DE602005007633D1 - Wärmegeregelte, fluidische selbstmontage - Google Patents

Wärmegeregelte, fluidische selbstmontage

Info

Publication number
DE602005007633D1
DE602005007633D1 DE602005007633T DE602005007633T DE602005007633D1 DE 602005007633 D1 DE602005007633 D1 DE 602005007633D1 DE 602005007633 T DE602005007633 T DE 602005007633T DE 602005007633 T DE602005007633 T DE 602005007633T DE 602005007633 D1 DE602005007633 D1 DE 602005007633D1
Authority
DE
Germany
Prior art keywords
assembly
thermal control
fluid self
self
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005007633T
Other languages
English (en)
Inventor
Ravi Sharma
Charles P Lusignan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of DE602005007633D1 publication Critical patent/DE602005007633D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95145—Electrostatic alignment, i.e. polarity alignment with Coulomb charges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T436/00—Chemistry: analytical and immunological testing
    • Y10T436/25—Chemistry: analytical and immunological testing including sample preparation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
DE602005007633T 2004-12-22 2005-12-20 Wärmegeregelte, fluidische selbstmontage Active DE602005007633D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/021,120 US7687277B2 (en) 2004-12-22 2004-12-22 Thermally controlled fluidic self-assembly
PCT/US2005/046316 WO2006069137A1 (en) 2004-12-22 2005-12-20 Thermally controlled fluidic self-assembly

Publications (1)

Publication Number Publication Date
DE602005007633D1 true DE602005007633D1 (de) 2008-07-31

Family

ID=36146918

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005007633T Active DE602005007633D1 (de) 2004-12-22 2005-12-20 Wärmegeregelte, fluidische selbstmontage

Country Status (5)

Country Link
US (2) US7687277B2 (de)
EP (1) EP1829104B1 (de)
JP (1) JP4990794B2 (de)
DE (1) DE602005007633D1 (de)
WO (1) WO2006069137A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2592055A1 (en) 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US7696013B2 (en) * 2007-04-19 2010-04-13 Eastman Kodak Company Connecting microsized devices using ablative films
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8456393B2 (en) * 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US7709298B2 (en) 2007-07-18 2010-05-04 Hewlett-Packard Development Company, L.P. Selectively altering a predetermined portion or an external member in contact with the predetermined portion
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8425716B2 (en) * 2009-06-23 2013-04-23 Global Oled Technology Llc Applying chiplets to substrates
US8933526B2 (en) * 2009-07-15 2015-01-13 First Solar, Inc. Nanostructured functional coatings and devices
US8953314B1 (en) * 2010-08-09 2015-02-10 Georgia Tech Research Corporation Passive heat sink for dynamic thermal management of hot spots
WO2012031178A2 (en) * 2010-09-03 2012-03-08 The Procter & Gamble Company A light emitting apparatus
US20130175516A1 (en) * 2011-09-02 2013-07-11 The Procter & Gamble Company Light emitting apparatus
US20130175515A1 (en) * 2011-09-02 2013-07-11 The Procter & Gamble Company Light emitting apparatus
EP2839522A4 (de) * 2012-04-20 2015-12-09 Rensselaer Polytech Inst Lichtemittierende dioden und verfahren zur verpackung davon
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
US10249599B2 (en) 2016-06-29 2019-04-02 eLux, Inc. Laminated printed color conversion phosphor sheets
US9892944B2 (en) 2016-06-23 2018-02-13 Sharp Kabushiki Kaisha Diodes offering asymmetric stability during fluidic assembly
US10418527B2 (en) * 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10242977B2 (en) * 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US9755110B1 (en) 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
US9917226B1 (en) 2016-09-15 2018-03-13 Sharp Kabushiki Kaisha Substrate features for enhanced fluidic assembly of electronic devices
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US9985190B2 (en) 2016-05-18 2018-05-29 eLux Inc. Formation and structure of post enhanced diodes for orientation control
US9627437B1 (en) 2016-06-30 2017-04-18 Sharp Laboratories Of America, Inc. Patterned phosphors in through hole via (THV) glass
US10243097B2 (en) 2016-09-09 2019-03-26 eLux Inc. Fluidic assembly using tunable suspension flow
CN107833525B (zh) * 2016-09-15 2020-10-27 伊乐视有限公司 发光显示器的流体组装的系统和方法
US9837390B1 (en) 2016-11-07 2017-12-05 Corning Incorporated Systems and methods for creating fluidic assembly structures on a substrate
US10636837B2 (en) * 2017-01-26 2020-04-28 International Business Machines Corporation Solution deposited magnetically guided chiplet displacement
DE102017113094A1 (de) * 2017-06-14 2018-12-20 Osram Opto Semiconductors Gmbh Verfahren zum selbstjustierten Bestücken eines Anschlussträgers mit einem Bauteil, Vorrichtung und optoelektronisches Bauteil
US10361337B2 (en) * 2017-08-18 2019-07-23 Intel Corporation Micro light-emitting diode (LED) display and fluidic self-assembly of same
CN109727880A (zh) * 2017-10-30 2019-05-07 展晶科技(深圳)有限公司 发光二极管晶粒的检测方法
CN111292631B (zh) * 2018-11-21 2022-03-25 成都辰显光电有限公司 微发光二极管显示面板及其制备方法
WO2021025184A1 (ko) * 2019-08-05 2021-02-11 엘지전자 주식회사 오조립된 반도체 발광소자의 제거 모듈 및 이를 이용한 오조립된 반도체 발광소자의 제거방법
KR20190105537A (ko) * 2019-08-26 2019-09-17 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
KR20200026725A (ko) * 2019-08-28 2020-03-11 엘지전자 주식회사 반도체 발광소자 수거 장치 및 수거 방법
JP6842783B1 (ja) * 2019-10-31 2021-03-17 アルディーテック株式会社 マイクロｌｅｄディスプレイの製造方法およびマイクロｌｅｄディスプレイ
KR20200021969A (ko) * 2020-02-11 2020-03-02 엘지전자 주식회사 반도체 발광소자의 자가조립 장치 및 방법
US12087754B2 (en) 2021-02-16 2024-09-10 Samsung Electronics Co., Ltd. Hybrid element and method of fabricating the same

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5605662A (en) 1993-11-01 1997-02-25 Nanogen, Inc. Active programmable electronic devices for molecular biological analysis and diagnostics
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
JP3376183B2 (ja) 1994-09-29 2003-02-10 キヤノン株式会社 インクジェット用水性インク、インクジェット記録方法及びブリード緩和方法
CA2328593C (en) 1998-05-20 2011-07-12 Integrated Nano-Technologies, Llc Chemically assembled nano-scale devices
US6683663B1 (en) 1999-02-05 2004-01-27 Alien Technology Corporation Web fabrication of devices
US6274508B1 (en) 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6555408B1 (en) 1999-02-05 2003-04-29 Alien Technology Corporation Methods for transferring elements from a template to a substrate
US6468638B2 (en) 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
WO2001001475A1 (en) 1999-06-30 2001-01-04 The Penn State Research Foundation Electrofluidic assembly of devices and components for micro- and nano-scale integration
US6623579B1 (en) 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6527964B1 (en) 1999-11-02 2003-03-04 Alien Technology Corporation Methods and apparatuses for improved flow in performing fluidic self assembly
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6605453B2 (en) 1999-12-01 2003-08-12 The Regents Of The University Of California Electric-field-assisted fluidic assembly of inorganic and organic materials, molecules and like small things including living cells
JP4330787B2 (ja) * 1999-12-15 2009-09-16 東京エレクトロン株式会社 膜形成装置
US6695922B2 (en) 1999-12-15 2004-02-24 Tokyo Electron Limited Film forming unit
WO2001095375A1 (en) 2000-06-06 2001-12-13 The Penn State Research Foundation An electro-fluidic assembly process for integration of electronic devices onto a substrate
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6611237B2 (en) 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
US6864435B2 (en) 2001-04-25 2005-03-08 Alien Technology Corporation Electrical contacts for flexible displays
US7018575B2 (en) 2001-09-28 2006-03-28 Hrl Laboratories, Llc Method for assembly of complementary-shaped receptacle site and device microstructures
US7253091B2 (en) 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US7323757B2 (en) 2002-01-24 2008-01-29 Massachusetts Institute Of Technology System for field assisted statistical assembly of wafers
JP3789827B2 (ja) * 2002-02-04 2006-06-28 大日本印刷株式会社 Ｉｃチップ実装方法とｉｃチップ付き包装体およびｉｃチップ付き包装体の製造方法
JP3978189B2 (ja) * 2004-01-23 2007-09-19 松下電器産業株式会社 半導体装置の製造方法及びその製造装置
US7251882B2 (en) * 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites

Also Published As

Publication number Publication date
JP2008525206A (ja) 2008-07-17
JP4990794B2 (ja) 2012-08-01
EP1829104A1 (de) 2007-09-05
US7687277B2 (en) 2010-03-30
WO2006069137A1 (en) 2006-06-29
US20100122654A1 (en) 2010-05-20
EP1829104B1 (de) 2008-06-18
US20060134799A1 (en) 2006-06-22

Similar Documents

Publication Publication Date Title
DE602005018493D1 (de) Wärmegeregelte, fluidische selbstmontage
DE602005007633D1 (de) Wärmegeregelte, fluidische selbstmontage
DE602005022897D1 (de) Piperidinylamino-thienoä2,3-dü-pyrimidinverbindungen
ATE469145T1 (de) 4-ä5-methoxy-6-(2-methyl-6-ä1,2,4ütriazol-1-yl-
NL1028967A1 (nl) 4-Fenylamino-chinazoline-6-yl-amiden.
NO20051522D0 (no) Kabelskjotbeskytter.
NO20053210D0 (no) Linneslakkompensator.
DE502005007723D1 (de) 18-methyl-19-nor-17-pregn-4-en-21,17-carbolactone,
DE602007001681D1 (de) 1,3-dioxan-carboxylsäuren
NO20052746D0 (no) Avlopsenhet.
DE502006002257D1 (de) Durchflussmengenregler
NO20041374D0 (no) Bolgekraftverk.
NO20052482D0 (no) Redningskokong.
ATE445604T1 (de) Neue 2,6-diaminopyridin-3-on-derivate
NO20040762L (no) Stromskinne.
FI20041019A0 (fi) Virtaussäädin
DE602005000473D1 (de) Thermisch aktivierter Betätiger
NL1028622A1 (nl) Stelwig.
ES1058958Y (es) Mastil perfeccionado.
ITMO20040347A1 (it) Dispositivo riscaldante.
NL1025196A1 (nl) Hark-Zeef-Vork.
ITTV20040024U1 (it) Contenitore termico refrigerante - riutilizzabile.
FI20041628A0 (fi) Kolmiulotteinen, optinen mittausjärjestelmä
ES1057393Y (es) Protesis capilar perfeccionada.
FI20040060A (fi) Lämmönsiirtojärjestelmän ohjaaminen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition