JP2007213463A - Noncontact data carrier and wiring board for noncontact data carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact data carrier having a mounting structure for the subject of mounting and capable of being made smaller and less expensive, and a wiring board for the noncontact data carrier. <P>SOLUTION: The noncontact data carrier comprises an IC chip capable of storing data, and a wiring board on which the IC chip is mounted. The wiring board has on either side an outer wiring layer formed with a mounting pattern. The wiring board for the noncontact data carrier comprises an insulating board and an outer wiring layer formed on either side of the insulating board and formed with a mounting pattern. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a contactless data carrier that can read stored data in a contactless manner and a wiring board for a contactless data carrier that is a component thereof, and in particular, contactless data having a structure in which an antenna pattern is provided on the wiring substrate. The present invention relates to a carrier and a non-contact data carrier wiring board.

  In recent years, contactless data carriers using IC chips (also referred to as IC tags, wireless tags, RFIDs, etc.) have been used as carriers for tag information of articles. The main components of the non-contact data carrier are an IC chip that holds data and an antenna connected to the IC chip. There is one in which an antenna pattern is formed on a wiring board on which an IC chip is mounted in order to configure an antenna (for example, see Patent Document 1 below).

  A non-contact data carrier is generally used by being attached to an attachment target. Examples of non-contact data carriers having a structure for attachment are disclosed in Patent Documents 2 and 3 below. The one disclosed in Patent Document 2 has a structure in which a lead frame is newly provided and this lead frame is projected from a sealing resin of an IC chip. Solder can be applied to the object to be attached by applying solder to the lead frame extending in a protruding manner. The one disclosed in Patent Document 3 has a structure in which connection terminals are provided on both end faces of a chip-like insulating substrate facing each other. Solder can be applied to the attachment target by applying solder to both end faces.

The structure in which the antenna pattern is formed on the wiring board can be reduced in size due to the structure in which the antenna is patterned into a plurality of wiring layers. However, when the mounting structure as described above is adopted, the consistency is improved. It becomes a challenge. That is, in the structure disclosed in Patent Document 2, an increase in size due to the provision of a lead frame is unavoidable, and in the structure disclosed in Patent Document 3, the increase in the manufacturing cost due to an increase in the steps for providing the connection terminal on the end face. There is.
JP-A-2004-206736 (FIGS. 6, 7, 8, and 9) Japanese Patent Laid-Open No. 4-167719 (FIG. 2) Special reissue table WO2003 / 083770 (FIG. 2)

  The present invention has been made in view of the above circumstances, and is attached to an attachment target in a non-contact data carrier capable of reading out stored data in a non-contact manner and a wiring board for a non-contact data carrier which is a component thereof. It is an object of the present invention to provide a non-contact data carrier and a non-contact data carrier wiring board that have a structure and can be made smaller and less expensive.

  In order to solve the above problems, a non-contact data carrier according to the present invention includes an IC chip capable of storing data, and a wiring board on which the IC chip is mounted. It has an outer wiring layer in which a mounting pattern is formed on any one surface.

  That is, a non-contact data carrier having an IC chip mounted on a wiring board, and having an outer wiring layer on one side of the wiring board, and a mounting pattern is formed on the outer wiring layer . In this structure, the mounting pattern can be downsized without requiring a new structure such as a lead frame. Further, since the mounting pattern can be formed as a part of the outer wiring layer, the cost is not increased due to an increase in processes.

  A non-contact data carrier wiring board according to the present invention comprises an insulating substrate and an outer wiring layer formed on any one surface of the insulating substrate and having a mounting pattern. To do.

  That is, the non-contact data carrier wiring board has an outer wiring layer on one surface of the insulating substrate, and a mounting pattern is formed on the outer wiring layer. In this structure, the mounting pattern can be downsized without requiring a new structure such as a lead frame. Further, since the mounting pattern can be formed as a part of the outer wiring layer, the cost is not increased due to an increase in processes.

  According to the present invention, a non-contact data carrier that can read stored data in a non-contact manner and a wiring board for a non-contact data carrier that is a component of the non-contact data carrier have an attachment structure to an attachment target while realizing a smaller size and a lower price. Can be provided.

  As an embodiment of the present invention, an antenna pattern may be further formed on the outer wiring layer of the wiring board. In the structure in which the outer wiring layer on which the mounting pattern is formed has an antenna pattern, the mounting pattern can be provided at a position avoiding the antenna pattern. Further, since the mounting pattern can be formed as part of the outer wiring layer simultaneously with the antenna pattern, the cost is not increased due to an increase in the number of processes.

  Here, the antenna pattern of the outer wiring layer is substantially formed in a spiral shape, and the mounting pattern of the outer wiring layer is positioned outside the outermost spiral of the antenna pattern. it can. By positioning the mounting pattern outside the antenna pattern, the degree of influence on the communication characteristics can be further reduced.

  As an embodiment, the wiring board has a substantially rectangular planar shape, and the mounting patterns of the outer wiring layer are provided in the vicinity of the four corners of the wiring board. . Since the mounting pattern is provided in the vicinity of the four corners of the rectangular wiring substrate, stable mounting to the mounting target is possible. This is also preferable in terms of securing an antenna pattern formation region. Consistency with the aspect in which the mounting pattern is located outside the antenna pattern is also good.

  Here, the wiring board further includes a conductor layer having a shape having a defect portion at the four corners and formed on an end surface of the wiring substrate in the defect portion and connected to the mounting pattern. Good. In this case, the end face of the wiring board at the missing portions at the four corners can also be used as a part for attaching the non-contact data carrier. Therefore, reliable and strong attachment is possible, and since the corners are removed and the local sharpness is removed, a fillet with a good shape can be formed when, for example, soldering is performed. . Therefore, the mounting reliability is further improved.

  Further, as an embodiment, it may further include a solder ball provided on the mounting pattern of the outer wiring layer. By providing the solder balls in this way, it is possible to ensure a standoff with the mounting surface.

  As an embodiment, the IC chip may not be mounted on the surface of the wiring board on the side having the outer wiring layer. For example, a mode of mounting on a surface opposite to the surface having the outer wiring layer or a mode of being built in a wiring board can be considered.

  Therefore, the mold resin is formed on the surface of the wiring substrate so that the IC chip is mounted on the surface of the wiring substrate opposite to the surface having the outer wiring layer and covers the IC chip. It may further comprise a layer. A mold resin layer is provided to physically and chemically protect the IC chip and the connection between the IC chip and the wiring board.

  As an embodiment, the IC chip may be mounted on the surface of the wiring board on the side having the outer wiring layer. In this case, the compatibility with the aspect in which the solder ball provided on the mounting pattern of the outer wiring layer is further provided is good. This is because the thickness of the IC chip can be accommodated in a standoff made of solder balls.

  Here, a mold resin layer formed so as to cover the IC chip without covering the mounting pattern may be further provided on the surface of the wiring board on which the IC chip is mounted. A mold resin layer is provided to physically and chemically protect the IC chip and the connection between the IC chip and the wiring board. The reason why the mold resin layer is not provided on the mounting pattern is to ensure the function as the mounting pattern.

  Further, as an embodiment, the IC chip can be mounted on the wiring board using a bonding wire, or can be mounted on the wiring board by flip chip connection. This is an example that can be adopted as a mounting mode of an IC chip on a wiring board.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a bottom view (FIG. 1 (a)) and cross-sectional views (FIG. 1 (b1) and FIG. 1 (b2)) showing a schematic configuration of a non-contact data carrier according to an embodiment of the present invention. 1 (b1) and 1 (b2) each show another aspect, and are cross-sections at the position A-Aa in FIG. 1 (a).

  As shown in FIG. 1, this non-contact data carrier 1 includes interlayer insulating materials 21, 22, 23, antenna patterns 11, 12, 13, 14, IC chip 15 (15A), mounting patterns 16, 17, 18, 19, solder resists 24 and 25, mold resin 26 (in the case of FIG. 1 (b1)), underfill resin 27 (in the case of FIG. 1 (b2)), three-layer four-layer connection body 8, and four-layer one-layer connection body 9 Have Although it is hidden in the drawing, it also has a first-layer / second-layer connection body 6 and a two-layer / three-layer connection body 7 (see FIG. 2 described later). The difference between the IC chip 15 and the IC chip 15A is a difference between mounting by bonding wires or mounting by flip chip connection.

  The non-contact data carrier 1 has a schematic configuration in which an IC chip 15 (15A) is mounted on a rectangular wiring board having interlayer insulating materials 21, 22, 23 and antenna patterns 11, 12, 13, 14. The antenna pattern 11 is formed as a first layer (outer layer) antenna pattern, and the antenna patterns 12 and 13 are formed as a second layer (inner layer) antenna pattern and a third layer (inner layer) antenna pattern, respectively. The antenna pattern 14 is formed as a fourth layer (outer layer) antenna pattern. The interlayer insulating material 21 is an insulating substrate that separates the antenna pattern 11 and the antenna pattern 12, the interlayer insulating material 22 is an insulating substrate that separates the antenna pattern 12 and the antenna pattern 13, and the interlayer insulating material 33 is an antenna pattern. 13 is an insulating substrate that separates the antenna pattern 14 from the antenna 13.

  The connection relationship between the antenna patterns 11, 12, 13, and 14 and the IC chip 15 is as shown in FIG. FIG. 2 is a schematic exploded perspective view showing a connection relationship of antenna patterns in the non-contact data carrier shown in FIG. In FIG. 2, the same components as those shown in FIG. The illustration of the interlayer insulating materials 21, 22, and 23 is omitted. As shown in FIG. 2, the antenna patterns 11, 12, 13, and 14 are each formed in a substantially spiral shape, and these antenna patterns 11, 12, 13, and 14 are connected in series, and both ends thereof as a whole. Is connected to the IC chip 15. The same applies to the IC chip 15A.

  More specifically, this antenna is connected to the inner end of the first layer antenna pattern 11 from one input / output pad of the IC chip 15 with a bonding wire (in the case of the IC chip 15A, for example, via a protruding electrode). The outer end portion of the pattern 11 is connected to the outer end portion of the second layer antenna pattern 12 by the one-layer / two-layer connection body 6. The inner end portion of the second layer antenna pattern 12 is connected to the inner end portion of the third layer antenna pattern 13 by the two-layer / three-layer connection body 7, and the outer end portion of the antenna pattern 13 is connected to the three-layer / four-layer connection body. 8 is connected to the outer edge of the fourth layer antenna pattern 14. The inner end portion of the fourth layer antenna pattern 14 is connected to the wiring layer having the first layer antenna pattern by the four-layer / one-layer connection body 9, so that the other input / output pad of the IC chip 15 can be bonded to the wiring layer ( In the case of the IC chip 15A, it is electrically connected (for example, via a protruding electrode).

  The first-layer / second-layer connection body 6, the second-layer / three-layer connection body 7, the third-layer / four-layer connection body 8, and the fourth-layer / first-layer connection body 9 can be well-known through-hole inner wall conductors. Further, it is also possible to provide a connection body using a partial through-hole inner wall conductor and a conductive resin.

  Returning to the description with reference to FIG. The first layer antenna pattern 11 is a pattern provided as an outer layer wiring layer on the upper surface side of the wiring board, and the IC chip 15 (15A) is mounted on the upper surface side with the functional surface facing up. As described above, the electrical connection between the IC chip 15 and the outer wiring layer is made by bonding wires (in the case of the IC chip 15A, flip chip connection).

  In the case of flip-chip connection of the IC chip 15A, for example, a protruding electrode is provided on the functional surface of the IC chip 15A, and connected to and mounted on the outer wiring layer where the first layer antenna pattern exists via the protruding electrode. An underfill resin 27 is filled between the functional surface of the IC chip 15A and the interlayer insulating material 21 in order to chemically and physically protect the connection portion between the IC chip 15A and the outer wiring layer from the external environment. Yes. An anisotropic conductive resin or non-conductive resin can be used as the underfill resin 27.

  Each of the interlayer insulating materials 21, 22, and 23 can be made of, for example, epoxy resin containing glass cloth, BT resin, aramid resin, liquid crystal polymer, polyimide, or Teflon (registered trademark). The thickness may be 0.1 mm, for example, and the size may be 5 mm square, for example. Each of the antenna patterns 11, 12, 13, and 14 is formed by patterning a copper foil, for example, and has a thickness of 18 μm, for example. As a layout rule for forming the antenna patterns 11, 12, 13, and 14, in this example, for example, one having a line / space of 75 μm / 75 μm can be adopted. The interlayer insulating materials 21, 22, and 23 may employ an inorganic material (ceramic) in addition to the organic material as described above. In the following description, the organic material system will be described.

  The IC chip 15 (15A) is provided with a communication circuit unit (not shown) and a memory unit (not shown) as main internal components. The communication circuit unit is connected to an antenna composed of antenna patterns 11, 12, 13, and 14 and receives a data read command signal from the outside via this antenna and is stored in the memory unit in response to this. Mediates data output.

  The solder resist 24 is formed on the surface of the interlayer insulating material 21 provided with the first layer antenna pattern 11 so as to include a pattern portion that does not require solder connection (thickness is, for example, 25 μm). The solder resist 25 is formed on the surface of the interlayer insulating material 23 provided with the fourth layer antenna pattern 14 so as to include a pattern portion that does not require solder connection (the thickness is similar to that of the solder resist 24, for example, 25 μm). In particular, the solder resist 25 on the interlayer insulating material 23 has a non-formation site for solder-connecting the non-contact data carrier 1 to the attachment object 61 (described later).

  The mold resin 26 is formed on at least the surface of the interlayer insulating material 21 so as to cover the IC chip 15 and to cover the antenna pattern 11 provided on the surface of the interlayer insulating material 21 via the solder resist 24. (Thickness is, for example, 0.5 mm: in this embodiment, it is formed on the entire surface.) The material of the mold resin 26 can be an epoxy resin, for example. The IC chip 15 is chemically and physically protected from the external environment by the mold resin 26. The mold resin 26 is not provided in the case of the IC chip 15A as shown in FIG. 1B2, but may be provided to strengthen protection of the IC chip 15A.

  In this embodiment, as a part of the outer layer wiring layer on which the fourth layer antenna pattern 14 is formed, the mounting patterns 16, 17, 18, 19 for attaching and fixing the non-contact data carrier 1 to the attachment target 61 are provided. Have. The solder resist 25 is not formed on a part of the mounting patterns 16, 17, 18, and 19, so that the non-contact data carrier 1 can be connected and fixed to the attachment object 61 via connection solders 51 and 52. . The connecting solders 51 and 52 can be replaced with a conductive adhesive or a non-conductive adhesive. Specifically, the attachment target 61 is, for example, a mother board, a daughter board, a module board, a metal plate, or various components. Various materials such as metal, resin, and ceramic are conceivable.

  The mounting patterns 16, 17, 18, and 19 are provided near the four corners of the rectangular interlayer insulating material 23. The antenna pattern 14 is formed avoiding the positions of these mounting patterns 16, 17, 18, and 19. Therefore, the mounting patterns 16, 17, 18, and 19 are located outside the outermost spiral of the antenna pattern 14, and thus the antenna pattern 14 can be formed without disturbing the more natural spiral shape.

  Since the mounting patterns 16, 17, 18, and 19 are conductors, it is preferable that the mounting patterns 16, 17, 18, and 19 are provided outside in the inner periphery of the antenna pattern 14. Since it does not interfere, the degree of influence on the communication characteristics is smaller. Further, since the mounting patterns 16, 17, 18, and 19 are located at the four corners, stable attachment to the attachment target 61 can be performed. Furthermore, in the attached state, each antenna pattern 11-14 becomes the direction of the planar coil which can input easily the flux linkage which generates a bigger induced electromotive force, and is preferable.

  In addition, the non-contact data carrier 1 can be reduced in size without requiring a new configuration such as a lead frame. Further, since the mounting patterns 16, 17, 18, and 19 can be formed as part of the outer wiring layer simultaneously with the antenna pattern 14, the cost is not increased due to an increase in the number of processes.

  In addition, as an advantage, the mounting patterns 16, 17, 18, 19 (or the mounting patterns 16, 17, 18, 19 in portions where the solder resist 25 is not covered) can be used as an identification pattern at the end of the manufacturing process. It is done. That is, a plurality of non-contact data carriers 1 can be manufactured side by side using a single substrate. In that case, the non-contact data carrier 1 is finally singulated. The singulation process can be performed with the surface on which the antenna pattern 14 is formed facing upward. The above identification pattern can be used as an identification mark for machine vision when each non-contact data carrier 1 is captured by a suction nozzle after separation. Further, the front and back identification marks of the non-contact data carrier 1 can be used.

  The manufacturing process of the non-contact data carrier 1 described above is schematically as follows, for example. First, a double-sided copper-clad plate including an interlayer insulating material 22 is prepared, a hole for interlayer connection is formed at a required position, a conductive layer is formed on the inner wall of the hole, and a two-layer / three-layer connection body 7 make. Next, the copper foils on both sides are patterned by etching to form antenna patterns 12 and 13. Next, the interlayer insulating material 21 and the copper foil, the interlayer insulating material 23 and the copper foil are laminated and integrated on the respective surfaces on which the antenna patterns 12 and 13 are formed.

  Similarly to the formation of the two-layer / three-layer connection body 7, a hole for interlayer connection is formed at a necessary position, and a conductive layer is formed on the inner wall of the hole to form a one-layer / two-layer connection body 6. A three-layer four-layer connection body 8 and a four-layer one-layer connection body 9 are formed. Next, the copper foil on the interlayer insulating material 21 and the copper foil on the interlayer insulating material 23 are respectively patterned by etching to form antenna patterns 11 and 14 and mounting patterns 16, 17, 18 and 19. Hereinafter, formation of solder resists 24, 25, nickel plating and gold plating (at least on the mounting patterns 16, 17, 18, 19 not covered by the solder resist 25), mounting of the IC chip 15 (15A), molding resin 26 Each step of forming (in the case of the IC chip 15) is performed in order. The nickel plating and gold plating processes may be nickel plating, palladium plating, and flash gold plating. In addition, when a plurality are formed on the same substrate, individualization can be performed thereafter.

  In addition, as a manufacturing process of the non-contact data carrier 1, the following is applied to the first-layer / second-layer connection body 6, the second-layer / three-layer connection body 7, the third-layer / four-layer connection body 8, and the fourth-layer / first-layer connection body 9. A method using paste can also be adopted. First, a protruding silver paste bump for interlayer connection (for two-layer / three-layer connection body 7 and four-layer / one-layer connection body 9) is printed and cured at a required position of the copper foil. An interlayer insulating material 22 is laminated and integrated on the copper foil so as to penetrate. Next, another copper foil is laminated and integrated on the interlayer insulating material 22 so that the tip of the penetrating silver paste is plastically deformed. Then, the copper foils on both sides are patterned by etching to form antenna patterns 12 and 13.

  Next, a protruding silver paste for interlayer connection (for 1 layer 2 interlayer connection body 6, 3 layer 4 interlayer connection body 8, 4 layer 1 interlayer connection body 9) at a required position of another copper foil Bumps are formed, and an interlayer insulating material 21 or 23 is laminated and integrated on the copper foil so that the silver paste bumps penetrate therethrough. Then, these are laminated and integrated on both surfaces of the interlayer insulating material 22 on which the antenna patterns 12 and 13 are formed, so that the tip of the silver paste penetrating them is plastically deformed. Then, the copper foil on the interlayer insulating material 21 and the copper foil on the interlayer insulating material 23 are respectively patterned by etching to form antenna patterns 11 and 14 and mounting patterns 16, 17, 18 and 19.

  Hereinafter, formation of solder resists 24 and 25, nickel plating and gold plating treatment (on mounting patterns 16, 17, 18, and 19 not covered by solder resist 25), mounting of IC chip 15 (15A), and molding resin 26 Each process of formation (in the case of IC chip 15) is performed in order. The nickel plating and gold plating processes may be nickel plating, palladium plating, and flash gold plating. In addition, when a plurality are formed on the same substrate, individualization can be performed thereafter.

  The manufacturing method using the silver paste for the above-described one-layer / two-layer connection body 6 or the like can also be performed by changing the stacking procedure of the interlayer insulating layers 21, 22, and 23 in an order different from the above. That is, an antenna pattern 12 (or 13) is formed on one side of an interlayer insulating layer (interlayer insulating layers 21 and 23) to be positioned on the outside, a copper foil is provided on the other side, and these are electrically connected. Each having layer 2 interlayer connector 6 (including part of 4 layer 1 interlayer connector 9) or 3 layer 4 interlayer connector 8 (including part of 4 layer 1 interlayer connector 9) is prepared first. To do. Then, the last layer integration step is performed so that the interlayer insulating layer 22 is located between them and the two-layer / three-layer connection body 7 (including a part of the four-layer / one-layer connection body 9) passes through the interlayer insulation layer 22. I do. The subsequent etching of the copper foil on the interlayer insulating material 21 and the copper foil on the interlayer insulating material 23 and the subsequent steps are the same as described above.

  Next, another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a bottom view (FIG. 3 (a)) and cross-sectional views (FIG. 3 (b1) and FIG. 3 (b2)) showing a schematic configuration of a non-contact data carrier 1A according to another embodiment of the present invention. . 3 (b1) and 3 (b2) each show another aspect, and are cross-sections at the position B-Ba in FIG. 3 (a). Components identical or equivalent to those already described in FIG. 3 are denoted by the same reference numerals and description thereof is omitted.

  In this embodiment, solder balls 71, 72, 73, and 74 are provided in connection with the mounting patterns 16, 17, 18, and 19, respectively. The other configuration is the same as that of the embodiment shown in FIG. The connection relationship of the antenna patterns 11 to 14 shown in FIG. 2 is also the same. This non-contact data carrier 1A is attached to the attachment object 61 via solder balls 71, 72, 73, 74. Therefore, the non-contact data carrier 1A has a certain amount of standoffs with the attachment target 61. For example, it is possible to deal with a case where the surface of the attachment target 61 has unevenness such as a step.

  In place of this, the solder balls 71, 72, 73, 74 may be formed as ball-shaped connecting bodies in which a resin ball is subjected to a surface treatment. The solder balls 71, 72, 73, 74 can be formed by using solder in addition to mounting the solder balls on the mounting patterns 16, 17, 18, 19 on the solder balls formed in a spherical shape in advance. It is also possible to print on the wiring board and reflow it.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 4 is a bottom view (FIG. 4 (a)) and sectional views (FIG. 4 (b1), (b2)) showing a schematic configuration of a non-contact data carrier 1B according to still another embodiment of the present invention. is there. 4 (b1) and 4 (b2) each show another aspect, and are cross sections at the C-Ca position in FIG. 4 (a). Components identical or equivalent to those already described in FIG. 4 are given the same reference numerals and description thereof is omitted.

  This embodiment is the same as the embodiment shown in FIG. 3 in that solder balls 71, 72, 73, and 74 are provided in connection with the mounting patterns 16, 17, 18, and 19, respectively. A further difference is that the IC chip 15 (15A) is mounted on the surface on which the fourth layer antenna pattern 14 is formed. Further, a mold resin 26A is formed so as to cover the IC chip 15 and not cover at least the mounting patterns 16, 17, 18, and 19 (in the case of the IC chip 15 mounted using bonding wires). Since no IC chip is mounted on the surface on which the antenna pattern 11 is formed, no mold resin is formed on this surface.

  FIG. 5 is a schematic exploded perspective view showing the connection relationship of antenna patterns in the non-contact data carrier shown in FIG. In FIG. 5, the same components as those already shown are denoted by the same reference numerals. The illustration of the interlayer insulating materials 21, 22, and 23 is omitted. Although the mounting surface of the IC chip 15 (15A) is opposite to the embodiment shown in FIG. 1, as shown in FIG. 5, the antenna patterns 11, 12, 13, and 14 are connected in series, The point that both ends are connected to the IC chip 15 (15A) is the same.

  This embodiment is characterized in that the IC chip 15 (15A) is provided so as to use a standoff with the mounting object 61 formed by the solder balls 71, 72, 73, 74. In the embodiment using the solder balls 71, 72, 73, 74, the space utilization efficiency can be increased.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a bottom view (FIG. 6 (a)) and a side view (FIG. 6 (b1), (b2)) showing a schematic configuration of a non-contact data carrier 1C according to still another embodiment of the present invention. is there. FIGS. 6 (b1) and 6 (b2) each show another aspect, and are side surfaces at the D-Da position in FIG. 6 (a). Components identical or equivalent to those already described in FIG. 6 are denoted by the same reference numerals and description thereof is omitted.

  In this embodiment, the interlayer insulating materials 21, 22, and 23 have defects at the four corners. Conductive layers 91, 92, etc. are formed on the end surface of the non-contact data carrier 1C in the missing portion. The conductor layers 91, 92, etc. are provided on the surface on which the first-layer antenna pattern (not shown) is formed, and on the mounting patterns 81, 82, 83 provided on the surface on which the fourth-layer antenna pattern 14 is formed. , 84. At least a part of the mounting patterns 81, 82, 83, 84 is not covered with the solder resist 25.

  The patterns provided on the surface on which the first layer antenna pattern is formed and the mounting patterns 81, 82, 83, 84 provided on the surface on which the fourth layer antenna pattern 14 is formed are the conductor layer 91. , 92 and the like. The pattern formation can be performed simultaneously with the formation of the first layer antenna pattern or the fourth layer antenna pattern 14. The missing portions of the interlayer insulating materials 21, 22, and 23 can be obtained, for example, by forming a through hole before being divided into individual pieces and dividing the through holes into four when being cut into individual pieces. In addition, after forming a conductive layer on the inner wall surface of the through hole, solder resists 24 and 25 are formed on the interlayer insulating layers 21 and 22, and nickel plating and gold plating treatment are performed on the conductor layer on the inner wall surface of the through hole. If it carries out, the conductor layers 91 and 92 etc. of a preferable through-hole inner wall surface with corrosion resistance can be formed.

  In this embodiment, the mold resin 26 </ b> B covering the IC chip 15 is not formed on the entire surface but is formed except at least the vicinity of the four corners of the interlayer insulating material 21. This is to keep the formed through hole as a through hole immediately before separation.

  In this embodiment, the end faces (conductor layers 91, 92, etc.) of the wiring board at the missing portions at the four corners are also used as parts for attaching the non-contact data carrier 1C to the attachment object 61 via the connection solders 51A, 52A. be able to. Therefore, reliable and strong attachment is possible, and since the four corners are removed and the local sharpness is removed, a fillet with a good shape can be formed when performing solder connection. Therefore, the mounting reliability is further improved. The solder connection can be replaced with a conductive resin or a non-conductive resin.

  Next, still another embodiment of the present invention will be described with reference to FIGS. FIG. 7 is a bottom view (FIG. 7 (a)) and sectional views (FIG. 7 (b1) and FIG. 7 (b2)) showing a schematic configuration of a non-contact data carrier 1D according to still another embodiment of the present invention. is there. FIGS. 7 (b1) and 7 (b2) each show another embodiment, and are cross sections at the position E-Ea in FIG. 7 (a). Components identical or equivalent to those already described in FIG. 7 are denoted by the same reference numerals and description thereof is omitted.

  FIG. 8 is a schematic exploded perspective view showing the connection relationship of antenna patterns in the non-contact data carrier shown in FIG. In FIG. 8, the same components as those already shown are denoted by the same reference numerals. The illustration of the interlayer insulating materials 21, 22, and 23 is omitted.

  In this embodiment, as shown in FIGS. 7 and 8, a substantial antenna pattern is not provided in the first wiring layer and the fourth wiring layer (both outer wiring layers), and the second layer (inner layer). ) The antenna is constituted only by the antenna pattern 12 and the third layer (inner layer) antenna pattern 13. The remaining configuration is the same as that of the embodiment shown in FIGS.

  Thus, antenna patterns are not provided on both outer wiring layers, one outer wiring layer is provided only with a pattern for mounting the IC chip 15 (15A), and the other outer wiring layer is provided with the mounting patterns 16 to 16. A configuration in which 19 is provided is also possible as the non-contact data carrier 1D. In this non-contact data carrier 1D, the shape, position, and number of degrees of freedom of the mounting patterns 16 to 19 are remarkably increased. The same applies to the mounting position of the IC chip 15 (15A).

  In this embodiment, the antenna is composed of two layers of antenna patterns. However, for example, in the embodiment shown in FIG. 1, a new interlayer insulating material (including an interlayer connector) and a wiring layer for mounting the IC chip 15 are provided on the upper side of the antenna pattern 11, and the lower side of the antenna pattern 14 is provided. If a wiring layer for transferring another new interlayer insulating material and the mounting patterns 16 to 19 is provided, the antenna structure with the four-layer antenna pattern can be maintained.

  As a modification of the non-contact data carrier 1D, an aspect in which the IC chip 15 (15A) is mounted on the side on the interlayer insulating material 23 provided with the mounting patterns 16 to 19 can be mentioned. In this case, a pattern for mounting the IC chip 15 (15A) is also formed on the outer wiring layer having the mounting patterns 16 to 19, and the interlayer insulating material 23 is provided with an interlayer connector, while the interlayer insulating material 21 Substantially does not provide an interlayer connection. Since the IC chip 15 (15A) is provided on the side of the interlayer insulating material 23, an embodiment having solder balls on the mounting patterns 16 to 19 is more useful (see FIG. 4).

  As another modification of the non-contact data carrier 1D, a configuration in which the interlayer insulating material 21 (and its interlayer connector) is omitted and the IC chip 15 (15A) is mounted on the interlayer insulating material 22 is exemplified. Can do. In this case, a pattern for mounting the IC chip 15 (15A) is also formed on the wiring layer having the antenna pattern 12. Alternatively, the configuration of the interlayer insulating material 21 (and its interlayer connector) may be omitted, and the IC chip 15 (15A) may be mounted on the side of the interlayer insulating material 23 on which the mounting patterns 16 to 19 are provided. . In this case, a pattern for mounting the IC chip 15 (15A) is also formed on the outer wiring layer having the mounting patterns 16 to 19, and the interlayer insulating material 23 is provided with an interlayer connector. An embodiment having solder balls on the mounting patterns 16 to 19 is more useful.

  In the above-mentioned another modified example, since the interlayer insulating material becomes two layers of the interlayer insulating materials 22 and 23, it should be noted that warpage may easily occur due to the manufacturing process. Depending on the warp specifications, it is cheap and useful.

The bottom view and sectional view showing the typical composition of the non-contact data carrier concerning one embodiment of the present invention. The typical exploded perspective view which shows the connection relation of the antenna pattern in the non-contact data carrier shown in FIG. The bottom view and sectional drawing which show the typical structure of the non-contact data carrier which concerns on another embodiment of this invention. The bottom view and sectional view showing the typical composition of the non-contact data carrier concerning another embodiment of the present invention. The typical exploded perspective view which shows the connection relation of the antenna pattern in the non-contact data carrier shown in FIG. The bottom view and side view which show the typical structure of the non-contact data carrier which concerns on another embodiment of this invention. The bottom view and side view which show the typical structure of the non-contact data carrier which concerns on another embodiment of this invention. The typical exploded perspective view which shows the connection relation of the antenna pattern in the non-contact data carrier shown in FIG.

Explanation of symbols

  1, 1A, 1B, 1C ... contactless data carrier, 6 ... 1 layer 2 interlayer connection, 7 ... 2 layer 3 interlayer connection, 8 ... 3 layer 4 interlayer connection, 9 ... 4 layer 1 interlayer connection, 11 ... 1st layer (outer layer) antenna pattern, 12 ... 2nd layer (inner layer) antenna pattern, 13 ... 3rd layer (inner layer) antenna pattern, 14 ... 4th layer (outer layer) antenna pattern, 15, 15A ... IC chip, 16, 17, 18, 19 ... mounting pattern, 21, 22, 23 ... interlayer insulating material, 24, 25 ... solder resist, 26, 26A, 26B ... mold resin, 27 ... underfill resin, 51, 52 ... connection solder , 51A, 52A ... connection solder, 61 ... attachment object, 71, 72, 73, 74 ... solder ball, 81, 82, 83, 84 ... mounting pattern, 91, 92 ... conductor layer.

Claims (14)

An IC chip capable of storing data;
A wiring board on which the IC chip is mounted;
The non-contact data carrier, wherein the wiring board has an outer wiring layer in which a mounting pattern is formed on one surface of the wiring board.   2. The non-contact data carrier according to claim 1, wherein an antenna pattern is further formed on the outer wiring layer of the wiring board.   The antenna pattern of the outer wiring layer is formed in a substantially spiral shape, and the mounting pattern of the outer wiring layer is located outside the outermost spiral of the antenna pattern. Contactless data carrier as described.   2. The non-contact according to claim 1, wherein the wiring board has a substantially rectangular planar shape, and the mounting pattern of the outer wiring layer is provided in the vicinity of four corners of the wiring board. Data carrier. The wiring board has a shape having a defect portion at the four corners,
The contactless data carrier according to claim 4, further comprising a conductor layer formed on an end face of the wiring board in the defective portion and connected to the mounting pattern.   2. The non-contact data carrier according to claim 1, further comprising a solder ball provided on the mounting pattern of the outer wiring layer.   2. The non-contact data carrier according to claim 1, wherein the IC chip is not mounted on a surface of the wiring board having the outer wiring layer. The IC chip is mounted on a surface of the wiring board opposite to the surface having the outer wiring layer;
The contactless data carrier according to claim 7, further comprising a mold resin layer formed on a surface of the wiring substrate so as to cover the IC chip.   2. The non-contact data carrier according to claim 1, wherein the IC chip is mounted on a surface of the wiring board on the side having the outer wiring layer.   The contactless data carrier according to claim 9, further comprising a solder ball provided on the mounting pattern of the outer wiring layer.   The mold resin layer formed on the surface of the wiring board on which the IC chip is mounted so as to cover the IC chip without covering the mounting pattern. Non-contact data carrier.   2. The non-contact data carrier according to claim 1, wherein the IC chip is mounted on the wiring board using a bonding wire.   2. The non-contact data carrier according to claim 1, wherein the IC chip is mounted on the wiring board by flip chip connection. An insulating substrate;
A non-contact data carrier wiring board, comprising: an outer wiring layer formed on any one surface of the insulating substrate and provided with a mounting pattern.

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