JP2009010144A5 - Substrate processing apparatus and method of manufacturing semiconductor device - Google Patents
Substrate processing apparatus and method of manufacturing semiconductor device Download PDFInfo
- Publication number
- JP2009010144A5 JP2009010144A5 JP2007169779A JP2007169779A JP2009010144A5 JP 2009010144 A5 JP2009010144 A5 JP 2009010144A5 JP 2007169779 A JP2007169779 A JP 2007169779A JP 2007169779 A JP2007169779 A JP 2007169779A JP 2009010144 A5 JP2009010144 A5 JP 2009010144A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- susceptor
- heater
- semiconductor device
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims 17
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 239000004065 semiconductor Substances 0.000 title claims 3
- 238000000034 method Methods 0.000 claims 1
- 239000012495 reaction gas Substances 0.000 claims 1
Claims (2)
前記サセプタに設けられた第一ヒータと、A first heater provided to the susceptor;
前記基板を前記サセプタの上から浮かせるリフトピンと、A lift pin for floating the substrate above the susceptor;
前記サセプタと対向して設けられる第二ヒータと、A second heater provided opposite to the susceptor;
前記サセプタの表面よりも所定の高さ分だけ突き出た前記リフトピンに前記基板を載置した状態で、前記第一ヒータ及び第二ヒータで前記基板を加熱し、The substrate is heated by the first heater and the second heater in a state in which the substrate is mounted on the lift pins protruding by a predetermined height from the surface of the susceptor.
前記リフトピンと前記サセプタを相対的に移動して、前記基板を前記サセプタに載置するよう制御する制御部とA control unit that moves the lift pins and the susceptor relative to each other to place the substrate on the susceptor;
を備えている基板処理装置。A substrate processing apparatus comprising:
前記サセプタに設けられた第一ヒータと、A first heater provided to the susceptor;
前記基板を前記サセプタの上から浮かせるリフトピンと、A lift pin for floating the substrate above the susceptor;
前記サセプタと対向して設けられる第二ヒータと、A second heater provided opposite to the susceptor;
各構成を制御する制御部とを有する基板処理装置を用いた半導体装置の製造方法であって、A method of manufacturing a semiconductor device using a substrate processing apparatus having a control unit that controls each component,
前記サセプタの表面よりも所定の高さ分だけ突き出た前記リフトピンに基板を移載し、The substrate is transferred to the lift pin which protrudes by a predetermined height from the surface of the susceptor;
前記リフトピンに前記基板を載置した状態で、前記第一ヒータ及び第二ヒータで前記基板を加熱し、The substrate is heated by the first heater and the second heater while the substrate is mounted on the lift pins,
前記リフトピンと前記サセプタを相対的に移動して、前記基板を前記サセプタに載置し、Moving the lift pin and the susceptor relative to each other to place the substrate on the susceptor;
前記基板を前記サセプタに載置後、反応ガスを前記処理室に供給して前記基板を処理し、After the substrate is placed on the susceptor, a reaction gas is supplied to the processing chamber to process the substrate.
予め設定された処理時間が経過された後、前記基板を前記処理室の外へ搬送するThe substrate is transported out of the processing chamber after a preset processing time has elapsed.
半導体装置の製造方法。Semiconductor device manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007169779A JP2009010144A (en) | 2007-06-27 | 2007-06-27 | Substrate treating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007169779A JP2009010144A (en) | 2007-06-27 | 2007-06-27 | Substrate treating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009010144A JP2009010144A (en) | 2009-01-15 |
| JP2009010144A5 true JP2009010144A5 (en) | 2010-08-05 |
Family
ID=40324942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007169779A Pending JP2009010144A (en) | 2007-06-27 | 2007-06-27 | Substrate treating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009010144A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101590661B1 (en) * | 2010-09-13 | 2016-02-01 | 도쿄엘렉트론가부시키가이샤 | Liquid processing apparatus, liquid processing method and storage medium |
| CN104106128B (en) * | 2012-02-13 | 2016-11-09 | 应用材料公司 | Method and apparatus for the selective oxidation of substrate |
| KR101541392B1 (en) * | 2014-01-06 | 2015-08-03 | 에이피티씨 주식회사 | Apparatus for manufacturing semiconductor device and method of fabricating the semiconductor device using the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05160046A (en) * | 1991-12-05 | 1993-06-25 | Kokusai Electric Co Ltd | Method and device for heating substrate |
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2007
- 2007-06-27 JP JP2007169779A patent/JP2009010144A/en active Pending
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