JP2009016755A - Member supporting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a member supporting method for efficiently carrying out the works with sufficient accuracy without depending on the form of irregularity of the surface with which a member is supported, when performing the works for mounting components to the member such as a board. <P>SOLUTION: The member supporting method for supporting a member by supports includes a contact step (S1) for making respective end parts of a plurality of supports to be brought into contact with a member by making the plurality of supports provided at a position facing a surface to be supported of the member move in the support direction in which the supports support the member; and a fixing step (S2) for restricting the movement of the plurality of supports to both directions parallel to the support direction of the plurality of supports, by fixing the position of the plurality of supports by electrostatic force in the state where the respective end parts of the plurality of supports are brought into contact with the member and located at a position according to the irregularity of the surface by which the member is supported. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a member support method for supporting a member when performing work such as mounting of a component on a member constituting an industrial product.

  2. Description of the Related Art Conventionally, manufacturing processes for industrial products such as electronic devices include many processes for mounting components and applying liquid agents to members such as printed circuit boards (hereinafter simply referred to as “substrates”) that constitute industrial products. ing. Further, such a member often has irregularities on the surface supported when these operations are performed.

  Therefore, in order to perform these operations accurately and reliably, it is necessary to support the work target member in a form corresponding to the unevenness on the support side.

  For example, in a component mounter that mounts components on a substrate, it is required to mount the components accurately and reliably on substrates of various shapes and sizes.

  In addition, the substrates to be mounted with components are not only different in planar shape and size but also have components already mounted on the back surface of the surface on which the components are mounted. In such a case, the substrate cannot be supported from below by a simple plane.

  Therefore, the present invention relates to a method and apparatus for stably supporting a substrate corresponding to various types of substrates having different concave and convex shapes on the back surface due to components mounted on the surface to be supported, that is, the back surface. Technology is also disclosed.

  Hereinafter, with reference to the drawings, a conventional technique for supporting a substrate corresponding to various substrates having different uneven shapes on the back surface will be described.

  FIG. 38 is a diagram showing an outline of a first conventional substrate support apparatus.

  The substrate support apparatus shown in FIG. 38 includes a support pin 30 that directly supports the substrate 20 conveyed by the conveyance rail 15 and an actuator 31 that drives the support pin 30 up and down. The table on which the support pin 30 and the actuator 31 are installed is driven up and down by the up-and-down drive unit 32.

  In addition, a storage device 34 in which support pin data 34a is stored is provided. The support pin data 34a is information for specifying the support pin 30 to be raised according to the shape of the substrate 20 and the presence / absence of the component 20a on the back surface of the substrate 20.

  The actuator switching controller 33 can raise only the support pin 30 at a position where the component 20a does not exist directly below and above the substrate 20 by giving an instruction based on the support pin data 34a to the actuator 31.

  In FIG. 38, the actuator 31 to which “1” is attached is in an on state, and the actuator 31 to which “0” is attached is in an off state.

  That is, as shown in FIG. 38, the conventional first substrate support apparatus is configured to turn on only the actuator 31 in which the component 20a does not exist directly above and raise the support pin 30 on the actuator 31. .

  Thereby, even when a component is mounted on the back surface of the board, the board can be supported.

  Further, a technique regarding an apparatus for supporting a substrate using the elasticity of a spring is also disclosed (for example, see Patent Document 2).

  FIG. 39 is a diagram showing an outline of a conventional second substrate support apparatus.

  The substrate support apparatus shown in FIG. 39 includes a cylinder 40 filled with a piston 40 that supports the substrate 20, a spring 41 that applies an upward biasing force to the piston 40, and a viscous fluid 43 that serves as a damper for the movement of the piston 40. 42.

  Further, when the substrate 40 is supported, these pistons 40 and the like are raised upward by the vertical drive unit 44 as shown in the right diagram of FIG. As a result, the right piston 40 that contacts the component 20a sinks as the spring 41 contracts, and supports the substrate 20 via the component 20a. In addition, the left piston 40 located in a portion where the component 20a does not exist directly contacts and supports the substrate 20.

  As described above, the substrate support apparatus 30 can use the elasticity of the spring 41 to support the substrate from under the component even when the component is mounted on the back surface of the substrate.

  In addition, a technique for an apparatus for supporting a substrate using an electrorheological fluid, which is a fluid whose viscosity can be reversibly changed in milliseconds by application of a voltage, is also disclosed (for example, see Patent Document 3).

  FIG. 40 is a diagram showing an outline of a conventional third substrate support apparatus.

  The substrate support apparatus shown in FIG. 40 is an apparatus that supports the substrate 20 from below with an electrorheological fluid 52 covered with an elastic film 51. The electrorheological fluid 52 covered with the elastic film 51 is contained in the container 50. In addition, two electrodes are installed in the elastic film 51, and a voltage is applied to the electrorheological fluid 52 by the power supply unit 54.

  When components are mounted on the substrate 20 from above, the container 50 is raised by the vertical drive unit 55 as shown in the right diagram of FIG. Further, in a state where the elastic film 51 is deformed according to the uneven shape on the back surface of the substrate 20, the switch of the power supply unit 54 is turned on, and a predetermined voltage is applied to the electrorheological fluid 52. The electrorheological fluid 52 is transformed into a semi-solid state by applying a predetermined voltage.

Thereby, even if it is a case where components are mounted in the back surface of a board | substrate, a board | substrate can be supported according to the uneven | corrugated shape of the back surface.
Japanese Patent No. 2769368 JP-A-7-183700 JP 2003-069295 A

  However, when the substrate is supported by the conventional first substrate support device, information for specifying the support pin 30 to be raised is supported for each type of substrate that differs depending on the size and position of the components mounted on the back surface. It is necessary to store as pin data 34a.

  That is, as the number of types of boards to be handled increases, the size of the support pin data 34a increases, and there is a problem that the management becomes complicated.

  Further, the moving distances of the support pins 30 to be raised are all the same. Therefore, when the substrate that should be in a flat state is distorted due to an environment or the like, only the support pins 30 that contact the substrate support the substrate. Further, even when many components are mounted on the back surface of the substrate, the substrate is supported by a small number of support pins 30.

  In these cases, not only the stability of the substrate is impaired, but also there is a problem that a large load is applied to the support pins 30 that are in contact.

  Furthermore, even when the wear of the support pin 30 progresses, there is a problem that the lowering of the reaching position due to wear at the upper end of the support pin 30 to be raised cannot be corrected. This also impairs the stability of the substrate and causes a bias in the load applied to each support pin 30.

  Further, when the substrate is supported by the conventional second substrate support device, the piston 40 continues to push the substrate by the urging force of the spring 41, and the substrate may be deformed. Therefore, it is conceivable to use a spring having a low elastic modulus, that is, a spring having a low repulsive force, but in this case, the supporting force of the substrate is reduced. In other words, the original purpose of giving the substrate a supporting force against the force caused by component mounting from above the substrate cannot be achieved.

  Further, as shown in FIG. 39, when the component 20a is mounted on the back surface of the substrate 20, the spring 41 of the right piston 40 located under the component 20a is connected to the left piston 40 directly in contact with the substrate. It will be contracted more than the spring 41. That is, the right piston 40 pushes the substrate with a larger force than the left piston 40.

  Therefore, the magnitudes of a plurality of forces that work upward from the back surface of the substrate may differ greatly. For this reason, it is conceivable that the board is distorted or the board is displaced from a predetermined position during mounting of components.

  Even if there are no components on the back surface of the substrate, the force to push the substrate increases as the thickness of the substrate increases, and the force to push the substrate decreases as the substrate becomes thinner. That is, there is a problem that the supporting force with respect to the substrate varies depending on the thickness of the substrate.

  Further, the second substrate support device cannot cause the piston 40 to move up and down quickly due to the presence of the viscous fluid 43. Therefore, it is difficult to change the position of each piston 40 immediately.

  That is, there is a problem that when the substrate to be supported is changed, it takes time to stably support the substrate after the change.

  Further, when the substrate is supported by the conventional third substrate support device, the gap length between the electrodes changes depending on the presence or absence of components on the back surface of the substrate to be supported. Thereby, even if the applied voltage is constant, the viscosity of the electrorheological fluid changes. That is, there is a problem that the force that supports the substrate changes depending on the presence or absence of components on the back side of the substrate.

  Further, when the substrate has irregularities due to the presence of parts on the notch or the back surface, as shown in FIG. 40, the elastic film 51 containing the electrorheological fluid 52 is deformed according to its outer shape. In this state, a voltage is applied to the electrorheological fluid 52 to make the electrorheological fluid 52 semi-solid.

  That is, a non-uniform force is applied to the component mounted on the back surface of the substrate from various directions, and for example, the substrate may be deformed or the component may be displaced.

  As described above, in these conventional substrate support devices, there is a case where the substrate cannot be stably supported when there are irregularities on the support side of the member to be supported, such as when a component is mounted on the back surface of the substrate. Further, by applying unnecessary force to the substrate, there is a possibility of damaging the substrate and components already mounted on the substrate.

  In consideration of these conventional problems, the present invention performs these operations without depending on the uneven shape of the surface supported by the member when the component mounting operation is performed on the member such as the board. It aims at providing the member support method for making it carry out accurately and efficiently.

  In order to achieve the above object, the member support method of the present invention is a member support method for supporting a member by a support, and includes a plurality of supports provided at positions facing a surface to be supported by the member. A contact step in which the support is moved in a support direction that is a direction in which the member is supported, and an end of each of the plurality of supports is brought into contact with the member; By fixing the positions of the plurality of supports by electrostatic force in a state where the end portions of the supports are in contact with the members and are in a position according to the unevenness of the surface supported by the members, A fixing step for restricting the movement of the support in both directions parallel to the support direction.

  As described above, the member support method of the present invention fixes the positions of the plurality of supports moved in the direction of the member in a state where the end portions of the respective supports are in contact with the unevenness of the member. This fixing restricts the support body from moving in both directions parallel to the support direction.

  That is, the position of each support can be fixed in a state where each support moves and contacts the member.

  For example, when the surface on which the member is supported is uneven or not, or when the uneven shape is different, the positions in the support direction for the respective support members to support the member are different.

  Even in such a case, according to the member support method of the present invention, the member is applied to the member from the opposite side to the support side regardless of the position of the support in the support direction when the support contacts the member. The member can be supported against the force. Further, unlike the conventional method of supporting by the repulsive force of the elastic body, the member can be supported without applying unnecessary force.

  Therefore, according to the member support method of the present invention, the member can be supported so as to stably maintain the correct posture regardless of the size and shape of the member to be supported.

  Further, since electrostatic force is used to fix the position of each support, it is possible to instantaneously fix and release each support. Therefore, when sequentially supporting a plurality of members, these members can be efficiently and sequentially supported even when the shapes of these members are different.

  Further, it is possible to fix the position without contacting each support, thereby extending the service life of each support. Further, since no liquid is used unlike the conventional third substrate support apparatus, there is no concern about liquid leakage.

  Thus, the present invention can provide a member support method for accurately and efficiently performing work on a member without depending on the uneven shape of the surface on which the member is supported.

  Further, the plurality of supports are held by a single holding body so as to be movable in both directions parallel to the supporting direction, and the holding body corresponds to the holding body of each of the plurality of supporting bodies. A fixing means for fixing the position by the electrostatic force, and in the fixing step, the fixing means and the plurality of support bodies are charged by applying a predetermined voltage to the fixing means to charge the plurality of support bodies; The positions of the plurality of supports relative to the holding body may be fixed by generating the electrostatic forces attracting each other.

  In this way, each support may be charged by applying a voltage to the fixing means. Thereby, by controlling the presence or absence of voltage application to the fixing means or the magnitude of the voltage to be applied, it is possible to freely control the fixation and release of each support.

  Further, in the contact step, the plurality of supports are moved simultaneously by moving the holding body in the support direction, and the ends of the plurality of supports are in contact with the member, When the holding body moves in the support direction after stopping the movement of the holding body and each of the plurality of support bodies held by the holding body comes into contact with the member, The plurality of supports that are held by the holding member while moving in the direction opposite to the supporting direction with respect to the holding member, and that are in contact with the member in the contact step are the holding members. On the other hand, the position of each of the plurality of supports may be fixed by the fixing means in a stationary state.

  Thereby, the contact means can move a some support body collectively by moving a holding body. Further, even after a certain support body comes into contact with the member, the holding body continues to move because another support body comes into contact with the member. However, the individual supports can move in the direction opposite to the support direction with respect to the holding body. For this reason, the support member in contact with the member does not apply unnecessary force to the member even when the holding member moves in the support direction after contacting the member.

  Even if the surface to be supported by the member is uneven, the ends of the plurality of supports abut against the surface of the member existing in the respective moving directions, and then the movement is restricted by the fixing means. The Thereby, a member can be supported stably.

  In addition, the holding body has a plurality of holes that penetrate each of the plurality of support bodies in the support direction, and the member support method further includes the fixing means positioned at the periphery of each of the plurality of holes. A holding step of holding the plurality of supports movably on the holding body by an electrostatic force generated by applying a voltage smaller than the predetermined voltage, and in the abutting step, the holding step includes: The holding body holding a plurality of support bodies in a movable manner may be moved in the support direction.

  As described above, when the supporting body penetrating the hole is held by the holding body by electrostatic force, a gap can be provided between the inner surface of the hole and the supporting body. This is because the electrostatic force acts in a non-contact manner.

  Further, by providing a gap between the inner surface of the hole and the support in this way, the support can move smoothly when no voltage is applied to the fixing means.

  Further, the holding body has a plurality of holes that penetrate each of the plurality of support bodies in the support direction, and each of the plurality of support bodies is between the inner surface of the hole through which the support body passes. When the holding body moves in the supporting direction after the end portion of the holding body is slidably held on the holding body by a frictional force and contacts the member, the supporting direction with respect to the holding body And may slide in the opposite direction.

  By doing so, power is not consumed to hold the support body movably on the holding body.

  The predetermined voltage is a DC voltage, and the member supporting method further includes fixing the predetermined DC voltage or the predetermined AC voltage whose polarity is opposite to the predetermined voltage after the fixing step. A neutralization step may be included in which the positions of the plurality of supports are released by applying to the means to neutralize the charging of the plurality of supports. Thereby, the static elimination of a support body can be performed reliably. In addition, when removing electricity using an AC voltage, it is not necessary to strictly manage the voltage application period and is easy to implement.

  The member support method is a method of sequentially supporting a plurality of members, and further, the position of each of the plurality of supports needs to be changed in order to support a subsequent member that is a member to be supported next. A step of determining whether or not there is a step, wherein the static elimination step releases the fixing of the positions of the plurality of supports only when it is determined that the change is necessary in the determination step, and the contact In the step, the ends of the plurality of supports may be brought into contact with the subsequent member by moving the plurality of supports whose positions are released in the static elimination step in the support direction.

  Further, in the determination step, when the uneven shape of the surface supported by the subsequent member is different from the uneven shape of the surface supported by the preceding member which is the previously supported member, or when the plurality of supports are supported. When the number of members is a predetermined number or more, it may be determined that the change is necessary.

  By doing so, for example, the plurality of supports and the entire holding body can be moved up and down with respect to a plurality of members having the same shape, and these can be supported sequentially.

  That is, the control burden of the voltage applied to the fixing means is reduced. In addition, a plurality of members can be supported efficiently.

  Further, an acquisition step for acquiring information on the size of the member, and a surface on which the member is supported from a plurality of supports based on the information on the size of the member acquired in the acquisition step. And a selection step of selecting a plurality of supports provided at positions facing each other, and in the contact step, the plurality of supports selected in the selection step may be moved in the support direction.

  Thereby, for example, when supporting a member, when another object such as a transport rail that transports the member is present close to the member, it is possible to prevent the support from coming into contact with the other object. .

  The component mounting method of the present invention is realized as a method of mounting a component on a substrate supported by the member support method of the present invention. Moreover, the printing method of this invention is implement | achieved as a method of printing an electrically conductive paste on the board | substrate currently supported by the member support method of this invention.

  These component mounting method and printing method employ the member support method of the present invention, and therefore, when the component is mounted on the back surface of the work target substrate, the back surface of the substrate is uneven. In addition, the substrate can be stably supported. Therefore, component mounting or conductive paste printing can be accurately and efficiently performed on the substrate.

  In the component mounting method and the printing method of the present invention, the substrate may be a flexible substrate or a rigid flexible substrate.

  That is, the present invention can support a flexible substrate using a flexible material and a rigid flexible substrate that is a multilayer board having a rigid portion on which components are mounted and a flex portion that can be bent.

  When supporting a substrate having flexibility in whole or in part, if the substrate is carelessly applied, the substrate and components mounted on the substrate are likely to be damaged. However, the member support method of the present invention limits the movement of the support after the support is brought into contact with the substrate. That is, the support body does not apply an urging force to the substrate, and can resist the force applied to the substrate during operations such as component mounting on the substrate.

  Moreover, this invention is realizable as a member support apparatus provided with the structure part which performs the characteristic step of the member support method of this invention. Moreover, it is realizable as a component mounting machine and printing machine provided with this member support apparatus.

  Furthermore, the present invention can be realized as a program including characteristic steps in the member support method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. it can. The program can also be distributed via a transmission medium such as a communication network.

  According to the member supporting method of the present invention, when supporting a member that is a target of work such as mounting of a component or application of a liquid agent, it can be stably supported without applying unnecessary force.

  In addition, it is possible to instantly fix and release each support, and unnecessary time is not consumed when changing a member to be supported.

  Therefore, according to the present invention, when work such as component mounting is performed on a member such as a substrate, the work is performed accurately and efficiently without depending on the uneven shape of the surface supported by the member. Therefore, a member supporting method can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
First, the structure of the substrate support apparatus 1 of Embodiment 1 is demonstrated using FIGS.

  FIG. 1 is an overview diagram showing an overview of the substrate support apparatus 1 according to the first embodiment.

  A substrate support device 1 shown in FIG. 1 is an example of a member support device of the present invention, and is provided as a device for supporting a substrate in a component mounting machine. The substrate support device 1 can support the substrate 20 transported by the transport rail 15 from below.

  In the component mounting machine including the board support device 1, the board 20 is supported from below by the board support device 1, so that components can be mounted from above the board 20. The board | substrate 20 is also an example of the member in the member support method of this invention of this invention also including the component, when components are mounted in the back surface.

  As shown in FIG. 1, the direction parallel to the transport direction of the substrate 20 is the X-axis direction, the direction parallel to the lifting shaft 4, that is, the direction parallel to the substrate support direction is the Z-axis direction, and the X-axis A direction perpendicular to the direction and the Z-axis direction is taken as a Y-axis direction.

  The substrate support device 1 includes a support pin 3, an elevating shaft 4, a fixed portion 1 a, a shaft holder 6, a drive portion 7, and a base 8. The fixing portion 1a has an electrode 11 (not shown in FIG. 1) enclosed in the insulator 5. In the present embodiment, polyimide is employed as the material for the insulator 5.

  The support pins 3 are components that support the substrate 20 directly or via components mounted on the back surface of the substrate 20.

  The elevating shaft 4 is a component that connects the drive unit 7 and the support pin 3. A support body in the member support method of the present invention is realized by the support pin 3 and the lifting shaft 4.

  In the present embodiment, there are 20 sets of support pins 3 and lifting shafts 4, and there are 20 driving units 7 and fixing units 1 a corresponding to each set. Further, some or all of the 20 sets of the support pins 3 and the lifting shaft 4 are provided at positions facing the back surface of the substrate 20 when the substrate 20 is transported.

  In addition, the fixing | fixed part 1a in this Embodiment is an example of the fixing means of this invention, and each and the whole 20 fixing | fixed part 1a function as one fixing means.

  The drive unit 7 is a component that moves the support pin 3 in the support direction to bring the support pin 3 into contact with the substrate 20 or a component mounted on the back surface of the substrate 20. The drive unit 7 is fixed to the base 8.

  In addition, the drive part 7 is an example of the structure part which implement | achieves execution of the contact step in the member support method of this invention. In the present embodiment, the drive unit 7 is specifically an air cylinder.

  The distance for moving the support pin 3 upward is the same as or slightly longer than the distance between the upper end of the support pin 3 at the initial position and the back surface of the substrate 20.

  That is, the distance that the upper end of the support pin 3 is in contact with the back surface of the substrate 20 and does not substantially damage the substrate 20 is determined as the moving distance of the support pin 3 upward.

  The shaft holder 6 is a component that holds the elevating shaft 4 so as to be movable, and is fixed to the base 8 or the component mounting machine in parallel with the base 8 at a predetermined distance.

  The shaft holder 6 has a fixed portion 1a. The lift shaft 4 can move in the Z-axis direction with respect to the shaft holder 6 while it is not fixed by the fixing portion 1a.

  The fixing portion 1a is a component that restricts the vertical movement of the lifting shaft 4 by fixing the position of the lifting shaft 4 in a state where the support pin 3 is in contact with the substrate 20. Details of the fixing portion 1a will be described later with reference to FIG.

  The base 8 is a base that is the basis of the substrate support apparatus 1. The base 8 is fixed to the component mounter, and the relative position in the component mounter is constant.

  FIG. 2 is a side view of the substrate support apparatus 1 when viewed from the Y-axis direction. A similar view is also obtained when the substrate support device 1 is viewed from the X-axis direction.

  That is, the base 8 and the shaft holder 6 are parallel to each other, and each elevating shaft 4 is perpendicular to the base 8 and the shaft holder 6.

  FIG. 3 is a diagram showing an outline of the configuration of the fixing unit 1a.

  FIG. 3A is a perspective view showing a configuration outline of the fixing portion 1a, and FIG. 3B is a plan view. In FIG. 3A, the insulator 5 is omitted for convenience of illustration.

  As shown in FIGS. 3A and 3B, the shaft holder 6 has a holding hole 9 for holding the elevating shaft 4 so as to be movable. There is a slight gap (for example, several tens of microns) between the inner surface of the holding hole 9 and the lifting shaft 4.

  The fixing portion 1 a is located on the periphery of the holding hole 9 and has two electrodes 11. The two electrodes 11 are located opposite to each other with the lifting shaft 4 interposed therebetween.

  These two electrodes 11 are both connected to the power supply unit 12, and when the switch is switched to the contact "1" (hereinafter referred to as [1]; the same applies to other contact numbers), a predetermined voltage V1 is applied. The By applying this voltage V1, the elevating shaft 4 is charged, and an electrostatic force is generated between the fixed portion 1a and the elevating shaft 4.

  Specifically, an electrostatic force is generated between the two insulators 5 included in the fixing portion 1 a and the lifting shaft 4. The position of the lifting shaft 4 with respect to the shaft holder 6 is fixed by this electrostatic force.

  Further, when the switch is switched to [0], the electric charge stored in the elevating shaft 4 is released. That is, the charge is eliminated.

  The manner in which the electrostatic force is generated by the application of a voltage to the fixing portion 1a, the size thereof, and the like will be described later with reference to FIGS.

  The power supply unit 12 is an example of a voltage application unit and an example of a charge removal unit in the substrate support apparatus of the present invention.

  In addition, although the lifting shaft 4 is grounded in the drawing, grounding is not necessary when the material of the lifting shaft 4 is a non-conductor.

  In addition, since there is a gap between the inner surface of the holding hole 9 and the lifting shaft 4 as described above, the lifting shaft 4 smoothly moves up and down with respect to the shaft holder 6 when the switch is [0]. can do. As a result, the position of each support pin 3 can be changed efficiently.

  FIG. 4 is a diagram for explaining charging and discharging of the lifting shaft 4.

  As shown in FIG. 4A, when the switch of the power supply unit 12 is [1], the voltage V1 is applied to the fixed unit 1a. Specifically, the voltage V1 is applied to the two electrodes 11, and each becomes a positive potential. Thereby, a negative potential appears on the lifting shaft 4 side of each insulator 5, and the two surfaces on the electrode 11 side of the lifting shaft 4 are positively charged.

  As a result, electrostatic forces attracting each other act between the elevating shaft 4 and the two insulators 5. Therefore, this electrostatic force can also be expressed as “adsorption power”.

  That is, when the voltage V1 is applied to the fixing portion 1a, an electrostatic force is generated between the elevating shaft 4 and the shaft holding body 6, thereby fixing the position of the elevating shaft 4 with respect to the shaft holding body 6. it can.

  As shown in FIG. 4B, when the switch of the power supply unit 12 is [0], the two electrodes 11 are grounded, and the lifting shaft 4 is discharged. As a result, the electrostatic force disappears and the elevating shaft 4 is released from the limitation of movement.

  Thus, since the substrate support apparatus 1 uses electrostatic force to fix the lifting shaft 4, the lifting shaft 4 can be fixed without contact. Therefore, a gap can be provided between the elevating shaft 4 and the shaft holder 6 as shown in the figure.

  Thereby, abrasion of the raising / lowering shaft 4 can be suppressed, and the lifetime of the raising / lowering shaft 4 can be extended. That is, the load concerning the maintenance of the substrate support apparatus 1 can be suppressed.

  FIG. 5 is a diagram showing a graph of experimental values of electrostatic force generated between the lifting shaft 4 and the insulator 5.

  Specifically, experimental values are shown when the elevating shaft 4 is made of non-conductor bakelite, conductors aluminum and stainless steel (SUS).

  In any case, the material of the insulator 5 is polyimide as described above, and the distance from the electrode 11 to the holding hole 9 is 0.5 mm.

The horizontal axis of the graph is the voltage applied to the electrode 11, and the unit is kilovolt (KV). The vertical axis of the graph is the electrostatic force per unit area generated by one electrode 11 (adsorptive force with respect to the lifting shaft 4), and the unit is gram (gr) / cm ² .

  As shown in the graph, the magnitude of the applied voltage and the electrostatic force have a positive correlation regardless of the material of the elevating shaft 4. Further, it can be seen that the electrostatic force most generated in the case of non-conductor bakelite is large.

For example, when the material of the elevating shaft 4 is bakelite, the electrostatic force generated when the voltage is 1 KV is about 60 gr / cm ² .

  The magnitude of the electrostatic force generated by the two electrodes 11 can be obtained by multiplying the value of the electrostatic force by the projected area of the electrode 11 onto the lifting shaft 4 and further doubling it.

  FIG. 6 is a diagram showing a positional relationship between the two electrodes 11 and the lifting shaft 4.

  For example, it is assumed that the lateral width W of the electrode 11 shown in FIG. 6A is 30 mm and the height H is 10 mm.

If the horizontal width of the lifting shaft 4 is equal to the horizontal width of the electrode 11, the projected area of the electrode 11 onto the lifting shaft 4 is 3 cm ² (30 mm × 10 mm), which is the area of the electrode 11.

  The material of the lifting shaft 4 is bakelite, and the distance L from the electrode 11 to the holding hole 9 is 0.5 mm.

Under the above assumption, the magnitude of electrostatic force generated by the two electrodes 11 is calculated using the above experimental value (60 gr / cm ² ), and the following values are obtained.

60 gr / cm ² × 3 cm ² × 2 (number of electrodes) = 360 gr (Formula 1)

  The electrostatic force required in this way acts as a fixing force for the lifting shaft 4 and the movement of the lifting shaft 4 in the vertical direction is limited.

  FIG. 7 is a cross-sectional view showing a configuration outline of the fixing portion 1a.

  As shown in FIG. 7, the fixing portion 1 a has two electrodes 11, and each is enclosed in an insulator 5.

  Moreover, the drive part 7 and the raising / lowering axis | shaft 4 comprise the actuator 1b, and the actuator 1b, the fixing | fixed part 1a, the raising / lowering axis | shaft 4, and the support pin 3 comprise the support part 1c. That is, the board | substrate support apparatus 1 is provided with the 20 support parts 1c.

  The two electrodes 11 of each fixing part 1a are connected to the power supply part 12, and when the switch of the power supply part 12 is [1], the voltage V1 is applied to the two electrodes 11 of the fixing part 1a.

  When the voltage V <b> 1 is applied to the two electrodes 11, the elevating shaft 4 is charged as described above, and electrostatic force is generated between the shaft 11 and the shaft holder 6.

  The position of the lift shaft 4 with respect to the shaft holder 6 is substantially fixed by the generated electrostatic force. That is, the vertical movement of the lifting shaft 4 and the support pin 3 is restricted.

  Further, when the switch of the power supply unit 12 is set to [0], the lifting shaft 4 is neutralized, the electrostatic force is substantially eliminated, and the lifting shaft 4 is movable with respect to the shaft holder 6.

  In the following description, it is assumed that the material of the lifting shaft 4 used by the substrate support device 1 is a non-conductor such as bakelite. Therefore, no grounding wiring is provided on the lifting shaft 4. The same applies to the second embodiment to be described later.

  FIG. 8 is a diagram showing the relationship between the switch state of the power supply unit 12 and the electrostatic force generated between the elevating shaft 4 and the fixed unit 1a. In the figure, the switch is described as “SW”. The same applies to the other drawings.

  As shown in FIG. 8, when the switch of the power supply unit 12 is [1], the value of the electrostatic force is large, and when the switch is set to [0], the value of the electrostatic force is substantially zero.

  Note that the magnitude of the electrostatic force generated between the elevating shaft 4 and the shaft holder 6 varies depending on the magnitude of the voltage applied to the fixed portion 1a, as can be seen from the graph of FIG.

  Therefore, the voltage generated by the driving force of the drive unit 7 against the lifting shaft 4 and the support pin 3 and the electrostatic force that can fix the position of the lifting shaft 4 against the force that the substrate to be supported receives from above is the power source. What is necessary is just to determine as a voltage applied to the fixing | fixed part 1a from the part 12. FIG.

  Specifically, any voltage between several hundred V and about 5 KV is adopted as an applied voltage for fixing the elevating shaft 4.

  Further, after the position of the elevating shaft 4 is fixed by the fixing portion 1a, the substrate is supported by the support pins 3 whose movement in the vertical direction is restricted. That is, the push-up force of the drive unit 7 does not need to resist the force applied from above to the substrate supported by the support pins 3.

  Therefore, the drive part 7 should just generate | occur | produce the raising force which pushes up the raising / lowering axis | shaft 4 and the support pin 3 until the upper end of the support pin 3 contact | abuts on the back surface of a board | substrate. Therefore, the components mounted on the substrate and the back surface of the substrate are not damaged by the lifting force.

  In addition, all the fixed parts 1a are connected to the power supply part 12 so that a voltage can be applied by the power supply part 12. When the switch of the power supply part 12 is set to [1], each of the fixed parts 1a is moved up and down. The position of the shaft 4 is fixed. Further, when the switch of the power supply unit 12 is set to [0], each lifting shaft 4 can move with respect to the shaft holder 6.

  FIG. 9 is a functional block diagram illustrating a functional configuration of the substrate support apparatus 1 according to the first embodiment.

  As shown in FIG. 9, the operation of each support portion 1c is controlled by the control portion 1d. The control unit 1d can be realized by a computer having a central processing unit (CPU), a storage device, an interface for inputting and outputting information, and the like.

  Specifically, the control unit 1d controls the operation of the fixing unit 1a by controlling the switching [1] and [0] of the switches of the power supply unit 12 illustrated in FIG. Further, the control of the drive unit 7, that is, the push-up and lowering of the support pin 3 by the actuator 1b is controlled.

  Next, operation | movement of the board | substrate support apparatus 1 of Embodiment 1 is demonstrated using FIGS.

  FIG. 10 is a flowchart showing an outline of the operation when the substrate support apparatus 1 supports the substrate.

  As shown in the flowchart of FIG. 10, the substrate support apparatus 1 raises all the support pins 3 (S1). Specifically, the control unit 1 d operates all the drive units 7, and the support pins 3 are raised by the drive units 7 via the lifting shaft 4.

  All the support pins 3 are raised, and the position of the elevating shaft 4 is fixed by electrostatic force in a state where the upper ends of the support pins 3 are in contact with the substrate (S2). Specifically, the control unit 1d sets the switch of the power supply unit 12 to [1] in a state where the upper ends of all the support pins 3 are in contact with the substrate or a component mounted on the back surface of the substrate. Thereby, a voltage is applied to the electrodes 11 of all the fixing parts 1a, and the positions of all the lifting shafts 4 are fixed.

  In addition, in this Embodiment, the timing which the control part 1d sets the switch of the power supply part 12 to [1] is about 2 second after operating the drive part 7. FIG. In other words, during this time, it means that the upper ends of all the support pins 3 are in contact with the substrate or a component mounted on the back surface of the substrate.

  Further, the control unit 1d may detect that all the drive units 7 have finished the push-up operation or that all the lift shafts 4 have stopped rising, and set the switch of the power supply unit 12 to [1]. .

  That is, if the position of each elevating shaft 4 is fixed in a state where the upper ends of all the support pins 3 are in contact with the substrate or the components mounted on the back surface of the substrate, the fixing is performed after a predetermined time. May be triggered by a change in the state of the component.

  Thereafter, when mounting of the components on the board is completed, all the lifting shafts 4 are neutralized, and the electrostatic force that has fixed each lifting shaft 4 disappears, so that each support pin 3 is lowered to the lowest point. (S3).

  Specifically, when the control unit 1d detects that the mounting operation on the board is completed, the switch of the power supply unit 12 is set to [0]. Thereby, the electrodes 11 of all the fixing parts 1a are grounded, and all the lifting shafts 4 are neutralized. That is, the electrostatic force acting on all the lifting shafts 4 disappears.

  When the electrostatic force disappears, there is a gap between each lifting shaft 4 and the inner surface of the holding hole 9, so that each lifting shaft 4 is immediately lowered by its own weight. When the weight of the support pin is reduced, the weight does not drop due to the weight of the support pin. To avoid such a case, in the first embodiment, the drive unit 7 is activated downward to forcibly move the lifting shaft 4. I try to lower it.

  Thereafter, the control unit 1d confirms whether or not component mounting has been completed for all the boards. If it has not been completed yet (No in S4), the substrate support apparatus 1 repeats the operation from the rising (S1) to the lowering (S3) of the support pin 3.

  When component mounting has been completed for all the boards (Yes in S4), the board support device 1 ends the operation related to board support.

  FIG. 11 is an operation outline diagram illustrating the operation flow shown in the flowchart of FIG.

  As shown in FIG. 11, (1) before the support pin 3 is raised, the switch of the power supply unit 12 is [0]. (2) The support pin 3 is raised by the drive unit 7, and the switch is set to [1] in the power supply unit 12 in a state where the support pin 3 is in contact with the back surface of the substrate 20 or the component 20a. Thereby, the position of the raising / lowering axis | shaft 4 is fixed by the fixing | fixed part 1a, and the board | substrate 20 is supported by the support pin 3. FIG.

  Originally, the drive unit 7 generates a push-up force that raises the lift shaft 4 and the support pin 3 to a position where at least the tip of the support pin 3 comes into contact with the substrate 20. Therefore, as shown in FIG. 11, when the component 20a exists directly above the support pin 3, in this state, the component 20a is continuously given a push-up force.

  However, as described above, the push-up force generated by the drive unit 7 is a force that pushes up the lifting shaft 4 and the support pin 3 until the upper end of the support pin 3 directly contacts the substrate 20.

  Further, after the upper end of the support pin 3 comes into contact with the component 20a, the position of the elevating shaft 4 is fixed by the fixing portion 1a. That is, even when the drive unit 7 continues to generate the pushing force, the pushing force is not continuously applied to the component 20a and the board 20.

  Therefore, applying unnecessary force to the component 20a and the substrate 20 does not damage the component 20a and the substrate 20.

  In addition, when using a drive system such as an air cylinder, the drive unit 7 does not supply air to the drive unit 7 so that no lifting force acts on the lift shaft 4, and the lift shaft 4 may be held by fixing by electrostatic force.

  FIG. 12 is a diagram illustrating a state in which the substrate support apparatus 1 supports the substrate. FIG. 12A is a diagram showing a state in which a substrate on which no component is mounted on the back surface is supported, and FIG. 12B is a diagram in which a substrate on which components are mounted on the back surface is supported. FIG.

  As shown in FIG. 12A, when the substrate support device 1 supports the substrate 20 on which no component is mounted on the back surface, the upper ends of the plurality of support pins 3 follow the plane of the back surface of the substrate 20. The substrate 20 can be kept parallel to the XY plane.

  Further, as shown in FIG. 12B, even when the substrate support apparatus 1 supports the substrate 20 on which the component 20a is mounted on the back surface, the upper ends of the plurality of support pins 3 are connected to the substrate 20. And the substrate 20 can be kept parallel to the XY plane.

  In this way, the substrate support apparatus 1 stably holds the substrate 20 so that the substrate 20 is in a state parallel to the XY plane, that is, in a normal posture, regardless of the irregular shape of the back surface of the substrate 20. Can be supported.

  When components are mounted on the upper surface of the substrate 20 thus supported, the drive unit 7 lowers all the lifting shafts 4 under the control of the control unit 1d. Thereafter, when the next substrate is transferred onto the substrate support device 1, all the lifting shafts 4 are raised.

  FIG. 13 is a diagram illustrating a state in which the substrate support device 1 sequentially supports the substrates being transferred.

  FIG. 13 shows a case where a substrate 22 in which the component is mounted is different from the substrate 20 after the substrate 20 on which the component is mounted on the back surface.

  As shown in FIG. 13, (1) the upper ends of the plurality of support pins 3 are in contact with the back surface of the substrate 20 by the drive unit 7 and are in a position according to the unevenness of the back surface of the substrate 20. The switch is set to [1]. That is, the substrate 20 is stably supported. In this state, components are mounted from above the substrate 20 by the mounting head provided in the component mounter.

  (2) The switch of the power supply unit 12 is set to [0], and all the support pins 3 are returned to the initial positions by the drive unit 7. Further, the board 20 on which the components are mounted is transported in the X-axis direction.

  (3) The next substrate 22 is transported onto the substrate support device 1, and (4) the upper ends of the plurality of support pins 3 are brought into contact with the back surface of the substrate 22 by the driving unit 7, and follow the unevenness of the back surface of the substrate 22. In the position, the switch of the power supply unit 12 is set to [1]. That is, the substrate 22 is stably supported. In this state, components are mounted from above the substrate 22 by the mounting head provided in the component mounter.

  As described above, even when the substrate support device 1 sequentially supports substrates having different uneven shapes on the back surface of the substrate, the substrate support device 1 can accurately support the substrate according to each shape.

  Further, it is not necessary to store in advance information on the uneven shape of the back surface of each substrate, and the drive unit 7 only raises the lifting shaft 4 and the support pin 3 with a predetermined pushing force.

  In addition, after the upper ends of all the support pins 3 come into contact with the board or the components mounted on the back surface of the board, the position of the elevating shaft 4 is fixed by the fixing portion 1a. Is also fixed. Therefore, each support pin 3 does not continue to apply unnecessary force to the substrate and can resist the force received from above the substrate.

  Further, even when no component is mounted on the back surface of the substrate, the back surface of the substrate may not be flat, such as when the substrate is distorted. However, even in such a case, the position of each elevating shaft 4 is fixed in a state where the upper ends of the plurality of support pins 3 are in a position according to the distorted shape of the back surface, and the substrate is stably supported. Can do.

  That is, the substrate support device 1 can support the substrate so that the substrate maintains a normal posture even if the back surface of the substrate is flat or uneven, and damages the substrate and components. There is no such thing as shifting from the normal position.

  If the size of the substrate is smaller than the range that can be supported by the plurality of support pins 3, the support pins 3 that do not support the substrate are also raised by the drive unit 7. However, there is no influence on the support pins 3 that are in contact with the substrate so that the substrate is supported in a normal posture.

  As described above, the substrate support apparatus 1 according to the present embodiment ensures accurate component mounting without depending on the uneven shape of the surface supported by the substrate when the component is mounted on the substrate. Can be done.

  In the present embodiment, it is assumed that all the fixing parts 1a are connected to the power supply part 12 so that a voltage can be applied by the power supply part 12.

  FIG. 14 is a diagram illustrating an arrangement of the fixing portions 1a when the shaft holder 6 of the first embodiment is viewed from the Z-axis direction.

  As shown in FIG. 14, in the present embodiment, the fixing portion 1 a is located on the periphery of each of the plurality of holding holes 9. These fixed parts 1 a are connected to one power supply part 12. Thereby, it is possible to fix the position of all the lifting shafts 4 and release the fixing by one power supply unit 12.

  However, you may control separately the operation | movement of each fixing | fixed part 1a. In addition, information regarding the size of the substrate to be supported may be used for this control.

  For example, in a component mounter, when the size of a substrate to be mounted with a component changes, the width of the transport rail 15 that transports the substrate is changed. Therefore, the information regarding the width of the transport rail 15 after the change may be used as the information regarding the size of the substrate, and the operation of each fixing unit 1a may be individually controlled.

  The “width of the transport rail” refers to the width of the transport rail 15 in the Y-axis direction. The case of “substrate width” also follows this.

  FIG. 15 is a diagram illustrating how the width of the transport rail 15 is changed in the component mounter. FIG. 15A shows a state before the change, and FIG. 15B shows a state after the change.

  The transport rail 15 includes a movable rail 15a and a fixed rail 15b, and the width of the transport rail 15 can be changed by moving the movable rail 15a in the Y-axis direction.

  For example, when the substrate 20 is transported, the substrate 20 is transported with the width shown in FIG. Thereafter, when a substrate 23 having a size different from that of the substrate 20 is transported, the width of the transport rail 15 is changed to the width shown in FIG. 15B corresponding to the size of the substrate 23, and the substrate 23 is transported. .

  The change of the width of the transport rail 15 is performed by executing a program for controlling the operation of the component mounting machine. That is, the component mounter has information about the width of the transport rail 15 (hereinafter referred to as “width information”). The width information is, for example, “width: 100 mm”, “movable rail position: Y = 280”, and the like.

  Therefore, the board | substrate support apparatus 1 can control operation | movement of each fixing | fixed part 1a according to the width information by acquiring this width information from a component mounting machine.

  Specifically, the fixing portions 1a arranged in parallel in the X-axis direction are set as one group. Further, a switch for switching on and off the voltage application to each group by the power supply unit 12 is provided.

  FIG. 16 is a diagram illustrating an example of wiring for applying a voltage to each of the plurality of fixed portions 1a for each group.

  As shown in FIG. 16, the fixing portions 1a arranged in parallel in the X-axis direction are grouped into groups A to D. Further, for each of the groups A to D, wiring for switching on (contact [1]) and off (contact [0]) of voltage application is performed, and a switch corresponding to each group is provided. The switches corresponding to the groups A to D are SW-a, SW-b, SW-c, and SW-d, respectively.

  FIG. 17 is a diagram illustrating a state in which the substrate support device 1 controls the operation of the fixing unit 1 a according to the width of the transport rail 15.

  For example, it is assumed that the movable rail 15a has moved and the width of the transport rail 15 has been changed to the width shown in the upper left diagram of FIG.

  In this case, the control unit 1d acquires the width information related to this change from the component mounter, and selects a plurality of support pins 3 to be raised.

  Specifically, the support pins 3 corresponding to the A group do not need to support the substrate. Therefore, first, SW-a is turned on, and the position of the lifting shaft 4 corresponding to the A group is fixed to each fixing portion 1a. In this state, all the drive parts 7 are operated.

  Accordingly, as shown in FIG. 17, only the support pins 3 corresponding to the groups B to C other than the A group are raised. That is, the board | substrate support apparatus 1 selects the some support pin 3 provided in the position facing the back surface of the board | substrate of a support object based on the acquired width information. Further, the selected plurality of support pins 3 can be moved upward.

  The control unit 1d sets SW-b, SW-c, and SW-d to [1] in a state where the upper ends of all the raised support pins 3 are in contact with the board or a component mounted on the back surface of the board. To. Thereby, the raised support pins 3 are fixed, and the substrate can be supported so that the substrate maintains a normal posture.

  Thus, the board | substrate support apparatus 1 can select the support pin 3 required for support of a board | substrate using the information regarding the width | variety of the conveyance rail 15, and can raise it. In this operation, each operation of the acquisition step and the selection step in the member support method of the present invention is realized by the control unit 1d.

  In this way, for example, when there is a mechanism part below the movable rail 15a and the support pin 3 is not desired to be in contact with the mechanism part, the support pin 3 just below the movable rail 15a may not be raised. it can.

  When the component mounter has information for specifying the size of the board that is the target of component mounting, the board support device 1 specifies information for specifying the size of the board, not the width of the transport rail 15. May be acquired from the component mounter.

  If the size of the substrate can be specified, it can be determined which group the support pins 3 should be raised. For this reason, it is possible to control the elevation of the support pins 3 in units of groups as described above by acquiring and using information specifying the size of the board from the component mounter.

  Further, the substrate support apparatus 1 may be adapted to the width of the substrate in the X-axis direction instead of or in addition to selecting and raising the support pins 3 necessary for supporting the substrate according to the width of the substrate in the Y-axis direction. Then, the operation of each fixing part 1a may be controlled to select and raise the support pins 3 necessary for supporting the substrate.

  In this case, if a switch for applying a voltage for each group corresponding to the group of fixed portions 1a divided along the Y-axis direction or a switch for applying a voltage corresponding to each fixed portion 1a is provided. Good. Further, the control unit 1d may acquire information necessary for this control from, for example, a component mounter, and control these switches.

  Here, the substrate support device 1 according to the present embodiment is configured according to the uneven shape of the back surface, regardless of whether the component is mounted on the back surface of the substrate or the arrangement of the components. The substrate can be supported.

  Therefore, when the substrate support apparatus 1 raises only the support pins 3 necessary for supporting the substrate in consideration of both the widths of the substrate in the X-axis direction and the Y-axis direction, for example, the conventional first substrate support Unlike the device, no information is required on which part of the back side of the board the component is placed.

  Therefore, when storing information for raising only the support pins 3 necessary for supporting the substrate, it is only necessary to store information indicating the widths of the substrate in the X-axis direction and the Y-axis direction. That is, the amount of information to be stored and managed is smaller than that of the conventional first substrate support apparatus.

  Further, regardless of the presence or absence of components on the back side of the substrate, all the support pins 3 existing directly under the substrate are lifted to support the substrate, so that more stable support than the conventional first substrate support device can be performed. it can.

  Moreover, you may control operation | movement of each drive part 7 instead of controlling operation | movement of each fixing | fixed part 1a. For example, in the case of the example shown in FIG. 17, the control unit 1d operates only the drive unit 7 corresponding to the B to D groups. This also prevents the support pins 3 corresponding to the A group that is not necessary for supporting the substrate from being raised.

  Further, in the present embodiment, the substrate support device 1 repeats raising and lowering of the support pins 3 every time the substrate to be supported is changed as shown in FIG.

  However, in the case where substrates having the same concavo-convex shape of the supported surface, that is, substrates of the same type, are continuously conveyed, there is no need to change the relative position of each support pin 3 with respect to the shaft holder 6. Therefore, instead of moving the support pins 3 up and down for each substrate to be supported, the shaft holder 6, the lifting shaft 4 and the support pins 3 may be moved up and down while the positions of the support pins 3 are fixed.

  In this case, for example, the shaft holder 6 is fixed to the base 8 in parallel with the base 8 at a predetermined distance. Further, the base 8 is not fixed to the component mounter, but is attached to the component mounter so that it can be moved up and down.

  Further, a drive mechanism for moving the base 8 up and down is installed, for example, under the base 8, and the control unit 1d performs the control.

  FIG. 18 is a flowchart showing an operation flow of the substrate support apparatus 1 when the vertical movement of each support pin 3 is controlled depending on whether or not the position change of each support pin 3 is necessary.

  At the start of the following operation, the base 8 is lowered to a predetermined initial position.

  First, it is determined whether or not the position of each support pin 3 needs to be changed based on the information related to the board acquired from the control unit 1d and the component mounting machine (S10).

  For example, when a board | substrate is first conveyed on the board | substrate support apparatus 1, it is necessary to change the position of each support pin 3 according to the said board | substrate.

  Even when the type of the substrate is changed, it is necessary to change the positions of the support pins 3 in accordance with the uneven shape of the back surface of the substrate after the change.

  Furthermore, even when the same type of substrate is continuously supported, the substrate is held by adjusting the position of each support pin 3 when the number of supported substrates exceeds a predetermined number. It is conceivable to maintain the accuracy of the posture. Also in this case, it is necessary to change the position of each support pin 3 for every predetermined number.

  When determining that the position of each support pin 3 needs to be changed based on one of these determination criteria or a combination of these determination criteria (Yes in S10), the control unit 1d switches the switch of the power source unit 12 to [ 0] and the drive unit 7 is driven downward to lower the support pin to the lowest point. As a result, each lifting shaft 4 is neutralized, and all the support pins 3 are lowered to the lowest point (S11).

  When the position of the support pin is unknown even at the start of component mounting, the support pin is moved to the lowest point by switching the switch of the power supply unit 12 to [0] and driving the drive unit 7 downward. The support pin can be surely moved to the lowest point by lowering to.

  Thereafter, the control unit 1d raises the base 8 to a predetermined position (S12). That is, the base 8, the shaft holder 6, the plurality of lifting shafts 4, and the plurality of support pins 3 are integrally raised to a predetermined position.

  Thereafter, the control unit 1d raises each support pin 3 (S13), and fixes the position of each lifting shaft 4 in a state where each of the support pins 3 is in contact with the substrate (S14). That is, the switch of the power supply unit 12 is set to [1].

  In this manner, various components are mounted on the substrate while the substrate is held on each support pin 3. When the mounting is completed, the control unit 1d lowers the base 8 to a predetermined initial position (S16).

  After that, when mounting is completed on all the substrates (Yes in S17), that is, when there is no next substrate to be transported on the substrate support device 1, the substrate support device 1 operates to support the substrate. Exit.

  If there is still a substrate to be supported by the substrate support device 1, the control unit 1d determines whether or not the position of each support pin 3 needs to be changed for the next substrate (S10).

  Here, for example, when the substrate to be supported next by the substrate support apparatus 1 is of the same type as the previously supported substrate, it is determined that the position change of each support pin 3 is unnecessary (No in S10). ) After the substrate is transferred onto the substrate support device 1, the base 8 is raised to a predetermined position.

  Thereby, the said board | substrate is supported by each support pin 3, and various components are mounted.

  As described above, the substrate support device 1 according to the present embodiment determines that the position of each support pin 3 needs to be changed, for example, when the uneven shape of the substrate that is the subsequent member is different from the uneven shape of the substrate that is the preceding member. Only in some cases, the position may be changed.

  That is, when sequentially supporting a plurality of substrates, the positions of the support pins 3 may be maintained depending on the shape of the substrates.

  FIG. 19 is a diagram illustrating a state in which the substrate support device 1 sequentially supports the substrates without changing the positions of the support pins 3.

  For example, it is assumed that the substrates 20 that are the same type of substrate are sequentially transferred onto the substrate support apparatus 1.

  In this case, as shown in FIG. 19, (1) the power source is in a state where the upper ends of the plurality of support pins 3 are in contact with the back surface of the substrate 20 by the drive unit 7 and are in a position according to the unevenness of the back surface of the substrate 20 The switch of the section 12 is set to [1], and the substrate 20 is stably supported. In this state, components are mounted from above the substrate 20 by the mounting head provided in the component mounter.

  (2) The base 8 is returned to the predetermined initial position while the switch of the power supply unit 12 remains at [1]. Further, the board 20 on which the components are mounted is transported in the X-axis direction.

  (3) The next substrate 20 is transferred onto the substrate support device 1, and (4) the base 8 is raised to a predetermined position. At this time, the height positions of the plurality of support pins 3 with respect to the shaft holder 6 (and the base 8) are the same as when the previous substrate 20 is supported.

  Therefore, the substrate 20 that is currently supported is stably supported. In this state, components are mounted from above the substrate 20 by the mounting head provided in the component mounter.

  As described above, when the substrate support device 1 sequentially supports substrates having the same concave and convex shape on the back surface of the substrate, each substrate pin 8 can be accurately moved up and down without changing the position of each support pin 3. The substrate can be supported.

  Further, in the present embodiment, the shaft holder 6 is fixed to the base 8 or the component mounting machine in parallel with the base 8 at a predetermined distance. That is, the shaft holder 6 does not need to move with respect to the base 8. Therefore, the shaft holder 6 and the base 8 can be integrated.

  FIG. 20 is a diagram showing a configuration when the shaft holder 6 and the base 8 are integrated.

  As shown in FIG. 20, the drive unit 7 is installed so as to be embedded in the shaft holder 6. Further, the shaft holder 6 is fixed at a predetermined position in the component mounter. That is, the shaft holder 6 shown in FIG. 20 has the functions of the shaft holder 6 and the base 8 shown in FIG.

  By doing so, for example, the substrate support apparatus 1 can be made compact. Further, in the case of such a compact configuration, the operation described with reference to FIGS. 18 and 19 can be realized more easily.

  Moreover, the fixing | fixed part 1a has the two electrodes 11 which face each other. However, the fixing portion 1a may have three or more electrodes 11.

  For example, you may install the four electrodes 11 so that the four sides of the raising / lowering axis | shaft 4 may be enclosed. When the number of the electrodes 11 is increased in this way, the electrostatic force acting as a force for fixing the elevating shaft 4 increases in proportion to the number.

  The number of electrodes 11 included in the fixing portion 1a may be one. That is, if an electrostatic force capable of fixing the position of the lifting / lowering shaft 4 against the push-up force of the driving unit 7 on the lifting / lowering shaft 4 and the support pin 3 and the force received from above by the substrate to be supported can be generated. The number may be 1.

  The material of the support pin 3 is not particularly limited, and can be made of a material such as rubber, metal, and plastic. In short, any material and shape that can support a member to be supported may be used.

  Further, when supporting a substrate with a notch, it is conceivable that the upper end of the support pin 3 enters the notch and the substrate cannot be supported so as to maintain a normal posture.

  In order to prevent such a state, the upper end of the support pin 3 may be sized so as not to enter the notch.

  FIG. 21 is a diagram showing the width of the notch of the substrate and the width of the upper end of the support pin 3.

  As shown in FIG. 21A, it is assumed that the substrate supported by the substrate support apparatus 1 has a notch and the width thereof is “T”. Further, as shown in FIG. 21B, it is assumed that the width of the upper end of the support pin 3 in the Y-axis direction is “W1” and the width in the X-axis direction is “W2”.

  In such a case, if “T <W1” and “T <W2”, the upper end of the support pin 3 does not enter the notch, and the substrate can be supported so that the substrate maintains a normal posture. .

  Moreover, the drive part 7 may not be an air cylinder, for example, the mechanism which pushes up the raising / lowering axis | shaft 4 and the support pin 3 with a motor may be sufficient as it. That is, the drive part 7 should just raise the raising / lowering axis | shaft 4 and the support pin 3 until the upper end of the support pin 3 contact | abuts to a board | substrate.

  Further, the support pin 3 and the elevating shaft 4 may not be separate. For example, the upper end portion of the lifting shaft 4 may serve as the support pin 3. Alternatively, the support pin 3 may be pushed up directly by the drive unit 7.

  Further, the substrate support device 1 may not include 20 sets of the support pins 3 and the lifting shaft 4. What is necessary is just to provide the support pin 3 and the raising / lowering axis | shaft 4 of 1 or more sets.

  As shown in FIG. 1, when the board support apparatus 1 is provided in a component mounter, the board to be supported is supported on both sides parallel to the X-axis direction by the transport rail 15.

  Therefore, for example, when the substrate to be supported is small, if the support pin 3 supporting the member and the lifting shaft 4 are in one set, the substrate can be supported so that the substrate maintains a normal posture. Cases are also conceivable. That is, in such a case, only one set of the support pin 3 and the lifting shaft 4 is required.

  Moreover, the board | substrate which the board | substrate support apparatus 1 supports is not limited to a specific kind. For example, a rigid substrate using an inflexible material for the insulator base material or a flexible substrate using a flexible material may be used. Further, it may be a rigid-flex board that is a multilayer board having a rigid part on which components are mounted and a bendable flex part.

  Here, in the board | substrate support apparatus 1, the case where the board | substrate of a support object is a board | substrate which has flexibility in all or one part like a flexible board | substrate or a rigid flexible board | substrate is assumed.

  In this case, for example, the maximum height reached by the upper end of the support pin 3 is set to several hundred microns above the position where the back surface of the substrate exists, and the movement acceleration of the support pin 3 is reduced. By performing the adjustment, even if the substrate is weak against such a force, the support pins 3 do not substantially damage the substrate and the component.

  In addition, after the upper end of the support pin 3 comes into contact with the substrate or a component mounted on the back surface of the substrate, the position of the lifting shaft 4 that has pushed up the support pin 3 is fixed. Therefore, unnecessary force is not applied to such a flexible substrate, that is, a substrate that is easily deformed.

  As described above, the substrate support device 1 does not continue to push the substrate with the elastic force of the spring unlike the conventional second substrate support device, and therefore, the substrate support device 1 is used to support such a deformable substrate. Even if it exists, a board | substrate can be supported so that a board | substrate may maintain a normal attitude | position.

(Embodiment 2)
As a second embodiment of the present invention, unlike the first embodiment, a substrate support apparatus in which a plurality of support pins 3 are simultaneously lifted by one drive unit raising the shaft holding body 6 will be described.

  First, the structure of the substrate support apparatus 2 of Embodiment 2 is demonstrated using FIGS. 22-25.

  FIG. 22 is an overview diagram showing an overview of the substrate support apparatus 2 according to Embodiment 2 of the present invention.

  A substrate support device 2 shown in FIG. 22 is another example of the member support device of the present invention, and is provided in a component mounting machine, like the substrate support device 1. Further, the substrate 20 transported by the transport rail 15 can be supported from below.

  As shown in FIG. 22, the substrate support device 2 includes a support pin 3, an elevating shaft 4, a fixed portion 2 a, a shaft holder 6, a drive portion 7 a, and a base 8.

  The fixing portion 2a is a component that fixes the position of the elevating shaft 4 by electrostatic force, like the fixing portion 1a of the first embodiment, and has two electrodes 11. Each of these two electrodes 11 is included in an insulator 5. The fixing principle is the same as that of the fixing portion 1a of the first embodiment.

  The substrate support device 2 includes 20 sets of support pins 3 and lifting shafts 4 as with the substrate support device 1, but does not have a drive unit corresponding to each set, and one drive unit. 7a.

  Further, the shaft holder 6 has a fixing portion 2 a corresponding to each lifting shaft 4. All these fixing parts 2a are connected to the power supply part 12 in the same manner as the fixing part 1a in the substrate support apparatus 1, and a predetermined voltage is applied to the power supply part 12 so that the position of each lifting shaft 4 with respect to the shaft holder 6 is To fix.

  In this embodiment, the elevating shaft 4 and the inner surface of the holding hole 9 are in contact with each other, and the elevating shaft 4 slides on the shaft holding body 6 by the frictional force between the shaft holding body 6 and the inner surface. Held possible.

  This frictional force is such a force that the elevating shaft 4 and the support pin 3 do not fall off the shaft holding body 6 due to their own weight. That is, the size of the holding hole 9 and the material of the insulator 5 are determined so that this level of frictional force is exhibited.

  As in the first embodiment, a clearance is provided between the lifting shaft 4 and the inner surface of the holding hole 9, and a voltage lower than the voltage at the time of fixing is applied to the fixing portion 2a, so that the lifting shaft 4 and the support pin 3 Can be held slidably so as not to fall off the shaft holder 6 by its own weight. This configuration will be described later with reference to FIGS.

  The drive unit 7a is fixed to the base 8, and by moving the shaft holding body 6, the lifting shaft 4 slidably held by the shaft holding body 6 is moved, and the upper ends of the plurality of support pins 3 are moved. It can be brought into contact with the substrate. The drive unit 7a is another example of a component that realizes the execution of the contact step in the member support method of the present invention. In the present embodiment, the drive unit 7a is specifically an air cylinder.

  The basic operation flow related to the substrate support of the substrate support device 2 is the same as the operation flow of the substrate support device 1 shown in FIG.

  That is, the support pin 3 is raised by the drive unit 7a (S1). The position of the elevating shaft 4 is fixed in a state where the upper end of the support pin 3 is in contact with the substrate or a component mounted on the back surface of the substrate (S2).

  Thereafter, when the component mounting on the board is completed, all the lifting shafts 4 are neutralized, and the support pins 3 are lowered to the lowest point by the drive unit 7a (S3).

  Thereafter, the series of operations is performed on each board until component mounting is completed for all boards (Yes in S4).

  However, the board | substrate support apparatus 2 raises the raising / lowering axis | shaft 4 hold | maintained by the shaft holding body 6 so that sliding is possible by raising the shaft holding body 6. FIG. That is, the plurality of support pins 3 are raised by raising the shaft holder 6.

  FIG. 23 is a side view of the substrate support apparatus 2 when viewed from the Y-axis direction.

  As shown in FIG. 23, the drive part 7a can raise the shaft holding body 6 by pushing up the shaft holding body 6 from below.

  Further, the elevating shaft 4 moves with the vertical movement of the shaft holding body 6 by the frictional force between the elevating shaft 4 and the shaft holding body 6 as described above.

  FIG. 24 is a diagram showing an outline of the configuration of the fixing portion 2a.

  As shown in FIG. 24, the fixing portion 2a has two electrodes 11 included in the insulator 5, like the fixing portion 1a of the first embodiment.

  Moreover, the fixing | fixed part 2a can fix the position of the raising / lowering axis | shaft 4 by applying a voltage from the power supply part 12, like the fixing | fixed part 1a.

  FIG. 25 is a functional block diagram showing a functional configuration of the substrate support apparatus 2.

  As shown in FIG. 25, the substrate support apparatus 2 includes a control unit 2b that controls the drive unit 7a and the fixing unit 2a. Specifically, the control part 2b performs control for raising and lowering the shaft holding body 6 with respect to the drive part 7a.

  Moreover, control for releasing and fixing the position of the elevating shaft 4 is performed on the plurality of fixing portions 2a. In FIG. 25, only one fixed part 2a is shown for simplification of illustration.

  Next, the operation of the substrate support apparatus 2 according to the second embodiment will be described with reference to FIGS.

  FIG. 26 is a schematic diagram showing an outline of the operation when the substrate support apparatus 2 supports the substrate.

  As shown in FIG. 26, (1) the substrate 20 is transferred onto the substrate support device 2. In this state, the switch of the power supply unit 12 is [0].

  (2) The drive unit 7a raises the shaft holder 6 while the switch of the power supply unit 12 remains [0]. Along with this rise, the support pin 3 also rises, and the upper end of the support pin 3 comes into contact with the substrate 20 or a component 20a mounted on the back surface of the substrate 20.

  Here, as shown in FIG. 26, when the component 20 a is mounted on the back surface of the substrate 20, the back surface of the substrate 20 has an uneven shape. That is, the plurality of support pins 3 do not contact the substrate 20 or the component 20a at the same time. Therefore, even if a certain support pin 3 comes into contact with the component 20a, the drive unit 7a needs to raise the shaft holding body 6 until another support pin 3 comes into contact with the substrate 20 or another component.

  Even in such a case, since the lifting shaft 4 is slidably held by the shaft holder 6, the lifting shaft 4 under the support pin 3 that is in contact with the component 20 a is connected to the shaft holder 6. Can be slid downward with respect to the shaft holder 6, that is, in a direction opposite to the support direction. That is, the relative position with respect to the shaft holder 6 can be changed while maintaining the relative position in the substrate support device 2.

  Further, the frictional force acting between the shaft holding body 6 and the lifting shaft 4 is such a force that the lifting shaft 4 and the support pin 3 do not fall out of the shaft holding body 6 due to their own weight.

  Therefore, even when the shaft holding body 6 continues to rise while the upper end of a certain support pin 3 is in contact with the component 20a, the support pin 3 does not apply an excessive force to the component 20a. .

  (3) With the upper end of the support pin 3 in contact with the substrate 20 or the component 20a, the drive unit 7a stops the ascending of the shaft holder 6, and the control unit 2b controls the power source unit 12 The switch is set to [1], and the elevating shaft 4 is fixed by the fixing portion 2a.

  Note that the timing at which the control unit 2b sets the switch of the power supply unit 12 to [1] is about 2 seconds after the drive unit 7a is operated, as in the first embodiment. That is, during this time, it means that the upper ends of the plurality of support pins 3 immediately below the substrate 20 abut on the substrate or a component mounted on the back surface of the substrate.

  In addition, the controller 2b has finished the pushing-up operation of the drive unit 7a, or the lifting shaft 4 below the plurality of support pins 3 whose upper ends are in contact with the substrate or the component is connected to the shaft holder 6. The switch of the power supply unit 12 may be set to [1] by detecting that it is stationary.

  That is, the position of each elevating shaft 4 is fixed when the elevating shafts 4 below the plurality of support pins 3 whose upper ends are in contact with the substrate or components are stationary with respect to the shaft holder 6. In this case, the fixing may be performed with the passage of a predetermined time, or may be performed with a change in the state of the component.

  FIG. 27 is a diagram illustrating a state in which the substrate support device 2 supports the substrate. FIG. 27A is a diagram showing a state where a substrate on which no component is mounted is supported on the back surface, and FIG. 27B is a state where a substrate on which components are mounted on the back surface is supported. FIG.

  As shown in FIG. 27A, when the substrate support device 2 supports the substrate 20 on which no component is mounted on the back surface, the upper ends of the plurality of support pins 3 follow the plane of the back surface of the substrate 20. The substrate 20 can be kept parallel to the XY plane.

  In addition, as shown in FIG. 27B, even when the substrate support device 2 supports the substrate 20 on which the component 20a is mounted on the back surface, the upper ends of the plurality of support pins 3 are connected to the substrate 20. And the substrate 20 can be kept parallel to the XY plane.

  That is, similarly to the substrate support device 1, the substrate support device 2 can support the substrate 20 so that the substrate 20 maintains a normal posture regardless of the shape of the back surface of the substrate 20.

  FIG. 28 is a diagram illustrating a state in which the substrate support device 2 sequentially supports the substrates being transferred.

  FIG. 28 shows a case where a substrate 22 having a component mounted position different from the substrate 20 is conveyed after the substrate 20 on which the component is mounted on the back surface.

  As shown in FIG. 28, (1) the upper ends of the plurality of support pins 3 are brought into contact with the back surface of the substrate 20 by the drive unit 7a and are in a position according to the unevenness of the back surface of the substrate 20, The switch is set to [1]. That is, the substrate 20 is stably supported. In this state, components are mounted from above the substrate 20 by the mounting head provided in the component mounter.

  (2) The switch of the power supply unit 12 is set to [0], and the shaft holder 6 is returned to the initial position by the drive unit 7a. Further, the board 20 on which the components are mounted is transported in the X-axis direction.

  (3) The next substrate 22 is transported onto the substrate support device 2, and (4) the upper ends of the plurality of support pins 3 are brought into contact with the back surface of the substrate 22 by the driving unit 7a, and follow the unevenness of the back surface of the substrate 22. In the position, the switch of the power supply unit 12 is set to [1]. That is, the substrate 22 is stably supported. In this state, components are mounted from above the substrate 22 by the mounting head provided in the component mounter.

  As described above, the substrate support device 2 can support the substrate accurately according to each shape even when sequentially supporting the substrates having different uneven shapes on the back surface of the substrate, like the substrate support device 1. it can.

  Further, it is not necessary to store in advance information about the uneven shape of the back surface of each substrate, and the drive unit 7a only raises the shaft holder 6 with a predetermined pushing force.

  In addition, after the upper ends of all the support pins 3 come into contact with the substrate or the components mounted on the back surface of the substrate, the position of the lifting shaft 4 is fixed by the fixing portion 2a, so that the support pins 3 are stationary. Is also fixed. Therefore, each support pin 3 does not give unnecessary force to the substrate and can resist the force received from above the substrate.

  That is, the substrate support apparatus 1 can support the substrate so that the substrate maintains a normal posture, and does not damage the substrate and components or shift the substrate from the normal position.

  Even when the size of the substrate is smaller than the range that can be supported by the plurality of support pins 3, the support pins 3 that are in contact with the substrate keep the substrate in a normal posture, as in the substrate support device 1. There is no impact on being supported to keep.

  As described above, the substrate support apparatus 2 according to the present embodiment ensures the component mounting with high accuracy without depending on the uneven shape of the surface supported by the substrate when the component is mounted on the substrate. Can be done.

  In the present embodiment, the elevating shaft 4 is slidably held on the shaft holder 6 by frictional resistance.

  However, as in the first embodiment, a gap may exist between the inner surface of the holding hole 9 and the lifting shaft 4.

  In this case, when the shaft holder 6 is moved up and down, a voltage is applied to the fixed portion 2a to generate an electrostatic force that does not cause the lift shaft 4 and the support pin 3 to fall off the shaft holder 6 due to their own weight.

  Accordingly, each lifting shaft 4 can be lifted and lowered with respect to the shaft holding body 6 as the shaft holding body 6 is lifted and lowered.

  FIG. 29 is a diagram illustrating a relationship between the three-stage state of the switch of the power supply unit 12 and the electrostatic force generated between the lifting shaft 4 and the fixed unit 2a.

  Note that the voltages applied to the fixed portion 2a when the switch states are [0], [1], and [2] are “0”, “V0”, and “V1” in this order. And Further, the magnitude relationship between these is “0 <V0 <V1”. When the switch state is [0], the fixed portion 2a is grounded as in the switch shown in FIG.

  As shown in FIG. 29, when the state of the switch is changed to [0], [1], [2], the voltage applied to the fixed portion 2a increases, so that the generated electrostatic force also increases.

  Further, when the switch is [0], the electrostatic force is “0”, and there is a gap between the shaft holder 6 and the lift shaft 4, so that the lift shaft is lifted even if the shaft holder 6 is lifted. 4 will not rise.

  The electrostatic force “F0” when the switch is [1] is an electrostatic force that prevents the lifting shaft 4 and the support pin 3 from coming off the shaft holder 6 under their own weight.

  Therefore, when the switch is [1], the lifting shaft 4 is also raised as the shaft holding body 6 is raised, but the shaft holding body 6 is continuously raised after the upper end of the support pin 3 comes into contact with the substrate. The lift shaft 4 is held by the shaft holder 6 while sliding.

  The electrostatic force “F1” when the switch is [2] is an electrostatic force capable of fixing the position of the elevating shaft 4 against the force received from above the substrate.

  Thus, even when a gap is provided between each lifting shaft 4 and the inner surface of the holding hole 9, the lifting shaft 4 is changed to the shaft holding body 6 by changing the voltage applied to the fixed portion 2 a. It is possible to hold it slidably and to fix the position of the elevating shaft 4 with respect to the shaft holder 6.

  Furthermore, when the electrostatic force in each state of the switch of the power supply unit 12 has the above-described value, it is possible to select and raise the support pin 3 necessary for supporting the substrate.

  That is, in the board support device 2, as with the board support device 1, information received from the component mounter may be used to individually control the operation of each fixing unit 2 a.

  Specifically, for the fixing part 2a corresponding to the support pin 3 necessary for supporting the substrate, the switch is set to [1] and the voltage V0 is applied. Further, for the fixing portion 2a corresponding to the support pin 3 unnecessary for supporting the substrate, the switch is set to [0], the lifting shaft 4 is neutralized, and the fixing to the shaft holding body 6 is released. Further, in this state, the shaft holder 6 is raised.

  Thereby, the raising / lowering axis | shaft 4 corresponding to the fixing | fixed part 2a to which the voltage V0 was applied raises with the axis | shaft holding body 6. FIG. In addition, the lift shaft 4 that has been neutralized remains in the initial position.

  This operation can also be realized, for example, by grouping the fixed portions 2a and providing a switch capable of switching the applied voltage in three stages for each group, as shown in the wiring diagram of FIG.

  FIG. 30 is a diagram illustrating an example of wiring for switching the applied voltage in three stages for each group with respect to the plurality of fixing portions 2a.

  As shown in FIG. 30, the fixed portions 2a arranged in parallel in the X-axis direction are grouped into groups A to D. Further, a switch is provided for each of the groups A to D to switch the applied voltage to any one of “0”, “V0”, and “V1”. The switches corresponding to these groups A to D are SW-a, SW-b, SW-c, and SW-d, respectively.

  With this wiring, it is possible to switch for each group whether or not the plurality of lifting shafts 4 are lifted together with the shaft holder 6.

  Specifically, as shown in FIG. 30, when the fixing portions 2a arranged in parallel in the X-axis direction are made into one group, it faces the back surface of the substrate according to the width in the Y-axis direction of the substrate to be supported. The support pins 3 provided at the positions to be selected can be selected and raised in groups.

  Further, as described with reference to FIGS. 15 to 17, the component mounting machine has the width information of the transport rail 15, and the board support device 2 acquires the width information from the component mounting machine. According to the width information, the operation of the fixed unit 2a can be controlled in units of groups.

  FIG. 31 is a diagram illustrating a state in which the substrate support device 2 controls the operation of the fixing unit 2 a according to the width of the transport rail 15.

  As shown in FIG. 31, (1) the movable rail 15a moves to narrow the rail width, and the substrate 20 having a narrow width is conveyed. The control part 2b of the board | substrate support apparatus 2 acquires width information from a component mounting machine, and selects BD group based on the acquired width information. That is, SW-a corresponding to the A group is set to [0], and other SW-b, SW-c, and SW-d are set to [1].

  (2) The shaft holder 6 is raised by the drive unit 7a. At this time, SW-a is [0], and the lifting shaft 4 corresponding to the A group does not rise. That is, the support pin 3 corresponding to the A group does not rise. Further, the support pins 3 corresponding to the BD groups are raised.

  (3) The upper end of each raised support pin 3 is in a position according to the unevenness of the back surface of the substrate 20. In this state, the control unit 2b sets SW-b, SW-c, and SW-d to [2]. That is, each fixing part 2a of the B to D groups fixes the position of each lifting shaft 4. Thereby, the board | substrate 20 is supported stably.

  As described above, the substrate support device 2 selects a plurality of support pins 3 including the plurality of support pins 3 provided at positions facing the back surface of the substrate to be supported based on the acquired width information. Further, the selected plurality of support pins 3 can be moved upward. In this operation, each operation of the acquisition step and the selection step in the member support method of the present invention is realized by the control unit 2b.

  In this way, when the substrate support apparatus 1 according to the first embodiment selects and raises the support pins 3 necessary for supporting the substrate, for example, when there is some mechanism part below the movable rail 15a, It can prevent that the support pin 3 contacts a mechanism part.

  Similarly to the board support device 1, the board support device 2 acquires information specifying the size of the board, not the width of the transport rail 15, from the component mounter and uses it to control the operation of each fixing unit 2a. May be. Further, instead of or in addition to selecting and raising the support pins 3 necessary for holding the substrate according to the width of the substrate in the Y-axis direction, each of the fixing portions 1a is changed according to the width of the substrate in the X-axis direction. The operation may be controlled and the support pins 3 necessary for supporting the substrate may be selected and raised.

  Also, the support pins 3 are not limited to specific materials and shapes as in the first embodiment. Further, as described with reference to FIG. 21, in order to support a substrate having a notch, the tip of the support pin 3 may be sized so as not to enter the notch.

  Moreover, the drive part 7a may not be an air cylinder, but should just be a mechanism which can raise the raising / lowering axis | shaft 4 and the support pin 3 until the upper end of the support pin 3 contact | abuts to a board | substrate.

  Further, the support pin 3 and the elevating shaft 4 may not be separate. Any shape, size, and material that can support the substrate may be used.

  Further, the substrate support device 2 may not include 20 sets of the support pins 3 and the lifting shaft 4. What is necessary is just to provide the support pin 3 and the raising / lowering axis | shaft 4 of 1 or more sets. This is because if there are one or more pairs of support pins 3 and lifting shafts 4, there may be cases where the members can be supported so as to maintain a normal posture as described above.

  Also in the substrate support device 2, as in the substrate support device 1, the substrate to be supported may be any of a rigid substrate, a flexible substrate, and a rigid flexible substrate.

  When the substrate to be supported by the substrate support device 2 is a flexible substrate such as a flexible substrate or a rigid flexible substrate, the same adjustment as the substrate support device 1 may be performed.

  Specifically, the maximum height reached by the upper end of the support pin 3 and the movement acceleration of the support pin 3 are adjusted.

  Further, in the substrate support device 2, when the shaft holder 6 is raised, the elevating shaft 4 is slidably held by the shaft holder 6. Therefore, this holding force is lowered to a limit at which the elevating shaft 4 to which the support pin 3 is attached does not fall off from the shaft holding body 6 by its own weight, so that the support pin 3 can be attached to the component mounted on the substrate or the back surface of the substrate. When the upper end comes into contact, the elevating shaft 4 is easy to slide with respect to the shaft holder 6.

  Therefore, the force applied to the board and the component at the time of contact can be minimized. In addition, what is necessary is just to obtain | require the said holding force optimally by experiment etc.

  Also in the substrate support device 2, the position of each support pin 3 may not be changed for each substrate, but only when necessary (see FIGS. 18 and 19).

  In addition, as the first and second embodiments, the case where one substrate support device 1 or 2 is provided in the component mounter has been described. However, a plurality of board support devices 1 or 2 may be provided in the component mounter.

  For example, a plurality of substrate support devices 1 or 2 can be incorporated in a component mounting machine as a substrate support unit including fewer than 20 sets of support pins 3 and lifting shafts 4. In this way, the component mounter can target components of various sizes from large substrates to small substrates by changing the number of units.

  FIG. 32 is a diagram illustrating an arrangement example of a plurality of unitized substrate support apparatuses in a component mounter.

  FIG. 32A shows a state where six substrate support units are arranged, and FIG. 32B shows a state where four substrate support units are arranged.

  32A and 32B, a substrate support unit 101 is a unitized substrate support device 1 according to the first embodiment. The substrate support unit 102 is a unitized substrate support device 2 according to the second embodiment. That is, the substrate support device 1 or the substrate support device 2 can be unitized.

  In FIG. 32A, six substrate support units 101 (102) with unit numbers <1> to <6> are arranged, and the substrate can be supported by these six substrate support units 101 (102). .

  Here, when the size of the board to be mounted by the component mounting machine is small, for example, as shown in FIG. 32B, the two board support units 101 with unit numbers <1> and <6> are provided. (102) is taken out.

  Further, the movable rail 15a moves to the position shown in FIG. 32B according to the size of the board to be transported. Thereby, the board | substrate conveyed by the conveyance rail 15 can be supported by the four board | substrate support units 101 (102) of unit number <2>-<5>.

  Thus, when the board | substrate support apparatus 1 or 2 is unitized, a board | substrate support unit can be shared between several component mounting machines according to the specification of these units, for example. In addition, there is a time and economic advantage such as maintenance such as repair in units.

  In addition, as the first and second embodiments of the present invention, the substrate support apparatus that supports the substrate in the component mounter has been described. However, the present invention can also be applied as a member supporting method and a supporting device in other devices.

  For example, the present invention is applicable to a substrate support method and a support device in a screen printing machine that applies a conductive paste such as a solder paste to a substrate.

  In the screen printing machine, when the conductive paste is applied to the substrate, the squeegee moves on the substrate masked except for the application portion so as to apply the conductive paste to the substrate. That is, the substrate receives a force from above from the squeegee.

  Therefore, it is important to firmly support the substrate in the screen printer. In addition, when a component is mounted on the back surface of the substrate, that is, the back surface of the substrate may be uneven, the member support method and the member support device of the present invention are used as a substrate support method in a screen printing machine and Use as a support device is useful.

  Further, the present invention is also useful as a support method and a support device for supporting, for example, a metal having irregularities on the surface to be supported, work such as polishing, cutting, and component mounting on wood or the like.

  The member support method and member support apparatus according to the present invention, when any work is performed on the member, causes the support to abut from the side of the member that is approximately opposite to the side on which the operation is performed, and the support abuts. And a method and an apparatus for fixing the position of the support in a state of being performed.

  Therefore, the present invention is not limited to the case where the member to be supported is a substrate on which no component is mounted on the back surface and a substrate on which one or more components are mounted on the back surface, as in the substrate support devices 1 and 2. It can be implemented as a member support method and member support device during various operations on various members constituting an industrial product.

  Further, the supporting direction does not need to be a supporting direction from bottom to top as in the substrate supporting devices 1 and 2. For example, when a component is attached while applying a force to the right side surface of a certain member, the direction in which the member is supported is a direction from left to right. In this case, the support may be brought into contact with the member from the left side of the member, and the position of the support may be fixed in the contacted state.

  In short, as described above, regardless of what material the member to be supported is, what uneven shape is on the side opposite to the work side, and in which direction the support direction is Regardless of whether it is present, the present invention can be implemented, and the member to be supported can be supported so as to maintain a normal posture.

  Specifically, the size, shape, hardness, number, and arrangement of the support and the position of the support are fixed according to the size and weight of the member to be supported, the magnitude of the force applied during work, etc. What is necessary is just to determine the fixing force at the time of doing.

  Thus, the present invention can be implemented as a method and apparatus for supporting a member regardless of the material of the member, the support direction, and the like, and work on the member can be performed accurately and reliably.

(Supplementary items of Embodiments 1 and 2)
In the first and second embodiments, the position of the elevating shaft 4 with respect to the shaft holder 6 is fixed by electrostatic force. In addition, the fixing principle is as described with reference to FIGS. 3 (A) to 4 (B).

  Here, it has been described that the lifting shaft 4 is grounded in FIGS. 3A to 4B, and that grounding is not required when the material of the lifting shaft 4 is a non-conductor.

  However, it is possible to charge the lifting / lowering shaft 4 without grounding the lifting / lowering shaft 4 regardless of whether or not the material of the lifting / lowering shaft 4 is a conductor.

  FIG. 33 is a view for explaining a method of charging the elevating shaft 4 without grounding.

  FIG. 33 shows a case where the method is performed in the fixing unit 1a of the first embodiment, but the method can be similarly implemented in the fixing unit 2a of the second embodiment.

  As shown in the figure, voltages having opposite signs are applied to the two electrodes 11. Specifically, in the figure, the lower electrode 11 is connected to the power supply unit 12, and when the switch is [1], the voltage V1 (V1> 0) is applied.

  In the drawing, the upper electrode 11 is connected to the power supply unit 13, and when the switch is [1], a voltage (-V1) is applied.

  In this way, by applying voltages having different positive and negative to the two electrodes 11, the elevating shaft 4 is charged as shown in the figure, and an electrostatic force that attracts the elevating shaft 4 and the two insulators 5 is generated. Thereby, the position of the lift shaft 4 with respect to the shaft holder 6 is fixed.

  Further, by setting the switch of the power supply unit 12 and the switch of the power supply unit 13 to [1], the lifting shaft 4 is neutralized and released from being fixed.

  In the first and second embodiments, the lifting shaft 4 is neutralized by grounding the electrode 11. However, the lifting shaft 4 may be neutralized by neutralizing the charging of the lifting shaft 4 by applying to the electrode 11 a voltage opposite in polarity to that at the time of fixing.

  FIG. 34 is a diagram illustrating an example of a change in voltage when the lifting shaft 4 is neutralized by voltage application.

  As shown in FIG. 34A, the voltage applied to the electrode 11 is changed from “V1” to “−V2”, and this state is maintained for a predetermined period T. Thereafter, the electrode 11 is grounded.

  For example, “V1” is 1 KV, “−V2” is −500 V, and the predetermined period T is 2 seconds. Thereby, the electric charge stored in the elevating shaft 4 is neutralized. That is, the lifting shaft 4 is neutralized.

  Further, as shown in FIG. 34B, after the state where the applied voltage to the electrode 11 is “−V2” is maintained for a predetermined period T, the applied voltage may be set to “V0”.

  As a result, it is possible to generate an electrostatic force enough to prevent the lifting shaft 4 and the support pin 3 from falling off the shaft holding body 6 by their own weight after the lifting shaft 4 has been neutralized.

  FIG. 35 is a diagram illustrating an example of a configuration that realizes the change in the applied voltage illustrated in FIG.

  In FIG. 35, charging and discharging of the lifting shaft 4 by the fixing portion 1a of the first embodiment are illustrated, but the same effect can be obtained even with the fixing portion 2a of the second embodiment. The same applies to FIG. 37 described later.

  As shown in FIG. 35, the power supply unit 12 includes a switch for switching the voltage applied to the two electrodes 11 of the fixed unit 1a between “V1”, “−V2”, and “0”.

  In such a configuration, as shown in the left figure, when the switch is set to [2], the voltage “V1” is applied to the two electrodes 11, the lifting shaft 4 is charged, the lifting shaft 4 and the two insulators 5. Electrostatic force is generated between Thereby, the position with respect to the axis | shaft holding body 6 of the raising / lowering axis | shaft 4 is fixed.

  Further, as shown in the right figure, the switch is set to [1], and the negative voltage “−V2” is applied to the two electrodes 11 for the period T. As a result, the lifting shaft 4 is neutralized, and the lifting shaft 4 is movable with respect to the shaft holder 6.

  Thereafter, the switch is switched to [0] to ground the two electrodes 11.

  In this way, the power supply unit 12 applies a predetermined voltage, which is opposite to the voltage when the lifting shaft 4 is fixed, to the fixing unit 1a, and neutralizes the charge accumulated in the lifting shaft 4, thereby You may perform static elimination.

  Moreover, instead of removing the lifting shaft 4 from the DC voltage, the lifting shaft 4 may be discharged from the AC voltage.

  FIG. 36 is a diagram illustrating an example of a change in voltage applied to the electrode 11 when the lifting shaft 4 is neutralized with an AC voltage.

  As shown in FIG. 36A, the AC voltage “V3” is applied for a predetermined period T in a state where the DC voltage “V1” is applied to the electrode 11 and the elevating shaft 4 is charged. Thereafter, the electrode 11 is grounded.

  Thereby, the electric charge stored in the elevating shaft 4 can be neutralized. That is, the lifting shaft 4 can be neutralized.

  In addition, as shown in FIG. 36B, the DC voltage V0 may be applied after the AC voltage “V3” is applied for a predetermined period T.

  As a result, it is possible to generate an electrostatic force enough to prevent the lifting shaft 4 and the support pin 3 from falling off the shaft holding body 6 by their own weight after the lifting shaft 4 has been neutralized.

  FIG. 37 is a diagram illustrating an example of a configuration that realizes the change in the applied voltage illustrated in FIG.

  As shown in FIG. 37, the power supply unit 12 includes a switch for switching the voltage applied to the two electrodes 11 of the fixed unit 1a to a DC voltage “V1”, an AC voltage “V3”, and “0”.

  In such a configuration, as shown in the left figure, when the switch is set to [2], the voltage “V1” is applied to the two electrodes 11, the lifting shaft 4 is charged, the lifting shaft 4 and the two insulators 5. Electrostatic force is generated between Thereby, the position with respect to the axis | shaft holding body 6 of the raising / lowering axis | shaft 4 is fixed.

  Further, as shown in the right figure, the switch is set to [1], and the AC voltage “V3” is applied to the two electrodes 11 for the period T. As a result, the lifting shaft 4 is neutralized, and the lifting shaft 4 is movable with respect to the shaft holder 6.

  Thereafter, the switch is switched to [0] to ground the two electrodes 11.

  As described above, the power supply unit 12 may apply a predetermined alternating voltage to the fixed unit 1 a and neutralize the charge accumulated in the lifting shaft 4 to neutralize the lifting shaft 4.

  In addition, as described above, when an AC voltage is used for neutralizing the lifting shaft 4, there is an advantage that it is not necessary to strictly control the application period.

  The present invention can be applied to a method and an apparatus for supporting a member when an operation is performed on the member. In particular, it is useful as a component support method, a component support device, and the like in a component mounter that mounts components such as semiconductor elements on a substrate and a screen printer that prints conductive paste such as solder paste on the substrate.

1 is an overview diagram showing an overview of a substrate support apparatus according to a first embodiment. It is a side view at the time of seeing the board | substrate support apparatus of Embodiment 1 from the Y-axis direction. (A) is a perspective view which shows the structure outline | summary of the fixing | fixed part of Embodiment 1, (B) is a top view. It is a figure for demonstrating electrification and static elimination of a raising / lowering axis | shaft. It is a figure which shows the graph of the experimental value of the electrostatic force generate | occur | produced between a raising / lowering axis | shaft and an insulator. It is a figure which shows the positional relationship of two electrodes and a raising / lowering axis | shaft. FIG. 3 is a cross-sectional view illustrating a configuration outline of a fixing unit according to the first embodiment. It is a figure which shows the relationship between the state of the switch of a power supply part, and the electrostatic force generate | occur | produced between a raising / lowering axis | shaft and a fixing | fixed part. FIG. 3 is a functional block diagram illustrating a functional configuration of the substrate support apparatus according to the first embodiment. It is a flowchart which shows the outline | summary of operation | movement when the board | substrate support apparatus of Embodiment 1 supports a board | substrate. It is the operation | movement outline diagram which illustrated the flow of the operation | movement shown in the flowchart of FIG. (A) is a figure which shows the state which the board | substrate support apparatus of Embodiment 1 is supporting the board | substrate with which components are not mounted in the back surface, (B) is the board | substrate support apparatus of Embodiment 1. It is a figure which shows the state which is supporting the board | substrate with which components are mounted in the back surface. It is a figure which shows a mode that the board | substrate support apparatus of Embodiment 1 supports the board | substrate conveyed sequentially. It is the general-view figure which looked at the axis | shaft holding body of Embodiment 1 from the Z-axis direction. (A) is a figure which shows the state before the width | variety of a conveyance rail is changed in a component mounting machine, (B) is a figure which shows the state after the width | variety of a conveyance rail is changed in a component mounting machine. is there. FIG. 3 is a diagram illustrating an example of wiring for applying a voltage to each of a plurality of fixing units in the first embodiment. It is a figure which shows a mode that the board | substrate support apparatus 1 of Embodiment 1 controls operation | movement of a fixing | fixed part according to the width | variety of a conveyance rail. It is a flowchart which shows the flow of operation | movement of a board | substrate support apparatus in the case of controlling the vertical motion of each support pin according to whether the position change of each support pin is required. It is a figure which shows a mode that a board | substrate support apparatus supports a board | substrate sequentially, without changing the position of each support pin. It is a figure which shows the structure at the time of integrating a shaft holder and a base. It is a figure which shows the width | variety of the notch of a board | substrate, and the width | variety of the upper end of a support pin. FIG. 5 is an overview diagram showing an overview of a substrate support apparatus according to a second embodiment. It is a side view at the time of seeing the board | substrate support apparatus of Embodiment 2 from the Y-axis direction. FIG. 10 is a diagram illustrating an outline of a configuration of a fixing unit according to a second embodiment. FIG. 6 is a functional block diagram illustrating a functional configuration of a substrate support apparatus according to a second embodiment. It is a schematic diagram which shows the outline | summary of operation | movement when the board | substrate support apparatus of Embodiment 2 supports a board | substrate. (A) is a figure which shows the state in which the board | substrate support apparatus of Embodiment 2 is supporting the board | substrate with which components are not mounted in the back surface, (B) is a board | substrate support apparatus of Embodiment 2 back surface It is a figure which shows the state which is supporting the board | substrate with which components are mounted in. It is a figure which shows a mode that the board | substrate support apparatus of Embodiment 2 supports the board | substrate conveyed sequentially. It is a figure which shows the relationship between the state of three steps of the switch of a power supply part, and the electrostatic force generate | occur | produced between a raising / lowering axis | shaft and a fixing | fixed part. It is a figure which shows an example of the wiring for switching an applied voltage to three steps for every group with respect to a some fixing | fixed part. It is a figure which shows a mode that the board | substrate support apparatus of Embodiment 2 controls operation | movement of a fixing | fixed part according to the width | variety of a conveyance rail. (A) is a figure which shows the state by which six board | substrate support units are arrange | positioned, (B) is a figure which shows the state by which four board | substrate support units are arrange | positioned. It is a figure for demonstrating the method of electrifying without raising / lowering an axis | shaft grounding. (A) is a figure which shows an example of the change of the voltage at the time of performing static elimination of a raising / lowering axis | shaft by voltage application, (B) is a figure which shows another example. It is a figure which shows an example of a structure which implement | achieves the change of the applied voltage shown to FIG. (A) is a figure which shows an example of the change of the applied voltage with respect to the electrode at the time of neutralizing the raising / lowering axis | shaft with an alternating voltage, (B) is a figure which shows another example. It is a figure which shows an example of a structure which implement | achieves the change of the applied voltage shown to FIG. It is a figure which shows the outline | summary of the conventional 1st board | substrate support apparatus. It is a figure which shows the outline | summary of the conventional 2nd board | substrate support apparatus. It is a figure which shows the outline | summary of the conventional 3rd board | substrate support apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 Board | substrate support apparatus 1a, 2a Fixed part 1b Actuator 1c Support part 1d, 2b Control part 3 Support pin 4 Lifting shaft 5 Insulator 6 Axis holding body 7, 7a Drive part 8 Base 9 Holding hole 11 Electrode 12 Power supply part 13 Power supply 15 Transport rail 15a Movable rail 15b Fixed rail 101, 102 Substrate support unit

Claims (29)

A member support method for supporting a member by a support,
A plurality of supports provided at positions facing a surface of the member to be supported are moved in a support direction, which is a direction in which the support supports the member, and each end of the plurality of supports is moved. A contact step for contacting the member;
In the abutting step, the positions of the plurality of supports are set to electrostatic force in a state where the end portions of the plurality of supports are in contact with the member and are in a position according to the unevenness of the surface supported by the member. And a fixing step of restricting the movement of the plurality of supports in both directions parallel to the support direction. The plurality of supports are held by one holder so as to be movable in both directions parallel to the support direction;
The holding body has fixing means for fixing the position of each of the plurality of supporting bodies with respect to the holding body by the electrostatic force;
In the fixing step, by applying a predetermined voltage to the fixing means to charge the plurality of supports, the electrostatic force attracting each other is generated between the fixing means and each of the plurality of supports. The member supporting method according to claim 1, wherein positions of the plurality of supporting bodies with respect to the holding body are fixed. In the abutting step, the holding body is moved in the supporting direction to simultaneously move the plurality of supporting bodies, and the ends of the plurality of supporting bodies are in contact with the member, Stop moving and
Each of the plurality of supports held by the holder is supported by the holder when the holder moves in the support direction after its end abuts the member. Held in the holding body while moving in a direction opposite to the direction,
In the fixing step, the positions of the plurality of supports are fixed by the fixing means in a state where the plurality of supports abutted on the member in the contact step are stationary with respect to the holding body. The member supporting method according to claim 2. The holding body has a plurality of holes that penetrate each of the plurality of supports in the support direction;
The member support method further includes:
Holding the plurality of supports movably held by the holding body by electrostatic force generated by applying a voltage smaller than the predetermined voltage to the fixing means located at the periphery of each of the plurality of holes. Including steps,
The member supporting method according to claim 3, wherein in the abutting step, the holding body that holds the plurality of supporting bodies in a movable manner in the holding step is moved in the supporting direction. The holding body has a plurality of holes that penetrate each of the plurality of supports in the support direction;
Each of the plurality of supports is
The holding body is slidably held by the frictional force with the inner surface of the hole through which it passes, and after the end of its own abuts the member, the holding body moves in the supporting direction. The member support method according to claim 3, wherein, when moved, the member slides in a direction opposite to the support direction with respect to the holding body. The predetermined voltage is a DC voltage;
The member supporting method may further include, after the fixing step, applying a predetermined DC voltage whose polarity is opposite to the predetermined voltage, or a predetermined AC voltage to the fixing unit to charge the plurality of supports. The member support method of any one of Claims 2-5 including the static elimination step which cancels | releases fixation of the position of these support bodies by neutralizing. The method further includes a static elimination step of releasing the fixing of the positions of the plurality of supports by grounding the fixing means that is charged by applying a predetermined voltage in the fixing step. The member supporting method according to any one of the above. The member support method is a method of sequentially supporting a plurality of members,
further,
Determining whether it is necessary to change the position of each of the plurality of supports in order to support a subsequent member that is a member to be supported next;
In the static elimination step, the fixing of the positions of the plurality of support members is released only when it is determined that the change is necessary in the determination step,
In the abutting step, the ends of the plurality of supports are brought into abutment with the subsequent member by moving the plurality of supports whose positions are fixed in the static elimination step in the support direction. Item 8. The member supporting method according to Item 6 or 7. In the determining step, when the uneven shape of the surface supported by the subsequent member is different from the uneven shape of the surface supported by the preceding member, which is the member supported first, or of the member supported by the plurality of supports The member support method according to claim 8, wherein when the number is a predetermined number or more, it is determined that the change is necessary. The member is located above the plurality of supports;
The support direction is a direction from bottom to top,
In the abutting step, the plurality of supports are brought into contact with the member by raising the plurality of supports upward.
The member support method according to any one of claims 1 to 9, wherein, in the fixing step, movement of the plurality of supports is restricted in a vertical direction by fixing positions of the plurality of supports. Furthermore, an acquisition step of acquiring information related to the size of the member;
A selection step of selecting a plurality of supports provided at positions facing a surface to be supported of the member from among the plurality of supports based on information on the size of the member acquired in the acquisition step; Including
The member support method according to claim 1, wherein in the contact step, the plurality of support bodies selected in the selection step are moved in the support direction. A component mounting method for mounting a component on a substrate that is a member supported by the member supporting method according to claim 11,
In a state where the positions of the plurality of supports are fixed in the fixing step, including a mounting step of mounting components on the substrate from the opposite side of the plurality of supports across the substrate,
The substrate is transported by a transport rail,
In the acquiring step, width information regarding the width of the transport rail is acquired as information regarding the size of the member. A component mounting method for mounting a component on a substrate that is a member supported by the member supporting method according to any one of claims 1 to 11,
A component mounting method including a mounting step of mounting components on the substrate from a side opposite to the plurality of supports with the substrate interposed therebetween in a state where the positions of the plurality of supports are fixed in the fixing step. The component mounting method according to claim 12, wherein the substrate is a flexible substrate or a rigid flexible substrate. A printing method for printing a conductive paste on a substrate that is a member supported by the member supporting method according to claim 1,
A printing method comprising: a printing step of printing a conductive paste on the substrate from a side opposite to the plurality of supports with the substrate interposed therebetween in a state where the positions of the plurality of supports are fixed in the fixing step. The printing method according to claim 15, wherein the substrate is a flexible substrate or a rigid flexible substrate. A member support device for supporting a member by a support,
A plurality of supports provided at positions facing a surface of the member to be supported are moved in a support direction, which is a direction in which the support supports the member, and each end of the plurality of supports is moved. A contact means for contacting the member;
The positions of the plurality of supports are set to the electrostatic force in a state where the end portions of the plurality of supports are in contact with the member by the abutting means and are in a position according to the unevenness of the surface supported by the member. And a fixing means for restricting the movement of the plurality of support bodies in both directions parallel to the support direction. The plurality of supports are held by one holder so as to be movable in both directions parallel to the support direction;
The holding body has fixing means for fixing the position of each of the plurality of supporting bodies with respect to the holding body by the electrostatic force;
The member supporting device further generates the electrostatic force attracting each other between the fixing means and each of the plurality of supports by applying a predetermined voltage to the fixing means to charge the plurality of supports. The member support apparatus of Claim 17 provided with the voltage application means to make. The abutting means moves the plurality of supports simultaneously by moving the holding body in the supporting direction, and the holding body is in a state where the end portions of the plurality of supports are in contact with the member. Stop moving and
Each of the plurality of supports held by the holder is supported in the support direction with respect to the holder when the holder moves in the support direction after its end abuts the member. Is held by the holding body while moving in the opposite direction,
The fixing means fixes a position of each of the plurality of support bodies in a state where the plurality of support bodies abutted on the member by the contact means are stationary with respect to the holding body. The member supporting apparatus according to the description. The holding body has a plurality of holes penetrating each of the plurality of supports,
The voltage applying means applies a voltage smaller than a voltage at the time of fixing the positions of the plurality of supports to the fixing means positioned at the periphery of each of the plurality of holes,
The fixing means holds the plurality of supports movably on the holding body by electrostatic force generated when the small voltage is applied,
The member support device according to claim 19, wherein the contact means moves the holding body that holds the plurality of support bodies in a movable direction. The predetermined voltage is a DC voltage;
The member supporting device further applies a predetermined DC voltage whose polarity is opposite to the predetermined voltage or a predetermined AC voltage to the fixing means after the positions of the plurality of supports are fixed. The member support device according to any one of claims 18 to 20, further comprising a charge removing unit that neutralizes charging of the plurality of supports to release the fixed positions of the plurality of supports. 21. A static elimination unit that releases the fixing of the positions of the plurality of supports by grounding the fixing unit that is charged when a predetermined voltage is applied by the voltage application unit. The member support apparatus of any one of Claims. The member support device is a device that sequentially supports a plurality of members,
further,
A determination means for determining whether or not the position of each of the plurality of supports needs to be changed in order to support a subsequent member that is a member to be supported next;
The static elimination means releases the fixing of the positions of the plurality of supports only when the determination means determines that the change is necessary,
The abutting means moves the plurality of support bodies whose positions are released by the static elimination means in the support direction, thereby abutting the end portions of the plurality of support bodies to the subsequent member. Item 21. The member supporting device according to Item 21 or 22. The determination means is configured such that the uneven shape of the surface supported by the subsequent member is different from the uneven shape of the surface supported by the preceding member, which is a previously supported member, or of the member supported by the plurality of supports. The member support device according to claim 23, wherein when the number is a predetermined number or more, it is determined that the change is necessary. further,
Obtaining means for obtaining information on the size of the member;
Selection means for selecting a plurality of supports provided at positions facing a surface supported by the member from among the plurality of supports based on information on the size of the member acquired by the acquisition means; With
The member support device according to any one of claims 17 to 24, wherein the contact means moves the plurality of support bodies selected by the selection means. A component mounter comprising the member support device according to claim 25, wherein the component mounter mounts a component on a substrate that is the member.
A transport rail for transporting the substrate to a position where the member support device can support the substrate;
In a state where the positions of the plurality of supports are fixed by the fixing means, mounting means for mounting components on the board from the opposite side of the plurality of supports across the board,
The acquisition unit acquires, as information related to the size of the member, width information that is information related to the width of the transport rail. A component mounter comprising the member support device according to any one of claims 17 to 25, and mounting a component on a substrate that is the member,
A component mounting machine comprising mounting means for mounting a component on the substrate from a side opposite to the plurality of supports with the substrate interposed therebetween in a state where the positions of the plurality of supports are fixed by the fixing unit. A printing machine comprising the member supporting device according to any one of claims 17 to 25, wherein a conductive paste is printed on a substrate that is the member,
A printing machine, comprising: a printing unit configured to print the conductive paste on the substrate from a side opposite to the plurality of supports with the substrate sandwiched therebetween in a state where the positions of the plurality of supports are fixed by the fixing unit. A program for controlling a member support device for supporting a member by a support,
The member support device includes contact means for bringing the support into contact with the member, and fixing means for fixing positions of a plurality of supports.
The program is
A plurality of supports provided at positions facing a surface of the member to be supported are moved in a support direction, which is a direction in which the support supports the member, and each end of the plurality of supports is moved. A contact step for contacting the member;
In the abutting step, the plurality of supports are placed on the fixing means in a state where the end portions of the plurality of supports abut on the member and are in a position according to the unevenness of the surface supported by the member. A program for causing a computer to execute a fixing step of restricting movement of the plurality of supports in both directions parallel to the support direction by fixing the positions of the plurality of support bodies by electrostatic force.

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