JP2009024056A - Prepreg and laminate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board material which retains flame retardancy in a high degree without using a halogen compound, a phosphorus compound or a hydrated metal oxide, and has excellent chemical resistance, high glass transition temperature and excellent soldering heat resistance, and to provide a laminate. <P>SOLUTION: A halogen-free flame-retardant resin composition, a prepreg and a laminate are disclosed, prepared by compounding a maleimide compound, silicone powder and a silicate compound in a naphthol aralkyl type cyanate resin and a nonhalogen epoxy resin. Flame retardancy in a high degree can be retained by the silicone powder only, as well as excellent chemical resistance and heat resistance are obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a prepreg made of a flame retardant resin composition for printed wiring boards, a laminate using the prepreg, and a metal-clad laminate.

The high integration, high functionality, and high-density mounting of semiconductors widely used in electronic devices, communication devices, personal computers, etc. are unrecognized, and their progress is accelerating. In particular, in recent years, the technology of mobile devices represented by mobile phones has rapidly advanced, and technological innovation for realizing a ubiquitous society has been remarkable.
Semiconductor packages are also expanding from QFP to area mounting types such as BGA and CSP, and the form is becoming more diverse as high-functional types such as MCP and SIP appear. For this reason, there has been an increasing demand for high reliability for laminated substrates for semiconductor packages.

Conventionally, FR-4 type laminates in which epoxy resin is cured with dicyandiamide have been widely used as laminates for printed wiring boards, but this method has limitations in meeting the requirements for high heat resistance. It was. As a resin for printed wiring boards having excellent heat resistance, cyanate ester resin is known, and based on a resin composition of bisphenol A type cyanate ester resin and other thermosetting resin or thermoplastic resin. In recent years, it has been widely used for semiconductor package laminates.
This bisphenol A type cyanate ester resin has excellent electrical properties, mechanical properties, chemical resistance, adhesive properties, etc., but it is not suitable under severe conditions in terms of water absorption and moisture absorption heat resistance. In some cases, cyanate ester resins having other structures have been studied with the aim of further improving the properties.
As examples of cyanate ester resins having other structures, there are many examples of phenol novolac-type cyanate ester resins (see, for example, Patent Document 1), but phenol novolac-type cyanate ester resins have a small cyanate group equivalent and are rigid. Due to its skeletal structure, many unreacted cyanate groups tend to remain at the time of curing, and the properties such as adhesion to the metal foil, water absorption rate and moisture absorption heat resistance are not satisfactory.
In addition, studies using naphthol aralkyl-type cyanate ester resins have been conducted (see, for example, Patent Document 2), making use of the characteristics of the rigid structure of the resin skeleton to maintain heat resistance and reduce reaction inhibition factors to cure. Resin compositions having improved properties and excellent water absorption and moisture absorption heat resistance have been obtained.

  For the flame retardancy of laminated boards for printed wiring boards used in electronic devices and the like, conventionally, a prescription using a brominated flame retardant has been used (see, for example, Patent Document 3). In response, there is a demand for resin compositions that do not use halogen compounds. Naphthol aralkyl type cyanate ester resin has excellent flame retardancy with a resin composition comprising a combination of a non-halogen epoxy resin and an inorganic filler, but in order to obtain higher flame retardancy, Hydrated metal oxides such as aluminum hydroxide are required as a compound for phosphorus compounds and as an inorganic filler. However, phosphorus compounds may generate toxic compounds such as phosphine during combustion, and aluminum hydroxide, which is known as an inorganic filler flame retardant, is an alkali when the amount of gibbsite, which is a general structure of aluminum hydroxide, is large. As the chemical resistance to acid and acid tends to be extremely inferior, the reliability of the insulating layer was insufficient under severe alkaline and acidic conditions such as etching, desmear, and plating in the printed wiring board manufacturing process. .

  Furthermore, in the assembly process of the semiconductor package, thermal processing at 120 to 200 ° C. is performed in processes such as baking, wire bonding, die attach, and mold resin curing, and solder ball connection is replaced with conventional lead solder due to environmental problems. Since the reflow temperature is increased by 20 to 30 ° C. by using lead-free solder, the demand for high heat resistance required for a laminated board for semiconductor packages does not remain. In a laminate using gibbsite as a flame retardant, the dehydration start temperature of gibbsite is in the vicinity of slightly over 200 ° C, so heat resistance may be inferior in high-temperature processing at 200 ° C or higher, and high reliability is required. Therefore, it has been desired to develop a laminated board that does not use a halogen-based compound having excellent heat resistance.

Japanese Patent Laid-Open No. 11-124433 Japanese Unexamined Patent Publication No. 2007-45984 Japanese Patent Laid-Open No. 11-021452

  The present invention is a printed wiring that retains high flame retardancy without using a halogen compound, phosphorus compound, or hydrated metal oxide, has excellent chemical resistance, has a high glass transition temperature, and has excellent solder heat resistance. It is an object to provide a prepreg for a plate material and a laminate.

（式中、Ｒは水素原子またはメチル基を示し、ｎは平均値として１から１０である。） The present inventors can obtain high flame retardancy by blending a maleimide compound, a silicone powder as a flame retardant aid, and an inorganic filler into a naphthol aralkyl cyanate ester resin and a non-halogen epoxy resin. It was confirmed. In addition, we found that inorganic fillers can maintain a high level of flame retardancy even if a silicate compound is added instead of aluminum hydroxide, which is a flame retardant. Halogen-free flame retardant with excellent chemical and heat resistance From the fact that a functional resin composition could be obtained, the present invention was completed. That is, the present invention relates to a cyanate ester resin (A) represented by the general formula (1), a non-halogen epoxy resin (B), a maleimide compound (C), a silicone powder (D), and a silicate compound (E). A prepreg obtained by combining a resin composition containing a base material (F), and a laminate or a metal foil-clad laminate obtained by curing these prepregs.

(In the formula, R represents a hydrogen atom or a methyl group, and n is 1 to 10 as an average value.)

  The cured product of the prepreg according to the present invention has excellent chemical resistance, excellent heat resistance, and high flame resistance without using a halogen-based flame retardant. It is suitable for materials for printed wiring boards with high functionality that are manufactured under the conditions and require high heat resistance and high reliability, and industrial practicality is extremely high.

（式中、Ｒは水素原子またはメチル基を示し、ｎは平均値として１から１０である。） The cyanate ester resin (A) represented by the general formula (1) used in the present invention comprises naphthols such as α-naphthol or β-naphthol, p-xylylene glycol, α, α'-dimethoxy-p-xylene. , Obtained by condensing naphthol aralkyl resin obtained by reaction with 1,4-di (2-hydroxy-2-propyl) benzene and cyanic acid, and its production method is not particularly limited, and cyanic acid It may be produced by any existing method for ester synthesis. Specifically, it can be obtained by reacting a naphthol aralkyl resin represented by the general formula (2) with cyanogen halide in an inert organic solvent in the presence of a basic compound. Further, a similar method may be employed in which a salt of a naphthol aralkyl resin and a basic compound is formed in a solution containing water, and then a two-phase interface reaction with cyanogen halide is performed.

(In the formula, R represents a hydrogen atom or a methyl group, and n is 1 to 10 as an average value.)

Ｇ：グリシジル基
（式中、Ar1・Ar2はフェニル基、ナフチル基、ビフェニル基等の単環あるいは多環の芳香族炭化水素が置換基になったアリール基を示し、Rx・Ryは水素原子またはアルキル基、アリール基を示し、mは１〜５までの整数を示し、ｎは１から５０までの整数を示す。）

シアン酸エステル樹脂(A)と非ハロゲン系エポキシ樹脂(B)は、樹脂組成物中のシアン酸エステル樹脂(A)のシアネート基数と非ハロゲン系エポキシ樹脂(B)のエポキシ基数の比(CN/Ep)が0.7〜2.5で配合することが好ましい。CN/Epが0.7未満では積層板の難燃性が低下し、2.5を超える配合では硬化性などが低下する場合がある。 The non-halogen epoxy resin (B) used in the present invention is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule and intentionally not having a halogen atom in the molecular skeleton. It is not something. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, trifunctional phenol type epoxy resin, tetrafunctional phenol type epoxy resin, naphthalene type epoxy Resin, biphenyl type epoxy resin, aralkyl novolak type epoxy resin, alicyclic epoxy resin, polyol type epoxy resin, glycidylamine, glycidyl ester, butadiene epoxidized compound, hydroxyl group-containing silicone resin and epichlorohydrin In particular, an aralkyl novolac type epoxy resin is preferable in order to improve flame retardancy. The aralkyl novolac type epoxy resin can be represented by the formula (3), and examples thereof include a phenol phenyl aralkyl type epoxy resin, a phenol biphenyl aralkyl type epoxy resin, and a naphthol aralkyl type epoxy resin. These non-halogen epoxy resins (B) can be used alone or in combination of two or more.

G: Glycidyl group (wherein Ar1 and Ar2 represent an aryl group substituted with a monocyclic or polycyclic aromatic hydrocarbon such as a phenyl group, a naphthyl group and a biphenyl group, and Rx and Ry represent a hydrogen atom or An alkyl group or an aryl group, m represents an integer of 1 to 5, and n represents an integer of 1 to 50.)

Cyanate ester resin (A) and non-halogen epoxy resin (B) are the ratio of the number of cyanate groups of cyanate ester resin (A) to the number of epoxy groups of non-halogen epoxy resin (B) in the resin composition (CN / Ep) is preferably blended at 0.7 to 2.5. If CN / Ep is less than 0.7, the flame retardancy of the laminate is reduced, and if it exceeds 2.5, the curability may be reduced.

  The maleimide compound (C) used in the present invention is not particularly limited as long as it is a compound having one or more maleimide groups in one molecule. Specific examples thereof include N-phenylmaleimide, N-hydroxyphenylmaleimide, bis (4-maleimidophenyl) methane, 2,2-bis {4- (4-maleimidophenoxy) -phenyl} propane, bis (3,5 -Dimethyl-4-maleimidophenyl) methane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, bis (3,5-diethyl-4-maleimidophenyl) methane, polyphenylmethanemaleimide, and these maleimide compounds Or a prepolymer of a maleimide compound and an amine compound can be used, and one kind or two or more kinds can be appropriately mixed and used. More preferred are bis (4-maleimidophenyl) methane, 2,2-bis {4- (4-maleimidophenoxy) phenyl} propane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane Is mentioned. The blending amount of the maleimide compound (C) in the present invention is not particularly limited, but if the blending amount is too small, the flame retardancy of the resulting laminate will be reduced, and if it is too large, the water absorption rate will be high, so cyanic acid. The range of 5 to 75% by weight of the total amount of the ester resin (A) and the maleimide compound (C) is preferable, and the range of 10 to 70% by weight is particularly preferable.

The silicone powder (D) used in the present invention is a fine powder of polymethylsilsesquioxane in which siloxane bonds are crosslinked in a three-dimensional network, addition polymerization of vinyl group-containing dimethylpolysiloxane and methylhydrogenpolysiloxane. The surface of the fine powder made from the addition of vinyl group-containing dimethylpolysiloxane and methylhydrogenpolysiloxane was coated with polymethylsilsesquioxane crosslinked with a three-dimensional network of siloxane bonds. And those coated with polymethylsilsesquioxane having a siloxane bond crosslinked in a three-dimensional network on the surface of the inorganic carrier. Silicone powder acts as a flame retardant aid that delays the burning time and enhances the flame retardant effect. Silicone powder consists of cyanate ester resin (A), non-halogen epoxy resin (B), and maleimide compound (C). It has been found that when 5 parts by weight or more is blended with respect to 100 parts by weight of blending amount, there is a remarkable flame retardant effect without blending any other flame retardant. The blending amount of the silicone powder is 5 to 30 parts by weight with respect to 100 parts by weight of the total blending amount of the cyanate ester resin (A), the non-halogen epoxy resin (B) and the maleimide compound (C). Is 5 to 25 parts by weight.

The silicic acid compound (E) used in the present invention is a condensed silicic acid group formed by connecting SiO tetrahedral basic units in various bonding modes, and various cations such as alkali metals and alkaline earth metals. In general, known silicate compounds can be used as fillers. Specific examples thereof include silica, talc, calcined talc, silicate glass, mica, mullite, cordierite and the like. The average particle size (D50) of the silicate compound (E) is not particularly limited, but it is preferable that the average particle size (D50) is 0.2 to 5 μm in consideration of dispersibility. The amount of the silicate compound (E) is 50 to 350 parts by weight with respect to 100 parts by weight of the total amount of the cyanate ester resin (A), the non-halogen epoxy resin (B), and the maleimide compound (C). When the amount of the silicic acid compound (E) is too large, the moldability may be lowered, so 50 to 300 parts by weight is particularly preferable.

As the base material (F) used in the present invention, known materials used for various printed wiring board materials can be used. Examples include glass fibers such as E glass, D glass, S glass, NE glass, and T glass, or inorganic fibers other than glass, and organic fibers such as polyimide, polyamide, and polyester, and are appropriately selected depending on the intended use and performance. it can. Examples of the shape include woven fabric, non-woven fabric, roving, chopped strand mat, and surfacing mat. The thickness is not particularly limited, but usually about 0.01 to 0.3 mm is used. Among these substrates, glass substrates are preferable in terms of strength and water absorption.

  With respect to the silicic acid compound (E) to be used, a silane coupling agent or a wetting and dispersing agent can be used in combination. These silane coupling agents are not particularly limited as long as they are silane coupling agents generally used for inorganic surface treatment. Specific examples include aminosilanes such as γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, epoxysilanes such as γ-glycidoxypropyltrimethoxysilane, γ Vinyl silanes such as -methacryloxypropyltrimethoxysilane, cationic silanes such as N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane hydrochloride, phenylsilanes, etc. It is also possible to use one kind or a combination of two or more kinds as appropriate. The wetting dispersant is not particularly limited as long as it is a dispersion stabilizer used for coatings. Examples thereof include copolymer-based wetting and dispersing agents having acid groups such as Disperbyk-110, 111, 180, BYK-W996, W9010, and W903 manufactured by Big Chemie Japan.

  The resin composition of the prepreg of the present invention includes other thermosetting resins, thermoplastic resins and oligomers thereof, various polymer compounds such as elastomers, and other flame retardants as long as the desired properties are not impaired. Can also be used in combination with other compounds and additives. These are not particularly limited as long as they are generally used. For example, examples of the flame retardant compound include nitrogen-containing compounds such as melamine and benzoguanamine, and oxazine ring-containing compounds. Additives include UV absorbers, antioxidants, photopolymerization initiators, optical brighteners, photosensitizers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, brighteners In addition, a polymerization inhibitor or the like can be used in appropriate combination as desired.

  The prepreg resin composition of the present invention can be used in combination with a curing accelerator in order to adjust the curing rate as needed. These are not particularly limited as long as they are generally used as a curing accelerator for the cyanate ester resin (A) and the non-halogen epoxy resin (B). Specific examples thereof include organic metal salts such as copper, zinc, cobalt and nickel, imidazoles and derivatives thereof, and tertiary amines.

  The prepreg production method of the present invention contains cyanate ester resin (A), non-halogen epoxy resin (B), maleimide compound (C), silicone powder (D), and silicate compound (E) as essential components. The method is not particularly limited as long as it is a method for producing a prepreg by combining the resin composition and the base material (F). For example, after impregnating or applying the resin varnish containing the resin composition to the base material (F), it is semi-cured by a method of heating for 1 to 60 minutes in a dryer at 100 to 200 ° C. to produce a prepreg The method of doing is mentioned. The amount of the resin composition attached to the substrate (F) is preferably in the range of 20 to 90% by weight in terms of the resin content of the prepreg (including the silicate compound).

  An organic solvent can be used for the resin varnish as required. The organic solvent is not particularly limited as long as the mixture of the cyanate ester resin (A), the non-halogen epoxy resin (B), and the maleimide compound (C) is compatible. Specific examples include ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as benzene, toluene and xylene, amides such as dimethylformamide and dimethylacetamide, and the like.

The laminate of the present invention is formed by lamination using the above-described prepreg. Specifically, it is manufactured by laminating one or a plurality of the prepregs described above and laminating and forming a metal foil such as copper or aluminum on one or both sides as desired. The metal foil to be used is not particularly limited as long as it is used for a printed wiring board material. As a lamination molding condition, a general method for a laminate for a printed wiring board and a multilayer board can be applied. For example, using a multi-stage press, multi-stage vacuum press, continuous molding, autoclave molding machine, etc., the temperature is generally 100 to 300 ° C., the pressure is ^{2 to} 100 kgf / cm ² , and the heating time is generally in the range of 0.05 to 5 hours. . Moreover, you may perform postcure at the temperature of 150-300 degreeC as needed.

  Synthesis Examples, Examples and Comparative Examples are shown below to describe the present invention in detail, but the present invention is not limited thereto.

式(4)で表されるα−ナフトールアラルキル樹脂(SN485、OH基当量：219g/eq.軟化点：86℃、新日鐵化学（株）製) １０３ｇ(OH基0.47モル)をクロロホルム 500mlに溶解後、トリエチルアミン 0.7モルを添加混合し、これを 0.93モルの塩化シアンのクロロホルム溶液 300ｇに、-10℃で1.5時間かけて滴下し、30分撹拌した後、更に 0.1モルのトリエチルアミンとクロロホルム 30ｇの混合溶液を滴下し、30分撹拌して反応を完結させた。生成するトリエチルアミンの塩酸塩を濾別した後、得られた濾液を 0.1Ｎ塩酸 500mlで洗浄した後、水 500mlでの洗浄を4回繰り返した。ついで、クロロホルム/水混合溶液のクロロホルム層を分液処理により抽出、クロロホルム溶液に硫酸ナトリウムを添加し脱水処理を行った。硫酸ナトリウムを濾別した後、75℃でエバポレートし、更に９０℃で減圧脱気することにより、褐色固形の式(5)で表されるα−ナフトールアラルキル型のシアン酸エステル樹脂を得た。赤外吸収スペクトルにおいて、2264cm-1付近にシアン酸エステル基の吸収を確認。また、13C-NMR及び1H-NMRにより、構造を同定し、OH基からOCN基への転化率は、99%以上であった。

Synthesis Example 1 Synthesis of α-naphthol aralkyl type cyanate ester resin-1

Α-naphthol aralkyl resin represented by formula (4) (SN485, OH group equivalent: 219 g / eq. Softening point: 86 ° C., manufactured by Nippon Steel Chemical Co., Ltd.) 103 g (OH group 0.47 mol) in 500 ml of chloroform After dissolution, 0.7 mol of triethylamine was added and mixed, and this was added dropwise to 300 g of 0.93 mol of cyanogen chloride in chloroform over 1.5 hours at −10 ° C., stirred for 30 minutes, and further 0.1 mol of triethylamine and 30 g of chloroform. The mixed solution was added dropwise and stirred for 30 minutes to complete the reaction. The resulting triethylamine hydrochloride was filtered off, and the obtained filtrate was washed with 500 ml of 0.1N hydrochloric acid, and then washed with 500 ml of water four times. Subsequently, the chloroform layer of the chloroform / water mixed solution was extracted by liquid separation treatment, and sodium sulfate was added to the chloroform solution for dehydration treatment. Sodium sulfate was filtered off, evaporated at 75 ° C., and degassed under reduced pressure at 90 ° C. to obtain an α-naphthol aralkyl type cyanate ester resin represented by the formula (5) as a brown solid. In the infrared absorption spectrum, the absorption of the cyanate ester group was confirmed around 2264 cm-1. Further, the structure was identified by 13C-NMR and 1H-NMR, and the conversion rate from OH group to OCN group was 99% or more.

Synthesis Example 2 Synthesis of α-naphthol aralkyl-type cyanate ester resin-2
Instead of α-naphthol aralkyl resin (SN485, OH group equivalent: 219 g / eq. Softening point: 86 ° C., manufactured by Nippon Steel Chemical Co., Ltd.) α-naphthol aralkyl resin (SN4105, OH group equivalent: 226 g / eq. Softening point: 105 ° C., manufactured by Nippon Steel Chemical Co., Ltd.) 102 g (OH group 0.45 mol) was used, and synthesis was performed in the same manner as in Synthesis Method 1 except that the amount of cyanogen chloride was 0.90 mol.

Example 1
37 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by Keisei Kasei Co., Ltd.) and the α-naphthol aralkyl cyanate ester resin obtained in Synthesis Example 1 (cyanate equivalent: 237 g / eq) .) 55 parts by weight, phenol phenyl aralkyl type epoxy resin (Zylock type epoxy resin, epoxy equivalent: 240 g / eq., Nippon Kayaku Co., Ltd.) 41 parts by weight, naphthalene skeleton type epoxy resin (HP-4032D, epoxy equivalent) : 140g / eq., 4 parts by weight of Dainippon Ink Chemical Co., Ltd.) is dissolved and mixed with methyl ethyl ketone, and 14 parts by weight of silicone powder (X52-1621, Shin-Etsu Chemical Co., Ltd.), calcined talc (BST) -200 L, manufactured by Nippon Talc Co., Ltd.) 165 parts by weight and zinc octylate 0.03 parts by weight were mixed to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 4 minutes to obtain a prepreg having a resin content of 50% by weight.

(Example 2)
28 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by Keisei Kasei Co., Ltd.) and the α-naphthol aralkyl cyanate ester resin obtained in Synthesis Example 1 (cyanate equivalent: 237 g / eq) .) 42 parts by weight, phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g / eq., Manufactured by Nippon Kayaku Co., Ltd.) 52 parts by weight, naphthalene skeleton type epoxy resin (HP-4032D, epoxy) Equivalent: 140 g / eq., 6 parts by weight, manufactured by Dainippon Ink & Chemicals, Inc., 4 parts by weight of silane coupling agent (Z6040, manufactured by Toray Dow Corning), wetting and dispersing agent (BYK-W996, Big Chemie Japan ( Co., Ltd.) 4 parts by weight is dissolved and mixed with methyl ethyl ketone, 7 parts by weight of silicone powder (X52-1621, Shin-Etsu Chemical Co., Ltd.), glass beads (EMB10, Potters Barotini Co., Ltd.) 385 parts by weight Parts, zinc octylate 0.03 Part were mixed to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 4 minutes to obtain a prepreg having a resin content of 50% by weight.

(Example 3)
57 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by KAYsei Kasei) and the α-naphthol aralkyl-type cyanate ester resin obtained in Synthesis Example 1 (cyanate equivalent: 237 g / eq) .) 38 parts by weight, phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g / eq., Manufactured by Nippon Kayaku Co., Ltd.) 54 parts by weight, phenol novolac type epoxy resin (EPICLON N-770, Epoxy equivalent: 190 g / eq., Manufactured by Dainippon Ink & Chemicals, Inc.) 8 parts by weight, silane coupling agent (Z6040, manufactured by Toray Dow Corning), 4 parts by weight, wetting and dispersing agent (BYK-W903, Big Chemie) 5 parts by weight of Japan Co., Ltd.) is dissolved and mixed with methyl ethyl ketone, and 31 parts by weight of silicone powder (Tospearl 130, manufactured by Momentive Performance Materials Japan GK) and zinc molybdate are talc. Coated (Chemguard 911C, zinc molybdate supported: 10% by weight, Sherwin Williams Chemicals) 5 parts by weight, calcined talc (BST-200L, Nippon Talc Co., Ltd.) 188 parts by weight, glass beads (EMB10 8 parts by weight of Potters Barotini Co., Ltd.) and 0.03 part by weight of zinc octylate were mixed to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 4 minutes to obtain a prepreg having a resin content of 50% by weight.

Example 4
17 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by Keisei Kasei Co., Ltd.) and the α-naphthol aralkyl type cyanate ester resin obtained in Synthesis Example 2 (cyanate equivalent: 244 g / eq) .) 40 parts by weight, phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g / eq., Nippon Kayaku Co., Ltd.) 60 parts by weight, wetting and dispersing agent (BYK-W903, Big Chemie Japan) (Made by Co., Ltd.) 4 parts by weight of methyl ethyl ketone was dissolved and mixed, and then 12 parts by weight of silicone powder (Tospearl 120, manufactured by Momentive Performance Materials Japan GK), calcined talc (BST-200L, Nippon Talc Co., Ltd.) 111 parts by weight, 140 parts by weight of spherical fused silica (SC2050MB, manufactured by Admatex Co., Ltd.), and 0.03 part by weight of zinc octylate were mixed to obtain a varnish. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 4 minutes to obtain a prepreg having a resin content of 50% by weight.

(Example 5)
15 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by Kasei Chemical Co., Ltd.) and α-naphthol aralkyl type cyanate ester resin obtained in Synthesis Example 2 (cyanate equivalent: 244 g / eq) .) 60 parts by weight, phenol biphenyl aralkyl type epoxy resin (NC-3000-FH, epoxy equivalent: 320 g / eq., Manufactured by Nippon Kayaku Co., Ltd.) 35 parts by weight, naphthalene skeleton type epoxy resin (HP-4032D, epoxy) Equivalent: 140 g / eq., 5 parts by weight of Dainippon Ink Chemical Co., Ltd.), 1.5 parts by weight of a wetting and dispersing agent (BYK-W996, produced by Big Chemie Japan) are dissolved and mixed with methyl ethyl ketone. (Tospearl 120, manufactured by Momentive Performance Materials Japan GK) 28 parts by weight, zinc molybdate coated on talc (chemguard 911C, zinc molybdate supported: 10% by weight, shear It made down Williams Chemicals) 3.5 parts by weight of spherical fused silica (SC2050MB, Admatechs Co.) 63 parts by weight, to obtain a varnish by mixing 0.02 part by weight of zinc octylate. This varnish was diluted with methyl ethyl ketone, impregnated with 0.1 mm thick E glass cloth, and dried by heating at 160 ° C. for 4 minutes to obtain a prepreg having a resin content of 50% by weight.

(Comparative Example 1)
A prepreg was obtained in the same manner as in Example 1 except that 37 parts by weight of bis (3-ethyl-5-methyl-4maleimidophenyl) methane (BMI-70, manufactured by KAI Kasei) was removed.

(Comparative Example 2)
A prepreg was obtained in the same manner as in Example 1 except that 14 parts by weight of silicone powder (X52-1621, manufactured by Shin-Etsu Chemical Co., Ltd.) was excluded.

(Comparative Example 3)
In Comparative Example 2, a comparison was made except that 165 parts by weight of gibbsite (aluminum hydroxide CL303, manufactured by Sumitomo Chemical Co., Ltd.) was used instead of 165 parts by weight of calcined talc (BST-200L, manufactured by Nippon Talc Co., Ltd.). A prepreg was obtained in the same manner as in Example 2.

(Comparative Example 4)
In Comparative Example 1, except for 14 parts by weight of silicone powder (X52-1621, manufactured by Shin-Etsu Chemical Co., Ltd.), instead of 165 parts by weight of calcined talc (BST-200L, manufactured by Nippon Talc Co., Ltd.), spherical fused silica A prepreg was obtained in the same manner as in Comparative Example 1 except that 150 parts by weight (SC2050MB, manufactured by Admatex Co., Ltd.) was used.

(Comparative Example 5)
In Example 3, instead of 38 parts by weight of α-naphthol aralkyl type cyanate ester resin (cyanate equivalent: 237 g / eq.), A prepolymer of 2,2-bis (4-cyanatephenyl) propane (BT2070, cyanate equivalent) : 139 g / eq., Manufactured by Mitsubishi Gas Chemical Co., Ltd.) A prepreg was obtained in the same manner as in Example 3 except that 38 parts by weight were used.

(Comparative Example 6)
In Example 5, instead of 60 parts by weight of α-naphthol aralkyl type cyanate ester resin (cyanate equivalent: 237 g / eq.), Phenol novolac type cyanate (PT-30, cyanate equivalent: 126 g / eq., Manufactured by Lonza) ) A prepreg was obtained in the same manner as in Example 5 except that 60 parts by weight were used.

Production of Metal Foil-Clad Laminate 1 Four prepregs obtained in Examples 1 to 5 and Comparative Examples 1 to 6 are each stacked to be 18 μm thick electrolytic copper foil (3EC-III, manufactured by Mitsui Kinzoku Mining Co., Ltd.) Were placed on top and bottom, and laminate molding was performed at a pressure of 30 kgf / cm ² and a temperature of 220 ° C. for 120 minutes to obtain a copper-clad laminate having an insulating layer thickness of 0.4 mm.

Preparation of metal foil-clad laminate 2 Eight of the prepregs obtained in Examples 1 to 5 and Comparative Examples 1 to 6 were each stacked to be 18 μm thick electrolytic copper foil (3EC-III, manufactured by Mitsui Mining & Smelting Co., Ltd.) Were placed on the top and bottom, and laminate molding was performed at a pressure of 30 kgf / cm ² and a temperature of 220 ° C. for 120 minutes to obtain a copper-clad laminate having an insulating layer thickness of 0.8 mm.

Preparation of Metal Foil-Clad Laminate 3 Two prepregs obtained in Examples 1 to 5 and Comparative Examples 1 to 6 are overlaid to obtain 18 μm electrolytic copper foil (3EC-III, manufactured by Mitsui Mining & Smelting Co., Ltd.). Laminate molding was carried out at a pressure of 30 kgf / cm ² and a temperature of 220 ° C. for 120 minutes to obtain a copper-clad laminate having an insulation layer thickness of 0.2 mm.

  Table 1 shows the results of evaluating the glass transition temperature, solder heat resistance, moisture absorption heat resistance, flame retardancy, and chemical resistance using the obtained metal foil-clad laminates 1 to 3.

The glass transition temperature, solder heat resistance, and moisture absorption heat resistance were evaluated by the following method after removing the copper foil from the metal foil-clad laminate 1 by etching.
Glass transition temperature: Measured with a dynamic viscoelasticity analyzer (TA Instruments) according to JIS C6481.
Solder heat resistance: A sample of 5 cm x 5 cm was dried at 115 ° C for 20 hours, then floated in a solder bath at 288 ° C, and the time until swelling was measured.
The symbol of solder heat resistance in Table 1 is: ○: No blistering for 30 minutes or more ×: Blistering occurs in less than 30 minutes.
Hygroscopic heat resistance: After drying a sample of 5cm x 5cm at 115 ° C for 20 hours, it is treated in a pressure cooker tester (PC-3 type, manufactured by Hirayama Seisakusho) at 121 ° C and 2 atm for 4 hours, then in a 260 ° C solder bath for 60 seconds It was immersed and visually observed for the presence or absence of swelling.
The symbols for moisture absorption heat resistance in Table 1 are: ○: no abnormality Δ: occurrence of mesling ×: occurrence of blistering.

The evaluation of flame retardancy was performed by the following method after removing the copper foil by etching the metal foil-clad laminates 1 and 2.
Combustion test: Evaluated according to UL94 vertical combustion test method.
The flame retardance 1 in Table 1 is the result of using the metal-clad laminate 1 and the flame retardance 2 is the result of using the metal-clad laminate 2.

Evaluation of alkali resistance and acid resistance was performed by the following method after removing the copper foil by etching the metal foil-clad laminate 3.
Alkali resistance: Weight change rate after 5 cm x 5 cm sample (1) dried at 115 ° C for 20 hours, (2) immersed in 1N sodium hydroxide solution at 70 ° C for 60 minutes, and (3) dried at 115 ° C for 20 hours Was measured. The weight of the sample after (1) was W1, the weight of the sample after (3) was W2, and the weight change rate was calculated by the following formula.
Weight change rate [wt%] = (W1-W2) x100 / W1
Acid resistance: 5cmx5cm sample was dried (4) at 115 ° C for 20 hours, (5) 60% immersed in 4N hydrochloric acid aqueous solution for 60 minutes, and (6) measured for weight change after drying at 115 ° C for 20 hours. did. The weight of the sample after (4) was W3, the weight of the sample after (6) was W4, and the weight change rate was calculated by the following equation.
Weight change rate [wt%] = (W3-W4) x100 / W3
The symbols for alkali resistance and acid resistance in Table 1 are: ○: Less than 0.1 wt% change in weight ×: 0.1 wt% or more change in weight.

  (Table 1) shows that Examples 1 to 5 according to the present invention are Comparative Example 1 in which bis (3-ethyl-5-methyl-4maleimidophenyl) methane is not blended, Comparative Example 2 in which no silicone powder is used, Flame retardant compared to Comparative Example 4 without using bis (3-ethyl-5-methyl-4maleimidophenyl) methane and silicone powder and Comparative Example 5 using a prepolymer of 2,2-bis (4-cyanatephenyl) propane It was shown to be superior in chemical resistance and solder heat resistance than Comparative Example 3 using gibbsite as a flame retardant, and better in hygroscopic heat resistance than Comparative Example 6 using phenol novolac-type cyanate. Therefore, it was confirmed that the prepreg laminate obtained by the present invention was excellent in chemical resistance and heat resistance, and the flame retardancy was able to achieve UL94V-0 without using a phosphorus compound and a halogen-based flame retardant.

Claims (5)

Resin composition and group containing cyanate ester resin (A) represented by general formula (1) and non-halogen epoxy resin (B), maleimide compound (C), silicone powder (D), and silicate compound (E) Prepreg made of material (F).

(In the formula, R represents a hydrogen atom or a methyl group, and n is 1 to 10 as an average value.) The silicone powder (D) is 5 to 30 parts by weight with respect to 100 parts by weight of the total amount of the cyanate ester resin (A) and the non-halogen epoxy resin (B) maleimide compound (C). Prepreg. The blending amount of the silicic acid compound (E) is 50 to 350 parts by weight with respect to 100 parts by weight of the total blending amount of the cyanate ester resin (A), the non-halogen epoxy resin (B) and the maleimide compound (C). The prepreg according to claim 1. A laminate obtained by curing the prepreg according to any one of claims 1 to 3. A metal foil-clad laminate obtained by laminating and curing the prepreg according to any one of claims 1 to 3 and a metal foil.