JP2009016641A - Flexible film circuit board, manufacturing method thereof, and flexible film circuit board manufacture management system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible film circuit board which makes it possible to easily trace a manufacture history by a fine unit of 1m or less while the manufacture history of the circuit pattern formed on a sheet flexible film can be traced only by the unit of several tens m or more by an existing technique after making a sheet flexible film board into a long-length film by connecting the sheet boards. <P>SOLUTION: On the flexible film circuit board where the circuit pattern is formed, an identification mark is written to the prescribed part of a region where the circuit pattern is not formed, registration in the management system is executed, and a manufacture condition, an inspection condition and an inspected result, etc., are recorded and managed in such a state that they can be collated with a product. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a film circuit board used for an electronic circuit board on which a semiconductor element or the like is mounted, a manufacturing apparatus thereof, and a manufacturing management system.

  As electronics products become lighter and smaller, printed circuit board patterning needs to be highly accurate. Since the flexible film substrate can be bent, three-dimensional wiring can be formed, and the flexible film substrate is suitable for downsizing of electronic products.

  COF (Chip on Flex) technology used for IC connection to the liquid crystal display panel can obtain the finest pattern that is the best as a resin substrate by processing a relatively narrow long polyimide film substrate. The progress of computerization is approaching the limit.

  For miniaturization, there are an index represented by a line width and a space width between lines, and an index represented by a position of a pattern on a substrate. Although there are measures to further reduce the line width and space width, the positional accuracy, which is the latter index, is used to align the electrode pad and the circuit board pattern when joining the electronic components such as the circuit board and IC. In connection with the progress of the increase in the number of pins of ICs, it is becoming strict to meet the required accuracy.

  On the other hand, in recent years, it has been proposed to form a very fine circuit pattern by attaching a flexible film substrate to a reinforcing plate and maintaining dimensional accuracy (see Patent Document 1). The flexible film substrate is used after being peeled off from the reinforcing plate after the circuit pattern is formed. The proposal mainly uses a sheet-type reinforcing plate, and the flexible film substrate on which the circuit pattern is formed is also a sheet. On the other hand, in the current COF technology, handling of a flexible film substrate on which a circuit pattern is formed, such as electronic component connection, test, connection with an LCD panel, etc., has both a single wafer and a long case, In many cases, long films are handled on a reel-to-reel basis. For this reason, after forming a circuit pattern on the flexible film substrate of a sheet | seat, joining these and making a long film is proposed (refer patent document 2).

From the viewpoint of production control and quality control, it is required to make it possible to track the manufacturing history. In the existing flexible film circuit board in the form of a long film, the length of several tens of meters wound on a reel is collectively associated with the manufacturing history. In addition, since the tying is done with a label, it is necessary to issue and affix a label and attach a label tag each time it is put into the process, unwound and wound up. Could happen. In addition, there is a request for extending the flexible film circuit board that can be accommodated on one reel in order to increase productivity, and there is a problem that the traceable manufacturing unit becomes rough.
International Publication No. 03/009657 (2nd page) JP 2006-295143 A (pages 1 to 27)

  An object of the present invention is to provide a flexible film circuit that can easily track the manufacturing history of a circuit pattern formed on a single sheet of flexible film substrate even after the single substrates are joined together to form a long film. It is to provide a substrate and a manufacturing method thereof. Furthermore, the existing technology can only track the manufacturing history in units of several tens of meters or more, but according to the present invention, the manufacturing history can be tracked in fine units of 1 m or less.

That is, this invention consists of the following structures.
(1) A flexible film circuit board on which a circuit pattern is formed, wherein an identification mark is attached to a region where the circuit pattern is not formed.
(2) The flexible film circuit board to which the identification mark is attached is formed by joining the strip-shaped flexible film circuit boards to be elongated, and for each of the strip-shaped flexible film circuit boards. The flexible film circuit board according to (1), wherein different identification marks are attached to each other.
(3) A flexible film circuit board provided with a transport region having sprocket holes at an end in the substrate width direction, wherein an identification mark is attached to the transport region. Flexible film circuit board.
(4) The flexible film circuit board according to (1), wherein the identification mark is made of the same material and the same layer structure as the circuit pattern.
(5) A method for manufacturing a flexible film circuit board, wherein an identification mark is attached to a predetermined portion of a region where a circuit pattern is not formed.
(6) The flexible film circuit board in which the identification mark is written is formed by joining the strip-shaped flexible film circuit boards and extending the length, and the strip-shaped flexible film circuit board has (5) The method for producing a flexible film circuit board according to (5), wherein different identification marks are attached.
(7) A method of manufacturing a flexible film circuit board in which a sprocket hole is formed in a conveyance area at the width direction end of the flexible film circuit board, wherein an identification mark is attached to the conveyance area. The method for producing a flexible film circuit board according to (5).
(8) The method for producing a flexible film circuit board according to (5), wherein the identification mark is made of the same material and the same layer structure as the circuit pattern.
(9) The flexible film circuit board according to (5), wherein the identification mark is attached in a state where the flexible film circuit board is bonded to the reinforcing plate via an organic layer that can be peeled off. Manufacturing method.
(10) The production management system for a flexible film circuit board according to any one of (1) to (4), wherein an identification mark is attached to a predetermined portion of a region where a circuit pattern is not formed and the central management device A flexible film circuit board production management system characterized in that the identification mark is registered, and the history of each manufacturing process and each inspection process is stored in the central management device in association with the identification mark.

  According to the present invention, when a plurality of strip-shaped sheet flexible film substrates are connected to form a long film circuit board, a circuit pattern formed on each strip-shaped sheet flexible film substrate. The manufacturing history can be tracked. Furthermore, the existing technology can only track the manufacturing history in units of several tens of meters or more. However, according to the present invention, the manufacturing history can be tracked in fine units of 1 m or less, and fine production management can be realized. When a plurality of strip-shaped sheet-fed flexible film circuit boards are formed on one large sheet-fed substrate, and a plurality of strip-shaped flexible film circuit boards are peeled and connected to produce a long film circuit board, a strip-shaped sheet is used. Depending on how the leaf flexible film circuit boards are connected, very complicated history management is required, but each strip-like sheet flexible film circuit board is attached with an individual identification mark and linked to the manufacturing history database. By doing so, it becomes easy to cope, and the present invention is particularly effective.

The flexible film circuit board of the present invention has a circuit pattern formed on at least one side.
A plastic film is used as the flexible film substrate. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among these, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Moreover, these films may be laminated | stacked.
Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide (co) polymer resin, polyamide, and polyimide.
The thickness of the flexible film substrate is preferably thin for light weight, downsizing, or formation of fine via holes. On the other hand, the flexible film substrate is thick for ensuring mechanical strength and maintaining flatness. Is preferable, the range of 4 μm to 125 μm is preferable.

  The circuit pattern formed on the flexible film substrate is preferably formed mainly of a copper film having a small resistance value, and known techniques such as a subtractive method, a semi-additive method, and a full additive method can be employed. Further, tin plating or gold plating for solder bonding, or formation of a solder resist film for metal film protection can be performed as appropriate.

An example of the aspect of the present invention will be described with reference to FIGS.
A circuit pattern 3 is formed on the flexible films 1 and 2 of FIG. A sprocket hole 4 is provided in the conveyance region at the width direction end of the flexible film circuit board. In order to enhance the mechanical strength of the sprocket hole and smooth the conveyance, A reinforcing pattern 5 of the same material and layer structure is provided. In the present invention, an identification mark can be provided at a predetermined position in a region where a circuit pattern is not formed, but the identification mark 6 is provided on the reinforcing pattern 5 in that the identification mark can be formed at the same position regardless of the circuit pattern. Is preferred. When the identification mark 6 is attached, various methods such as photolithography, laser processing, or mechanical punching can be used. Among these, it is particularly preferable in terms of cost to attach the identification mark 6 by photolithography or laser processing. Providing the identification mark at the same position can also make the position of the writing / reading apparatus of the identification mark constant, and can simplify the production management and the apparatus. As the identification mark, a one-dimensional or two-dimensional barcode, a symbol, or a character can be adopted. Of these, the two-dimensional barcode is preferable in that it is compact and has a large amount of information and can be easily converted into electronic data. FIG. 1 illustrates a two-dimensional barcode as an identification mark.

  The present invention makes it possible to track the manufacturing history for each strip when the strip-shaped flexible film substrates are connected to form a long film substrate. That is, a different identification mark is entered for each strip-shaped sheet-fed flexible film substrate, thereby enabling verification with the manufacturing history database. FIG. 2 shows an example of a state in which the flexible films 1 and 2 are joined together in a cross section. The flexible film is bonded via the adhesive 7.

  FIG. 3 shows an enlarged portion of the identification mark 6. A part of the reinforcing pattern of the metal film is prevented from being formed or removed so as to produce an identification mark. When the reinforcing pattern of the metal film is not provided in the transport region, the metal film is formed in the shape of an identification mark as shown in FIG.

At least one identification mark is provided on the strip-like sheet-fed flexible film.
The present invention is also effective for manufacturing history management of a flexible film that is in a long state from the beginning. In this case, an identification mark may be provided according to the minimum length for which the manufacturing process history is desired to be recorded.

  An example of the flexible film circuit board manufacturing management system will be described with reference to FIG. Flexible film circuit board manufacture consists of a plurality of manufacturing steps and inspection steps. For the identification mark formation, the upstream process of the flexible film circuit board manufacturing is preferable because the management range is widened, but the optimum process is selected in combination with the in-process product having a layer structure capable of exposure or laser processing. . The identification mark is generated and registered by the central management apparatus (server) 10 and written by exposure or laser processing means. In each process, an identification mark reading device is installed, and a product to be processed or inspected is associated with manufacturing conditions, inspection conditions, and inspection results, and a record is left in the central management apparatus via the PC 11. A record on the central management device can be pulled out to mark defective products as defective. At the stage of product shipment, the identification mark can be used for calculating the product quantity, the yield for each reel, and outputting a label describing them. According to the present system, when an abnormal condition appears in the manufacturing process or when the inspection result is abnormal, it is possible to manage so that the identification mark is not read and put into the next process.

The method for producing a circuit board of the present invention will be described below, but the present invention is not limited to this.
A peelable organic material is applied to a 1.1 mm thick soda lime glass as a reinforcing plate using a spin coater, blade coater, roll coater, bar coater, die coater, screen printing, or the like. Use of a die coater is preferable in order to uniformly apply to a single-wafer substrate sent intermittently. After the peelable organic material is applied, it is dried by heat drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air barrier film made of a release film (with a silicone resin layer provided on a polyester film) is bonded onto the peelable organic material layer applied and left at room temperature for 1 week. This period is called aging, and the cross-linking of the peelable organic substance proceeds and the adhesive force gradually decreases. The standing period and the storage temperature are selected so that a desired adhesive strength can be obtained. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.

  Next, a plastic film having a thickness of 38 μm, which is a flexible film substrate, is prepared. The air blocking film on the glass substrate is peeled off, and the plastic film is bonded to the glass substrate. A metal film (which may be a circuit pattern on the bonded surface) may be formed in advance on one or both surfaces of the plastic film. The plastic film may be pasted in a cut sheet having a predetermined size, or may be pasted and cut while being unwound from a long roll.

Next, a circuit pattern is formed on the surface opposite to the bonding surface of the plastic film.
When a metal film with a thickness of 1 to 10 μm is provided on the surface opposite to the bonding surface of the plastic film, a circuit pattern, a reinforcing pattern for the transport region, and an identification mark for the transport region are provided by the subtractive method. Form. That is, a photoresist film is applied and dried on the metal film, and the circuit pattern and the reinforcing pattern are exposed through the photomask. The identification mark portion exposes an individual pattern using a programmable exposure machine such as a laser exposure machine. The exposed pattern is developed, and the exposed portion of the metal film is etched to form a circuit pattern, a reinforcing pattern, and an identification mark. Thereafter, the photoresist film is peeled off.

  In the case of using the semi-additive method, a metal film having a thickness of 0.05 to 1 μm is provided on the entire surface opposite to the bonding surface of the plastic film, and a photoresist film is applied on the metal film. After drying, the circuit pattern and the reinforcing pattern are exposed through a photomask. The identification mark portion exposes an individual pattern using a programmable exposure machine such as a laser exposure machine. The exposed pattern is developed, and a metal film is deposited on the exposed portion of the metal film by electroplating to form a circuit pattern, a reinforcing pattern, and an identification mark. Thereafter, the photoresist film is peeled off, and the metal film initially provided is etched using the metal pattern formed by plating as a mask. Instead of exposing the identification mark pattern using a programmable exposure machine, the metal film having a thickness of 0.05 to 1 μm is partially removed with a laser, and then electroplated to remove the part with the laser It is also possible to form a pattern having no metal alone.

  In the case of using the full additive method, the surface of the plastic film opposite to the bonding surface is subjected to a catalyst application treatment such as palladium, nickel or chromium, and dried. The catalyst referred to here does not act as a nucleus for plating growth as it is, but it becomes a nucleus for plating growth by activation treatment. Next, a photoresist film is applied and dried, and the circuit pattern and the reinforcing pattern are exposed through a photomask. The identification mark portion exposes an individual pattern using a programmable exposure machine such as a laser exposure machine. The exposed pattern is developed, the exposed portion of the catalyst is activated, and then immersed in an electroless plating solution to deposit a metal film, thereby forming a circuit pattern, a reinforcing pattern, and an identification mark. Instead of exposing the identification mark pattern using a programmable exposure machine, the catalyst is partially removed with a laser, and then a pattern without metal is formed only on the laser-removed portion by electroless plating. You can also.

  The present invention is particularly suitable for the semi-additive method or the full additive method. That is, when a fine pattern is exposed to the photoresist, a plating film is faithfully formed in accordance with the exposure pattern. The subtractive method depends on isotropic etching, and there is a limit to fine pattern processing. In addition, when an identification mark is formed by laser processing, since the target to be written is a thin metal film or a catalyst layer, the laser processing speed can be increased and productivity is increased, and detailed processing is performed to increase the amount of information. Or increase the redundancy to increase the certainty. It is a preferable effect that the metal film and the catalyst layer are thin that the amount of smear scattered is small. Therefore, the thickness of the metal film when forming the identification mark is preferably 0.05 to 0.2 μm.

  As described above, in any of the subtractive method, the semi-additive method, and the full additive method, the identification mark passes through the circuit pattern formation process and is composed of the same material and the same layer as the circuit pattern, so the identification mark is formed. For this reason, the manufacturing cost burden can be reduced only by using an exposure machine or a laser processing machine. The layer structure of the identification mark and circuit pattern in the subtractive method and the semi-additive method is surface plating layer / low resistance metal layer / adhesion improving layer / flexible film substrate. The layer structure of the identification mark and circuit pattern in the full additive method is surface plating layer / low resistance metal layer / catalyst layer / flexible film substrate. In the circuit pattern, a resin layer called solder resist is formed as the outermost layer in a place that is not connected to the external connection, but the identification mark is a solder resist like the external connection part of the circuit pattern to facilitate image recognition. Is preferably not formed.

The identification mark is generated by the central management device and written on the product by the writing device. The identification mark is preferably written in a state where the flexible film substrate is bonded to the reinforcing plate via an organic layer that can be peeled off. That is, by attaching a flexible film substrate to a rigid and flat reinforcing plate, it is easy to control the focal length and position of exposure and laser processing and form an accurate pattern. In addition, when a plurality of strips of flexible film circuit boards having a predetermined length are cut out from a single flexible film circuit board using a large reinforcing plate, the joining order can be recorded and used as product information. It is preferable to write the identification mark in a state where the flexible film substrate is bonded to the reinforcing plate via an organic layer that can be peeled off. It is preferable that writing is performed in a state where the flexible film substrate is bonded to the reinforcing plate via an organic layer that can be peeled off from the point of providing an identification mark at an early stage of circuit pattern processing.
In terms of imparting an identification mark at an early stage of processing a circuit pattern, laser processing on a metal thin film is preferable to the identification mark exposure on a photoresist because the identification mark can be used in an upstream process.

  The metal film that forms the circuit pattern is preferably copper in that the resistance value is low. In addition, in the subtractive method and the semi-additive method, a thin film selected from nickel, chromium, titanium and their alloys is placed between the copper film and the plastic film in order to increase the adhesive strength between the copper film and the plastic film. It is preferable to form.

  If necessary, plating of gold, nickel, tin or the like is performed on the metal film pattern formed as described above. Furthermore, if necessary, a solder resist layer is formed on the metal pattern. As the solder resist, a photosensitive solder resist or a thermosetting solder resist is preferable.

  The adhesive 7 shown in FIG. 2 is applied to one end in the length direction of the flexible film circuit board fixed to the soda lime glass and dried, and then the flexible film circuit board is peeled from the soda lime glass. Two strip-like flexible film circuit boards are repeatedly connected via the adhesive 7 to obtain a long flexible film circuit board. Position alignment when connecting two strip-shaped flexible film circuit boards can employ image recognition using an alignment mark prepared in advance or a method using sprocket holes and pins.

  Using a punching device or a laser processing device, a sprocket hole is drilled in a long flexible film substrate. Sprocket hole drilling method is by laser processing if it is before peeling the flexible film circuit board from soda lime glass, and after peeling the flexible film circuit board from soda lime glass, it depends on the mold Either punching or laser processing can be used.

  As a sheet reinforcing plate that can be used in the present invention, inorganic glass such as soda lime glass, borosilicate glass, quartz glass, ceramics such as alumina, silicon nitride, zirconia, metals such as stainless steel, Invar alloy, titanium, Those having a small linear expansion coefficient and hygroscopic expansion coefficient such as a plate having glass fiber reinforced resin are preferred. Among these, inorganic glass and a metal plate are preferable in that appropriate flexibility can be easily obtained. In addition, it has excellent heat resistance and chemical resistance, has a large area with high surface smoothness and is easily available at low cost, is difficult to plastically deform, and is less likely to generate particles due to contact with a transport device A plate made of an inorganic glass is particularly preferable because it is an insulator and does not deposit due to electrolytic plating.

  Examples of the peelable organic layer for bonding the reinforcing plate and the plastic film that can be used in the present invention include an adhesive called an acrylic or urethane re-release agent. Adhesive strength is sufficient during processing of flexible film substrate, it can be easily peeled off at the time of peeling, and it does not cause distortion in flexible film substrate. preferable. A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.

  As organic materials that can be peeled, those whose adhesive strength and adhesive strength are reduced at low temperatures, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are suitably used. . Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.

  The thickness of the peelable organic material layer used in the present invention is preferably 0.1 μm or more, because the flatness becomes worse as the thickness becomes thinner, and the unevenness of the peeling force due to the unevenness of the film thickness occurs. More preferably, it is the above. On the other hand, when the thickness of the peelable organic material layer is increased, the anchoring property of the organic material layer on the flexible film substrate is improved, so that the adhesive strength is increased. Therefore, it is preferably 20 μm or less, and more preferably 10 μm or less. Moreover, it is preferable that the adhesive force of the peelable organic substance layer and the reinforcing plate is larger than the adhesive force of the peelable organic substance layer and the flexible film substrate. As a method for controlling the adhesive strength on both sides in this way, for example, there is a method using aging of an adhesive. That is, a surface with reduced adhesive strength can be obtained by applying a pressure-sensitive adhesive on the side where the adhesive strength is to be increased, and then proceeding with crosslinking for a predetermined period in a state where the air is shut off.

In the present invention, the peeling force between the reinforcing plate and the flexible film substrate is measured by a 180 ° peel strength when peeling a 1 cm wide flexible film substrate bonded to the reinforcing plate through a peelable organic layer. Is done. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, in order to control the above-described peeling angle within an optimum range, the peeling force is preferably in the range of 0.098 N / m to 98 N / m.
The use of the circuit board obtained by the production method of the present invention is not particularly limited, but it is preferably used for a wiring board of an electronic device, an IC package interposer, and the like.

  Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.

Example 1
A long polyimide film (“Kapton” 150EN (trade name) manufactured by Toray Du Pont Co., Ltd.) having a thickness of 38 μm was prepared as a flexible film substrate. Using a reel-to-reel type sputtering apparatus compatible with long films, a 15 nm thick chromium: nickel = 5: 95 (weight ratio) alloy film and a 150 nm thick copper film were laminated in this order on a polyimide film. .
As a reinforcing plate, soda lime glass with a thickness of 1.1 mm and 300 x 350 mm, with a die coater, UV curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and curing agent L45 (Soken Chemical Co., Ltd.) )) Was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.
A polyimide film provided with a metal film was cut out to 300 × 350 mm. After peeling off the air blocking film, a polyimide film provided with a metal film on a peelable organic layer was bonded.

  A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes to form a photoresist having a thickness of 15 μm. The photoresist was exposed through a photomask. In the photomask, the plating film is deposited in a pattern in which the photoresist is developed and removed, and the photoresist in the transport region is removed so that the plating film is deposited to form a reinforcing pattern. In addition, the two-dimensional barcode forming position for manufacturing history management was not exposed at this time. Next, the barcode generated by the central management apparatus was exposed to a photoresist using a titler (manufactured by Toray Engineering Co., Ltd.). Thereafter, development was performed to remove unnecessary portions of the photoresist.

  The photomask pattern had the shape shown below. Six circuit patterns were arranged at 48 mm intervals in the 300 mm direction of the substrate, and 11 circuit patterns were arranged at a pitch of 28.5 mm in the 350 mm direction. As shown in FIG. 1, the reinforcing pattern 5 is disposed at the end in the width direction of 48 mm, and the plating film is prevented from being deposited at the sprocket hole position in the reinforcing pattern. In the titler, a different two-dimensional barcode is assigned to each 300 × 350 mm substrate and further to each row of circuit patterns in the same substrate.

  Next, a copper film having a thickness of 8 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. After removing the chrome-nickel alloy film, the two-dimensional barcode can be read, and the manufacturing conditions and inspection results are automatically stored in the central control unit, including the copper film and chrome-nickel alloy film removal process, which is the previous process. did.

Subsequently, a tin film having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern, a reinforcing pattern, and a two-dimensional barcode.
The inspection by the automatic circuit pattern inspection device was performed, and the inspection result was recorded in the central management device in association with the two-dimensional barcode. Thereafter, solder resist SN-9000 (manufactured by Hitachi Chemical Co., Ltd.) was printed with a screen printer.

Using a dispenser, a polyimide adhesive was applied to the end of the product in the 350 mm direction so that the width was 0.6 mm and the thickness was 2 μm, and dried at 80 ° C. for 2 minutes.
A polyimide film was cut into 48 mm width and 314.5 mm length strips using a YAG laser, and 1.981 mm square sprocket holes were provided at 4.75 mm pitch at both ends in the width direction. Subsequently, the polyimide film cut into strips from the soda lime glass was peeled off.

  The obtained two strip-shaped polyimide films were aligned with pins using sprocket holes. That is, the lengthwise ends of the strips were aligned so as to overlap with a width of 1 mm via an adhesive. A bar code reader was installed in this process, and an alarm was issued if it was not a strip to be connected based on process information and inspection information recorded in the central control unit. Next, the tool heated to 350 ° C. was pressed against the overlapped portion at a pressure of 10 kgf, and the polyimide-based adhesive was melted and solidified to join the two strip-shaped polyimide films. In addition, another strip-shaped polyimide film was connected in the same manner to the two strip-shaped polyimide films that were connected, and a long flexible film circuit board was obtained.

  The obtained long flexible film circuit board is hung on an automatic visual inspection apparatus and an electric inspection apparatus using image recognition, and the position in the long flexible film circuit board of products that do not meet the predetermined standard is centrally managed. Output to the device. Based on this information and the inspection information by the circuit pattern automatic inspection apparatus, defective product marking was performed by another apparatus.

  The two-dimensional bar code formed in the transport region is different for each strip substrate, and history management can be performed finely for each strip-like flexible film circuit board. In addition, by incorporating a barcode reader into the main equipment of the production line, the possibility of mistakes in input and delivery by the company and customers could be reduced.

Example 2
A long polyimide film (“Kapton” 150EN (trade name) manufactured by Toray Du Pont Co., Ltd.) having a thickness of 38 μm was prepared as a flexible film substrate. Using a reel-to-reel type sputtering apparatus compatible with long films, a 15 nm thick chromium: nickel = 5: 95 (weight ratio) alloy film and a 150 nm thick copper film were laminated in this order on a polyimide film. .
As a reinforcing plate, soda lime glass with a thickness of 1.1 mm and 300 x 350 mm, with a die coater, UV curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and curing agent L45 (Soken Chemical Co., Ltd.) )) Was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.
A polyimide film provided with a metal film was cut out to 300 × 350 mm. After peeling off the air blocking film, a polyimide film provided with a metal film on a peelable organic layer was bonded.

  A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes to form a photoresist having a thickness of 15 μm. The photoresist was exposed through a photomask. The photomask is a pattern in which the photoresist is developed and removed where the plating film is deposited, and the plating film is deposited by removing the photoresist in the transport area so that a reinforcing pattern and a two-dimensional barcode are formed. I made it. Thereafter, development was performed to remove unnecessary portions of the photoresist. A two-dimensional barcode was written with a YAG laser on the metal film at the position of the transfer area where the photoresist was removed. That is, the metal film in a portion where no plating film was deposited was burned off with a laser. The two-dimensional barcodes generated by the central management device have different numbers for each 300 × 350 mm substrate and for each row of circuit patterns on the same substrate. After the laser processing, the two-dimensional bar code can be read, and the manufacturing conditions and inspection results are automatically stored in the central management device including the photoresist formation exposure and development steps which are the previous steps.

  The photomask pattern was the same as in Example 1. Next, a copper film having a thickness of 8 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution.

The inspection by the automatic circuit pattern inspection device was performed, and the inspection result was recorded in the central management device in association with the two-dimensional barcode. Subsequently, a tin film having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern, a reinforcing pattern, and a two-dimensional barcode. Thereafter, solder resist SN-9000 (manufactured by Hitachi Chemical Co., Ltd.) was printed with a screen printer.
Using a dispenser, a polyimide adhesive was applied to the end of the product in the 350 mm direction so that the width was 0.6 mm and the thickness was 2 μm, and dried at 80 ° C. for 2 minutes.

A polyimide film was cut into 48 mm width and 314.5 mm length strips using a YAG laser, and 1.981 mm square sprocket holes were provided at 4.75 mm pitch at both ends in the width direction. Subsequently, the polyimide film cut into strips from the soda lime glass was peeled off.
The obtained two strip-shaped polyimide films were aligned with pins using sprocket holes. That is, the lengthwise ends of the strips were aligned so as to overlap with a width of 1 mm via an adhesive. A bar code reader was installed in this process, and an alarm was issued if it was not a strip to be connected based on process information and inspection information recorded in the central control unit.

  Next, the tool heated to 350 ° C. was pressed against the overlapped portion at a pressure of 10 kgf, and the polyimide-based adhesive was melted and solidified to join the two strip-shaped polyimide films. In addition, another strip-shaped polyimide film was connected in the same manner to the two strip-shaped polyimide films that were connected, and a long flexible film circuit board was obtained.

The obtained long flexible film circuit board is hung on an automatic visual inspection apparatus and an electric inspection apparatus using image recognition, and the position in the long flexible film circuit board of products that do not meet the predetermined standard is centrally managed. Output to the device. Based on this information and the inspection information by the circuit pattern automatic inspection apparatus, defective product marking was performed by another apparatus.
The two-dimensional bar code formed in the transport region is different for each strip substrate, and history management can be performed finely for each strip-like flexible film circuit board. In addition, by incorporating a barcode reader into the main equipment of the production line, the possibility of mistakes in input and delivery by the company and customers could be reduced.

Comparative Example 1
A long flexible film circuit board was obtained in the same manner as in Example 1 except that the two-dimensional barcode was not written in the conveyance area. There is no information to distinguish from other products other than the product pattern itself, and there is no information to distinguish at all if the pattern is the same, so the identification card was manually attached to the product and managed. Moreover, history management finer than 40 m for one reel could not be performed, and the influence of short-term fluctuations in the manufacturing process could not be traced.

Schematic which showed an example of the aspect of the flexible film circuit board of this invention. Schematic of flexible film substrate connection. An example of the aspect of an identification mark when there exists a reinforcement pattern in the area for conveyance. An example of the aspect of an identification mark when there is no reinforcement pattern in the area for conveyance. Explanatory drawing of the flexible film circuit board manufacturing management system of this invention

Explanation of symbols

1, 2, Flexible film substrate 3 Circuit pattern 4 Sprocket hole 5 Sprocket hole reinforcement pattern 6 Identification mark 7 Adhesive 8 Two-dimensional barcode 10 Central management device 11 PC

Claims (10)

A flexible film circuit board on which a circuit pattern is formed, wherein an identification mark is attached to a region where the circuit pattern is not formed. The flexible film circuit board to which the identification mark is attached is obtained by joining the strip-shaped flexible film circuit boards and lengthening them, and is different for each strip-shaped flexible film circuit board. The flexible film circuit board according to claim 1, further comprising an identification mark. 2. A flexible film circuit board having a transport area having sprocket holes at an end in the substrate width direction, wherein the transport area is provided with an identification mark. Film circuit board. The flexible film circuit board according to claim 1, wherein the identification mark is made of the same material and the same layer structure as the circuit pattern. A method for manufacturing a flexible film circuit board, comprising: attaching an identification mark to a predetermined portion of an area where a circuit pattern is not formed. The flexible film circuit board in which the identification mark is written is formed by joining strip-shaped flexible film circuit boards to be elongated, and the strip-shaped flexible film circuit boards have different identifications. 6. The method for producing a flexible film circuit board according to claim 5, wherein a label is attached. A method for manufacturing a flexible film circuit board, wherein a sprocket hole is formed in a conveyance area at a width direction end of the flexible film circuit board, wherein an identification mark is attached to the conveyance area. 6. A method for producing a flexible film circuit board according to 5. 6. The method of manufacturing a flexible film circuit board according to claim 5, wherein the identification mark is made of the same material and the same layer structure as the circuit pattern. 6. The method of manufacturing a flexible film circuit board according to claim 5, wherein the identification mark is attached in a state where the flexible film circuit board is bonded to the reinforcing plate via an organic layer that can be peeled off. . 5. The manufacturing management system for a flexible film circuit board according to claim 1, wherein an identification mark is attached to a predetermined portion of an area where a circuit pattern is not formed and the identification mark is registered in a central management device. A history of each manufacturing process and each inspection process is stored in the central management device in association with the identification mark.

Images