JP2008532320A5 - - Google Patents

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Publication number
JP2008532320A5
JP2008532320A5 JP2007558164A JP2007558164A JP2008532320A5 JP 2008532320 A5 JP2008532320 A5 JP 2008532320A5 JP 2007558164 A JP2007558164 A JP 2007558164A JP 2007558164 A JP2007558164 A JP 2007558164A JP 2008532320 A5 JP2008532320 A5 JP 2008532320A5
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JP
Japan
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target
targets
sine wave
periodic
pitch
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JP2007558164A
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Japanese (ja)
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JP4994248B2 (ja
JP2008532320A (ja
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Priority claimed from PCT/US2006/007195 external-priority patent/WO2006094021A2/en
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Publication of JP2008532320A5 publication Critical patent/JP2008532320A5/ja
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JP2007558164A 2005-03-01 2006-02-28 2つの回折次数による画像化に基づいたターゲット取得およびオーバレイ測定 Active JP4994248B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US65805605P 2005-03-01 2005-03-01
US60/658,056 2005-03-01
US72591805P 2005-10-11 2005-10-11
US60/725,918 2005-10-11
PCT/US2006/007195 WO2006094021A2 (en) 2005-03-01 2006-02-28 Target acquisition and overlay metrology based on imaging by two diffracted orders

Publications (3)

Publication Number Publication Date
JP2008532320A JP2008532320A (ja) 2008-08-14
JP2008532320A5 true JP2008532320A5 (enExample) 2009-03-19
JP4994248B2 JP4994248B2 (ja) 2012-08-08

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JP2007558164A Active JP4994248B2 (ja) 2005-03-01 2006-02-28 2つの回折次数による画像化に基づいたターゲット取得およびオーバレイ測定

Country Status (3)

Country Link
US (1) US7528953B2 (enExample)
JP (1) JP4994248B2 (enExample)
WO (1) WO2006094021A2 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005109909A1 (en) * 2004-05-12 2005-11-17 Eric Feremans Methods and devices for generating and viewing a planar image which is perceived as three dimensional
US7573584B2 (en) * 2006-09-25 2009-08-11 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7772710B2 (en) * 2006-11-01 2010-08-10 Sematech, Inc. Zero-order overlay targets
TWI347428B (en) * 2007-11-02 2011-08-21 Ind Tech Res Inst Overlay alignment structure and method for overlay metrology using the same
NL1036245A1 (nl) 2007-12-17 2009-06-18 Asml Netherlands Bv Diffraction based overlay metrology tool and method of diffraction based overlay metrology.
NL1036618A1 (nl) * 2008-03-24 2009-09-25 Asml Netherlands Bv Encoder-type measurement system, lithograpic apparatus and method to detect an error on or in a grid or grating of an encoder-type measurement system.
IL217843A (en) * 2011-02-11 2016-11-30 Asml Netherlands Bv A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device
NL2009001A (en) * 2011-07-08 2013-01-09 Asml Netherlands Bv Methods and patterning devices for measuring phase aberration.
NL2010401A (en) 2012-03-27 2013-09-30 Asml Netherlands Bv Metrology method and apparatus, lithographic system and device manufacturing method.
NL2010259A (en) * 2012-04-12 2013-10-16 Asml Holding Nv Position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method, optical element.
KR102231730B1 (ko) 2012-06-26 2021-03-24 케이엘에이 코포레이션 각도 분해형 반사율 측정에서의 스캐닝 및 광학 계측으로부터 회절의 알고리즘적 제거
US9243886B1 (en) * 2012-06-26 2016-01-26 Kla-Tencor Corporation Optical metrology of periodic targets in presence of multiple diffraction orders
NL2011181A (en) * 2012-08-16 2014-02-18 Asml Netherlands Bv Method and apparatus for measuring asymmetry of a microstructure, position measuring method, position measuring apparatus, lithographic apparatus and device manufacturing method.
NL2011476A (en) 2012-10-02 2014-04-07 Asml Netherlands Bv Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method.
NL2011477A (en) * 2012-10-10 2014-04-14 Asml Netherlands Bv Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method.
US9291554B2 (en) 2013-02-05 2016-03-22 Kla-Tencor Corporation Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection
NL2012996A (en) 2013-07-03 2015-01-06 Asml Netherlands Bv Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method.
US9719920B2 (en) 2013-07-18 2017-08-01 Kla-Tencor Corporation Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
KR102069253B1 (ko) * 2013-07-18 2020-01-22 케이엘에이 코포레이션 스캐터로메트리 측정들을 위한 조명 구성들
JP2018517933A (ja) * 2015-06-05 2018-07-05 エーエスエムエル ネザーランズ ビー.ブイ. アライメントシステム
EP3336605A1 (en) * 2016-12-15 2018-06-20 ASML Netherlands B.V. Method of measuring a structure, inspection apparatus, lithographic system and device manufacturing method
KR102729956B1 (ko) * 2018-08-28 2024-11-13 케이엘에이 코포레이션 2-회절된 차수들의 이미징을 사용한 축외 조명 오버레이 측정
US11118903B2 (en) 2018-10-17 2021-09-14 Kla Corporation Efficient illumination shaping for scatterometry overlay
WO2021013483A1 (en) 2019-07-24 2021-01-28 Asml Holding N.V. On chip wafer alignment sensor
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
EP4020084A1 (en) * 2020-12-22 2022-06-29 ASML Netherlands B.V. Metrology method
US11800212B1 (en) 2022-04-08 2023-10-24 Kla Corporation Multi-directional overlay metrology using multiple illumination parameters and isolated imaging
JP7550814B2 (ja) * 2022-05-18 2024-09-13 キヤノン株式会社 検出装置、リソグラフィ装置、物品製造方法および検出システム
CN117572655B (zh) * 2023-11-17 2025-08-26 宜宾学院 一种衍射成像系统及图像的快速复原方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6173958A (ja) * 1984-09-20 1986-04-16 Matsushita Electric Ind Co Ltd 露光装置
US4828392A (en) * 1985-03-13 1989-05-09 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
USRE34010E (en) * 1985-03-22 1992-07-28 Nikon Corporation Position detection apparatus
JPH0715368B2 (ja) * 1985-09-05 1995-02-22 株式会社ニコン 位置ずれ検出装置
JPH07122565B2 (ja) * 1986-04-30 1995-12-25 松下電器産業株式会社 露光装置
US5327221A (en) * 1988-02-16 1994-07-05 Canon Kabushiki Kaisha Device for detecting positional relationship between two objects
JPH0243719A (ja) * 1988-08-04 1990-02-14 Toshiba Corp 位置合わせ方法
JP2808619B2 (ja) * 1988-11-15 1998-10-08 株式会社ニコン 位置合わせ装置,露光装置及び素子製造方法
JP2691298B2 (ja) * 1989-06-05 1997-12-17 株式会社ニコン 位置合わせ装置およびそれを備えた露光装置
JP3077149B2 (ja) * 1990-01-22 2000-08-14 株式会社ニコン 測定装置、測定方法、及び露光装置、露光方法、及び回路パターンチップ
JP2893823B2 (ja) * 1990-03-20 1999-05-24 株式会社ニコン 位置合わせ方法及び装置
JPH0453220A (ja) * 1990-06-20 1992-02-20 Nikon Corp 投影光学装置
US5477309A (en) * 1992-03-09 1995-12-19 Nikon Corporation Alignment apparatus
JP3216240B2 (ja) * 1992-06-04 2001-10-09 キヤノン株式会社 位置合わせ方法及びそれを用いた投影露光装置
JPH06310404A (ja) * 1993-04-23 1994-11-04 Nikon Corp 投影露光装置
JPH08186069A (ja) * 1994-12-28 1996-07-16 Nikon Corp 露光装置
JP3622249B2 (ja) * 1995-02-01 2005-02-23 株式会社ニコン 位置検出方法及び装置
JPH08250391A (ja) * 1995-03-10 1996-09-27 Nikon Corp 位置検出用マーク及び位置検出方法
JPH08321452A (ja) * 1995-05-26 1996-12-03 Nikon Corp アライメント結果評価方法及び該方法を使用するアライメント装置
US6023338A (en) * 1996-07-12 2000-02-08 Bareket; Noah Overlay alignment measurement of wafers
JP3713354B2 (ja) * 1997-03-21 2005-11-09 株式会社トプコン 位置測定装置
JP2001267211A (ja) * 2000-03-16 2001-09-28 Nikon Corp 位置検出方法及び装置、並びに前記位置検出方法を用いた露光方法及び装置
US20040066517A1 (en) * 2002-09-05 2004-04-08 Hsu-Ting Huang Interferometry-based method and apparatus for overlay metrology
TWI251722B (en) * 2002-09-20 2006-03-21 Asml Netherlands Bv Device inspection
JP4074867B2 (ja) * 2003-11-04 2008-04-16 エーエスエムエル ネザーランズ ビー.ブイ. 第1及び第2位置合せマークの相対位置を計測する方法及び装置
US6937337B2 (en) * 2003-11-19 2005-08-30 International Business Machines Corporation Overlay target and measurement method using reference and sub-grids
WO2005069082A1 (en) * 2003-12-19 2005-07-28 International Business Machines Corporation Differential critical dimension and overlay metrology apparatus and measurement method
US7791727B2 (en) * 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US7349105B2 (en) * 2004-09-01 2008-03-25 Intel Corporation Method and apparatus for measuring alignment of layers in photolithographic processes

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