JP2009021486A - Electronic circuit board and management method of same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit board in which a reflow solder and a flow solder are mixed, and an identifying mark for visually determining an unleaded and leaded state of each solder is formed immediately before a solder process. <P>SOLUTION: A surface packaging component 12 is reflow-soldered on a first face 10a of the electronic circuit board 10 by melting and cooling of a solder paste, and a lead component 11 is inserted into a board through hole, and is flow-soldered from the side of a second face 10b by coming into contact with a melted solder and cooling. In a first identifying mark 20c provided on the first face 10a, if the reflow solder is unleaded, a metal mask of a circular core 25 is opened, and the solder paste is coated thereon, and if leaded, the metal mask is closed and the solder paste is not coated. In a second identifying mark 30c provided on the first face 10a, if the flow solder of the second face 10b is unleaded, the metal mask of a rectangular core 35 is opened, and the solder paste is coated thereon, and if leaded, the metal mask is closed and the solder paste is not coated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic circuit board and an electronic circuit board for improving the shape and arrangement of identification marks for visually determining the lead-free and lead-lead of each solder and the method of using the same in an electronic circuit board in which reflow solder and flow solder are mixed The present invention relates to a circuit board management method.

In an electronic circuit board on which electronic circuit components are mounted and soldered, in order to increase recycling efficiency, whether the applied solder is a leaded material or a lead-free material is identified and displayed.
For example, the “component mounting circuit formed body and the recycling method of electrical products including the same” disclosed in Patent Document 1 have identification information indicating that the component is mounted by a solder material not containing lead and does not contain lead. The component mounting circuit formed body is characterized in that an identification mark, a barcode or an IC is used as identification information, and the identification mark varies depending on the type of solder material, and the barcode or IC is a type of solder material. And information regarding the blending ratio, the components to be mounted, and the material of the component mounting circuit forming body.
In addition, the “use member of solder” of Patent Document 2 is an identification means for identifying the type of solder used for attachment of a use member such as an electrical component, connection between use members, or the type of solder that can be used during repair. The identification means identifies the type of solder by changing the color according to the type of solder. This identification means is provided on a letter, a figure or a symbol or a combination thereof or a barcode applied to a member using solder corresponding to the type of solder, or on a member using solder, and corresponds to the type of solder. The type of solder is identified by a substance having magnetism or reflectivity.

  Furthermore, the “component mounting board” of Patent Document 3 requires time and effort for the operator to search for a production drawing or temperature information of a reflow furnace applied to each printed wiring board or a paper sheet of a document or the like. In order to reduce the human error in setting the temperature profile of the reflow furnace, the setting information of the heating device is displayed on the component mounting substrate for soldering the components with the heating device, and this display There is disclosed a component mounting board characterized in that at least one of the above is displayed as a bar code.

JP 2000-269614 A (pages 3 to 7, FIG. 1) JP 2001-352164 A (pages 3 to 5, FIG. 1) Japanese Patent Laying-Open No. 2006-278815 (page 3, FIG. 1)

The electronic circuit boards according to Patent Documents 1 and 2 indicate whether the solder to be applied is leaded solder or lead-free solder on the board manufacturer side, and the product manufacturer using this board complies with the display contents. It is a component mounting and soldering work, and even if leaded solder is mistakenly applied to the one with leadless solder indication, the identification display remains leadless solder, and the product that is not intended is completed There's a problem.
On the other hand, in the electronic circuit board according to Patent Document 3, the temperature setting information of the heating device is displayed on the board as a bar code, which is reflected in the temperature management of the reflow solder furnace and the flow solder furnace for various lead-free solders. However, there is a problem that visual confirmation of lead-free solder or lead-free solder cannot be performed, although the risk of the product being manufactured is reduced.

A first object of the present invention is to make it possible to visually determine the use status of leaded solder in an electronic circuit board in which lead-free solder and leaded solder may be mixed, and an identification mark for visual determination is a board manufacturing process. Instead, it is to provide an electronic circuit board that is formed in the board assembly process and can accurately reflect the correct reality.
In addition, the second object of the present invention is that the lead / lead-free solder identification mark provided on the electronic circuit board is not only for increasing the recycling efficiency of the product, but also in the mounting assembly process of the electronic circuit board. The present invention also provides an electronic circuit board management method that can be effectively used to prevent the manufacture of a wrong product or a product having a wrong display.

The electronic circuit board according to the present invention is an electronic circuit board on which a surface mount component and a lead component to be inserted into the substrate through-hole are mounted and solder-connected to the connecting copper foil land by lead-free solder or leaded solder. And
The electronic circuit board is subjected to reflow soldering on the copper foil land for connection to which the solder paste is applied through a metal mask, and then overheating welding after placing the electrode part of the surface mount component, and the component for the lead component After the first surface, which is the mounting surface, and the surface-mounted component similar to the first surface are reflow soldered, local flow soldering is performed in which the end of the lead component and the copper foil land for connection contact and adhere to the molten solder. It is comprised by the 2nd surface.
A first identification mark and a second identification mark are applied to the first surface, and a first identification mark is applied to the second surface.
The first identification mark has a different appearance by opening or closing the opening of the metal mask depending on whether the reflow solder for the surface-mounted component is lead-free solder or leaded solder.
The second identification mark has a different appearance by opening or closing the opening portion of the metal mask depending on whether the local flow solder for the lead component is lead-free solder or leaded solder.
The first and second identification marks are formed on the second surface by distinguishing the first identification mark and the second identification mark by making the shape of the opening of the metal mask different. The first identification mark thus formed is provided at a portion where local flow soldering is not performed.

As described above, according to the present invention, the first and second identification marks provided on the first surface and the second surface serving as the reflow solder surface allow the reflow solder portions on the first surface and the second surface to be lead-free solder. And whether the flow solder part is lead-free solder or lead-free solder, each identification mark is a copper foil. It is formed by using the metal mask, and the appearance is changed depending on the presence or absence of the opening of the metal mask and the shape of the opening.
Therefore, even if lead-free or leaded reflow solder and lead-free or leaded flow solder are mixed, it can be easily identified visually, and the silk printing process is not required, and the electronic circuit board is inexpensive. .
In addition, since the identification mark is formed in the electronic component mounting and assembly process, compared to what is identified and displayed by silk printing in the manufacturing process of the electronic circuit board itself, it is necessary to form an accurate identification mark corresponding to the actual product. There is an effect that can.

Embodiment 1 FIG.
(1) Detailed Description of Configuration and Action FIG. 1 is a double-sided view showing an electronic circuit board according to Embodiment 1 of the present invention, and FIG. FIG. 1B is a diagram showing a substrate second surface (S surface) which is the opposite solder surface, and FIG. 1C is a diagram showing details of the first identification mark. FIG. 1D is a diagram showing details of the second identification mark.
In FIG. 1, an electronic circuit board 10 includes, for example, a first surface 10a on which a lead component 11 that is an input / output connector and a lead component 14 that is a large capacitor are mounted, and a second surface that is a solder surface that is the opposite surface. have. The surface mounting component 12 is an electronic component installed on the first surface 10a. The surface mounted component 13 is an electronic component installed on the second surface 10b.

The first identification marks 20c and 20s are for identifying whether the reflow solder for the surface mount components 12 and 13 is lead-free solder or leaded solder, and the first identification mark 20c is reflow soldering. The first identification mark 20s is provided on the first surface 10a where soldering is performed, and the first identification mark 20s is provided on the second surface 10b when reflow soldering is performed on the second surface 10b.
As shown in FIG. 1C, the first identification marks 20c and 20s are a circular core portion 25 that is an island-shaped copper foil portion, and an outer shell that is a copper foil portion provided on the outer periphery of the core portion 25. It consists of parts 21-24.

The second identification marks 30c and 30s are used to identify whether the flow solder for the surface mount components 12 and 13 or the lead components 11 and 14 is lead-free solder or lead-lead solder. The mark 30c is preferably provided on the first surface 10a where reflow soldering is performed, and the second identification mark 30s is preferably provided on the second surface 10b when reflow soldering is performed on the second surface 10b. Since the same content is displayed by the identification mark 30c, it is not always necessary.
The second identification marks 30 c and 30 s are constituted by a rectangular core portion 35 that is an island-shaped copper foil portion, and outer portions 31 to 34 of the copper foil portion provided on the outer periphery of the core portion 35.

The ID information media 40c and 40s are planar or linear barcodes, for example, made of a copper foil pattern, a solder resist film, a stamp, or an adhesive sheet provided on the first surface 10a and the second surface 10b, respectively.

FIG. 2 is a detailed view showing a first identification mark of the electronic circuit board according to Embodiment 1 of the present invention.
FIG. 2A is a top view showing a first identification mark for a lead-free solder substrate that has not been subjected to solder plating, and FIG. FIG. 2C is a top view showing one identification mark, FIG. 2C is a top view showing a first identification mark for a leaded solder substrate that has been precoated by solder plating, and FIG. 2A is a cross-sectional view taken along the line BB in FIG. 2B, and FIG. 2F is a cross-sectional view taken along the line C-C in FIG. 2C. It is sectional drawing.
In FIG. 2, 21 to 26 are the same as those in FIG. The first identification marks 201, 202, and 203 correspond to FIGS. 2A, 2B, and 2C. In FIG. 2D, the solder paste 27 is applied to the surface of the core portion 25, and in FIG. 2E, the pre-flux 29 is applied to the surfaces of the circular core portion 25 and the outer portions 21 to 24. In 2 (F), solder plating 28 is applied to the surfaces of the circular core portion 25 and the outer shell portions 21 to 24.

3 is a detailed view showing a second identification mark of the electronic circuit board according to Embodiment 1 of the present invention.
FIG. 3A is a top view showing a second identification mark for a lead-free solder substrate that is not subjected to solder plating, and FIG. FIG. 3C is a top view showing the second identification mark, and FIG. 3C is a top view showing the second identification mark for the leaded solder substrate that has been precoated by solder plating. FIG. 3A is a cross-sectional view taken along line AA in FIG. 3A, FIG. 3E is a cross-sectional view taken along line BB in FIG. 3B, and FIG. 3F is taken along line CC in FIG. It is sectional drawing.
In FIG. 3, numerals 10, 31 to 36 are the same as those in FIG. The second identification marks 301, 302, and 303 correspond to FIGS. 3A, 3B, and 3C. 3D, solder paste 37 is applied to the surface of the core portion 25. In FIG. 3E, the surfaces of the circular core portion 25 and the outer portions 21 to 24 are prefluxed 39. In 3 (F), solder plating 38 is applied to the surfaces of the circular core portion 25 and the outer shell portions 21 to 24.

FIG. 4 is a detailed view showing first and second identification marks of a modified type of the electronic circuit board according to Embodiment 1 of the present invention.
4A is a top view of the first identification mark, FIG. 4B is a top view of the second identification mark, and FIG. 4C is taken along line AA in FIG. 4A. 4D is a cross-sectional view taken along line BB in FIG. 4B.
4, reference numerals 10, 21 to 26, and 31 to 36 are the same as those in FIG. The first identification mark 204 corresponds to FIG. 4A, and the second identification mark 304 corresponds to FIG. 4B. In FIG. 4C, the solder paste 27 is applied, and in FIG. 4D, the solder paste 37 is applied.

FIG. 5 is a detailed view showing improved first and second identification marks of the electronic circuit board according to Embodiment 1 of the present invention.
5A is a top view of a first identification mark for a special lead-free solder substrate having a life display function, FIG. 5B is a top view of a second identification mark, and FIG. 5C is a diagram. 5A is a cross-sectional view taken along line AA in FIG. 5, and FIG. 5D is a cross-sectional view taken along line BB in FIG. 5B.
In FIG. 5, reference numerals 10, 21 to 26, and 31 to 36 are the same as those in FIG. The first identification mark 205 and the second identification mark 305 correspond to FIGS. 5A and 5B, respectively. The metal mask 50 is provided with openings 55a and 53a and openings 55b and 53b. Thin portions 54 a and 54 b are formed in the metal mask 50.

Next, the operation will be described.
First, FIG. 1 will be described.
In FIG. 1A showing the first surface 10 a of the electronic circuit board 10, for example, a lead part 11 that is an input / output connector and a lead part 14 that is a large capacitor are formed in a board through hole (not shown) provided in the electronic circuit board 10. A surface on which the lead parts 11 and 14 are mounted is referred to as a first surface or a C surface, and a solder surface opposite to the surface is referred to as a second surface or an S surface. . The surface-mounted component 12 is placed on a copper foil land (not shown) on the first surface 10a via a solder paste, and is heat-bonded by a reflow furnace.
In FIG. 1B showing the second surface 10b of the electronic circuit board 10, the surface mounting component 13 is installed with a solder paste on a copper foil land (not shown), and is heated and bonded by a reflow furnace. Or an electronic component that is placed directly on a copper foil land and temporarily fixed to the second surface 10b by an adhesive, and is subjected to flow soldering in which molten solder is contacted and adhered together with the lead components 11 and 14; When performed, the surface mount component 13 is such that the entire component passes through the molten solder solution.

As will be described later with reference to FIG. 2, the first identification marks 20c and 20s are used to identify whether the reflow solder for the surface mount components 12 and 13 is lead-free solder or lead-solder. The identification mark 20c is provided on the first surface 10a where reflow soldering is performed, and the first identification mark 20s is provided on the second surface 10b when reflow soldering is performed on the second surface 10b.
In FIG. 1C showing the details of the first identification marks 20c, 20s, the circular core portion 25 is an island-shaped copper foil portion generated by etching the copper foil of the electronic circuit board 10. The outer portions 21 to 24 provided on the outer periphery of the core portion 25 are annular copper foil portions, and the outer portions 21 to 24 and the core portion 25 correspond to cutout portions of the solder resist film 26. Even a copper foil portion that communicates as a whole can be used.

As will be described later with reference to FIG. 3, the second identification marks 30c and 30s are used to identify whether the flow solder for the surface mount components 12 and 13 or the lead components 11 and 14 is lead-free solder or lead-solder. The second identification mark 30c is provided on the first surface 10a where reflow soldering is performed, and the second identification mark 30s is formed on the second surface 10b when reflow soldering is performed on the second surface 10b. Although it is desirable to provide it, the same content is displayed by the second identification mark 30c, and therefore it is not always necessary.
In FIG. 1D showing the details of the second identification marks 30c, 30s, the square core portion 35 is an island-shaped copper foil portion generated by etching the copper foil of the electronic circuit board 10. Outer portions 31 to 34 provided on the outer periphery of the core portion 35 are annular copper foil portions, and the outer portions 31 to 34 and the core portion 35 correspond to cutout portions of the solder resist film 36. Even a copper foil portion communicated as a whole can be used.

The ID information media 40c and 40s are, for example, a planar or linear barcode provided on the first surface 10a and the second surface 10b, for example, a copper foil pattern, a solder resist film, a stamp, or a sticking sheet. For the code, the placement information on which side the barcode is provided, the first material information on whether the reflow solder is lead-free solder or leaded solder, and the flow solder is lead-free solder Includes direct information on the second material information of whether it is leaded or leaded solder, or includes a reflow soldering facility or a board type code number authorized and registered in the flow soldering facility described below. .
As the ID information media 40c and 40s, an ID tag memory that can be read out in a non-contact manner by a tag reader can be used in place of the barcode.

Next, FIG. 2 which is a detailed view of the first identification marks 20c and 20s of FIG. 1 will be described. FIG. 2A shows a top view of the first identification mark 201 with respect to a lead-free solder substrate that is not subjected to solder plating, and is a cross-sectional view taken along the line AA in FIG. It explains together.
The outer portions 21 to 24 and the core portion 25 generated by etching the copper foil pattern of the electronic circuit board 10 are separated from each other by the solder resist film 26, and a metal (not shown) is formed on the surface of the core portion 25. The solder paste 27 is applied through the opening of the mask, and the opening of the metal mask is not provided on the surface of the outer portions 21 to 24 so that the solder paste is not applied.
As a result, as shown in FIG. 2A, the surface of the circular core portion 25 has the hue of the solder paste 27, and the surfaces of the outer portions 21 to 24 have the hue of the preflux 29 applied to the copper foil surface. It has become.

FIG. 2B shows a top view of the first identification mark 202 with respect to the leaded solder substrate not pre-coated by solder plating, and is a cross-sectional view taken along the line BB of FIG. This will be described together with E).
In this example, metal core openings are not provided on the surfaces of the core portion 25 and the outer portions 21 to 24 so that solder paste is not applied.
As a result, as shown in FIG. 2B, the surfaces of the circular core portion 25 and the outer shell portions 21 to 24 are unified with the hue of the preflux 29 applied to the copper foil surface.

FIG. 2C shows a top view of the first identification mark 203 on the leaded solder substrate that has been pre-coated by solder plating, and is a cross-sectional view taken along the line CC of FIG. F) and will be described.
Also in this example, the opening of the metal mask is not provided on the surfaces of the core portion 25 and the outer portions 21 to 24, and the solder paste is not applied.
As a result, as shown in FIG. 2C, the surfaces of the circular core portion 25 and the outer portions 21 to 24 are unified with the hue of the solder plating 28 applied to the copper foil surface.
2A to 2C, if the solder plating 28 and the solder paste 27 have the same hue, if the difference from the hue of the preflux 29 portion is clear, the three can be easily obtained. The shape can be identified.

Next, FIG. 3 which is a detailed view of the second identification marks 30c and 30s of FIG. 1 will be described.
FIG. 3A shows a top view of the second identification mark 301 with respect to the lead-free solder substrate that is not subjected to solder plating, and is a cross-sectional view taken along the line AA in FIG. It explains together.
The outer portions 31 to 34 and the core portion 35 generated by etching the copper foil pattern of the electronic circuit board 10 are separated from each other by the solder resist film 36, and a metal mask (not shown) is formed on the surface of the core portion 35. The solder paste 37 is applied through the openings, and the metal mask openings are not provided on the surfaces of the outer portions 31 to 34 so that the solder paste is not applied.
As a result, as shown in FIG. 3A, the surface of the square core portion 35 has the hue of the solder paste 37, and the surfaces of the outer portions 31 to 34 have the hue of the preflux 39 applied to the copper foil surface. It has become.

FIG. 3B shows a top view of the second identification mark 302 with respect to the leaded solder substrate that has not been pre-coated by solder plating, and is a cross-sectional view taken along the line BB of FIG. E) and explanation will be given.
In this example, the opening of the metal mask is not provided on the surfaces of the core portion 35 and the outer portions 31 to 34, and the solder paste is not applied.
As a result, as shown in FIG. 3B, the surfaces of the rectangular core portion 35 and the outer shell portions 31 to 34 are unified with the hue of the preflux 39 applied to the copper foil surface.

FIG. 3C shows a top view of the second identification mark 303 with respect to the leaded solder substrate that has been precoated with the solder plating 38, and is a cross-sectional view taken along the line CC of FIG. This will be described together with (F).
Also in this example, openings of the metal mask are not provided on the surfaces of the core portion 35 and the outer portions 31 to 34, and the solder paste is not applied.
As a result, as shown in FIG. 3C, the surfaces of the square core portion 35 and the outer shell portions 31 to 34 are unified with the hue of the solder plating 38 applied to the copper foil surface.
3A to 3C, even if the solder plating 38 and the solder paste 37 have the same hue, if the difference from the hue of the preflux 39 portion is clear, the three can be easily obtained. It is shaped so that the classification can be identified.
Further, the difference between the first identification mark and the second identification mark is devised so that it can be easily identified depending on whether the shape of the core portion is circular or square.

Next, FIG. 4 which is a detailed view of the modified first and second identification marks of the one of FIG. 1 will be described.
In FIG. 4, there are two types of material components of the lead-free solder to be applied, general lead-free solder and special lead-free solder, and these are separated and identified from each other.
FIG. 4A shows a top view of the first identification mark 204 for a special lead-free solder substrate that is not subjected to solder plating, and is a cross-sectional view taken along the line AA in FIG. It explains together.
The outer portions 21 to 24 and the core portion 25 generated by etching the copper foil pattern of the electronic circuit board 10 are separated from each other by the solder resist film 26, and the surfaces of the core portion 25 and the outer portions 21 and 23 are separated. A solder paste is applied through an opening of a metal mask (not shown), and the opening of the metal mask is not provided on the surface of the outer portions 22 and 24 so that the solder paste is not applied.
As a result, as shown in FIG. 4A, the surfaces of the circular core portion 35 and the arc-shaped outer portions 21 and 23 become the hue of the solder paste 27, and the surfaces of the outer portions 22 and 24 are on the copper foil surface. It is the hue of the preflux being applied.

The same applies to the second identification mark 304 shown in the top view of FIG. 4B and the cross-sectional view of FIG. 4D, and the solder paste is applied or not applied to a part of the arc-shaped outer portion. Whether it is general lead-free solder or special lead-free solder is discriminated.
That is, the first identification mark having a circular core portion is generally lead-free in FIG. 2A, the special lead-free in FIG. 4A, and the second identification mark having a square core portion is FIG. 3A. Are general lead-free, and FIG. 4B is special lead-free so that they can be distinguished from each other.

(2) Other Embodiments In the above description, the surface mounting components 12 and 13 are reflow soldered to the first surface 10a and the second surface 10b, and the lead components 11 and 14 are mounted on the first surface 10a. The embodiment of double-sided reflow soldering + flow soldering in which flow soldering is performed on the second surface 10b side has been described.
However, the surface mount component 12 is reflow soldered to the first surface 10a, and the surface mount component 13 is temporarily attached to the second surface 10b or lead components 11 and 14 are mounted on the second surface 10b side. The same identification mark can be used for the form of single-sided reflow solder in which flow soldering is performed.
However, when the reflow soldering is performed only on the first surface side, the first and second identification marks 20s and 30s on the second surface side shown in FIG. Only the first and second identification marks 20c and 30c on the side can identify reflow soldering and lead-free / leading of flow soldering.
Even when the reflow soldering is performed on the first surface and the second surface, the second identification mark 30s on the second surface side shown in FIG. 1B is the second identification mark on the first surface side. Since it is the same as 30c, it is not necessarily required, but it is desirable to provide it because it can be visually determined from either side.

In the above description, the outer portion of the identification mark is configured by the annular copper foil so as to surround the entire circumference of the core portion. For example, the outer portion surrounds three sides of the core portion and includes a pair of core portions. It is also possible to adopt a configuration in which the entire outer portion is surrounded by a single outer portion.
The point is that if it is a simple circular sign, it cannot be discriminated from a circular mark that occurs by chance, so that it is of a shaped shape indicating that it is an intended identification mark, and there is a pair of identification marks. It is important that they can be easily distinguished from each other without being dissipated.
In addition, since the visual observation site is provided for the electronic circuit board, it is important that the observation site is not scattered and is provided in a unified site for various electronic circuit boards.

Next, FIG. 5 showing an improved type identification mark devised so that the determination of the life of the metal mask can be performed using the first and second identification marks of FIG. 1 will be described.
FIG. 5 (A) shows a top view of the first identification mark 205 for a special lead-free solder substrate having a life display function, and is combined with FIG. 5 (C) which is a cross-sectional view taken along the line AA. I will explain.
The outer portions 21 to 24 and the core portion 25 generated by etching the copper foil pattern of the electronic circuit board 10 are separated from each other by the solder resist film 26, and a portion of the core portion 25 and the outer portions 21 to 24 are separated. Solder paste is applied to the surface of the metal mask 50 through the openings 55a and 53a of the metal mask 50, and the openings of the metal mask 50 are not provided on the remaining surfaces of the outer portions 21 to 24. The paste is not applied.
As a result, as shown in FIG. 5 (A), the surface of the circular core portion 35 and the arc-shaped outer portions 21 and 23 have a hue of solder paste, and the surfaces of the outer portions 22 and 24 are applied to the copper foil surface. It has a preflux hue.
However, since the closed portion of the metal mask 50 located at the outer portions 22 and 24 is closed by the thin portion 54a, when the metal mask 50 is worn, the thin portion 54a is first broken and the solder paste leaks. Early detection can be performed by changing the hues of the outer portions 22 and 24.

The second identification mark 305 shown in the top view of FIG. 5B and the cross-sectional view of FIG. 5D is the same, and is thinner than the closed portion of the metal mask with respect to a part of the arc-shaped outer portion. Although the part 54b is provided to detect the life of the metal mask, the life display can be limited to only the first identification mark 20c on the first surface.
Similarly, the thin portions of the metal mask 50 can be provided for the outer portions 22 and 24 in FIG. 2B and the outer portions 32 and 34 in FIG. 3B to detect the life of the metal mask 50. .
In the case of FIG. 2C and FIG. 3C, since the copper foil pattern is solder-plated, the life can be detected by the difference in the gloss of the solder plating and the solder paste.

(3) Main points and features of the first embodiment According to the electronic circuit board according to the first embodiment of the present invention, the surface mount components 12 and 13 and the lead component 11 inserted into the substrate through-hole are mounted, and lead-free solder Alternatively, the electronic circuit board 10 is solder-connected to the connection copper foil land by leaded solder, and the electronic circuit board 10 has a surface on the connection copper foil land to which the solder paste is applied via the metal mask 50. Reflow soldering is performed by overheating welding after placing the electrode part of the mounting component 12, and a first surface 10 a serving as a component mounting surface for the lead component 11 and a surface mounting component 13 similar to the first surface 10 a are provided. After the reflow soldering, the second surface 10b is subjected to local flow soldering in which the end of the lead component 11 and the connecting copper foil land are brought into contact with the molten solder.
A first identification mark 20c and a second identification mark 30c formed by the copper foil of the electronic circuit board 10 are provided on the first surface 10a, and at least the copper of the electronic circuit board 10 is provided on the second surface 10b. A first identification mark 20s formed of foil is provided.
The first identification marks 20c and 20s have different appearances by opening or closing the opening of the metal mask 50 depending on whether the reflow soldering for the surface mount components 12 and 13 is lead-free solder or leaded solder. It is.
The second identification mark 30c has a different appearance by opening or closing the opening of the metal mask 50 depending on whether the local flow solder for the lead component 11 is lead-free solder or lead-free solder.
The first and second identification marks are formed by distinguishing the first identification marks 20c and 20s from the second identification mark 30c by making the shape of the opening of the metal mask 50 different. The first identification mark 20s provided on the second surface 10b is provided at a portion where local flow soldering is not performed.

Further, the surface mount components 12 and 13, the substrate through-hole surface mount component 12 and the lead component 11 inserted into the substrate through-hole are mounted and solder-connected to the connection copper foil land by lead-free solder or lead-solder. The electronic circuit board 10 is a circuit board 10, and the electrode part of the surface mount component 12 is placed on the copper foil land for connection to which the solder paste is applied via the metal mask 50, and then overheated. A flow solder that causes the first surface 10a on which reflow soldering is performed and the electrode portion of the surface mounting component 13 temporarily bonded to the opposite surface of the first surface and the copper foil land for connection to adhere to the molten solder, or the first At least one or both of the flow solders for bringing the lead wire ends of the lead components 11 and 14 inserted and mounted from the surface 10a through the substrate through holes and the connecting copper foil lands into contact with the molten solder. It is constituted by a second surface 10b that over the solder is performed.
A first identification mark 20c and a second identification mark 30c formed by the copper foil of the electronic circuit board 10 are provided on the first surface 10a.
The first identification mark 20c has a different appearance by opening or closing the opening of the metal mask 50 depending on whether the reflow solder for the surface-mounted component 12 is lead-free solder or leaded solder.
The second identification mark 30c has a different appearance by opening or closing the opening portion of the metal mask 50 depending on whether the flow solder for the surface mounting component 13 or the lead components 11 and 14 is lead-free solder or leaded solder. The first and second identification marks are provided to distinguish the first identification mark 20c and the second identification mark 30c by making the shape of the opening of the metal mask 50 different. It is.

As described above, the first and second identification marks provided on the first surface to be the reflow solder surface identify whether the reflow solder portion of the first surface is lead-free solder or leaded solder, Whether the flow solder part is lead-free solder or leaded solder is distinguished and each identification mark is formed using the copper foil part of the electronic circuit board, and the presence or absence of the opening of the metal mask The appearance is changed depending on the shape of the opening.
Therefore, even if lead-free or leaded reflow solder and lead-free or leaded flow solder are mixed, it can be easily identified visually, and the silk printing process is not required, and the electronic circuit board is inexpensive. .
In addition, since the identification mark is formed in the electronic component mounting and assembly process, compared to what is identified and displayed by silk printing in the manufacturing process of the electronic circuit board itself, it is necessary to form an accurate identification mark corresponding to the actual product. There is an effect that can.

The first and second identification marks are constituted by the core portions 25 and 35 and the outer portions 21 to 24 and 31 to 34 separated by the solder resist films 26 and 36.
The copper foil land for connection of the electronic circuit board 10 when lead-free soldering is performed, the core portions 25 and 35 and the outer portions 21 to 24 and 31 to 34 of each identification mark are not precoated by solder plating, Rust prevention treatment is performed by preflux, and the metal mask for each of the identification marks 201 and 301 is provided with openings for applying the solder pastes 27 and 37 only to the core portions 25 and 35.
The copper foil land for connection of the electronic circuit board 10 when leaded soldering is performed, the core portions 25 and 35 of each identification mark, and the outer portions 21 to 24 and 31 to 34 are precoated with solder plating 28 and 38. There are two types, that is, those that are pre-coated by solder plating and are subjected to rust prevention treatment by pre-flux, and for leaded solder, solder plating 28, 38 The metal mask for each of the identification marks 203 and 303 when the soldering is performed and the metal mask for each of the identification marks 202 and 302 when the soldering plating is not performed are both the core portions 25 and 35 and the outer portions 21 to 24, Openings are not provided for 31 to 34, and solder paste is not applied.

As described above, each identification mark is constituted by a core portion and an outer portion, and expresses a difference in appearance between a leaded substrate having solder plating and a lead-free substrate not subjected to solder plating by the outer portion. .
Therefore, there is a feature that the difference between lead and lead can be easily identified for electronic circuit boards of various manufacturing methods.

Furthermore, the core portions 25 and 35 are portions having different appearances by opening or closing the opening portion of the metal mask depending on whether it is lead-free solder or leaded solder.
A part of the outer parts 21 to 24 and 31 to 34 is obtained by opening or closing the opening part of the metal mask to obtain the first and second identification marks 204 and 304 having different views, and applied lead-free solder. It shows the material type.
As described above, each identification mark is composed of a core portion and an outer portion, and the lead-free solder material can be classified depending on whether or not a solder paste is applied to a part of the outer portion.
Therefore, there is a feature that not only the difference between lead and lead can be distinguished for electronic circuit boards of various manufacturing methods, but also the difference in the material of lead-free solder can be easily identified.

The core portions 25 and 35 are portions having different appearances by opening or closing the openings 55a and 55b of the metal mask 50 depending on whether they are lead-free solder or leaded solder.
A part of the outer portions 21 to 24 and 31 to 34 is a portion which is closed by the thin portions 54a and 54b of the metal mask and is not applied with the solder paste, and the thin portion is worn out by wear of the metal mask. Thus, the first or second identification mark 205 or 305 indicates that the solder paste has been leaked and applied and the life of the metal mask has been reached.
As described above, at least one of the identification marks is provided with a wear detection function in which a solder paste is applied by wear of the metal mask.
Therefore, there is a feature that the parts to be watched and monitored are not scattered in the process of manufacturing process management, and the abnormality of the metal mask can be quickly found.

Furthermore, the first surface 10a and the second surface 10b of the electronic circuit board are provided with linear or planar barcodes or ID information media 40c, 40s using an ID tag memory.
The ID information media 40c and 40s are arranged on which surface, the first material information on whether the reflow solder is lead-free solder or leaded solder, and the flow solder is lead-free. Includes direct information on the second material information of whether it is solder or leaded solder, or includes a reflow soldering facility or a board type code number that is certified and registered in the flow soldering facility .
As described above, ID information media including direct or indirect information regarding solder material information are provided on both sides of the electronic circuit board.
Therefore, there is a feature that can be utilized as a means for preventing an incorrect identification mark from being generated by an incorrect metal mask.

Embodiment 2. FIG.
(1) Detailed Description of Configuration A component mounting solder process for an electronic circuit board according to Embodiment 2 of the present invention will be described below.
FIG. 6 is an explanatory view showing a first part of a manufacturing process of an electronic circuit board according to Embodiment 2 of the present invention.
In FIG. 6, a large number of electronic circuit boards 10 that are not mounted with components are stored in a board stacker 600 with the second surface as an upper surface.
The metal mask 50 is provided in the solder printing process 610 that is the first stage process, and the cream solder stored in the solder container 90 is injected into the upper surface of the metal mask 50. The electronic circuit board 10 transferred by the free flow conveyor is lifted and stopped on the lower surface of the metal mask 50, and the sliding piece 91 is slid and swept on the upper surface of the metal mask 50, thereby soldering from the opening of the metal mask 50. A paste is applied.
The second surface 10b of the electronic circuit board 10 is provided with, for example, an ID information medium 40s by a barcode, and a model number that becomes a feature of the electronic circuit board 10 that is inserted by the barcode reader 690 that is an information terminal. It is confirmed.
The metal mask 50 is provided with an ID information medium 691 using, for example, a barcode, and a management number that is a feature of the applied metal mask 50 is confirmed by a barcode reader 692 that is an information terminal.
The solder container 90 is provided with an ID information medium 693 using, for example, a barcode, and a management number that is a feature of the used solder container 90 is confirmed by a barcode reader 694 serving as an information terminal.
The solder printing machine used in the solder printing process 610 is provided with a work instruction medium 695 using a bar code printed on, for example, a work instruction, and a bar code reader 6 serving as an information terminal.
By 96, the model number of the electronic circuit board 10, the management number of the metal mask 50, and the management number of the solder container 90 to be applied to the solder printing process to be performed from now on are read out.

In the component installation / mounting step 620 which is a middle step, the electronic circuit board 10 transferred by the free flow conveyor is lifted and stopped at a predetermined position, and the surface mount component 13 is set by a surface mounter which is a three-dimensional robot.
In the reflow soldering process 630 which is a subsequent process, the electronic circuit board 10 transferred by the freeflow conveyor is preheated, soldered, heated and cooled to perform reflow soldering, and in the temporary storage process 640, the electronic circuit board 10 is transferred to the transfer stacker. Stacked and temporarily stored.
The electronic camera 699 is provided immediately before the reflow soldering process 630, and images the first identification mark 20s provided on the second surface 10b of the electronic circuit board 10.
The soldering machine used in the reflow soldering process 630 is provided with a work instruction medium 697 using, for example, a bar code printed on a work instruction, and a reflow to be performed by a bar code reader 698 serving as an information terminal. Whether or not the temperature management specification applied to the soldering process corresponds to the first identification mark 20s provided on the electronic circuit board 10 is read out.

Next, FIG. 7, which is an explanatory diagram of a second process block following the manufacturing process of FIG. 6, will be described.
FIG. 7 is an explanatory view showing a second part of the manufacturing process of the electronic circuit board according to the second embodiment of the present invention.
In FIG. 7, in the substrate stacker 700 in which the electronic circuit board 10 is temporarily stored in the temporary storage step 640, a large number of in-process electronic circuit boards 10 are stored with the second surface as the upper surface.
The front / back reversing process 710 that is the first stage process is a process that reverses the front / back of the electronic circuit board 10 and inputs it to the solder printing process 720 of the next stage process.
The solder printing process 720, the component installation / mounting process 730, the reflow soldering process 740, and the temporary storage process 750 correspond to the solder printing process 610, the component installation / mounting process 620, the reflow soldering process 630, and the temporary storage process 640 in FIG. Yes, the reversal soldering of the surface-mounted component 12 to the first surface 10a of the electronic circuit board 10 is performed by adding the front / back reversing step 710 as compared to the process block of FIG.

Next, FIG. 8 which is explanatory drawing of the 3rd process block following the manufacturing process of FIG. 7 is demonstrated. FIG. 8 is an explanatory view showing a third part of the manufacturing process of the electronic circuit board according to the second embodiment of the present invention.
In FIG. 8, a substrate stacker 800 in which the electronic circuit board 10 is temporarily stored in the temporary storage step 750 stores a number of in-process electronic circuit boards 10 with the first surface as an upper surface.
In the insertion / mounting process 810, the electronic circuit board 10 transferred from the board stacker 800 is supplied to the electronic circuit board 10, and the electronic circuit board 10 transferred by the free flow conveyor is lifted and stopped at a predetermined position, and is read by the inserter which is a three-dimensional robot. The component 11 is inserted into a board through hole (not shown).
In the local flow soldering process 820 which is a middle stage process, flux is applied to the lead terminal part of the lead component 11 of the electronic circuit board 10 which is transferred by the free flow conveyor, preheating is performed, and then the local flow soldering is performed. Through 830, the products are stacked and stored in a stacker for transfer to the product assembly process in the finished storage process 840.
The electronic camera 899 is provided immediately before the local flow soldering process 820, and images the second identification mark 30c provided on the first surface 10a of the electronic circuit board 10.
The soldering machine used in the local flow soldering process 820 is provided with, for example, a work instruction medium 891 using a bar code printed on a work instruction, and will be implemented by a bar code reader 892 which is an information terminal. Whether or not the temperature management specification applied to the flow soldering process corresponds to the second identification mark 30c provided on the electronic circuit board 10 is read out.

The first surface 10a of the electronic circuit board 10 is provided with, for example, a bar code ID information medium 40c, and a model that becomes a feature of the electronic circuit board 10 inserted by the bar code reader 890 serving as an information terminal. The number is confirmed.
The flow soldering machine used in the local flow soldering process 820 is provided with the above-described work instruction medium 891, and an electronic device applied to a local flow soldering process to be performed by a bar code reader 892 which is an information terminal. The model number of the circuit board 10 is read out.
The insertion / mounting process 810 starts when the information of the barcode readers 890 and 892 matches, and the local flow soldering process 820 includes information obtained from the electronic camera 899 and information obtained from the barcode reader 892. The operation is started when they match.

FIG. 9 is a process flowchart showing the manufacturing process of FIG.
FIG. 10 is a process flow diagram showing the manufacturing process of FIG.
FIG. 11 is a process flowchart showing the manufacturing process of FIG.

(2) Detailed Description of Operation and Operation The operation and operation of the component mounting soldering process for the in-vehicle electronic board according to the second embodiment configured as described above will be described.
First, in FIG. 9, which is a flowchart for explaining the operation corresponding to FIG. 6, step 611 is the operation start step of the first process block, and the subsequent step 612a is the substrate stacker 600 installed. This is a step of reading out the model information of the electronic circuit board 10 from the ID information medium 40s provided on the second surface.
The subsequent step 612b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 695 and determining whether or not it matches the model information read out in step 612a. If it is OK, the process proceeds to step 613a. If it is determined that there is a mismatch, the process proceeds to step 612c.
In step 612c, the operator is notified of the abnormality, the operator performs a repair process, and returns to step 612a again.

Step 613 a is a step of installing the metal mask 50 and reading out the model information of the electronic circuit board 10 applied from the ID information medium 691 provided on the metal mask 50 by the information terminal 692.
The subsequent step 613b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 695 and determining whether or not it matches the model information read out in step 613a. If it is OK, the process proceeds to step 614a. If it is determined that there is a mismatch, the process proceeds to step 613c.
In step 613c, an abnormality is notified to the operator, the repair process is performed by the operator, and the process returns to step 613a again.
In step 614 a, cream solder is taken out from the solder container 90 and injected into the metal mask 50, and the material information of the applied solder is read from the ID information medium 693 provided in the solder container 90 by the information terminal 694.
The subsequent step 614b is a step of reading the solder material information obtained from the work instruction medium 695 and determining whether or not it matches the material information read in step 614a. If the step 614b is a match determination, If the result is OK and the process proceeds to step 616, and if it is determined that there is a mismatch, the result is NG and the process proceeds to step 614c.
In step 614c, the operator is notified of the abnormality, the operator performs repair processing, and returns to step 614a again.
In step 616, solder printing using an appropriate metal mask 50 and solder cream is applied to the connecting copper foil land on the second surface of the electronic circuit board 10, and soldering to all the electronic circuit boards 10 in the board stacker 600 is performed. Until printing is completed, solder printing is performed on the electronic circuit board 10 that has been sequentially input.

Steps 612a to 616 correspond to the solder printing process 610.
The subsequent step 627 corresponds to a component installation / mounting process 620 for sequentially installing the surface mounting component 13 following the solder printing process 610.
The subsequent step 635a is a step of setting the temperature of the reflow furnace based on the work instruction medium 697, and the subsequent step 635b is information on the first identification mark 20s provided on the second surface of the electronic circuit board 10 by the electronic camera 699. Is read, and it is determined whether or not the content of the work instruction medium 697 in step 635a matches. If step 635b is a match determination, the result is OK and the process proceeds to step 638. NG, the process proceeds to step 635c.
In step 635c, an abnormality is notified to the operator, the repair process is performed by the operator, and the process returns to step 635a again.
In step 638, reflow soldering based on an appropriate temperature profile is performed, and the reflow soldering for the electronic circuit board 10 that has been sequentially added is executed until the reflow soldering for all the electronic circuit boards 10 in the board stacker 600 is completed.
Steps 635a to 638 correspond to the reflow soldering process 630.
The electronic circuit board 10 on which the reflow soldering of the surface mount component 13 to the second surface is performed is housed in the board stacker in the temporary storage process 640, and all the electronic circuit boards 10 are housed. The process proceeds to operation end step 641.

Next, FIG. 10 which is a flowchart for explaining the operation corresponding to FIG. 7 will be described.
Step 711 is the operation start step of the second process block, and the subsequent step 712 a is the electronic circuit board 10 from the ID information medium 40 c provided on the first surface of the electronic circuit board 10 by the information terminal 790 where the board stacker 700 is installed. This is a step of reading out the model information. The subsequent step 712b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 795 and determining whether or not it matches the model information read out in step 712a. If it is OK, the process proceeds to step 712, and if it is a mismatch determination, the result is NG and the process proceeds to step 712c.
In step 712c, the operator is notified of the abnormality, the operator performs repair processing, and the process returns to step 712a again.
Step 712 is a step of sequentially reversing the front and back of the electronic circuit board 10, and a substrate reversing process 710 is configured by steps 712 a to 712.
Subsequent steps 723a to 726 constitute a solder printing process 720, and after the component installation and mounting process 730, the reflow soldering process 740, and the temporary storage process 750, the operation for the second process block is completed by the step 751.
The operation flowchart of FIG. 10 differs from that of FIG. 9 only in that a front / back reversing step 710 is added.

Next, FIG. 11 which is a flowchart for explaining the operation corresponding to FIG. 8 will be described.
Step 811 is the operation start step of the third process block, and the subsequent step 812a is the electronic circuit board 10 from the ID information medium 40c provided on the first surface of the electronic circuit board 10 by the information terminal 890 where the board stacker 800 is installed. This is a step of reading out the model information. The subsequent step 812b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 891, and determining whether or not it matches the model information read out in step 812a. If it is OK, the process proceeds to step 817. If it is determined that there is a mismatch, the process proceeds to step 812c.
In step 812c, an abnormality is notified to the operator, the repair process is performed by the operator, and the process returns to step 812a again.
Step 817 is a step of inserting lead terminals of the lead component 11 from the first surface of the electronic circuit board 10 through a board through hole (not shown) until the component mounting on all the electronic circuit boards 10 in the board stacker 800 is completed. Then, component insertion into the electronic circuit board 10 that has been sequentially inserted is executed.
The insertion mounting process 810 is configured by Steps 812a to 817.

The subsequent step 825a is a step of setting the temperature of the flow solder furnace based on the work instruction medium 891, and the subsequent step 825b is the step of setting the second identification mark 30c provided on the first surface of the electronic circuit board 10 by the electronic camera 899. This is a step of reading out information and determining whether or not it matches the contents of the work instruction medium 891 in step 825a. If step 825b is a match determination, it becomes OK and the process moves to step 828, and a mismatch check is made. In this case, it becomes NG and the process proceeds to step 825c.
In step 825c, the operator is notified of the abnormality, the operator performs repair processing, and the process returns to step 825a again.
In step 828, flow soldering based on an appropriate solder material and temperature profile is performed, and the flow soldering for the electronic circuit board 10 that has been sequentially added is executed until the flow soldering for all the electronic circuit boards 10 in the board stacker 800 is completed. Is done.
Steps 825a to 828 correspond to the local flow soldering process 820.
The electronic circuit board 10 subjected to the flow soldering to the lead terminals of the lead component 11 is stored in the substrate stacker in the completed storage process 840 through the cooling process 830 in step 839, and all the electronic circuit boards 10 are stored. Thus, the process proceeds to the operation end step 841 of the third process block.

The outline of the entire operation flowchart will be described. At the start of the operation of each process block shown in FIGS. 6, 7, and 8, the process 620 and the process are performed based on the CAD data of the target electronic circuit board 10. The surface mounter control program used in 730 and the inserter control program used in Step 810 are stored, and the temperature profile of the reflow solder furnace used in Step 630 and Step 740 is set and used in Step 820. The solder material and temperature profile are set.
At the exit of the storage racks 600, 700, and 800 of the electronic circuit board 10 that arrives at the beginning of each process block, a barcode or ID tag memory provided on the electronic circuit board 10 by the information terminals 690, 790, and 890 First basic information obtained from the ID information media 40c and 40s is read out.
The information terminals 696, 796, 892 provided in the equipment machine upstream of the process block read out the second basic information obtained from the work instruction media 695, 795, 891.
The first and second basic information includes processing surface information indicating whether the substrate surface to be processed in the process block is related to the first surface or the second surface. At least one or both of the two basic information items include first material information on whether the reflow solder is lead-free solder or leaded solder and second information on whether the flow solder is lead-free solder or leaded solder. It contains direct information on the material information.
When the direct information is included in only one of the first and second basic information, it will share a linkage number for authenticating that it is a pair of appropriate combinations. ing. For example, the second basic information obtained from the work instruction medium includes the first and second material information and the model number information of the applied electronic circuit board, and is obtained from the electronic circuit board 10. Is model number information, the model number information corresponds to the linkage number.
Steps 612b, 712b, and 812b serving as operation start monitoring means are means for permitting the operation start of the process block when the first and second basic information matches.

Steps 613b and 723b serving as the first monitoring means are operation specifications provided on ID information media 40s and 40c provided on the electronic circuit board 10 or work instruction media 695 and 795 corresponding to the solder printing processes 610 and 720, respectively. The basic information based on at least one of the information matches the actual product information read from the ID information media 691 and 791 by the barcode or ID tag memory provided on the metal mask 50, and the metal of the appropriate management number It is a means of monitoring whether a mask is being used.
Steps 614b and 724b serving as the second monitoring means are operation specifications provided on the ID information media 40s and 40c provided on the electronic circuit board 10 or the work instruction media 695 and 795 corresponding to the solder printing processes 610 and 720, respectively. The basic information based on at least one of the information and the actual product information read from the ID information media 693 and 793 by the barcode or ID tag memory provided in the solder container 90 match, and the solder having the proper management number This is means for monitoring whether or not the solder stored in the container 90 is used.

Steps 635b and 745b serving as third monitoring means are obtained by imaging the first identification marks 20s and 20c provided on the second surface 10b or the first surface 10a of the electronic circuit board 10 with the electronic cameras 699 and 799. And the operation specification information provided in the work instruction media 697 and 797 corresponding to the reflow soldering processes 630 and 740 match, and the set temperature of the reflow soldering furnace conforms to lead-free or leaded solder. It is a means to monitor whether or not. Step 825b as the fourth monitoring means includes identification information obtained by imaging the second identification mark 30c provided on the first surface 10a of the electronic circuit board 10 with the electronic camera 899, and the local flow soldering process 820. It is means for monitoring whether the operation specification information provided in the corresponding work instruction medium 891 matches, and whether the solder material type and set temperature of the flow solder furnace are compatible with lead-free or leaded solder.
Work instruction medium 695, 697, 795, 797, 891 is a program memory stored in a programmable controller for drive control of equipment machine operating in solder printing process 610, 720 or reflow soldering process 630, 740 or local flow soldering process 820 Or a bar code posted on a work instruction posted on the equipment machine.

(3) Main points and features of the second embodiment According to the electronic circuit board management method according to the second embodiment of the present invention, the surface mount components 13 and 12 and the lead component 11 to be inserted into the substrate through hole are mounted. A method of managing the type of solder for the electronic circuit board 10 that is solder-connected to the connecting copper foil land by lead-free solder or leaded solder, and the reflow solder for the surface mount components 13 and 12 is lead-free solder. The first identification marks 20s and 20c that obtain different views by opening or closing the opening of the metal mask depending on whether it is leaded solder or leaded solder, and whether the flow solder for the lead component 11 is lead-free solder or leaded solder A second identification mark 30c that obtains a different overview by opening or closing the opening of the metal mask depending on whether or not 10, a solder printing process 610, a component installation / mounting process 620, a reflow soldering process 630, a solder printing process 720 for the first surface 10 a of the electronic circuit board 10, a component installation / mounting process 730, and a reflow process. It includes a soldering process 740, an insertion mounting process 810 of the lead component 11 on the first surface 10a, and a local flow soldering process 820 on the second surface 10b.

The solder printing processes 610 and 720 on the second and first surfaces are both metal masks on the copper foil land of the electronic circuit board 10 under the jurisdiction of the first and second monitoring means 613b, 723b, 614b, and 724b. 50, a solder paste is applied through the first and second identification marks 20s, 20c, and 30c in the solder printing steps 610 and 720. .
The first monitoring means 613b and 723b are used in at least one of the operation specification information provided in the ID information media 40s and 40c provided on the electronic circuit board 10 or the work instruction media 695 and 795 corresponding to the solder printing process. Whether the basic information based on the actual information read from the ID information medium 691 by the barcode or ID tag memory provided on the metal mask 50 is matched, and the metal mask having an appropriate management number is used Is a means of monitoring.
The second monitoring means 614b and 724b are provided on at least one of the operation specification information provided on the ID information media 40s and 40c provided on the electronic circuit board 10 or the work instruction media 695 and 795 corresponding to the solder printing process. The basic information on the basis and the actual product information read from the ID information media 693 and 793 by the barcode or ID tag memory provided in the solder container 90 match and are stored in the solder container 90 having an appropriate management number. This is a means for monitoring whether or not the solder is used.

The component installation / mounting steps 620 and 730 on the second and first surfaces are steps for mounting the surface mount components 13 and 12 on the copper foil land to which the solder paste is applied.
The reflow soldering processes 630 and 740 on the second and first surfaces are performed by heating and cooling the electronic circuit board 10 on which the surface mount components 13 and 12 are mounted under the jurisdiction of the third monitoring means 635b and 745b. Is a step of melting and soldering.
The third monitoring means 635b, 745b are identification information obtained by imaging the first identification marks 20s, 20c provided on the second surface 10b or the first surface 10a of the electronic circuit board 10 with the electronic cameras 699, 799. And the operation specification information provided in the work instruction media 697 and 797 corresponding to the reflow soldering process are matched, and it is monitored whether the set temperature of the reflow soldering furnace is suitable for lead-free or leaded solder. Means.
The insertion mounting process 810 is a process of inserting the lead terminal of the lead component 11 from the first surface 10 a side through the through hole of the electronic circuit board 10.
The local flow soldering process 820 solders the lead component 11 temporarily attached in the insertion mounting process 810 under the jurisdiction of the fourth monitoring means 825b by contacting and adhering molten solder from below the second surface 10b. It is a process.

The fourth monitoring means 825b includes identification information obtained by imaging the second identification mark 30c provided on the first surface 10a of the electronic circuit board 10 with the electronic camera 899, and work corresponding to the local flow soldering process. This is a means for monitoring whether or not the operation specification information provided in the instruction medium 891 matches, and whether the type and set temperature of the solder material of the flow solder furnace are compatible with lead-free or leaded solder.
The work instruction medium 695, 697, 795, 797, 891 is a program memory stored in a programmable controller for driving control of an equipment machine operating in a solder printing process, a reflow soldering process or a local flow soldering process, or the equipment This is a bar code posted on the work instructions posted on the machine.

As described above, according to the electronic circuit board management method according to the second embodiment of the present invention, the double-sided reflow solder to which the local flow solder is added is applied, and the lead of the electronic circuit board in which lead-free or leaded solder is used. In the attaching process, a first identification mark for identifying lead-free / leaded reflow solder and a second identification mark for identifying lead-free / leaded reflow solder are formed in the solder printing process. The second identification mark is picked up by an electronic camera immediately before the soldering process to check whether or not appropriate temperature control depending on the solder material is performed.
In the solder printing process, it is confirmed whether an appropriate metal mask and solder are used.
Therefore, the wrong identification mark is prevented from being formed, and the identification mark is not only used in the recycling process but also used in the manufacturing process of the electronic circuit board to prevent erroneous process management. There is an effect that can be done.

In addition, as an execution order of each process, first, a solder printing process 610 for the second surface 10b of the electronic circuit board 10, a component installation / mounting process 620, and a reflow soldering process 630 are performed.
Subsequently, through a board front / back reversing process 710, a solder printing process 720, a component installation / mounting process 730, and a reflow soldering process 740 are performed on the first surface 10a of the electronic circuit board 10.
Furthermore, an insertion mounting process 810 of the lead component 11 with respect to the first surface 10a and a local flow soldering process 820 with respect to the second surface 10b are performed.
As described above, in the soldering process of the electronic circuit board in which the double-sided reflow soldering of the surface mounting component to which the local flow solder is added to the lead component is preceded by the reflow soldering of the second surface to which the lead component is not attached, Local flow soldering is performed in the final process.
Therefore, since the front and back inversion of the electronic circuit board needs to be performed only once, the entire process is simplified.

Each process is divided into a plurality of process blocks that start operations under the jurisdiction of the operation start monitoring means 612b, 712b, and 812b.
At the exit of the electronic circuit board storage racks 600, 700, and 800 installed at the beginning of the process block, it is obtained from the bar code provided on the electronic circuit board 10 or the ID information media 40c and 40s by the ID tag memory. Information terminals 690, 790, and 890 for reading the first basic information are installed, and second basic information obtained from work instruction media 695, 795, and 891 provided in the equipment machine upstream of the process block Information terminals 696, 796, and 892 for reading are installed.
The reflow soldering process 630, 740 or the flow soldering process 820 is arranged at the final position of the divided process block.
The operation start monitoring means 612b, 712b, 812b is a means for permitting the operation start of the process block when the first and second basic information matches.
As described above, the entire process is divided into a plurality of process blocks, and the reflow solder process or the flow solder process is arranged at the final position of the divided process block. The first and second basic information is collated.
Therefore, there is a feature that the electronic circuit board is not left in the high-temperature furnace due to retention between processes accompanying the occurrence of abnormality.
In addition, there is a feature that the ID code information provided on the electronic circuit board and the operation specification information obtained from the work instruction medium are collated to prevent erroneous insertion of the electronic circuit board.

Furthermore, the first and second basic information includes processing surface information indicating whether the substrate surface processed in the process block is related to the first surface or the second surface, -At least one or both of the second basic information is the first material information on whether the reflow solder is lead-free solder or lead-free solder, and whether the flow solder is lead-free solder or lead-free solder Includes direct information about the second material information.
When the direct information is included in only one of the first and second basic information, the link number for authenticating that the pair is a proper combination is shared. .
As described above, the first and second basic information applied by the operation start monitoring means includes the processing surface information in addition to the solder material information.
Therefore, there is a feature that the first and second surfaces of the electronic circuit board are not erroneously inserted at the beginning of each process block.

Embodiment 3 FIG.
(1) Detailed Description of Configuration A component mounting soldering process for an electronic circuit board according to Embodiment 3 of the present invention will be described below.
In the case of the third embodiment as compared with the second embodiment described above, the reflow soldering is performed only on the first surface, and even if there is a surface-mounted component on the second surface, this surface mounting is performed. The main difference between the parts is that flow soldering is performed together with the lead parts and reflow soldering is not performed on the second surface, and the process order is changed accordingly.
FIG. 12 is an explanatory view showing a first part of a manufacturing process of an electronic circuit board according to Embodiment 3 of the present invention.
In FIG. 12, the board stacker 200, the solder printing process 210, the component installation / mounting process 220, the reflow soldering process 230, and the temporary storage process 240 are the board stacker 600, the solder printing process 610, and the component installation / mounting process 620 shown in FIG. The reflow soldering process 630 and the temporary storage process 640 are exactly the same process blocks, but in the case of FIG. 12, it is a process block for performing reflow soldering on the first surface.

Next, FIG. 13 which shows the 2nd process block following the manufacturing process of FIG. 12 is demonstrated.
FIG. 13 is an explanatory view showing a second part of the manufacturing process of the electronic circuit board according to the third embodiment of the present invention.
In FIG. 13, in the substrate stacker 300 in which the electronic circuit board 10 is temporarily stored in the temporary storage process 240, a number of in-process electronic circuit boards 10 are stored with the first surface as the upper surface.
The front / back reversing process 310 that is the first stage process is a process that reverses the front and back of the electronic circuit board 10 and puts it in the adhesive coating process 320 of the next stage process.
The first surface 10a of the electronic circuit board 10 is provided with, for example, an ID information medium 40c using a barcode, and a model number that becomes a feature of the electronic circuit board 10 that is inserted by the barcode reader 390 that is an information terminal. It is confirmed.
The reversing machine used in the front / reverse reversing process 310 is provided with a work instruction medium 391 using a bar code printed on, for example, a work instruction, and surface mounting to be performed by a bar code reader 392 serving as an information terminal. The model number of the electronic circuit board 10 applied to the component bonding process is read out.

In the adhesive material applying step 320, the electronic circuit board 10 transferred by the free flow conveyor is lifted and stopped at a predetermined position to apply the adhesive material.
The adhesive is applied to each part of the electronic circuit board 10 from the adhesive container 92 through a nozzle provided at the tip of the three-dimensional robot hand.
The application part of the adhesive is an attachment position of the surface mount component 13 extracted from CAD data of the electronic circuit board 10 in advance.
In the component installation / mounting process 330, the electronic circuit board 10 transferred by the free flow conveyor is raised and stopped at a predetermined position, and the surface-mounted component 13 is installed by the three-dimensional robot hand.
The installation position of the surface mounting component 13 is based on data previously extracted from CAD data of the electronic circuit board 10.
The electronic circuit board 10 that is sequentially transferred by the free flow conveyor is heated and dried and cooled in an adhesive drying process 340 to bond the surface mount component 13 to a predetermined portion of the electronic circuit board 10, and then through the front / back reversing process 350. In the temporary storage step 360, the substrate is temporarily stored in the substrate stacker.

Next, FIG. 14 which shows the 3rd process block following the manufacturing process of FIG. 13 is demonstrated.
FIG. 14 is an explanatory view showing a third part of the manufacturing process of the electronic circuit board according to Embodiment 3 of the present invention.
In FIG. 14, a substrate stacker 400 in which the electronic circuit board 10 is temporarily stored in the temporary storage process 360 contains a number of in-process electronic circuit boards 10 with the first surface as the upper surface.
In the insertion mounting process 410, the electronic circuit board 10 transferred from the board stacker 400 is supplied to the electronic circuit board 10 and is moved up and stopped at a predetermined position by the free flow conveyor. 14 is inserted into a substrate through hole (not shown).
The first surface 10a of the electronic circuit board 10 is provided with, for example, a bar code ID information medium 40c, and the model number that is the feature of the electronic circuit board 10 inserted by the bar code reader 490 that is an information terminal is confirmed. Is done.
In the subsequent insertion mounting process 420, the electronic circuit board 10 transferred by the free flow conveyor is lifted and stopped at a predetermined position, and the lead component 11 is inserted into a board through hole (not shown) by an inserter which is a three-dimensional robot. Is temporarily stored in the substrate stacker.
The insertion positions of the lead components 14 and 11 in the insertion mounting processes 410 and 420 are based on data extracted in advance from CAD data of the electronic circuit board 10.
The inserters used in the insertion mounting processes 410 and 420 are provided with, for example, bar code work instruction media 491 and 493 provided in the work instruction sheet. The model number of the electronic circuit board 10 applied by the component insertion to be implemented is read out.

Next, FIG. 15 which shows the 4th process block following the manufacturing process of FIG. 14 is demonstrated.
FIG. 15 is an explanatory view showing a fourth part of the manufacturing process of the electronic circuit board according to the third embodiment of the present invention.
In FIG. 15, a substrate stacker 500 in which the electronic circuit board 10 is temporarily stored in the temporary storage step 430 stores a large number of in-process electronic circuit boards 10 with the first surface as an upper surface.
In the flow soldering process 510, flux is applied to the lead terminal portions of the lead components 11 and 14 of the electronic circuit board 10 and the electrode portion of the surface mounting component 13 which are transferred by the free flow conveyor, and after preheating, the flow solder is applied. Then, after passing through the cooling step 520, the finished storage step 530 is stacked and stored in a stacker for transfer to the product assembly step.
The electronic camera 599 is provided immediately before the flow soldering process 510 and images the second identification mark 30 c provided on the first surface 10 a of the electronic circuit board 10.
The soldering machine used in the flow soldering process 510 is provided with a work instruction medium 591 using, for example, a bar code printed on a work instruction, and a flow to be performed by a bar code reader 592 serving as an information terminal. Whether or not the temperature management specification applied to the soldering process corresponds to the second identification mark 30c provided on the electronic circuit board 10 is read out.

The first surface 10a of the electronic circuit board 10 is provided with an ID information medium 40c using, for example, a barcode, and is a model that becomes a feature of the electronic circuit board 10 inserted by the barcode reader 590 that is an information terminal. The number is confirmed.
The flow soldering machine used in the flow soldering process 510 is provided with the above-described work instruction medium 591, and an electronic circuit board to be applied to the flow soldering process to be performed by a bar code reader 592 serving as an information terminal. Ten model numbers are read out.
The flow soldering process 510 starts to operate when the information of the barcode readers 590 and 592 matches and the information obtained from the electronic camera 599 and the information obtained from the barcode reader 592 match. It has become.

FIG. 16 is a process flowchart showing the manufacturing process of FIG.
FIG. 17 is a process flowchart showing the manufacturing process of FIG.
18 is a process flowchart showing the manufacturing process of FIG.
FIG. 19 is a process flowchart showing the manufacturing process of FIG.

(2) Detailed Description of Action and Operation The action and operation of the component mounting soldering process for the in-vehicle electronic board according to the third embodiment configured as described above will be described.
First, FIG. 16 which is a flowchart for explaining the operation with respect to FIG. 12 will be described.
Step 211 is an operation start step of the first process block, and a series of steps from the start step 211 to the operation end step 241 of the first process block reflows the surface mount component 12 on the first surface of the electronic circuit board 10. The operation is the same as in the case of FIG.
However, in the case of FIG. 9, it is reflow soldering of the surface mounting component 13 to the second surface. In FIG. 9, reference numerals of 600 series (corresponding to FIG. 6) are used, whereas in FIG. , Codes in the 200s (corresponding to FIG. 12) are used.

Next, FIG. 17 which is a flowchart for explaining the operation with respect to FIG. 13 will be described.
Step 311 is the operation start step of the second process block, and the subsequent step 311a is YES if there is a surface mount component 13 to be mounted on the second surface, and proceeds to step 312a. This is a determination step that proceeds to step 361, and the determination step 311a is determined by the operator.
The subsequent step 312a is a step in which the board stacker 300 is installed and the information terminal 390 reads out the model information of the electronic circuit board 10 from the ID information medium 40c provided on the first surface of the electronic circuit board 10.
The subsequent step 312b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 391 and determining whether or not it matches the model information read out in step 312a. If the determination is OK, the process proceeds to step 312, and if the determination is a mismatch, the determination is NG and the process proceeds to step 312 c.
In step 312c, an abnormality is notified to the operator, repair processing is performed by the operator, and the process returns to step 312a again.
Step 312 is a step in which the electronic circuit board 10 is sequentially reversed, and the substrate reversing process 310 is configured by steps 312 a to 312.

  The subsequent step 326a is a step of applying an adhesive and corresponds to the adhesive application step 320, and the subsequent step 337 is a step of installing the surface mounting component 13 and corresponds to the component installation and mounting step 330. The subsequent step 347 is a step of heating and drying and cooling the adhesive, and corresponds to the adhesive drying step 340, and the subsequent step 352 reverses the front and back of the electronic circuit board 10 again and puts it back. This corresponds to step 350, and then proceeds to the operation end step 361 through the temporary storage step 360.

Next, FIG. 18 which is a flowchart for explaining the operation with respect to FIG. 14 will be described.
Step 411 is the operation start step of the third process block, and the subsequent step 411a is YES if there is a lead component 14 to be mounted on the second surface, and proceeds to step 412a, otherwise, step 422a. This determination step 411a is determined by the operator.
The subsequent step 412a is a step in which the board stacker 400 is installed and the information terminal 490 reads the model information of the electronic circuit board 10 from the ID information medium 40c provided on the first surface of the electronic circuit board 10.
The subsequent step 412b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 491 and determining whether or not it matches the model information read out in step 412a. If the determination is OK, the process proceeds to step 417. If the determination is a mismatch, the determination is NG and the process proceeds to step 412c.
In step 412c, an abnormality is notified to the operator, repair processing is performed by the operator, and the process returns to step 412a again.
Step 417 is a step of inserting lead terminals of the lead component 14 from the first surface of the electronic circuit board 10 through a board through hole (not shown) until component mounting on all of the electronic circuit boards 10 in the board stacker 400 is completed. Then, component insertion into the electronic circuit board 10 that has been sequentially inserted is executed.
The insertion mounting process 410 is configured by steps 412a to 417.
Similarly, the subsequent steps 422a to 427 constitute the insertion mounting process 420, the lead component 11 is inserted in step 427, and then the provisional storage process 430 is followed to move to the operation end step 431. Yes.

Next, FIG. 19 which is a flowchart for explaining the operation with respect to FIG. 15 will be described.
Step 511 is the operation start step of the fourth process block, and the following step 512a is the electronic circuit board 10 from the ID information medium 40c provided on the first surface of the electronic circuit board 10 by the information terminal 590 where the board stacker 500 is installed. This is a step of reading out the model information. The subsequent step 512b is a step of reading out the model information of the electronic circuit board 10 obtained from the work instruction medium 591 and determining whether or not it matches the model information read out in step 512a. If the determination is OK, the process proceeds to step 515a. If the determination is a mismatch, the determination is NG and the process proceeds to step 512c.
In step 512c, the operator is notified of the abnormality, the operator performs a repair process, and returns to step 512a again.

The subsequent step 515a is a step of setting the temperature of the flow solder furnace based on the work instruction medium 591. The subsequent step 515b is the step of setting the second identification mark 30c provided on the first surface of the electronic circuit board 10 by the electronic camera 599. This is a step of reading out information and determining whether or not it matches the contents of the work instruction medium 591 in step 515a. If the step 515b is a match determination, it becomes OK and the process proceeds to step 518, and a mismatch check is made. If there is, it becomes NG and shifts to Step 515c.
In step 515c, an abnormality is notified to the operator, the repair process is performed by the operator, and the process returns to step 515a again.
In step 518, flow soldering based on an appropriate solder material and temperature profile is performed, and the flow soldering to the electronic circuit board 10 that has been sequentially added is executed until the flow soldering to all the electronic circuit boards 10 in the board stacker 500 is completed. Is done.
Steps 512a to 518 correspond to the flow soldering process 510.
The electronic circuit board 10 subjected to the flow soldering to the lead terminals of the surface mount component 13 and the lead components 14 and 11 is stored in the substrate stacker in the completed storage process 530 through the cooling process 520 in step 529, and the entire electronic circuit. When the substrate 10 is stored, the process proceeds to the operation end step 531 of the fourth process block.

The outline of the entire operation flowchart will be described. When the operation of each process block shown in FIGS. 12 to 15 is started, it is used in the processes 220 and 330 based on the CAD data of the target electronic circuit board 10. The surface mounter control program to be used, the inserter control program used in steps 410 and 420, and the adhesive application position data used in step 320 are stored, and the reflow solder used in step 230 is stored. A furnace temperature profile is set, the solder material and temperature profile used in step 510 are set, and an adhesive drying temperature profile used in step 340 is set.
A barcode provided on the electronic circuit board 10 by the information terminals 290, 390, 490, and 590 at the exit of the storage racks 200, 300, 400, and 500 of the electronic circuit board 10 that arrives at the beginning of each process block, Or the 1st basic information obtained from ID information media 40c and 40s by ID tag memory is read.
Information terminals 296, 392, 492, 494, 592 provided in the equipment machine upstream of the process block read the second basic information obtained from the work instruction media 295, 391, 491, 493, 591.
The first and second basic information includes processing surface information indicating whether the substrate surface to be processed in the process block is related to the first surface or the second surface. At least one or both of the two basic information items include first material information on whether the reflow solder is lead-free solder or leaded solder and second information on whether the flow solder is lead-free solder or leaded solder. It contains direct information on the material information.
When the direct information is included in only one of the first and second basic information, it will share a linkage number for authenticating that it is a pair of appropriate combinations. ing. Steps 212b, 312b, 412b, 422b, and 512b, which are operation start monitoring means, are means for permitting the operation start of the process block when the first and second basic information match.

Step 213b serving as the first monitoring means includes basic information based on at least one of the ID information medium 40c provided on the electronic circuit board 10 or the operation specification information provided on the work instruction medium 295 corresponding to the solder printing process 210. And the actual product information read from the ID information medium 291 by the barcode provided on the metal mask 50 or the ID tag memory match, and it is monitored whether or not the metal mask having an appropriate management number is used. It is a means.
Step 214b serving as the second monitoring means includes basic information based on at least one of the operation specification information provided on the ID information medium 40c provided on the electronic circuit board 10 or the work instruction medium 295 corresponding to the solder printing process 210. And the actual product information read from the ID information medium 293 by the barcode or ID tag memory provided in the solder container 90 match, and the solder stored in the solder container 90 with an appropriate management number is used. It is a means to monitor whether or not.

Step 235 b serving as the third monitoring means corresponds to the identification information obtained by imaging the first identification mark 20 c provided on the first surface 10 a of the electronic circuit board 10 with the electronic camera 299 and the reflow soldering process 230. Thus, the operation specification information provided in the work instruction medium 297 is matched, and it is a means for monitoring whether the set temperature of the reflow soldering furnace is suitable for lead-free or leaded solder.
Step 515b serving as the fourth monitoring means corresponds to the identification information obtained by imaging the second identification mark 30c provided on the first surface 10a of the electronic circuit board 10 with the electronic camera 599, and the flow soldering process 510. This is means for monitoring whether the operation specification information provided in the work instruction medium 591 matches, and whether the type of solder material and the set temperature of the flow solder furnace are compatible with lead-free or leaded solder.
The work instruction media 295, 297, 391, 491, 493, 591 are used to drive equipment machines that operate in the solder printing process 210, the reflow soldering process 230, the front / back reversing process 310, the component insertion mounting process 410, 420, or the flow soldering process 510. It is a program memory stored in a programmable controller for control, or a bar code posted on a work instruction sheet posted on the equipment machine.

(3) Main points and features of the third embodiment According to the electronic circuit board management method according to the third embodiment of the present invention, the surface mount components 12 and 13 and the lead components 14 and 11 inserted into the substrate through holes are provided. A method of managing the type of solder for an electronic circuit board 10 that is mounted and solder-connected to a copper foil land for connection by lead-free solder or leaded solder. The first identification mark 20c that obtains a different overview by opening or closing the opening of the metal mask depending on whether the lead solder is lead-free solder or lead-free solder, and whether the flow solder for the lead components 14 and 11 is lead-free solder or lead A second identification mark 30c that obtains a different appearance by opening or closing the opening of the metal mask depending on whether it is solder or not. A solder printing process 210 for the first surface 10 a of the circuit board 10, a component installation mounting process 220, a reflow soldering process 230, and an adhesive mounting process 320, 330 for the surface mounting component 13 for the second surface 10 b of the electronic circuit board 10; 340 or at least one or both of insertion mounting steps 410 and 420 of the lead components 14 and 11 with respect to the first surface 10a, and a flow soldering step 510 with respect to the second surface 10b.

The solder printing step 210 is a step of applying a solder paste to the copper foil land of the electronic circuit board 10 through the metal mask 50 under the jurisdiction of the first and second monitoring means 213b and 214b. In the printing step 210, the identification solder paste required for the first and second identification marks 20c, 20s, and 30c is applied.
The first monitoring unit 213b includes basic information based on at least one of the ID information medium 40c provided on the electronic circuit board 10 or the operation specification information provided on the work instruction medium 295 corresponding to the solder printing step 210, A means for monitoring whether the bar code provided on the metal mask 50 or the actual product information read from the ID information medium 291 by the ID tag memory matches and a metal mask with an appropriate management number is used. is there.
The second monitoring means 214b includes basic information based on at least one of the ID information medium 40c provided on the electronic circuit board 10 or the operation specification information provided on the work instruction medium 295 corresponding to the solder printing step 210, Whether the actual product information read from the ID information medium 293 by the barcode or ID tag memory provided in the solder container 90 matches, and the solder stored in the solder container of the appropriate management number is used Is a means of monitoring.

The component installation / mounting step 220 is a step of mounting the surface-mounted component 12 on the copper foil land to which the solder paste is applied.
The reflow soldering step 230 is a step of heating and cooling the electronic circuit board 10 on which the surface mount component 12 is mounted under the jurisdiction of the third monitoring unit 235b to melt and solder the solder paste.
The third monitoring means 235b is a work corresponding to the identification information obtained by imaging the first identification mark 20c provided on the first surface 10a of the electronic circuit board 10 with the electronic camera 299 and the reflow soldering process 230. This is means for monitoring whether or not the operation specification information provided in the indication medium 297 matches and the set temperature of the reflow solder furnace is suitable for lead-free or leaded solder.
The adhesive mounting process includes an adhesive material applying process 320 for the second surface 10b of the electronic circuit board 10, an installation mounting process 330 for the surface mount component 13, and an adhesive drying process 340. The surface mount component 13 is bonded and dried. This is a step of performing temporary attachment.
The insertion mounting processes 410 and 420 are processes for inserting the lead terminals of the lead components 14 and 11 from the first surface 10 a side through the through hole of the electronic circuit board 10.

The flow solder process 510 is performed under the jurisdiction of the fourth monitoring means 515b.
20, 330, 340 or at least one of the surface mounting component 13 or the lead components 14, 11 temporarily attached in the insertion mounting process 410, 420 is soldered by contacting and adhering molten solder from below the second surface 10 b. It is a process.
The fourth monitoring means 515b includes identification information obtained by imaging the second identification mark 30c provided on the first surface 10a of the electronic circuit board 10 with the electronic camera 599, and work corresponding to the flow soldering process 510. This is means for monitoring whether or not the operation specification information provided in the instruction medium 591 matches, and whether or not the type of solder material and the set temperature of the flow solder furnace are compatible with lead-free or leaded solder.
The work instruction medium 295, 297, 391, 491, 493, 591 is a program memory stored in a programmable controller for driving control of an equipment machine operating in a solder printing process, a reflow soldering process or a flow soldering process, or This is a bar code posted on the work instructions posted on the equipment machine.

As described above, according to the electronic circuit board management method according to the third embodiment of the present invention, the first surface is subjected to reflow soldering using lead-free or leaded solder, and the second surface is flow soldering using lead-free or leaded solder. In the soldering process of the electronic circuit board to which the soldering is applied, the first identification mark for identifying lead-free / leaded reflow solder and the second identification mark for identifying lead-free / leaded reflow soldering are solder printing processes. The first and second identification marks are picked up by an electronic camera immediately before the soldering process, and it is confirmed whether appropriate temperature control depending on the solder material is performed.
In the solder printing process, it is confirmed whether an appropriate metal mask and solder are used.
Therefore, the wrong identification mark is prevented from being formed, and the identification mark is not only used in the recycling process but also used in the manufacturing process of the electronic circuit board to prevent erroneous process management. There is an effect that can be done.

As the execution order of each process, first, a solder printing process 210 for the first surface 10a of the electronic circuit board 10, a component installation / mounting process 220, and a reflow soldering process 230 are performed.
Subsequently, the substrate front / back reversing step 310, the surface mounting component 13 bonding / mounting steps 320, 330, and 340 to the second surface 10b of the electronic circuit board 10 and the front / back reversing step 350 are performed again, or the first surface 10a. At least one of the insertion mounting steps 410 and 420 for the lead parts 14 and 11 is executed, and the flow soldering step 510 for the second surface 10b is further executed.
As described above, in the soldering process of the electronic circuit board in which the reflow solder for the surface mount component is applied to the first surface and the flow solder for the lead component or the surface mount component is applied to the second surface, the reflow solder for the first surface If there is a surface-mounted component on the second side, first reverse the front and back of the electronic circuit board, then temporarily attach the surface-mounted component, and then reverse the front and back of the electronic circuit board and then lead component Insertion and flow soldering on the second surface.
Therefore, the front and back inversion of the electronic circuit board is characterized in that the entire process is simplified because it is performed twice if there is surface mounting on the second surface and is not performed if there is no surface mounting component on the second surface.

Furthermore, each process is divided into a plurality of process blocks that start the operation under the jurisdiction of the operation start monitoring means 212b, 312b, 412b, 422b, and 512b.
At the exit of the electronic circuit board storage racks 200, 300, 400, 500 arriving and installed at the beginning of the process block, barcodes provided on the electronic circuit board 10 or ID information media 40c, 40s using an ID tag memory are provided. Information terminals 290, 390, 490, and 590 for reading the first basic information obtained from the work blocks are installed, and work instruction media 295, 391, 491, 493, and 591 provided in the equipment machine upstream of the process block. Information terminals 296, 392, 492, 592 for reading the second basic information obtained from are installed.
The reflow soldering process 230, the flow soldering process 510, or the adhesive drying process 340 is arranged at the final position of the divided process block.
The operation start monitoring means 212b, 312b, 412b, 422b, and 512b are means for permitting the operation start of the process block when the first and second basic information matches.
As described above, the entire process is divided into a plurality of process blocks, and the reflow solder process, the flow solder process, or the adhesive drying process is arranged at the final position of the divided process blocks, and at the start process of each process block The first and second basic information are collated by the operation start monitoring means.
Therefore, there is a feature that the electronic circuit board is not left in the high-temperature furnace due to retention between processes accompanying the occurrence of abnormality.
In addition, there is a feature that the ID code information provided on the electronic circuit board and the operation specification information obtained from the work instruction medium are collated to prevent erroneous insertion of the electronic circuit board.

The first and second basic information includes processing surface information indicating whether the substrate surface processed in the process block is related to the first surface 10a or the second surface 10b. At least one or both of the first and second basic information are the first material information on whether the reflow solder is lead-free solder or leaded solder, and whether the flow solder is lead-free or leaded solder. It contains direct information on the second material information.
When the direct information is included in only one of the first and second basic information, the link number for authenticating that the pair is a proper combination is shared. .
As described above, the first and second basic information applied by the operation start monitoring unit includes the processing surface information in addition to the solder material information.
Therefore, there is a feature that the first and second surfaces of the electronic circuit board are not erroneously inserted at the beginning of each process block.

It is a double-side view which shows the electronic circuit board by Embodiment 1 of this invention. It is detail drawing which shows the 1st identification mark of the electronic circuit board by Embodiment 1 of this invention. It is detail drawing which shows the 2nd identification mark of the electronic circuit board by Embodiment 1 of this invention. It is detail drawing which shows the deformation | transformation type 1st, 2nd identification mark of the electronic circuit board by Embodiment 1 of this invention. It is detail drawing which shows the 1st, 2nd identification mark of the improved type of the electronic circuit board by Embodiment 1 of this invention. It is explanatory drawing which shows the 1st part of the manufacturing process of the electronic circuit board by Embodiment 2 of this invention. It is explanatory drawing which shows the 2nd part of the manufacturing process of the electronic circuit board by Embodiment 2 of this invention. It is explanatory drawing which shows the 3rd part of the manufacturing process of the electronic circuit board by Embodiment 2 of this invention. FIG. 7 is a process flowchart showing the manufacturing process of FIG. 6. FIG. 8 is a process flowchart showing the manufacturing process of FIG. 7. FIG. 9 is a process flowchart showing the manufacturing process of FIG. 8. It is explanatory drawing which shows the 1st part of the manufacturing process of the electronic circuit board by Embodiment 3 of this invention. It is explanatory drawing which shows the 2nd part of the manufacturing process of the electronic circuit board by Embodiment 3 of this invention. It is explanatory drawing which shows the 3rd part of the manufacturing process of the electronic circuit board by Embodiment 3 of this invention. It is explanatory drawing which shows the 4th part of the manufacturing process of the electronic circuit board by Embodiment 3 of this invention. FIG. 13 is a process flowchart showing the manufacturing process of FIG. 12. FIG. 14 is a process flow diagram illustrating the manufacturing process of FIG. 13. FIG. 15 is a process flowchart showing the manufacturing process of FIG. 14. FIG. 16 is a process flowchart showing the manufacturing process of FIG. 15.

Explanation of symbols

10 Electronic circuit board 10a First surface 10b Second surface 11 Lead component (connector)
12, 13 Surface mount component 14 Lead component (large component)
20c First identification mark (first side)
20s First identification mark (second side)
201 First identification mark (Lead-free / No plating)
202 First identification mark (leaded / unplated)
203 First identification mark (leaded / plated)
204 First identification mark (no special lead / no plating)
205 First identification mark (life indication, no plating)
21-24 Outer part 25 Core part 26 Solder resist film 27 Solder paste 28 Solder plating 29 Preflux 30c Second identification mark (first surface)
301 Second identification mark (Lead-free / No plating)
302 Second identification mark (leaded / no plating)
303 Second identification mark (leaded / plated)
304 Second identification mark (special lead-free, no plating)
305 Second identification mark (life indication, no plating)
31-34 Outer part 35 Core part 36 Solder resist film 37 Solder paste 38 Solder plating 39 Preflux 40c ID information medium (first side)
40s ID information medium (second side)
50 Metal mask 53a Outer opening 54a Thin portion 53b Outer opening 54b Thin portion 90 Solder container 210 Solder printing process 212b Operation start monitoring means 213b First monitoring means 214b Second monitoring means 220 Component installation / mounting process 230 Reflow soldering process 235b Third monitoring means 290, 292 Bar code reader (information terminal)
291 ID information medium (metal mask)
293 ID information medium (solder container)
294,296 Bar code reader (information terminal)
295 Work instruction medium (work instruction)
297 Work instruction medium (work instruction)
298 Bar code reader (information terminal)
299 Electronic camera 310 Front / reverse inversion process 312b Operation start monitoring means 320 Adhesive material application process 330 Component installation / mounting process 340 Adhesive drying process 350 Front / back inversion process 390
Bar code reader (information terminal)
391 Work instruction medium (work instruction sheet)
392 Barcode reader (information terminal)
410 Insertion mounting process 412b, 422b Operation start monitoring means 420 Insertion mounting process 490 Bar code reader (information terminal)
491,493 Work instruction medium (work instruction sheet)
492,494 Bar code reader (information terminal)
510 Flow soldering process 512b Operation start monitoring means 515b Fourth monitoring means 590 Bar code reader (information terminal)
591 Work instruction medium (work instruction sheet)
592 Barcode reader (information terminal)
599 Electronic camera 610 Solder printing process 612b Operation start monitoring means 613b First monitoring means 614b Second monitoring means 620 Component installation mounting process 630 Reflow soldering process 635b Third monitoring means 690, 692 Bar code reader (information terminal)
691 ID information medium (metal mask)
693 ID information medium (solder container)
694,696 Bar code reader (information terminal)
695 Work instruction medium (work instruction)
697 Work instruction medium (work instruction)
698 Bar code reader (information terminal)
699 Electronic camera 710 Front / back reversing process 712b Operation start monitoring means 720 Solder printing process 723b First monitoring means 724b Second monitoring means 730 Component installation / mounting process 740 Reflow soldering process 745b Third monitoring means 790 Bar code reader (information terminal) )
791 ID information medium (metal mask)
792 Barcode reader (information terminal)
793 ID information medium (solder container)
794 Bar code reader (information terminal)
795 Work instruction medium (work instruction)
796 Barcode reader (information terminal)
797 Work instruction medium (work instruction)
798 Bar code reader (information terminal)
799 Electronic camera 810 Insertion mounting process 812b Operation start monitoring means 820 Local flow soldering process 825b Fourth monitoring means 890 Bar code reader (information terminal)
891 Work instruction medium (work instruction)
892 Bar code reader (information terminal)
899 electronic camera

Claims (13)

An electronic circuit board on which a surface mount component and a lead component inserted into a substrate through hole are mounted and solder-connected to a copper foil land for connection by lead-free solder or leaded solder,
The electronic circuit board is subjected to reflow soldering on which the electrode portion of the surface mount component is placed on the copper foil land for connection to which the solder paste is applied through a metal mask, and then overheat-welded, and the lead The first surface, which is the component mounting surface for the component, and the surface mount component similar to the first surface are reflow soldered, and then the lead component end and the connecting copper foil land are adhered to the molten solder. A second surface on which local flow soldering is performed,
The first surface is provided with a first identification mark and a second identification mark, the second surface is provided with a first identification mark, and the first identification mark is formed on the surface mounting Depending on whether the reflow soldering for the component is lead-free solder or leaded solder, it has a different appearance by opening or closing the opening of the metal mask, and the second identification mark is for the lead component Depending on whether the local flow solder is lead-free solder or leaded solder, it has a different appearance by opening or closing the opening of the metal mask, and the first identification provided on the second surface An electronic circuit board, wherein the mark is provided in a portion where the local flow soldering is not performed. An electronic circuit board on which a surface mount component and a lead component inserted into a substrate through hole are mounted and solder-connected to a copper foil land for connection by lead-free solder or leaded solder,
The electronic circuit board includes a first surface on which reflow soldering is performed, in which overheating welding is performed after the electrode portion of the surface mount component is placed on a copper foil land for connection to which a solder paste is applied through a metal mask. In addition, the flow solder for temporarily adhering the electrode part of the surface mount component and the connecting copper foil land, which are temporarily bonded to the opposite surface of the first surface, to the molten solder, or the first surface is inserted through the substrate through hole The lead wire end portion of the mounted lead component and the second surface on which flow soldering of at least one or both of the flow solders for contacting and attaching the connecting copper foil land to the molten solder is performed,
The first surface is provided with a first identification mark and a second identification mark, and the first identification mark indicates whether the reflow solder for the surface mount component is a lead-free solder or a leaded solder. The second identification mark is a lead-free solder or a lead-free solder for the surface mounting component or the lead component, which has a different appearance by opening or closing the opening of the metal mask. An electronic circuit board having a different appearance by opening or closing the opening of the metal mask depending on whether or not.   The first and second identification marks are constituted by a core part and an outer part separated by a solder resist film, and the copper foil land for connection of the electronic circuit board when the lead-free soldering is performed, and the above The core part and the outer part of each identification mark are not precoated by solder plating, and are rust-proofed by preflux. The metal mask for each identification mark is solder paste only on the core part. When the leaded soldering is performed, the copper foil land for connection of the electronic circuit board and the core part and the outer part of each identification mark are pre-coated by solder plating. Two types, either pre-coated by solder plating or rust-proofed by pre-flux The lead masked solder for the identification mark when the solder plating is applied to the leaded solder and the metal mask for the identification mark when the solder plating is not applied. 3. The electronic circuit board according to claim 1, wherein an opening is not provided for the core and the outer portion, and the solder paste is not applied. 4. The core portion is a portion having a different appearance by opening or closing the opening of the metal mask depending on whether it is lead-free solder or leaded solder, and a part of the outer portion is the metal mask The said 1st and 2nd identification mark by a different outline is obtained by opening or closing the opening of this, and shows the material classification of the lead-free solder applied Electronic circuit board.   The core portion is a portion having a different appearance by opening or closing the opening of the metal mask depending on whether it is lead-free solder or leaded solder, and a part of the outer portion is a portion of the metal mask. The portion where the solder paste is not applied because it is closed by the thin portion, and the thin portion is worn out by wear of the metal mask. The electronic circuit board according to claim 3, wherein the electronic circuit board is indicated.   The first surface and the second surface of the electronic circuit board are provided with a linear or planar barcode, or an ID information medium using an ID tag memory, and the ID information medium is provided on either surface. Information on whether the reflow solder is lead-free or leaded solder, and whether the flow solder is lead-free or leaded solder Including direct information related to the second material information, or including the board type name code number that is registered in the facility for performing the reflow soldering or the facility for performing the flow soldering. The electronic circuit board according to claim 1 or 2.   The first identification mark and the second identification mark are configured such that the first identification mark and the second identification mark are separated by making the shape of the opening of the metal mask different. The electronic circuit board according to claim 1, wherein the electronic circuit board is characterized in that Electronic circuit board management method for managing a solder type for an electronic circuit board on which a surface mount component and a lead component inserted into a through-hole of the board are mounted and solder-connected to a copper foil land for connection by lead-free solder or leaded solder Because
The electronic circuit board includes a first identification mark having a different appearance by opening or closing an opening of a metal mask depending on whether reflow soldering for the surface-mounted component is lead-free solder or leaded solder; and And having a second identification mark having a different overview by opening or closing the opening of the metal mask depending on whether the flow solder for the lead component is lead-free solder or leaded solder,
Solder printing process on the second surface of the electronic circuit board, component installation / mounting process, reflow soldering process, solder printing process on the first surface opposite to the second surface of the electronic circuit board, and component installation / mounting Formed by a process, a reflow soldering process, a lead component insertion mounting process on the first surface, and a local flow soldering process on the second surface,
In the solder printing process of the second surface and the first surface, the solder paste is applied to the copper foil land of the electronic circuit board through a metal mask under the jurisdiction of the first and second monitoring means. In the solder printing process, an identification solder paste required for the first and second identification marks is applied, and the first monitoring means is provided on the electronic circuit board. Read from basic information based on at least one of the operation specification information provided on the ID information medium or the work instruction medium corresponding to the solder printing process, and the ID information medium by the barcode or ID tag memory provided on the metal mask. It is a means for monitoring whether or not a metal mask having an appropriate management number is used that matches the actual product information that has been issued. Basic information based on at least one of the ID information medium provided on the road board or the operation specification information provided on the work instruction medium corresponding to the solder printing process, and the barcode provided on the solder container for storing the solder Or means for monitoring whether or not the actual product information read from the ID information medium by the ID tag memory matches and the solder stored in the solder container having an appropriate management number is used. The component installation mounting process on the second surface and the first surface is a step of mounting the surface mounting component on the copper foil land to which the solder paste is applied, and the reflow soldering process of the second surface and the first surface includes Under the jurisdiction of the third monitoring means, a step of heating and cooling the electronic circuit board on which the surface mount component is mounted, melting the solder paste, and soldering. The monitoring means includes identification information obtained by imaging the first identification mark provided on the second surface or the first surface of the electronic circuit board with an electronic camera, and a work instruction medium corresponding to the reflow soldering process. It is a means for monitoring whether or not the set operating specification information matches and the set temperature of the reflow soldering furnace is suitable for lead-free or leaded solder. A step of inserting a lead terminal of the lead component from the first surface side through a hole, and the local flow soldering step relates to the lead component temporarily mounted in the insertion mounting step under the jurisdiction of the fourth monitoring means. And a soldering process in which molten solder is contacted and adhered from the lower side of the second surface, and the fourth monitoring means electrically connects the second identification mark provided on the first surface of the electronic circuit board. The identification information obtained by imaging with the sub camera matches the operation specification information provided in the work instruction medium corresponding to the local flow soldering process, and the solder material type and set temperature of the flow solder furnace are lead-free. Alternatively, the work instruction medium is stored in a programmable controller for drive control of an equipment machine that operates in the solder printing process, the reflow soldering process, or the local flow soldering process. A method of managing an electronic circuit board, comprising: a program memory, or a bar code posted on a work instruction posted on the equipment machine.   As the execution order of each of the steps, first, a solder printing step for the second surface of the electronic circuit board, the component installation and mounting step, and the reflow soldering step are performed, and then the front and back reversing step of the electronic circuit substrate is performed. The solder printing step for the first surface of the electronic circuit board, the component installation mounting step, and the reflow soldering step are performed, and the lead component insertion mounting step for the first surface; 9. The method of managing an electronic circuit board according to claim 8, wherein the local flow soldering process for the second surface is performed. A management method for managing a solder type for an electronic circuit board on which a surface mount component and a lead component to be inserted into a substrate through-hole are mounted and solder-connected to a copper foil land for connection by lead-free solder or leaded solder,
The electronic circuit board includes a first identification mark having a different appearance by opening or closing an opening of a metal mask depending on whether reflow soldering for the surface-mounted component is lead-free solder or leaded solder; and And having a second identification mark having a different overview by opening or closing the opening of the metal mask depending on whether the flow solder for the lead component is lead-free solder or leaded solder,
A solder printing process on the first surface of the electronic circuit board, a component installation and mounting process, a reflow soldering process, and an adhesive mounting process of the surface-mounted component on the second surface opposite to the first surface of the electronic circuit board; Alternatively, it is formed by at least one or both of the steps of inserting and mounting the lead component on the first surface, and a flow soldering step on the second surface,
The solder printing step is a step of applying a solder paste to the copper foil land of the electronic circuit board through the metal mask under the jurisdiction of the first and second monitoring means, the solder printing step The first and second identification marks require identification solder paste, and the first monitoring means is an ID information medium provided on the electronic circuit board, or the solder printing process. The basic information based on at least one of the operation specification information provided in the work instruction medium corresponding to the above and the actual product information read from the ID information medium by the barcode or ID tag memory provided in the metal mask match. And means for monitoring whether or not a metal mask having an appropriate management number is used. The second monitoring means is an I / O circuit provided on the electronic circuit board. Basic information based on at least one of operation specification information provided on an information medium or a work instruction medium corresponding to the solder printing process, and ID information by a barcode or ID tag memory provided in a solder container for storing the solder It is means for monitoring whether the actual product information read from the medium matches and the solder stored in the solder container of the proper management number is used. The component is mounted on the copper foil land to which the solder paste is applied, and the reflow soldering process heats the electronic circuit board on which the surface mount component is mounted under the jurisdiction of the third monitoring means. Cooling and melting and soldering the solder paste, and the third monitoring means includes the first knowledge provided on the first surface of the electronic circuit board. The identification information obtained by imaging the mark with an electronic camera matches the operation specification information provided on the work instruction medium corresponding to the reflow soldering process, and the reflow solder furnace set temperature is lead-free or leaded solder The adhesion mounting step is composed of an adhesive application step for the second surface of the electronic circuit board, an installation mounting step for the surface mount component, and an adhesive drying step. The surface mounting component is bonded and dried and temporarily attached, and the insertion mounting step is a step of inserting the lead terminal of the lead component from the first surface side through the through hole of the electronic circuit board. The flow soldering process is performed under the jurisdiction of the fourth monitoring means of the surface mounting component or lead component temporarily mounted in the adhesive mounting process or the insertion mounting process. At least one of the steps is a step of soldering by attaching molten solder from below the second surface, and the fourth monitoring means is a second identification provided on the first surface of the electronic circuit board. The identification information obtained by imaging the mark with an electronic camera matches the operation specification information provided in the work instruction medium corresponding to the flow soldering process, and the type of solder material and the set temperature of the flow soldering furnace are The work instruction medium is stored in a programmable controller for drive control of equipment machines operating in the solder printing process, reflow soldering process or flow soldering process. A method of managing an electronic circuit board, characterized by being a program memory or a bar code posted on a work instruction posted on the equipment machine .   As the execution order of the above steps, first, the solder printing step on the first surface of the electronic circuit board, the component installation / mounting step, and the reflow soldering step are executed, and then the electronic circuit board is turned upside down. At least one of a process, an adhesive mounting process of the surface-mounted component to the second surface of the electronic circuit board, and a reversing process of the front and back, or an insertion mounting process of the lead component to the first surface The method of managing an electronic circuit board according to claim 10, further comprising: executing a flow soldering process on the second surface. Each of the processes is divided into a plurality of process blocks that start operation under the jurisdiction of the operation start monitoring means, and the electronic circuit board storage rack installed at the opening position of the process block has the electronic circuit at the outlet. An information terminal for reading the first basic information obtained from an ID information medium using a barcode or ID tag memory provided on a circuit board is installed, and work instructions provided on an equipment machine upstream of the process block An information terminal for reading the second basic information obtained from the medium is installed, and the reflow soldering process or the flow soldering process or the adhesive drying process is arranged at the final position of the divided process block, and the operation starts. The monitoring means is a means for permitting the operation start of the process block when the first and second basic information matches. Management method for an electronic circuit board according to claim 8 or claim 10 and symptoms.   The first and second basic information includes processing surface information indicating whether the electronic circuit board surface processed in the process block is related to the first surface or the second surface, and At least one or both of the first and second basic information are: first material information on whether the reflow solder is lead-free solder or leaded solder; and whether the flow solder is lead-free solder or lead-leaded solder If the direct information is included in only one of the first and second basic information, a pair of combinations appropriate for each other is included. The management method of an electronic circuit board according to claim 12, wherein a shared number for authenticating that is shared is shared.