JP4990794B2 - 熱制御流体自己組立 - Google Patents

熱制御流体自己組立 Download PDF

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Publication number
JP4990794B2
JP4990794B2 JP2007548426A JP2007548426A JP4990794B2 JP 4990794 B2 JP4990794 B2 JP 4990794B2 JP 2007548426 A JP2007548426 A JP 2007548426A JP 2007548426 A JP2007548426 A JP 2007548426A JP 4990794 B2 JP4990794 B2 JP 4990794B2
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support
fluid
cooling
assembly
microcomponent
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JP2008525206A (ja
JP2008525206A5 (enExample
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ラビ シャルマ
チャールズ ピー ルシナン
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イーストマン コダック カンパニー
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
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    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
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    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
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    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95145—Electrostatic alignment, i.e. polarity alignment with Coulomb charges
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    • H01L2924/1025—Semiconducting materials
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19041—Component type being a capacitor
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T436/25—Chemistry: analytical and immunological testing including sample preparation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
JP2007548426A 2004-12-22 2005-12-20 熱制御流体自己組立 Expired - Fee Related JP4990794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/021,120 US7687277B2 (en) 2004-12-22 2004-12-22 Thermally controlled fluidic self-assembly
US11/021,120 2004-12-22
PCT/US2005/046316 WO2006069137A1 (en) 2004-12-22 2005-12-20 Thermally controlled fluidic self-assembly

Publications (3)

Publication Number Publication Date
JP2008525206A JP2008525206A (ja) 2008-07-17
JP2008525206A5 JP2008525206A5 (enExample) 2008-12-18
JP4990794B2 true JP4990794B2 (ja) 2012-08-01

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US (2) US7687277B2 (enExample)
EP (1) EP1829104B1 (enExample)
JP (1) JP4990794B2 (enExample)
DE (1) DE602005007633D1 (enExample)
WO (1) WO2006069137A1 (enExample)

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EP1829104A1 (en) 2007-09-05
EP1829104B1 (en) 2008-06-18
JP2008525206A (ja) 2008-07-17
US20100122654A1 (en) 2010-05-20
WO2006069137A1 (en) 2006-06-29
US20060134799A1 (en) 2006-06-22
US7687277B2 (en) 2010-03-30

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