JP2008507851A - 光保護層を有するチップ - Google Patents

光保護層を有するチップ Download PDF

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Publication number
JP2008507851A
JP2008507851A JP2007523208A JP2007523208A JP2008507851A JP 2008507851 A JP2008507851 A JP 2008507851A JP 2007523208 A JP2007523208 A JP 2007523208A JP 2007523208 A JP2007523208 A JP 2007523208A JP 2008507851 A JP2008507851 A JP 2008507851A
Authority
JP
Japan
Prior art keywords
chip
integrated circuit
dielectric
mirror coating
dielectric mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007523208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008507851A5 (enExample
Inventor
クリスティアン、ツェンツ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008507851A publication Critical patent/JP2008507851A/ja
Publication of JP2008507851A5 publication Critical patent/JP2008507851A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Light Receiving Elements (AREA)
  • Formation Of Insulating Films (AREA)
JP2007523208A 2004-07-26 2005-07-20 光保護層を有するチップ Withdrawn JP2008507851A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04103562 2004-07-26
PCT/IB2005/052426 WO2006013507A1 (en) 2004-07-26 2005-07-20 Chip with light protection layer

Publications (2)

Publication Number Publication Date
JP2008507851A true JP2008507851A (ja) 2008-03-13
JP2008507851A5 JP2008507851A5 (enExample) 2008-09-04

Family

ID=35423325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523208A Withdrawn JP2008507851A (ja) 2004-07-26 2005-07-20 光保護層を有するチップ

Country Status (6)

Country Link
US (1) US20080093712A1 (enExample)
EP (1) EP1774592A1 (enExample)
JP (1) JP2008507851A (enExample)
KR (1) KR20070039600A (enExample)
CN (1) CN101027774B (enExample)
WO (1) WO2006013507A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9230852B2 (en) 2013-02-25 2016-01-05 Texas Instruments Incorporated Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads
DE102014100469A1 (de) 2013-11-29 2015-06-03 Epcos Ag Elektronisches Bauelement und Verwendung desselben
US9697455B2 (en) * 2014-12-26 2017-07-04 Avery Dennison Retail Information Services, Llc Using reactive coupling of a printed RFID chip on a strap to allow the printed material to be over-laminated with a barrier film against oxygen and moisture ingress
CN113130722B (zh) 2015-09-25 2025-08-12 美题隆公司 利用通过焊接附着的磷光体元件的高光功率的光转换装置
US11205625B2 (en) 2019-04-12 2021-12-21 Invensas Bonding Technologies, Inc. Wafer-level bonding of obstructive elements
US11373963B2 (en) 2019-04-12 2022-06-28 Invensas Bonding Technologies, Inc. Protective elements for bonded structures
US11610846B2 (en) 2019-04-12 2023-03-21 Adeia Semiconductor Bonding Technologies Inc. Protective elements for bonded structures including an obstructive element
US11385278B2 (en) 2019-05-23 2022-07-12 Invensas Bonding Technologies, Inc. Security circuitry for bonded structures
WO2021196039A1 (zh) * 2020-03-31 2021-10-07 深圳市汇顶科技股份有限公司 安全芯片、安全芯片的制造方法和电子设备
US12278255B2 (en) * 2021-06-11 2025-04-15 Raytheon Company Thin film obscurant for microelectronics
EP4371153A4 (en) * 2021-07-16 2025-05-21 Adeia Semiconductor Bonding Technologies Inc. OPTICALLY OBSTRUCTIVE PROTECTIVE ELEMENT FOR BONDED STRUCTURES
JP2024528964A (ja) 2021-08-02 2024-08-01 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド ボンデッド構造体用の保護半導体素子

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2228298B1 (enExample) * 1973-05-03 1978-01-06 Ibm
US5468990A (en) * 1993-07-22 1995-11-21 National Semiconductor Corp. Structures for preventing reverse engineering of integrated circuits
JPH07301824A (ja) * 1994-05-09 1995-11-14 Seiko Instr Inc 光弁用半導体装置
FR2735437B1 (fr) * 1995-06-19 1997-08-14 Sevylor International Vehicule roulant, notamment robot de nettoyage en particulier de piscine, a changement automatique de direction de deplacement devant un obstacle
US5917202A (en) * 1995-12-21 1999-06-29 Hewlett-Packard Company Highly reflective contacts for light emitting semiconductor devices
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
DE19840251B4 (de) * 1998-09-03 2004-02-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Schaltungschip, insbesondere Transponder mit Lichtschutz
US6515304B1 (en) * 2000-06-23 2003-02-04 International Business Machines Corporation Device for defeating reverse engineering of integrated circuits by optical means
US6686977B2 (en) * 2001-07-24 2004-02-03 Three-Five Systems, Inc. Liquid crystal on silicon device
GB2405531B (en) * 2002-05-14 2006-04-12 Hrl Lab Llc Integrated circuit with reverse engineering protection
US6933013B2 (en) * 2003-10-14 2005-08-23 Photon Dynamics, Inc. Vacuum deposition of dielectric coatings on volatile material

Also Published As

Publication number Publication date
WO2006013507A1 (en) 2006-02-09
EP1774592A1 (en) 2007-04-18
CN101027774B (zh) 2011-10-26
US20080093712A1 (en) 2008-04-24
CN101027774A (zh) 2007-08-29
KR20070039600A (ko) 2007-04-12

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