 7,
At least one optical sheet is provided on the conductive layer,
The conductive layer is exposed from the outer edge of the optical sheet to the outside of the optical sheet,
The liquid crystal device, wherein the conductive layer is in contact with a planar portion of the conductive frame in a planar area at a planar portion exposed to the outside of the optical sheet. The liquid crystal device according to any one of claims 1 to 8,
The conductive frame has four sides surrounding the image display area,
The liquid crystal device, wherein the conductive layer is in contact with a surface of the four sides of the conductive frame facing the second substrate in a surface region.   An electronic apparatus comprising the liquid crystal device according to claim 1.

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