JP2008525206A5 - - Google Patents

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Publication number
JP2008525206A5
JP2008525206A5 JP2007548426A JP2007548426A JP2008525206A5 JP 2008525206 A5 JP2008525206 A5 JP 2008525206A5 JP 2007548426 A JP2007548426 A JP 2007548426A JP 2007548426 A JP2007548426 A JP 2007548426A JP 2008525206 A5 JP2008525206 A5 JP 2008525206A5
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JP
Japan
Prior art keywords
fluid
microcomponent
binding site
support
engage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007548426A
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English (en)
Japanese (ja)
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JP2008525206A (ja
JP4990794B2 (ja
Filing date
Publication date
Priority claimed from US11/021,120 external-priority patent/US7687277B2/en
Application filed filed Critical
Publication of JP2008525206A publication Critical patent/JP2008525206A/ja
Publication of JP2008525206A5 publication Critical patent/JP2008525206A5/ja
Application granted granted Critical
Publication of JP4990794B2 publication Critical patent/JP4990794B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007548426A 2004-12-22 2005-12-20 熱制御流体自己組立 Expired - Fee Related JP4990794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/021,120 US7687277B2 (en) 2004-12-22 2004-12-22 Thermally controlled fluidic self-assembly
US11/021,120 2004-12-22
PCT/US2005/046316 WO2006069137A1 (en) 2004-12-22 2005-12-20 Thermally controlled fluidic self-assembly

Publications (3)

Publication Number Publication Date
JP2008525206A JP2008525206A (ja) 2008-07-17
JP2008525206A5 true JP2008525206A5 (enExample) 2008-12-18
JP4990794B2 JP4990794B2 (ja) 2012-08-01

Family

ID=36146918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007548426A Expired - Fee Related JP4990794B2 (ja) 2004-12-22 2005-12-20 熱制御流体自己組立

Country Status (5)

Country Link
US (2) US7687277B2 (enExample)
EP (1) EP1829104B1 (enExample)
JP (1) JP4990794B2 (enExample)
DE (1) DE602005007633D1 (enExample)
WO (1) WO2006069137A1 (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0519478A2 (pt) 2004-12-27 2009-02-03 Quantum Paper Inc display emissivo endereÇÁvel e imprimÍvel
US7696013B2 (en) * 2007-04-19 2010-04-13 Eastman Kodak Company Connecting microsized devices using ablative films
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8384630B2 (en) 2007-05-31 2013-02-26 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US7709298B2 (en) 2007-07-18 2010-05-04 Hewlett-Packard Development Company, L.P. Selectively altering a predetermined portion or an external member in contact with the predetermined portion
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8425716B2 (en) * 2009-06-23 2013-04-23 Global Oled Technology Llc Applying chiplets to substrates
US8933526B2 (en) * 2009-07-15 2015-01-13 First Solar, Inc. Nanostructured functional coatings and devices
US8953314B1 (en) * 2010-08-09 2015-02-10 Georgia Tech Research Corporation Passive heat sink for dynamic thermal management of hot spots
EP2612354A2 (en) * 2010-09-03 2013-07-10 The Procter and Gamble Company A light emitting apparatus
US20130175515A1 (en) * 2011-09-02 2013-07-11 The Procter & Gamble Company Light emitting apparatus
US20130175516A1 (en) * 2011-09-02 2013-07-11 The Procter & Gamble Company Light emitting apparatus
US9245875B2 (en) * 2012-04-20 2016-01-26 Rensselaer Polytechnic Institute Light emitting diodes and a method of packaging the same
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
US9755110B1 (en) 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
US9985190B2 (en) 2016-05-18 2018-05-29 eLux Inc. Formation and structure of post enhanced diodes for orientation control
US9892944B2 (en) 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
US10242977B2 (en) * 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10249599B2 (en) 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
US9917226B1 (en) 2016-09-15 2018-03-13 Sharp Kabushiki Kaisha Substrate features for enhanced fluidic assembly of electronic devices
US9627437B1 (en) 2016-06-30 2017-04-18 Sharp Laboratories Of America, Inc. Patterned phosphors in through hole via (THV) glass
US10243097B2 (en) 2016-09-09 2019-03-26 eLux Inc. Fluidic assembly using tunable suspension flow
CN107833525B (zh) * 2016-09-15 2020-10-27 伊乐视有限公司 发光显示器的流体组装的系统和方法
US9837390B1 (en) 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate
US10636837B2 (en) * 2017-01-26 2020-04-28 International Business Machines Corporation Solution deposited magnetically guided chiplet displacement
DE102017113094A1 (de) * 2017-06-14 2018-12-20 Osram Opto Semiconductors Gmbh Verfahren zum selbstjustierten Bestücken eines Anschlussträgers mit einem Bauteil, Vorrichtung und optoelektronisches Bauteil
US10361337B2 (en) * 2017-08-18 2019-07-23 Intel Corporation Micro light-emitting diode (LED) display and fluidic self-assembly of same
CN109727880A (zh) * 2017-10-30 2019-05-07 展晶科技(深圳)有限公司 发光二极管晶粒的检测方法
CN111292631B (zh) * 2018-11-21 2022-03-25 成都辰显光电有限公司 微发光二极管显示面板及其制备方法
WO2021025184A1 (ko) * 2019-08-05 2021-02-11 엘지전자 주식회사 오조립된 반도체 발광소자의 제거 모듈 및 이를 이용한 오조립된 반도체 발광소자의 제거방법
KR102760284B1 (ko) 2019-08-26 2025-02-03 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
KR102811480B1 (ko) 2019-08-28 2025-05-22 엘지전자 주식회사 반도체 발광소자 수거 장치 및 수거 방법
JP6842783B1 (ja) * 2019-10-31 2021-03-17 アルディーテック株式会社 マイクロｌｅｄディスプレイの製造方法およびマイクロｌｅｄディスプレイ
KR20200021969A (ko) * 2020-02-11 2020-03-02 엘지전자 주식회사 반도체 발광소자의 자가조립 장치 및 방법
US12087754B2 (en) 2021-02-16 2024-09-10 Samsung Electronics Co., Ltd. Hybrid element and method of fabricating the same

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5605662A (en) 1993-11-01 1997-02-25 Nanogen, Inc. Active programmable electronic devices for molecular biological analysis and diagnostics
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5824186A (en) 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
JP3376183B2 (ja) 1994-09-29 2003-02-10 キヤノン株式会社 インクジェット用水性インク、インクジェット記録方法及びブリード緩和方法
AU774187B2 (en) 1998-05-20 2004-06-17 Integrated Nano-Technologies, Llc Chemically assembled nano-scale devices
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6683663B1 (en) 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6555408B1 (en) 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6536106B1 (en) 1999-06-30 2003-03-25 The Penn State Research Foundation Electric field assisted assembly process
US6527964B1 (en) 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6623579B1 (en) 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6605453B2 (en) 1999-12-01 2003-08-12 The Regents Of The University Of California Electric-field-assisted fluidic assembly of inorganic and organic materials, molecules and like small things including living cells
US6695922B2 (en) 1999-12-15 2004-02-24 Tokyo Electron Limited Film forming unit
JP4330787B2 (ja) * 1999-12-15 2009-09-16 東京エレクトロン株式会社 膜形成装置
US6687987B2 (en) 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6611237B2 (en) 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US7253091B2 (en) 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US7018575B2 (en) 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US6888178B2 (en) 2002-01-24 2005-05-03 Massachusetts Institute Of Technology Method and system for magnetically assisted statistical assembly of wafers
JP3789827B2 (ja) * 2002-02-04 2006-06-28 大日本印刷株式会社 Ｉｃチップ実装方法とｉｃチップ付き包装体およびｉｃチップ付き包装体の製造方法
JP3978189B2 (ja) * 2004-01-23 2007-09-19 松下電器産業株式会社 半導体装置の製造方法及びその製造装置
US7251882B2 (en) * 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites

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