JP4214542B2 - Method for manufacturing antenna-mounted communication IC unit - Google Patents

Description

[0001]
The present invention relates to a method for manufacturing an antenna-mounted communication IC unit that can be particularly suitably used for a small portable communication terminal, a non-contact IC card, and the like.
[0002]
[Prior art]
Small portable communication terminals, non-contact type IC cards, and the like have built-in antennas that match the operating frequency.
[0003]
A conventional antenna is formed as a two-dimensional coil on a suitable flat substrate, and when combined with an IC module for communication, receives incoming radio waves from outside and supplies operating power to the IC module. Or transmitting / receiving radio waves for information transmission to / from external devices.
[0004]
[Problems to be solved by the invention]
In such a conventional technique, since the antenna is simply formed in two dimensions, it is difficult to realize a necessary high inductance by sufficiently reducing the pattern size, and circuit design is often difficult. However, there is a problem that it is extremely difficult to downsize by mounting it integrally on an IC module for communication.
[0005]
Therefore, in view of the problems of the prior art, an object of the present invention is to sufficiently reduce the pattern size by laminating the second coil via the insulating film on the first coil formed on the substrate. Another object of the present invention is to provide a method for manufacturing an antenna-mounted communication IC unit that realizes a necessary high inductance and can be easily mounted on a communication IC module.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the structure of the present invention includes a wafer in which a plurality of IC modules for communication are regularly arranged, and an antenna sheet in which a plurality of multilayer antennas are arranged so as to correspond to each IC module on the wafer. Are integrated, and the wafer is diced together with the antenna sheet for each IC module, the antenna mounting communication IC unit manufacturing method, each multilayer antenna of the antenna sheet, A first coil formed on the substrate and a second coil stacked on the first coil via an insulating film are provided, and the first and second coils have the same magnetic flux generation direction. Thus, the gist is to form a spiral on the base material and the insulating film and connect them in series.
[0011]
Note that the antenna sheet may be formed on the wafer, formed separately from the wafer, and bonded to the wafer.
[0012]
[Action]
According to the configuration of the invention, the first coil of each multilayer antenna is formed on the base material, and the second coil is laminated on the first coil via the insulating film. Therefore, the first and second coils are spirally formed on the base material and the insulating film so that the magnetic flux is generated in the same direction, and connected in series, thereby sufficiently reducing the pattern size. As a whole, the required high inductance can be easily realized.
[0013]
In addition to any plastic resin including epoxy resin and polyimide resin, the substrate can be ceramics, insulating plates such as mica and glass, insulating films, insulating sheets, insulating films, etc. A flexible polyimide resin film is particularly preferable from the viewpoints of characteristics, bondability to an IC module, and the like. Further, the insulating film can be formed as an insulating resist film by a method such as printing or coating using an arbitrary photoresist material, for example, a polyimide resin-based photoresist material. However, both the base material and the insulating film may be insulating resist films having the same specifications.
[0014]
The first and second coils can be formed of any conductive material including a metal by a technique such as plating, printing, etching, and vapor deposition on the base material and the insulating film, respectively. In addition, the reliability of a connection part can be improved by connecting in series via the via hole (via hole) which makes a 1st, 2nd coil parallel and forms the insulating film so that it may penetrate.
[0015]
The first and second coils can be formed around the space region set in the center of the base material and the insulating film, respectively, so that the effective opening area can be maximized and the operation efficiency as an antenna can be improved.
[0016]
When two or more layers of insulating films and the second coil are formed on the first coil, the first and second coils as a whole can further reduce the pattern size to obtain the required high inductance. it can.
[0017]
By protecting the uppermost second coil through a protective film, disconnection due to mechanical damage, deterioration due to oxidation, insulation deterioration due to humidity, and the like can be effectively prevented. In addition, the protective film can use the insulating film equivalent to a base material and an insulating film, or an insulating resist film.
[0018]
An antenna-mounted communication IC unit can be easily realized by integrally joining a multilayer antenna to a communication IC module. The IC module may be bonded to the lower surface of the lowermost base material of the multilayer antenna, or may be bonded to the uppermost second coil via an appropriate insulating film or insulating protective film. . At this time, it is preferable that the terminals of the multilayer antenna are drawn out on the lower surface of the base material or on the uppermost insulating film or protective film and directly joined to the terminals of the IC module.
[0019]
A plurality of antenna-mounted communication IC units can be formed on the wafer at once by integrally bonding a wafer on which a plurality of communication IC modules are arranged and an antenna sheet on which a plurality of multilayer antennas are arranged. By dicing the wafer together with the antenna sheet for each IC module, the communication IC unit can be easily mass-produced. Dicing refers to dividing a wafer into IC modules and cutting them.
[0020]
When the antenna sheet is formed on the wafer, the manufacturing process of the IC module and the manufacturing process of the multilayer antenna can be continued. If the antenna sheet is formed separately from the wafer, both manufacturing processes are performed in parallel. Can proceed simultaneously.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
The multilayer antenna A includes a base material 11, a first coil 21 formed on the base material 11, and a second coil 22 stacked on the first coil 21 with the insulating film 12 interposed therebetween ( FIG. 1, FIG. 2).
[0023]
The base material 11 and the insulating film 12 have a space region K set in the center thereof, and the first and second coils 21 and 22 are respectively formed on the base material 11 and the insulating film 12 in the space region K. It is formed in a spiral around. However, the second coil 22 has a smaller number of turns than the first coil 21 and is formed in a small pattern size. The second coil 22 is protected via a protective film 13 laminated on the insulating film 12, and terminals A 1 and A 2 of the multilayer antenna A are formed on the protective film 13.
[0024]
The terminal A1 is connected to the substrate 11 via the plurality of via holes 33a, 33a... On the protective film 13, the lands 34a on the insulating film 12 connected to each other, the plurality of via holes 34b, 34b. It is connected to the outer peripheral end of the upper first coil 21. The first coil 21 is formed clockwise inward from the outer peripheral end, and the inner peripheral end is formed on the insulating film 12 via the land 31b on the substrate 11 and the plurality of via holes 32a, 32a. Is connected to the inner peripheral end of the second coil 22. The second coil 22 is formed clockwise from the inner peripheral end to the outer side, and the outer peripheral end is connected to the terminal A2 via the land 32b on the insulating film 12 and the plurality of via holes 33b, 33b. It is connected to the. That is, the first and second coils 21 and 22 are connected in series so that the magnetic flux generated by the common current is generated in the same direction.
[0025]
The via holes 33a, 33a ..., 34b, 34b ..., 32a, 32a ..., 33b, 33b,. They are joined (FIG. 3). However, FIG. 3 shows a combination of via holes 32a, 32a...
[0026]
The multilayer antenna A can be operated as an antenna that receives incoming radio waves from the outside and transmits transmission radio waves to the outside by connecting to the communication IC module B via the terminals A1 and A2 (FIG. 1). it can. At this time, the resonance capacitance combined with the multilayer antenna A can use only the equivalent capacitance in the IC module B by sufficiently increasing the inductance of the multilayer antenna A, and there is no need to provide an external capacitor. . It should be noted that the outer dimensions of the multilayer antenna A are preferably set to the same as that of the IC module B and set to the minimum.
[0027]
In the above description, the number of turns and pattern size of the second coil 22, the insulating film 12 stacked on the first coil 21, and the number of stacked layers of the second coil 22 are the total requirements with the first coil 21. The setting can be changed as appropriate according to the inductance. That is, the insulating film 12 and the second coil 22 may be laminated in a multilayer of two or more layers on the base material 11 and the first coil 11. The winding direction and connection form of the first and second coils 21 and 22 may be any form other than that shown in the drawing as long as the magnetic flux generation direction from the first and second coils 21 and 22 is the same direction. You may change to
[0028]
Note that the multi-layer antenna A may be disposed sufficiently separated from the IC module B regardless of FIG. 1 and electrically connected to each other via an appropriate conductor.
[0029]
[Other embodiments]
The multilayer antenna A can be formed in the same size as the communication IC module B, and can be integrally joined to the IC module B to form an antenna-mounted communication IC unit C (FIG. 1). The IC module B is fixed on the protective film 13 with an anisotropic conductive adhesive, solder, or the like, and is electrically connected to the terminals A1 and A2. However, the terminals A1 and A2 on the protective film 13 are arranged in accordance with the terminal arrangement of the IC module B. In FIG. 1, the terminals A 1 and A 2 may be formed on the lower surface of the base material 11, and the IC module B may be bonded to the lower surface side of the base material 11.
[0030]
The communication IC unit C is mass-produced at once by integrally joining a wafer W on which a plurality of IC modules B, B... Are regularly arranged and an antenna sheet AS on which a plurality of multilayer antennas A, A. (FIG. 4). However, FIG. 4B is a cross-sectional view corresponding to the arrowed line YY in FIG.
[0031]
The antenna sheet AS is arranged with the multilayer antennas A, A... Of FIG. 1, and is manufactured, for example, according to the manufacturing process of FIG. That is, a plurality of first coils 21, 21... Are formed on the substrate 11 in accordance with the arrangement of the IC modules B, B... On the wafer W, and the first coils 21, 21. An insulating film 12 made of an insulating resist film is formed, and second coils 22, 22... Are formed on the insulating film 12 so as to correspond to the first coils 21, 21. Next, the protective film 13 is formed on the second coils 22, 22..., And terminals A 1, A 1, A 2, A 2, etc. are formed on the protective film 13 so as to correspond to the second coils 22, 22. Thus, the antenna sheet AS is completed. However, the lands 31a, 31b on the substrate 11, the via holes 32a, 32a ..., 34b, 34b ..., the lands 32b, 34a on the insulating film 12, and the via holes 33a, 33a ..., 33b, 33b ... Each of them is formed together with the first coil 21, the second coil 22, and the terminals A1 and A2.
[0032]
The antenna sheet AS thus formed separately from the wafer W is bonded to the wafer W via, for example, an anisotropic conductive adhesive (FIG. 4B), and each multilayer is connected via the terminals A1 and A2. The communication IC units C, C... Can be formed on the wafer W by electrically connecting the antenna A and the IC module B. In this case, the antenna sheet AS is bonded to the wafer W at the protective film 13 and the terminals A1, A1,..., A2, A2,. Therefore, the antenna sheet AS and the wafer W can be diced for each of the IC modules B, B... To mass-produce the antenna-mounted communication IC units C, C.
[0033]
The antenna sheet AS may be directly formed on the wafer W on which the IC modules B, B. That is, the base material 11 is formed on the wafer W, and the first coils 21 are arranged on the base material 11 so as to correspond to the IC modules B, B. 11 are formed to form via-hole terminals A1, A1,..., A2, A2,. Thereafter, the insulating film 12, the second coils 22, 22,..., And the protective film 13 may be laminated in order on the first coils 21, 21,. Each multilayer antenna A in the antenna sheet AS can be connected to a corresponding IC module B in the wafer W via via-hole terminals A1 and A2 on the substrate 11.
[0034]
Such an antenna-mounted communication IC unit C has the same pattern size as that of the IC module B of the multilayer antenna A, and can be compactly incorporated into a small portable communication terminal, IC card or the like.
[0035]
In the above description, the inductance of the first and second coils 21 and 22 is further increased by means of mixing and embedding a high magnetic material such as ferrite in the base material 11 and the insulating film 12, respectively. Can do.
[0036]
【The invention's effect】
As described above, according to the present invention, each multi-layer antenna is configured such that the first and second coils are magnetically fluxed by stacking the second coil via the insulating film on the first coil on the substrate. Can be operated as an integral coil by connecting them in series so that the direction of generation is the same direction, the required high inductance can be easily realized by minimizing the pattern size, and the communication IC module There is an excellent effect that it can be easily mounted.
[0037]
Further, by integrally joining the multilayer antenna to the communication IC module, an antenna-mounted communication IC unit can be easily realized.
[0038]
Furthermore, by mass joining a wafer on which a plurality of communication IC modules are arranged and an antenna sheet on which a plurality of multi-layer antennas are arranged together, dicing can be easily mass-produced. Can do.
[Brief description of the drawings]
1 is an exploded perspective view of a multi-layer antenna. FIG. 2 is an equivalent circuit diagram of the multi-layer antenna. FIG. 3 is an enlarged cross-sectional view corresponding to the line XX in FIG. 1. FIG.
FIG. 5 is a manufacturing process explanatory diagram (2).
[Explanation of symbols]
K ... Spatial area A ... Multi-layer antenna AS ... Antenna sheet B ... IC module C ... Communication IC unit W ... Wafer 11 ... Base material 12 ... Insulating film 13 ... Protective film 21 ... First coil 22 ... Second coil 31a , 31b, 32b, 34a ... land 32a, 33a, 33b, 34b ... via hole

Claims (3)

  A wafer on which a plurality of IC modules for communication are regularly arranged and an antenna sheet on which a plurality of multilayer antennas are arranged so as to correspond to each IC module on the wafer are integrally joined, and the wafer is integrated with the antenna sheet. A method for manufacturing an antenna-mounted communication IC unit, characterized in that each module is diced, each multilayer antenna of the antenna sheet includes a base material, a first coil formed on the base material, And a second coil laminated on the first coil via an insulating film, and the first and second coils are respectively on the base material and the insulating film so that the direction of generation of magnetic flux is the same. A method for manufacturing an antenna-mounted communication IC unit, wherein the antenna IC is formed in a spiral shape and connected in series. Antenna sheet, a manufacturing method of communication IC unit of the antenna mounting type according to claim 1, characterized in that formed on the wafer. Antenna sheet wafer and formed separately from, the method of manufacturing communication IC unit of the antenna mounting form of claim 1, wherein the bonding to the wafer.

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