JP2001223457A - Variety discrimination method in packaging substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a variety discrimination method in a simple packaging substrate that can easily discriminate variety even by human eyes. SOLUTION: A substrate discrimination part 4 is silk-printed on the packaging board where various kinds of electronic components are mounted. The substrate discrimination part 4 is equipped with a bond application region 7 where bit regions 6 in that bond 5 is or is not coated by a bond-coating machine for fixing the electronic components are provided in parallel, and a decimal display region 9 where a decimal display 8 is displayed corresponding to each bit region 6. The variety of the packaging board is discriminated according to a decimal value obtained by the coating/non-coating of the bond 5 in each bit region 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for discriminating a type of a mounted substrate in a case where a variety of electronic components are mounted on the same type of substrate and the same type of substrate is diversified.

[0002]

2. Description of the Related Art Conventionally, in a printed wiring board (mounting board) of an electronic device on which various electronic components are mounted, a large number of products are managed with the same type of printed wiring board depending on the presence or absence of the mounted electronic components. If it is necessary to do so, a part number sticker indicating the corresponding part number is attached to each, or a bar code seal of the corresponding part number is attached to each.

[0003] The type of the printed wiring board has been discriminated based on the attached product number sticker or bar code sticker.

[0004]

However, according to the conventional method of sticking a product number sticker or a bar code sticker on each of them, there is a problem that there is a mistake in sticking or that it takes time to stick.

[0005] Further, in order to automatically apply the stickers or eliminate mistakes, dedicated equipment is required, and considerable equipment costs are required. It is difficult to confirm the type of printed wiring board even when it is desired to confirm it with the human eye, and the type cannot be determined until a bar code scanner is used, which is very troublesome.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a simple type discriminating method for a mounting board, which can easily discriminate a type even by human eyes.

[0007]

A technical means for solving the above-mentioned problem is that in a method for determining a type of a mounting board on which various electronic components are mounted, a board determining section is silk-printed on the board, The substrate discriminating unit includes a bond application area in which bit areas to which a bond is applied or non-applied by an electronic component fixing bond application machine and a decimal number display corresponding to each bit area are displayed.
A zero-number display area is provided, and the type of the mounting board is determined from the decimal value obtained by applying / non-applying the bond in each bit area.

The electronic component mounting step may include a bond application step using the bond application machine.

Further, a method of discriminating a type of a mounting substrate from a decimal value obtained by identifying application / non-application of a bond in the bond application region by image recognition may be adopted.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show various types of electronic components such as ICs, resistors, and transistors on a printed wiring board 1 of the same type. Shows the mounting substrate 3 surface-mounted, and the mounted chip components 2 have a partially different structure. A board discriminating unit 4 for discriminating different types depending on the presence / absence of various chip components 2 is silk-printed at predetermined positions on the surface of the printed wiring board 1 respectively.

As shown in FIG. 3, the substrate discriminating section 4 is provided with a bit to which a bond 5 is applied or not applied by a bond applicator for fixing a large chip component 2 such as a chip electrolytic capacitor and a power transistor. The region 6 includes a bond application region 7 arranged side by side in the horizontal direction and a decimal number display region 9 displaying a decimal number display 8 corresponding to each bit region 6.

In the present embodiment, the bit area 6 has a 4-bit configuration with four locations, and 1 is displayed as a decimal number display 8 corresponding to the bit area 6 of the first least significant digit. , 2 is displayed as a decimal number display 8 corresponding to the bit area 6 of the second digit, 4 is displayed as a decimal number display 8 corresponding to the bit area 6 of the third digit,
8 is displayed as a decimal number display 8 corresponding to the bit area 6 of the fourth digit.

Next, an example of the bond application to the bond application area 7 of the substrate determination unit 4 will be described.

FIG. 4 shows a manufacturing process diagram of a mounting board 3 on which various chip components 2 are mounted. First, a printed wiring board 1 on which predetermined printed wiring and a board discriminating section 4 are silk-printed is mounted on a mounting line. (Substrate supply step).

Next, a solder paste is printed at a predetermined position on the surface of the printed wiring board 1 (a solder paste printing step). Thereafter, the bond 5 is applied to a predetermined position by a bond coater as necessary, and the bond 5 is also applied to a predetermined position in the bond application region 7 of the substrate determination unit 4.
Is applied (bond application step).

Next, various chip components 2 are mounted at predetermined positions (chip component mounting step), and thereafter, the solder paste is melted and automatic soldering is performed (reflow soldering step), and the mounting substrate 3 is manufactured. Is done.

Then, as shown in the part number correspondence table of Table 1 below, the bond application data is previously input to the manufacturing program for each type of the mounting board 3 according to the mounting data of the chip component 2 for each type, that is, for each part number. When the bond 5 is applied to the bond application area 7 in the above-described bond application step, control is performed so that the application / non-application processing of the bond 5 is performed on each bit area 6.

[0018]

[Table 1]

For example, if the bond 5 has been applied only to the first least significant digit of the bond application area 7 in the substrate discriminating section 4, the 10 in the corresponding decimal display area 9
From the decimal number 8, the value of the decimal number is set to 1, and if the bond 5 is applied only to the second digit, the value of the decimal number is set to 2 similarly, and the bond 5 is applied only to the fourth digit. , The decimal value is similarly set to 8, and if the bond 5 is applied to the first and second digits, the corresponding decimal number is set to 8.
Each decimal number 8 in the decimal number display area 9 is summed up, and the value of the decimal number is set to 3. The corresponding part numbers are determined from the thus obtained decimal values from the part number correspondence table in Table 1, and the type of the mounting board 3 is determined.

As described above, according to the product type discriminating method of this embodiment, it is visually determined whether or not the bond 5 is applied to each bit area 6 of the board discriminating section 4 of the mounting board 3. Calculating a decimal value from the decimal number display 8 displayed in the corresponding decimal number display area 9,
The product type can be easily identified from the product number correspondence table in Table 1, and the product type can be easily confirmed by human eyes.

In addition, the bond 5 is coated using a bond coater for fixing the large chip components 2 and the like, so that no new equipment is required and there is no possibility that the equipment cost will increase.

Furthermore, if the method of automatically applying the bond 5 in the manufacturing process of the mounting substrate 3 by inputting the bond application data into the program of the mounting data for each product type, Incorrect application of the bond 5 to each bit region 6 can be effectively prevented.

Also, the substrate discriminating portion 4 to be silk-printed is usually white, and the bond 5 is generally a thermosetting epoxy resin and becomes dark red after solidification. Application / non-application of the bond 5 can be identified by image recognition, and the type of the mounting substrate 3 can be automatically determined and managed from the obtained decimal value. That is, since the silk-printed portion has a high light reflectivity and the bond 5 coated portion generally has a low light reflectivity, the bond 5 has a different light reflectivity from an image taken by an image pickup means such as a CCD camera. What is necessary is just to recognize and manage the application / non-application of.

In the above embodiment, the bond application area 7 has a 4-bit configuration in which four bit areas 6 are provided. May be increased or decreased.

[0025]

As described above, according to the method for determining the type of a mounted substrate according to the present invention, the substrate determining portion is silk-printed on the substrate, and the substrate determining portion is coated with a bond by an electronic component fixing bond coating machine. A bond application area in which bit areas to be unapplied are arranged side by side; and a decimal number display area in which a decimal number display is displayed corresponding to each of the bit areas.
This is a method of discriminating the type of the mounting board from the value of the decimal number obtained by non-coating, and visually confirming whether or not a bond is applied to each bit area of the board discriminating unit and the corresponding decimal number. The value of the decimal number is calculated and obtained from the decimal number displayed in the display area, and the type can be determined from the value. The type can be easily determined by human eyes. This is a simple method of applying or non-applying a bond using a bond application machine for fixing an electronic component, and has an advantage that the existing equipment can be effectively used.

In addition, by adopting a method in which the electronic component mounting step includes a bond applying step using a bond applying machine, there is an advantage that erroneous application of the bond to the bit region can be effectively prevented.

Further, the application / non-application of the bond in the bond application area was determined by image recognition.
Adopting the method of determining the type of the mounting board from the value of the radix has an advantage that the mounting board can be automatically managed in a post-process.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a mounting board according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a mounting board according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram illustrating a board discrimination unit.

FIG. 4 is a manufacturing process diagram of the mounting board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Chip component 3 Mounting board 4 Board discriminating part 5 Bond 6 Bit area 7 Bond application area 8 Decimal number display 9 Decimal number display area

Claims (3)

[Claims] 1. A method for determining a type of a mounting board on which various electronic components are mounted, wherein a board determining section is silk-printed on the board, and the board determining section is coated or unbonded by an electronic component fixing bond coater. A bond application area in which bit areas to be applied are arranged side by side; and a decimal number display area in which a decimal number display is displayed corresponding to each of the bit areas. A kind discrimination method for a mounting board, wherein the kind of a mounting board is discriminated from a decimal value obtained by coating. 2. The method of claim 1, wherein the step of mounting the electronic component includes a step of applying a bond by the bond applying machine. 3. The type of the mounting substrate according to claim 1, wherein a type of the mounting substrate is determined from a decimal value obtained by identifying application / non-application of the bond in the bond application region by image recognition. Product type discrimination method for mounting boards.