JP2009027741A - Antenna-mounted communication ic unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accomplish an antenna-mounted communication IC unit C. <P>SOLUTION: A multilayered antenna A is formed by combining a base 11, a first coil 21 formed on the base 11, and a second coil 22 layered on the first coil 21 via an insulating film 12. The multilayered antenna A easily achieves required high inductance by reducing a pattern size and is integrally bonded with a communication IC module B to form the communication IC unit C. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an antenna-mounted communication IC unit that can be particularly suitably used for a small portable communication terminal, a non-contact IC card, and the like.

  Small portable communication terminals, non-contact type IC cards, and the like have built-in antennas that match the operating frequency.

  A conventional antenna is formed as a two-dimensional coil on a suitable flat substrate, and when combined with an IC module for communication, receives incoming radio waves from outside and supplies operating power to the IC module. Or transmitting / receiving radio waves for information transmission to / from external devices.

  In such a conventional technique, since the antenna is simply formed in two dimensions, it is difficult to realize a necessary high inductance by sufficiently reducing the pattern size, and circuit design is often difficult. However, there is a problem that it is extremely difficult to downsize by mounting it integrally on an IC module for communication.

  Therefore, in view of the problems of the prior art, an object of the present invention is to sufficiently reduce the pattern size by laminating the second coil via the insulating film on the first coil formed on the substrate. Another object of the present invention is to provide an antenna-mounted communication IC unit that realizes a required high inductance and can be easily mounted on a communication IC module.

  In order to achieve the above object, the configuration of the first invention according to this application (referred to as the invention according to claim 1, the same applies hereinafter) includes a communication IC module and a multilayer antenna that is superposed on the IC module and joined together. The multilayer antenna has the same external dimensions as the IC module, and is laminated on the first coil via the base material, the first coil formed on the base material, and the insulating film. 2 and a protective film for protecting the second coil, and the first and second coils are respectively formed in a spiral on the base material and the insulating film so that the magnetic flux generation directions are the same. The gist is to connect them in series and connect them to the IC module by drawing them out to the terminals on the protective film.

  The configuration of the second invention (referring to the invention according to claim 2, hereinafter the same) includes an IC module for communication and a multilayer antenna that is overlapped and integrally joined with the IC module. The module and the outer dimensions are standardized, and includes a base material, a first coil formed on the base material, and a second coil laminated on the first coil via an insulating film. The two coils are spirally formed on the base material and the insulating film so that the directions of magnetic flux generation are the same, connected in series, and drawn out to the terminals on the lower surface of the substrate and connected to the IC module. And

  In the first and second inventions, the insulating film and the second coil can be formed by stacking two or more layers on the first coil.

  The first and second coils may be connected in series via a plurality of via holes connected in parallel to each other on the protective film or the insulating film, and the via holes are joined to the corresponding lands on the insulating film or the base material. May be.

  According to the configuration of the first invention and the second invention, the first coil of the multilayer antenna is formed on the base material, and the second coil is laminated on the first coil via the insulating film. Yes. Therefore, the first and second coils are spirally formed on the base material and the insulating film so that the magnetic flux is generated in the same direction, and connected in series, thereby sufficiently reducing the pattern size. As a whole, the required high inductance can be easily realized. That is, since the first and second coils can be operated as an integrated coil, the required high inductance can be easily realized by minimizing the pattern size and can be easily mounted on a communication IC module. it can. Further, by integrally joining the multilayer antenna to the communication IC module, an antenna-mounted communication IC unit can be easily realized.

  In addition to any plastic resin including epoxy resin and polyimide resin, the substrate can be ceramics, insulating plates such as mica and glass, insulating films, insulating sheets, insulating films, etc. A flexible polyimide resin film is particularly preferable from the viewpoints of characteristics, bondability to an IC module, and the like. Further, the insulating film can be formed as an insulating resist film by a method such as printing or coating using an arbitrary photoresist material, for example, a polyimide resin-based photoresist material. However, both the base material and the insulating film may be insulating resist films having the same specifications.

  The first and second coils can be formed of any conductive material including a metal by a technique such as plating, printing, etching, and vapor deposition on the base material and the insulating film, respectively. In addition, the reliability of a connection part can be improved by connecting in series via the via hole (via hole) which makes a 1st, 2nd coil parallel and forms the insulating film so that it may penetrate.

  When two or more layers of insulating films and the second coil are formed on the first coil, the first and second coils as a whole can further reduce the pattern size to obtain the required high inductance. it can.

  By protecting the uppermost second coil through a protective film, disconnection due to mechanical damage, deterioration due to oxidation, insulation deterioration due to humidity, and the like can be effectively prevented. In addition, the protective film can use the insulating film equivalent to a base material and an insulating film, or an insulating resist film.

  The IC module may be bonded to the lower surface of the lowermost base material of the multilayer antenna, or may be bonded to the uppermost second coil via an appropriate insulating film or insulating protective film. . At this time, it is preferable that the terminals of the multilayer antenna are drawn out on the lower surface of the base material or on the uppermost insulating film or protective film and directly joined to the terminals of the IC module.

  An antenna-mounted communication IC unit is formed on the wafer at once by integrally bonding a wafer on which a plurality of communication IC modules are arranged and an antenna sheet on which a plurality of multilayer antennas are arranged. The wafer can be easily mass-produced by dicing the wafer together with the antenna sheet for each IC module. Dicing refers to dividing a wafer into IC modules and cutting them.

  However, if the antenna sheet is formed on the wafer, the IC module manufacturing process and the multilayer antenna manufacturing process can be continued, and if the antenna sheet is formed separately from the wafer, both manufacturing processes are paralleled. Can proceed simultaneously.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The multilayer antenna A includes a base material 11, a first coil 21 formed on the base material 11, and a second coil 22 stacked on the first coil 21 with the insulating film 12 interposed therebetween ( FIG. 1, FIG. 2).

  The base material 11 and the insulating film 12 have a space region K set in the center thereof, and the first and second coils 21 and 22 are respectively formed on the base material 11 and the insulating film 12 in the space region K. It is formed in a spiral around. However, the second coil 22 has a smaller number of turns than the first coil 21 and is formed in a small pattern size. The second coil 22 is protected via a protective film 13 laminated on the insulating film 12, and terminals A 1 and A 2 of the multilayer antenna A are formed on the protective film 13.

  The terminal A1 is connected to the substrate 11 via the plurality of via holes 33a, 33a... On the protective film 13, the lands 34a on the insulating film 12 connected to each other, the plurality of via holes 34b, 34b. It is connected to the outer peripheral end of the upper first coil 21. The first coil 21 is formed clockwise inward from the outer peripheral end, and the inner peripheral end is formed on the insulating film 12 via the land 31b on the substrate 11 and the plurality of via holes 32a, 32a. Is connected to the inner peripheral end of the second coil 22. The second coil 22 is formed clockwise from the inner peripheral end to the outer side, and the outer peripheral end is connected to the terminal A2 via the land 32b on the insulating film 12 and the plurality of via holes 33b, 33b. It is connected to the. That is, the first and second coils 21 and 22 are connected in series so that the magnetic flux generated by the common current is generated in the same direction.

  The via holes 33a, 33a ..., 34b, 34b ..., 32a, 32a ..., 33b, 33b,. They are joined (FIG. 3). However, FIG. 3 shows a combination of via holes 32a, 32a...

  The multilayer antenna A can be operated as an antenna that receives incoming radio waves from the outside and transmits transmission radio waves to the outside by connecting to the communication IC module B via the terminals A1 and A2 (FIG. 1). it can. At this time, the resonance capacitance combined with the multilayer antenna A can use only the equivalent capacitance in the IC module B by sufficiently increasing the inductance of the multilayer antenna A, and there is no need to provide an external capacitor. . It should be noted that the outer dimensions of the multilayer antenna A are preferably set to the same as that of the IC module B and set to the minimum.

  In the above description, the number of turns and pattern size of the second coil 22, the insulating film 12 stacked on the first coil 21, and the number of stacked layers of the second coil 22 are the total requirements with the first coil 21. The setting can be changed as appropriate according to the inductance. That is, the insulating film 12 and the second coil 22 may be laminated in a multilayer of two or more layers on the base material 11 and the first coil 11. The winding direction and connection form of the first and second coils 21 and 22 may be any form other than that shown in the drawing as long as the magnetic flux generation direction from the first and second coils 21 and 22 is the same direction. You may change to

  Note that the multi-layer antenna A may be disposed sufficiently separated from the IC module B regardless of FIG. 1 and electrically connected to each other via an appropriate conductor.

Other embodiments

  The multilayer antenna A can be formed in the same size as the communication IC module B, and can be integrally joined to the IC module B to form an antenna-mounted communication IC unit C (FIG. 1). The IC module B is fixed on the protective film 13 with an anisotropic conductive adhesive, solder, or the like, and is electrically connected to the terminals A1 and A2. However, the terminals A1 and A2 on the protective film 13 are arranged in accordance with the terminal arrangement of the IC module B. In FIG. 1, the terminals A 1 and A 2 may be formed on the lower surface of the base material 11, and the IC module B may be bonded to the lower surface side of the base material 11.

  The communication IC unit C is mass-produced at once by integrally joining a wafer W on which a plurality of IC modules B, B... Are regularly arranged and an antenna sheet AS on which a plurality of multilayer antennas A, A. (FIG. 4). However, FIG. 4B is a cross-sectional view corresponding to the arrowed line YY in FIG.

  The antenna sheet AS is arranged with the multilayer antennas A, A... Of FIG. 1, and is manufactured, for example, according to the manufacturing process of FIG. That is, a plurality of first coils 21, 21... Are formed on the substrate 11 in accordance with the arrangement of the IC modules B, B... On the wafer W, and the first coils 21, 21. An insulating film 12 made of an insulating resist film is formed, and second coils 22, 22... Are formed on the insulating film 12 so as to correspond to the first coils 21, 21. Next, a protective film 13 is formed on the second coils 22, 22... And terminals A 1, A 1, A 2, A 2... Are formed on the protective film 13 corresponding to the second coils 22, 22. Thus, the antenna sheet AS is completed. However, the lands 31a, 31b on the substrate 11, the via holes 32a, 32a ..., 34b, 34b ..., the lands 32b, 34a on the insulating film 12, and the via holes 33a, 33a ..., 33b, 33b ... Each of them is formed together with the first coil 21, the second coil 22, and the terminals A1 and A2.

  The antenna sheet AS thus formed separately from the wafer W is bonded to the wafer W via, for example, an anisotropic conductive adhesive (FIG. 4B), and each multilayer is connected via the terminals A1 and A2. The communication IC units C, C... Can be formed on the wafer W by electrically connecting the antenna A and the IC module B. In this case, the antenna sheet AS is bonded to the wafer W at the protective film 13 and the terminals A1, A1,..., A2, A2,. Therefore, the antenna sheet AS and the wafer W can be diced for each of the IC modules B, B... To mass-produce the antenna-mounted communication IC units C, C.

  The antenna sheet AS may be directly formed on the wafer W on which the IC modules B, B. That is, the base material 11 is formed on the wafer W, and the first coils 21 are arranged on the base material 11 so as to correspond to the IC modules B, B. 11 are formed to form via-hole terminals A1, A1,..., A2, A2,. Thereafter, the insulating film 12, the second coils 22, 22,..., And the protective film 13 may be laminated in order on the first coils 21, 21,. Each multilayer antenna A in the antenna sheet AS can be connected to a corresponding IC module B in the wafer W via via-hole terminals A1 and A2 on the substrate 11.

  Such an antenna-mounted communication IC unit C has the same pattern size as that of the IC module B of the multilayer antenna A, and can be compactly incorporated into a small portable communication terminal, IC card or the like.

  In the above description, the inductance of the first and second coils 21 and 22 is further increased by means of mixing and embedding a high magnetic material such as ferrite in the base material 11 and the insulating film 12, respectively. Can do.

Exploded perspective view of multilayer antenna Equivalent circuit diagram of multilayer antenna 1 is an enlarged sectional view corresponding to the line XX in FIG. Manufacturing process explanatory drawing (1) Manufacturing process explanatory diagram (2)

Explanation of symbols

A ... Multilayer antenna B ... IC module C ... Communication IC unit 11 ... Substrate 12 ... Insulating film 13 ... Protective film 21 ... First coil 22 ... Second coil 31a, 31b, 32b, 34a ... Land 32a, 33a , 33b, 34b ... via hole

Patent Applicant FCE Co., Ltd.
Attorney Tadaaki Matsuda, Attorney

Claims (5)

  A communication IC module; and a multilayer antenna that is overlapped and integrally joined with the IC module. The multilayer antenna has the same external dimensions as the IC module, a base material, and the base material. A first coil formed on the first coil, a second coil laminated on the first coil via an insulating film, and a protective film for protecting the second coil, the first and second The coils are spirally formed on the base material and the insulating film so as to have the same magnetic flux generation direction, connected in series, and drawn out to terminals on the protective film and connected to the IC module. An antenna-mounted communication IC unit.   A communication IC module; and a multilayer antenna that is overlapped and integrally joined with the IC module. The multilayer antenna has the same external dimensions as the IC module, a base material, and the base material. A first coil formed on the first coil and a second coil stacked on the first coil via an insulating film, wherein the first and second coils have the same direction of magnetic flux generation. The antenna-mounted communication IC unit is formed in a spiral form on the base material and the insulating film, connected in series, and pulled out to a terminal on the lower surface of the substrate and connected to the IC module.   3. The antenna-mounted communication IC unit according to claim 1, wherein the insulating film and the second coil have two or more layers stacked on the first coil. 4.   4. The antenna according to claim 1, wherein the first and second coils are connected in series via a plurality of via holes connected in parallel to each other on the protective film or the insulating film. Built-in communication IC unit.   5. The antenna-mounted communication IC unit according to claim 4, wherein the via hole is joined to a corresponding land on the insulating film or the base material.

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