JP2009016522A5 - - Google Patents

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Publication number
JP2009016522A5
JP2009016522A5 JP2007176037A JP2007176037A JP2009016522A5 JP 2009016522 A5 JP2009016522 A5 JP 2009016522A5 JP 2007176037 A JP2007176037 A JP 2007176037A JP 2007176037 A JP2007176037 A JP 2007176037A JP 2009016522 A5 JP2009016522 A5 JP 2009016522A5
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JP
Japan
Prior art keywords
substrate
semiconductor
semiconductor device
electrode
seal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007176037A
Other languages
English (en)
Japanese (ja)
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JP2009016522A (ja
JP4943959B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007176037A priority Critical patent/JP4943959B2/ja
Priority claimed from JP2007176037A external-priority patent/JP4943959B2/ja
Publication of JP2009016522A publication Critical patent/JP2009016522A/ja
Publication of JP2009016522A5 publication Critical patent/JP2009016522A5/ja
Application granted granted Critical
Publication of JP4943959B2 publication Critical patent/JP4943959B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007176037A 2007-07-04 2007-07-04 半導体装置 Expired - Fee Related JP4943959B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007176037A JP4943959B2 (ja) 2007-07-04 2007-07-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007176037A JP4943959B2 (ja) 2007-07-04 2007-07-04 半導体装置

Publications (3)

Publication Number Publication Date
JP2009016522A JP2009016522A (ja) 2009-01-22
JP2009016522A5 true JP2009016522A5 (enrdf_load_stackoverflow) 2010-05-13
JP4943959B2 JP4943959B2 (ja) 2012-05-30

Family

ID=40357083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007176037A Expired - Fee Related JP4943959B2 (ja) 2007-07-04 2007-07-04 半導体装置

Country Status (1)

Country Link
JP (1) JP4943959B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101849117B1 (ko) * 2011-10-19 2018-04-18 에스케이하이닉스 주식회사 연결 범프를 포함하는 전자 소자의 패키지, 전자 시스템 및 제조 방법
KR101735983B1 (ko) * 2013-03-07 2017-05-15 스미또모 베이크라이트 가부시키가이샤 접착 필름, 다이싱 시트 일체형 접착 필름, 백그라인드 테이프 일체형 접착 필름, 백그라인드 테이프 겸 다이싱 시트 일체형 접착 필름, 적층체, 적층체의 경화물, 및 반도체 장치, 그리고 반도체 장치의 제조 방법
JP7676108B2 (ja) * 2019-12-06 2025-05-14 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0472659A (ja) * 1990-07-12 1992-03-06 Fujitsu Ltd 半導体装置およびその製造方法
JPH0992683A (ja) * 1995-09-25 1997-04-04 Fujitsu Ltd 半導体装置
JPH1079405A (ja) * 1996-09-04 1998-03-24 Hitachi Ltd 半導体装置およびそれが実装された電子部品
JPH10144728A (ja) * 1996-11-14 1998-05-29 Sony Corp 表面実装部品及びこれを用いたプリント配線板
JP2000031340A (ja) * 1998-07-15 2000-01-28 Murata Mfg Co Ltd 電子部品
EP1189282A4 (en) * 2000-03-21 2006-02-15 Mitsubishi Electric Corp SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND PORTABLE INFORMATION TERMINAL
JP2004119550A (ja) * 2002-09-25 2004-04-15 Renesas Technology Corp 半導体装置およびその製造方法

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