JP2010170203A - Ic module and ic card equipped with the ic module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cope with the thinning of an IC card, by reducing the thickness of an LSI mounting part, even if a plurality of LSIs are mounted so as to be superimposed on a substrate. <P>SOLUTION: This IC module is provided with a substrate 2, having a plurality of contact terminal sections C1 to C8 which are to be used for data communication with the outside on one face side and a device hole 7 on the other face; and a plurality of LSIs 3 and 4, at least one of which at one end side of the superimposing direction is mounted so as to be stored in a device hole 7 and is electrically connected to the contact terminal sections C1 to C8. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an IC module that is mounted in a state where a plurality of LSIs are superimposed on a substrate, and an IC card including the IC module.

  Some IC cards include a plurality of LSIs, and can communicate data with the outside by a contact method or a non-contact method.

  A plurality of LSIs are mounted on a substrate. As a mounting method, there is a method of arranging a plurality of LSIs in the plane direction of the substrate.

  However, the method of arranging LSIs in the planar direction has a drawback that the product size increases.

Therefore, it is considered that LSIs are stacked and stacked in the height direction (see, for example, Patent Document 1 and Patent Document 2).
JP 11-338994 A JP-A-11-288877

  However, conventionally, since a plurality of LSIs are simply stacked on a substrate, there is a problem that the height dimension of the LSI mounting portion becomes large and the IC card cannot be made thinner.

  The present invention has been made by paying attention to the above circumstances, and the object of the present invention is to reduce the thickness of the LSI mounting portion even if a plurality of LSIs are mounted on the substrate, thereby reducing the thickness of the IC card. An object of the present invention is to provide an IC module and an IC card which can be used.

  In order to solve the above-mentioned problem, the invention described in claim 1 has a plurality of contact terminal portions used for data communication with the outside on one surface side, and a substrate having a concave portion on the other surface side, which are superimposed on each other. In this state, at least one of one end side in the overlapping direction is housed and mounted in the recess, and includes a plurality of LSIs electrically connected to the contact terminal portion.

  According to a fifth aspect of the present invention, there is provided at least one end in the overlapping direction in a state where a plurality of contact terminal portions used for data communication with the outside on one surface side and a substrate having a recess on the other surface side are overlaid on each other IC module comprising a plurality of LSIs, one of which is housed and mounted in the recess and electrically connected to the contact terminal part, and a card in which the IC module is embedded in a predetermined part And a base material.

  According to the present invention, even if a plurality of LSIs are stacked and mounted on a substrate, the thickness of the LSI mounting portion can be reduced, and the IC card can be made thinner.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing an IC module 1 according to an embodiment of the present invention from the LSI side, FIG. 2 is a plan view showing the LSI through it, and FIG. 3 is taken along the line A-AA in FIG. It is sectional drawing shown.

  The IC module 1 includes a glass epoxy substrate 2 having a thickness of 100 μm as a substrate, and a plurality of contact terminals C1 to C8 are disposed on the lower surface side (one surface side) of the substrate 2. On the upper surface side (other surface side) of the substrate 2, the first and second LSIs 3 and 4 having a thickness of 120 μm are mounted in a superposed state. The first LSI 3 has a large outer diameter, and the second LSI 4 has a small outer dimension. A gold bump 12 having a height of 20 μm protrudes from a terminal of the first LSI 3, and a gold bump (not shown) having a thickness of several μm protrudes from a terminal of the second LSI 4. The bumps 12 of the first LSI 3 and the bumps (not shown) of the second LSI 4 are bonded and electrically connected by heat and pressure.

  A device hole 7 as a concave portion is provided on the upper surface side of the substrate 2, and the first and second LSIs 3 and 4 are bonded to the substrate 2 by the adhesive 8 in a state where the second LSI 4 is accommodated in the device hole 7. ing.

  Further, on the upper surface side of the substrate 2, a pattern 10 is formed by applying nickel plating and gold plating to a 35 μm thick copper foil, and the contact terminals C1 to C8 described above are similarly configured. A through hole 11 is formed in the substrate 2, and the pattern 10 is connected to the contact terminals C 1 to C 8 through the through hole 11.

  The first LSI 3 is connected to the contact terminals C1 to C3, C5, and C7 through the bumps 12 and the pattern 10 as shown in FIG. 4 and used as a contact type IC module. It is connected to an external antenna via terminals C4, C6, C8 and used as a non-contact type IC module.

  Next, a method for manufacturing the above-described IC module 1 will be described.

  First, as shown in FIG. 5, the first LSI 3 is set with its bump 12 facing upward, and the anisotropic conductive adhesive 14 is applied to the area where the second LSI 4 is overlapped. After this application, the second LSI 4 is made to face the first LSI 3 with its bump (not shown) facing downward and then lowered, and the bump (not shown) is applied to the bump 12 of the first LSI 3 with heat and pressure. Join and make electrical connection. Thereby, the anisotropic conductive adhesive 14 is cured, and the first and second LSIs 3 and 4 are integrated as shown in FIG.

  After the first and second LSIs 3 and 4 are integrated in this way, they are turned upside down as shown in FIG. As shown in FIG. 8, the substrate 2 is set in the mounting portion with its device hole 7 facing upward, and an insulating adhesive 8 is accommodated in the device hole 7. The first and second LSIs 3 and 4 are opposed to the device hole 7 of the substrate 2 set in this manner with the second LSI 4 facing downward as shown in FIG. After facing in this way, the first and second LSIs 3 and 4 are lowered by a thermal pressure head (not shown), and the second LSI 4 is accommodated in the device hole 7 of the substrate 2 as shown in FIG. , Pressurize. As a result, the bumps 12 of the first LSI 3 and the substrate pattern 10 are electrically connected, and the first and second LSIs 3 and 4 and the substrate 2 are bonded and fixed by the adhesive 8, and the IC module 1. Will be configured.

  The IC module 1 configured as described above is embedded in a card base 19 to form an IC card K as shown in FIG.

  As described above, according to the embodiment, since the device hole 7 is formed in the substrate 2 and the second LSI 4 is fitted into the device hole 7, the thickness of the LSI mounting portion is accordingly increased. It is possible to reduce the thickness of the IC card K.

  12 and 13 show a second embodiment of the present invention.

  The same parts as those shown in the first embodiment are given the same reference numerals, and detailed description thereof is omitted.

  In the first embodiment described above, the bump 12 of the first LSI 3 and the contact terminals C1 to C8 are electrically connected via the pattern 10, but in the second embodiment, as shown in FIG. In addition, a through hole 21 is provided in the substrate 2 so that a part of the external contact terminals C 1 to C 8 is exposed, and a conductive adhesive 22 is injected into the through hole 21. The superposed first and second LSIs 3 and 4 are stored in the device hole 7 of the substrate 2 with the second LSI 4 facing downward, and the bumps 12 of the first LSI 3 are inserted into the through holes 21. Heat and pressurize. As a result, the conductive adhesive 22 is cured and the bumps 12 of the first LSI 3 and the external contact terminals C1 to C8 are electrically connected.

  Also according to the second embodiment, the height of the LSI mounting portion can be reduced and the IC card K can be made thinner as in the first embodiment.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

The top view which shows the IC module which is one embodiment of this invention. FIG. 2 is a view showing the LSI of the IC module of FIG. Sectional drawing shown along the AAA line in FIG. The figure which shows the connection state of LSI and the contact terminal of FIG. The figure which shows the state which tries to superimpose 2nd LSI on 1st LSI at the time of manufacture of IC module of FIG. FIG. 6 is a diagram showing a state in which the second LSI of FIG. 5 is overlaid on the first LSI. FIG. 7 is a diagram showing a state where the first and second LSIs of FIG. 6 are turned upside down. The figure which shows the state which set the board | substrate with the device hole facing upward at the time of manufacture of the IC module of FIG. The figure which shows the state which mounts the 1st and 2nd LSI on the board | substrate of FIG. FIG. 10 is a diagram showing a state in which the first and second LSIs of FIG. 9 are mounted on a substrate. The figure which shows the IC card with which the IC module of FIG. 10 was embed | buried. The figure which shows the state which mounts the 1st and 2nd LSI on a board | substrate at the time of manufacture of the IC module which is the 2nd Embodiment of this invention. FIG. 13 is a diagram showing a state where the first and second LSIs of FIG. 12 are mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 ... IC module, C1-C8 ... Contact terminal part, 7 ... Device hole (recessed part), 2 ... Board | substrate, 3 ... 1st LSI, 4 ... 2nd LSI, 10 ... Pattern, 11 ... Through-hole, 12 ... Bump, 21 ... through hole, 22 ... conductive adhesive, 19 ... card substrate, K ... IC card.

Claims (5)

A substrate having a plurality of contact terminal portions used for data communication with the outside on one side and a recess on the other side;
An IC module comprising: a plurality of LSIs, wherein at least one of one end side in the overlapping direction is housed and mounted in the recess and electrically connected to the contact terminal portion in a state where they are overlapped with each other .   The plurality of LSIs are a first LSI having a large external dimension and a second LSI having a small external dimension, and these first and second LSIs are electrically connected to each other via bumps. The IC module according to claim 1, wherein the second LSI is housed in a recess of the substrate. Forming a pattern on the other side of the substrate;
The pattern is electrically connected to the contact terminal portion through a through hole formed in the substrate,
3. The IC module according to claim 2, wherein the bumps of the first LSI are connected to the pattern. Providing a through hole in the substrate to expose the contact terminal portion;
Fill this through hole with conductive adhesive,
3. The IC module according to claim 2, wherein the bumps of the first LSI are electrically connected to the contact terminal portions via the conductive adhesive. A plurality of contact terminal portions used for data communication with the outside on one surface side, a substrate having a recess on the other surface side, and at least one end side in the overlapping direction in the recess are in the recess. An IC module comprising a plurality of LSIs housed and mounted and electrically connected to the contact terminal portion;
An IC card comprising: a card base material in which the IC module is embedded in a predetermined portion.

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