JP2008526106A - 集積オンチップ無線周波数信号結合器を備えた無線周波数回路 - Google Patents

集積オンチップ無線周波数信号結合器を備えた無線周波数回路 Download PDF

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Publication number
JP2008526106A
JP2008526106A JP2007548222A JP2007548222A JP2008526106A JP 2008526106 A JP2008526106 A JP 2008526106A JP 2007548222 A JP2007548222 A JP 2007548222A JP 2007548222 A JP2007548222 A JP 2007548222A JP 2008526106 A JP2008526106 A JP 2008526106A
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Prior art keywords
signal path
coupling
coupling portion
electronic device
coupler
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Pending
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JP2007548222A
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Japanese (ja)
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JP2008526106A5 (enExample
Inventor
リウ、リアンジュン
ケイ． アブロクワー、ジョナサン
アール． レイ、マーカス
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NXP USA Inc
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NXP USA Inc
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Publication of JP2008526106A publication Critical patent/JP2008526106A/ja
Publication of JP2008526106A5 publication Critical patent/JP2008526106A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185—Edge coupled lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Transceivers (AREA)
  • Filters And Equalizers (AREA)
JP2007548222A 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路 Pending JP2008526106A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/021,843 US7305223B2 (en) 2004-12-23 2004-12-23 Radio frequency circuit with integrated on-chip radio frequency signal coupler
PCT/US2005/041048 WO2006071371A2 (en) 2004-12-23 2005-11-10 Radio frequency circuit with integrated on-chip radio frequency signal coupler

Publications (2)

Publication Number Publication Date
JP2008526106A true JP2008526106A (ja) 2008-07-17
JP2008526106A5 JP2008526106A5 (enExample) 2008-10-16

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Family Applications (1)

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JP2007548222A Pending JP2008526106A (ja) 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路

Country Status (4)

Country Link
US (1) US7305223B2 (enExample)
JP (1) JP2008526106A (enExample)
TW (1) TWI377634B (enExample)
WO (1) WO2006071371A2 (enExample)

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CN103985613A (zh) * 2014-05-30 2014-08-13 佳一电气有限公司 用于断路器操作机构的离合装置和手动/电动切换装置
US12476592B2 (en) 2019-12-10 2025-11-18 Murata Manufacturing Co., Ltd. Power amplifier

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JP2008134695A (ja) * 2006-11-27 2008-06-12 Philtech Inc 基体データ管理システム
JP2008135951A (ja) * 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダー含有基体
JP2008134816A (ja) * 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダーの励起方法
JP2008136019A (ja) * 2006-11-29 2008-06-12 Philtech Inc 磁界結合装置および読取り装置
US7869784B2 (en) * 2007-02-27 2011-01-11 Freescale Semiconductor, Inc. Radio frequency circuit with integrated on-chip radio frequency inductive signal coupler
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US8385867B2 (en) * 2009-06-29 2013-02-26 Silicon Laboratories Inc. Tracking filter for a television tuner
US8358179B2 (en) * 2009-09-10 2013-01-22 Stats Chippac, Ltd. Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing
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US9692386B2 (en) * 2013-12-23 2017-06-27 Qualcomm Incorporated Three-dimensional wire bond inductor
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US9905902B2 (en) 2014-07-24 2018-02-27 Skyworks Solutions, Inc. Zero insertion loss directional coupler for wireless transceivers with integrated power amplifiers
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CN108292793B (zh) 2015-09-10 2021-03-09 天工方案公司 用于多频功率检测的电磁耦合器
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103985613A (zh) * 2014-05-30 2014-08-13 佳一电气有限公司 用于断路器操作机构的离合装置和手动/电动切换装置
US12476592B2 (en) 2019-12-10 2025-11-18 Murata Manufacturing Co., Ltd. Power amplifier

Also Published As

Publication number Publication date
TW200636895A (en) 2006-10-16
WO2006071371A2 (en) 2006-07-06
US20060141979A1 (en) 2006-06-29
WO2006071371A3 (en) 2007-02-15
TWI377634B (en) 2012-11-21
US7305223B2 (en) 2007-12-04

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