JP2008307610A - Polishing pad size setting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing pad size setting method for setting an optimum size of a polishing pad that can uniformly level a polished surface of a polishing object, and can polish the polished surface efficiently in a short period of time to a desired amount. <P>SOLUTION: According to the polishing pad size setting method, a plurality of polishing pads 18 are formed by changing an inner diameter ID and an outer diameter OD of annular polishing surfaces, and polished amount values obtained when the polished surface of the glass sheet 2 is polished by using the polishing pads 18, are measured, respectively. Then a range non-uniformity RNU (dispersion) of a polished amount on the polished surface of the glass sheet 2 is obtained for each of the measured polished amount values, and the inner diameter ID and the outer diameter OD of the annular polishing surface are set such that the range non-uniformity RNU (dispersion) of the polished amount falls in a predetermined range. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a polishing pad size setting method used in a polishing apparatus such as a CMP apparatus for polishing a surface of an object to be polished.

  As a polishing technique for an object to be polished such as a glass plate, chemical mechanical polishing is attracting attention as an efficient planarization technique for a large area. This is a polishing process called CMP (Chemical Mechanical Polishing). This CMP is an important technique for global planarization in a process of polishing the surface of an object to be polished by using a chemical action in combination with physical polishing. Specifically, an abrasive called slurry in which abrasive grains (silica, alumina, cerium oxide, etc. are commonly used) are dispersed in a soluble solvent of an abrasive such as acid, alkali, or oxidizer, and further polished. Polishing is advanced by pressurizing the surface of the object to be polished with a pad and rubbing with relative motion.

  Conventionally, in CMP, a large-diameter pad method using a polishing pad having a considerably larger diameter than an object to be polished and a small-diameter pad method using a polishing pad having a diameter substantially the same as or smaller than the object to be polished are known. (See Patent Document 1). In the large-diameter pad method, the polishing object is smaller than the polishing pad, and the entire surface of the polishing object is always in contact with the polishing pad. Therefore, some areas of the polishing object are given priority over other areas. It is extremely difficult to polish, and it is very difficult to uniformly flatten the surface of the object to be polished.

  On the other hand, in the small-diameter pad method using a polishing pad having a considerably smaller diameter than the object to be polished, it is possible to preferentially polish some areas of the object to be polished with respect to other areas. Problems arise. That is, on the peripheral side of the object to be polished, a large relative speed can be obtained between the object to be polished and the polishing pad, so that the polishing can be performed relatively quickly. However, in the vicinity of the center of the rotation axis of the object to be polished, the relative speed between the object to be polished and the polishing pad is remarkably reduced, so that high-speed polishing cannot be performed. Therefore, in the small-diameter pad method using an annular (doughnut-shaped) polishing pad having an outer diameter that is substantially the same size as the object to be polished and a smaller inner diameter and a relatively narrow width, the peripheral side of the object to be polished is given priority. The polishing rate can be increased and the surface of the polishing object can be uniformly flattened not only when polishing but also preferentially polishing the vicinity of the center of the rotation axis of the polishing object.

International Publication No. 04/075276 Pamphlet

  However, in a polishing pad having an annular diameter (doughnut shape) having an outer diameter that is substantially the same size as the object to be polished and a smaller inner diameter, the hollow area (inner diameter of the polishing pad) is too large. Alternatively, if the outer diameter of the polishing pad is too small, the contact area between the polishing object and the polishing pad becomes narrow, and if the entire area of the polishing object is to be polished to a desired amount, polishing cannot be performed efficiently. As time increases, it becomes difficult to preferentially polish some areas of the object to be polished with respect to other areas, which makes it difficult to uniformly planarize the surface of the object to be polished. .

  The present invention has been made in view of such problems, and can uniformly flatten a surface to be polished of an object to be polished and efficiently polish the surface to be polished to a desired amount in a short time. An object of the present invention is to provide a polishing pad size setting method capable of setting an optimum size of the polishing pad.

  In order to solve the above problems and achieve the object, in the polishing pad size setting method according to the present invention, the doughnut-shaped polishing surface of the polishing pad and the rectangular polished surface of the object to be polished are in contact with each other. In a polishing apparatus for performing surface polishing of the rectangular polished surface by relatively moving both, a plurality of polishing pads are formed by changing an inner diameter and an outer diameter of the doughnut-shaped polishing surface, and the plurality of polishing pads are respectively The amount of polishing when the surface of the rectangular polished surface is polished is measured, and the amount of polishing on the surface of the rectangular polished surface is determined for each measured amount of polishing. The inner diameter and the outer diameter of the doughnut-shaped polishing surface are set so that the variation is within a predetermined range.

  In the polishing pad size setting method, the plurality of polishing pads are formed by fixing one of an inner diameter and an outer diameter of the doughnut-shaped polishing surface and changing the other, and then fixing the other and fixing the one. Preferably, the inner diameter and the outer diameter of the doughnut-shaped polishing surface are set.

  In the polishing pad size setting method, the variation in the polishing amount is defined as the difference between the maximum polishing amount and the minimum polishing amount with respect to the average polishing amount on the rectangular polished surface, and the inner and outer diameters of the doughnut-shaped polishing surface Is preferably set.

  In the polishing pad size setting method, it is preferable that an inner diameter and an outer diameter of the doughnut-shaped polishing surface are set so that a variation in the polishing amount is 10% or less.

In the polishing pad size setting method, when the object to be polished is a square glass plate made of SiO ₂ , an inner diameter and an outer diameter of the doughnut-shaped polishing surface are set.

  In the polishing pad size setting method, when the glass plate size is 127 mm × 127 mm, the inner diameter ID and outer diameter OD of the doughnut-shaped polishing surface satisfy the conditions of ID <89 mm and OD> 130 mm. Set to

  In the polishing pad size setting method, when the size of the glass plate is 152 mm × 152 mm, the inner diameter ID and outer diameter OD of the doughnut-shaped polishing surface satisfy the conditions of ID <86 mm and OD> 150 mm Set to

  In the polishing pad size setting method, when the size of the glass plate is 178 mm × 178 mm, the inner diameter ID and outer diameter OD of the doughnut-shaped polishing surface satisfy the conditions of ID <90 mm and OD> 175 mm Set to

  According to the size setting method of the polishing pad according to the present invention, the inner diameter and the outer diameter of the doughnut-shaped polishing surface of the polishing pad are set so that the variation in the polishing amount is within a predetermined range. It is possible to set an optimum size of the polishing pad that can uniformly flatten the surface and can efficiently polish the surface to be polished to a desired amount in a short time.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic configuration of a CMP apparatus 1 which is a typical example of a polishing apparatus according to the present invention. The CMP apparatus 1 includes a polishing apparatus 10 that performs surface polishing of a rectangular glass plate 2 made of SiO ₂ that is an object to be polished, and a glass plate 2 such that a surface to be polished of the glass plate 2 faces the polishing apparatus 10. And a glass plate holding device 20 that holds the glass plate.

  The polishing device 10 and the glass plate holding device 20 are supported by a support frame 30. The support frame 30 includes a horizontal base 31 and a rail (not shown) provided on the base 31 so as to extend in the Y direction (the direction perpendicular to the paper surface is the front-rear direction). A first stage 32 that is movably provided, a vertical frame 33 that extends vertically from the first stage 32 (Z direction; vertical direction in the drawing), and a vertical frame 33 that extends in the Z direction. A second stage 34 provided movably, a horizontal frame 35 provided horizontally extending from the second stage 34 (X direction; left and right direction in the drawing), and moved on the horizontal frame 35 in the X direction. The third stage 36 is freely provided.

  A first drive mechanism D1 using an electric motor or the like as a drive source is provided in the first stage 32, and the first stage 32 can be moved in the Y direction along the rail by the first drive mechanism D1. it can. A second drive mechanism D2 is provided in the second stage 34, and the second stage 34 can be moved in the Z direction along the vertical frame 33 by the second drive mechanism D2. Further, a third drive mechanism D3 is provided in the third stage 36, and the third stage 36 can be moved in the X direction along the horizontal frame 35 by the third drive mechanism. For this reason, it is possible to move the third stage 36 to an arbitrary XY position (horizontal position) above the glass plate holding device 20 by performing drive control of the drive mechanisms D1 and D3 and combining the respective operations. . Further, by performing drive control of the second drive mechanism D2, the third stage 36 can be moved to an arbitrary Z position (a height position above the glass plate holding device 20). The drive mechanisms D2 and D3 are configured using an electric motor or the like as a drive source, similarly to the first drive mechanism D1.

  The polishing apparatus 10 includes a polishing head rotating shaft 11 provided so as to extend downward from the third stage 36, and a polishing head 12 attached to a lower end portion of the polishing head rotating shaft 11. As shown in FIG. 2A, the polishing head 12 is configured to detachably hold a carrier member 13 to which a pad plate 14 is attached. The carrier member 13 is formed in a disk shape, and is detachably attached to the lower end portion of the polishing head 12 by fitting using a pin member or the like.

  A fitting hole 15 matching the shape of the pad plate 14 is formed on the lower side of the carrier member 13, and the pad plate 14 is fitted into the fitting hole 15 using an O-ring or the like. The plate 14 is detachably attached to the carrier member 13. Further, a plurality of suction holes 16 connected to a vacuum source (not shown) are formed inside the carrier member 13, and the carrier member 13 is fitted by applying a negative pressure to the suction holes 16 using the vacuum source. The pad plate 14 attached to the hole 15 can be sucked and held.

  The pad plate 14 includes a resin plate member 17 and a polishing pad 18 attached to the front surface side (lower surface side) of the plate member 17. As described above, the pad plate 14 is fitted to the carrier member 13. The hole 15 is detachably attached. In addition, the pad plate 14 is a disposable pad plate using a resin plate member 17. By using such a disposable pad plate, the pad plate 14 can be easily attached to and detached from the carrier member 13. Yes.

  The plate member 17 is formed in a disk shape using a resin material such as PET (polyethylene-terephthalate), and a polishing pad 18 capable of polishing the surface of the glass plate 2 flatly is formed on the plate member 17 using a double-sided adhesive tape or the like. Affixed to the front side (lower side). The material of the plate member 17 is not a problem as long as it is not eroded by the abrasive (slurry), but PET is preferable because it is easily available, easy to process, and hardly causes pollution problems when discarded. .

  The polishing pad 18 is formed in a donut disk shape having a substantially same outer diameter as that of the plate member 17 by using a foam resin material such as foaming polyurethane, and the vicinity of the center portion on the surface side (lower surface side) of the plate member 17 is It is exposed without being covered with the polishing pad 18. On the surface (lower surface) of the polishing pad 18, a polishing surface 18 s is formed that contacts the surface to be polished of the glass plate 2 and performs polishing. In addition, lattice-shaped grooves 19 (see FIG. 2B) are formed at substantially equal intervals in the polishing surface 18s of the polishing pad 18 so that the polishing agent (slurry) diffuses during polishing. Has been promoted.

  As shown in FIG. 1, the polishing head rotating shaft 11 is rotated by a fourth drive mechanism D4 using an electric motor or the like provided in the third stage 36 as a drive source, thereby rotating the polishing head 12 to polish the polishing head. The polishing surface 18s of the pad 18 can be rotated in the XY plane (horizontal plane). The third stage 36 includes an air cylinder (not shown). The air cylinder moves the polishing head 12 up and down via the polishing head rotating shaft 11 to move the polishing surface 18 s of the polishing pad 18. The surface to be polished of the glass plate 2 can be pressed with a predetermined contact pressure.

  As shown in FIG. 1, the glass plate holding device 20 includes a turntable support portion 21 provided on a base 31, a chuck rotation shaft 22 provided vertically extending from the turntable support portion 21, The chuck rotating base 23 is mounted horizontally on the upper end portion of the chuck rotating shaft 22, and the vacuum chuck 24 is provided on the chuck rotating base 23 and holds the glass plate 2 on the upper surface side.

  A vacuum chucking mechanism (not shown) is provided in the vacuum chuck 24, and the glass plate 2 is detachably sucked and held by the vacuum chucking mechanism. A fifth drive mechanism D5 using an electric motor or the like as a drive source is provided in the turntable support portion 21, and a chuck rotation shaft 22 provided extending from the turntable support portion 21 is provided with the fifth drive mechanism D5. Thus, the chuck turntable 23 can be rotated.

  In the CMP apparatus 1 configured as described above, in order to perform surface polishing of the glass plate 2 using the polishing apparatus 10, first, the glass plate 2 to be polished on the upper surface of the vacuum chuck 24 in the glass plate holding apparatus 20. Adsorb and attach. Then, the chuck rotating base 23 is rotated via the chuck rotating shaft 22 by the fifth drive mechanism D5. That is, the chuck rotating base 23 is rotated by the fifth drive mechanism D5, and the vacuum chuck 24 provided on the chuck rotating base 23 and the glass plate 2 sucked and held by the vacuum chuck 24 are rotated.

  Next, the third stage 36 is moved by the driving mechanisms D1 and D3 so that the polishing head 12 is positioned above the glass plate 2, and the polishing head 12 is rotated via the polishing head rotating shaft 11 by the fourth driving mechanism D4. . Then, the second stage 34 is moved in the Z direction by the second drive mechanism D 2 so that the polishing surface 18 s of the polishing pad 18 is positioned close to the surface to be polished of the glass plate 2, and is incorporated in the third stage 36. The polishing head 12 is lowered using an air cylinder (not shown), and the polishing surface 18s of the polishing pad 18 is pressed against the surface to be polished of the glass plate 2 with a predetermined contact pressure. Thereafter, the third stage 36 is reciprocated along the horizontal frame 35 by the third drive mechanism D3. That is, the polishing head 12 (the polishing surface 18s of the polishing pad 18) is reciprocated in the X direction. At this time, the polishing agent is pumped from a polishing agent supply device (not shown) to supply the polishing agent to the lower surface side of the polishing pad 18 (the polishing surface 18s). Accordingly, the surface to be polished of the glass plate 2 is polished by the rotational movement of the glass plate 2 itself and the rotation and reciprocation of the polishing head 12 (polishing pad 18) while being supplied with the abrasive.

  Next, a method for setting the size of the polishing pad 18 used in the polishing apparatus 10 (CMP apparatus 1) that performs the surface polishing of the glass plate 2 in this way will be described with reference to a flowchart. The size of the polishing pad 18 means the inner diameter ID and the outer diameter OD of the polishing pad 18 (polishing surface 18s) shown in FIG.

  A method for setting the size of the polishing pad 18 is shown in the flow chart of FIG. 3. Here, in step S1, the inner diameter of the polishing pad 18 is fixed to the reference inner diameter ID0, and the outer diameter is set to the first outer diameter OD1, the second outer diameter. A plurality of polishing pads 18 having a diameter OD2, a third outer diameter OD3,... Are formed, and each of the outer diameter polishing pads 18 is attached to the polishing head 12 of the polishing apparatus 10, and the polishing apparatus as described above. 10, the surface to be polished of the glass plate 2 is polished by each polishing pad 18. The reference inner diameter ID0 is set to a sufficiently small value with respect to the outer diameter OD. That is, the reference inner diameter ID0 must be set by estimating so that the non-uniformity RNU of the polishing amount described later satisfies a predetermined range.

  Each time the polishing of the glass plate 2 by each polishing pad 18 is completed in step S1, the distribution of the polishing amount in the surface to be polished of the glass plate 2 is measured (step S2). Specifically, the distance to the surface to be polished is measured while scanning the surface to be polished of the glass plate 2 with an optical measuring instrument, and the surface to be polished of the glass plate 2 is calculated from the obtained distance data as an amount of deviation from the reference plane. The distribution of the polishing amount in the inside is required. For example, as described in Patent Document 1, a hollow is formed in the center of the polishing head rotating shaft 11, the polishing head 12, the carrier member 13 and the pad plate 14 (plate member 17 and polishing pad 18) constituting the polishing apparatus 10. And an optical fiber connected to an optical measuring instrument is provided in the cavity. By moving the polishing apparatus 10 in the XY plane above the glass plate 2 by the drive mechanisms D1 and D3, the surface to be polished of the glass plate 2 is scanned by the optical measuring instrument, and the surface of the glass plate 2 to be polished is scanned. The distribution of the polishing amount can be measured. Further, the optical measuring device may be provided separately from the polishing apparatus 10.

  When the measurement of the distribution of the polishing amount within the surface to be polished of the glass plate 2 is completed in step S2, the process proceeds to step S3, and the nonuniformity RNU (Range Non Uniformity) of the polishing amount is calculated from the obtained measurement data. The non-uniformity RNU is an index representing variation in the polishing amount. When the maximum value of the measured polishing amount is Max, the minimum value is Min, and the average value is Ave, RNU = (Max−Min) / Ave Is a value calculated by.

  When the nonuniformity RNU of the polishing amount in step S3 is calculated for each of the plurality of polishing pads 18 having different outer diameters OD, the process proceeds to step S4, and the outer diameter ODe when the calculated nonuniformity RNU falls within a predetermined range. And the outer diameter ODe is set to the outer diameter of the polishing pad 18.

  Next, in step S5, the plurality of polishing pads 18 whose outer diameter is fixed to the outer diameter ODe and whose inner diameter is changed to the first inner diameter ID1, the second inner diameter ID2, the third inner diameter ID3,. The polishing pad 18 having each inner diameter is attached to the polishing head 12 of the polishing apparatus 10, and the surface to be polished of the glass plate 2 is polished by the polishing pad 18 using the polishing apparatus 10 as described above.

  Each time the polishing of the glass plate 2 by each polishing pad 18 is completed in step S5, the distribution of the polishing amount in the surface to be polished of the glass plate 2 is measured as in step S2 (step S6).

  When the measurement of the distribution of the polishing amount in the surface to be polished of the glass plate 2 is completed in step S6, the process proceeds to step S7, and in the same manner as in step S3, the polishing amount non-uniformity RNU (Range Non Uniformity) is obtained from the obtained measurement data. ) Is calculated.

  When the polishing amount non-uniformity RNU in step S7 is calculated, the process proceeds to step S8, and an inner diameter IDe when the calculated non-uniformity RNU falls within a predetermined range is selected, and this inner diameter IDe is selected as the inner diameter of the polishing pad 18. Set to. In this way, the inner diameter IDe and the outer diameter ODe of the polishing pad 18 are set so that the variation in the polishing amount when the surface of the glass plate 2 is polished falls within a predetermined range.

  In the above flow, the inner diameter of the polishing pad 18 is fixed to the reference inner diameter ID0, a plurality of polishing pads 18 having different outer diameters are formed, and the outer diameter ODe of the polishing pad 18 is set. The outer diameter is fixed to the outer diameter ODe, a plurality of polishing pads 18 having different inner diameters are formed, and the inner diameter IDe of the polishing pad 18 is set. However, the outer diameter ODe may be set after the outer diameter IDe of the polishing pad 18 is set.

  4, 5, and 6, respectively, when the surface of the glass plate 2 is polished by using the polishing apparatus 10, the average polishing amount and the non-uniformity of the polishing amount within the surface to be polished of the glass plate 2. This is the simulation data that calculated RNU. In each figure, the size of the glass plate 2 (surface to be polished), which is an object to be polished, is different, and the shape of the glass plate 2 (surface to be polished) is 127 × 127 mm in FIG. 4, 152 × 152 mm in FIG. Is 178 × 178 mm. 4, 5, and 6, the horizontal axis represents the inner diameter ID or outer diameter OD of the polishing pad 18, the vertical axis represents the average polishing amount and the non-uniformity of the polishing amount RNU (the average polishing amount on the right side, the polishing on the left side) Non-uniformity RNU), and every time the size (inner diameter ID or outer diameter OD) of the polishing pad 18 is changed, the average polishing amount and polishing amount non-uniformity RNU on the polished surface of the glass plate 2 are changed. This is a plotted graph. In (a) of each figure, the inner diameter ID of the polishing pad 18 is fixed (ID = 54 mm), and the outer diameter OD of the polishing pad 18 is taken on the horizontal axis to change the outer diameter OD. In (b) of each figure, the outer diameter OD of the polishing pad 18 is fixed (OD = 170 mm in FIGS. 4 and 5, OD = 190 mm in FIG. 6), and the inner diameter ID of the polishing pad 18 is taken on the horizontal axis. Is changing.

  According to these simulation data, in order to keep the non-uniformity of polishing amount RNU to 10% or less (predetermined range), the glass plate 2 (surface to be polished) of 127 × 127 mm size is shown in FIG. As shown, the outer diameter OD of the polishing pad 18 must be OD = 130 mm or more and the inner diameter ID must be ID = 89 mm or less. It is preferable to use a polishing pad 18 having a diameter OD = 160 mm and an inner diameter ID = 54 mm. For a glass plate 2 (surface to be polished) having a size of 152 × 152 mm, the outer diameter OD of the polishing pad 18 is OD = 150 mm or more and the inner diameter ID is ID = 86 mm or less as shown in FIG. In order to perform surface polishing of the glass plate 2 without variation in polishing amount, it is preferable to use a polishing pad 18 having an outer diameter OD = 170 mm and an inner diameter ID = 54 mm. Further, for a glass plate 2 (surface to be polished) having a size of 178 × 178 mm, as shown in FIG. 6, the outer diameter OD of the polishing pad 18 is OD = 175 mm or more and the inner diameter ID is ID = 90 mm or less. In order to perform surface polishing of the glass plate 2 without variation in polishing amount, it is preferable to use a polishing pad 18 having an outer diameter OD = 210 mm and an inner diameter ID = 30 mm.

  7 shows the outer diameter OD of the polishing pad 18 on the horizontal axis and the non-uniformity RNU of the polishing amount on the vertical axis. Each time the outer diameter OD of the polishing pad 18 is changed, the glass plate 2 of each size is covered. It is the graph which plotted nonuniformity RNU of the amount of polish in a polish side. As shown in FIG. 7, when the surface polishing of the glass plate 2 of each size is performed using a common polishing pad 18, it is preferable to use the polishing pad 18 having an outer diameter OD = 190 mm. Further, when surface polishing of the glass plate 2 of each size is performed, as shown in FIGS. 4 to 6 (b), the inner diameter ID = 54 mm (the inner diameter ID = 30 mm is preferable for the glass plate 2 of 178 × 178 mm). It is preferable to use the polishing pad 18 having non-uniformity of polishing amount RNU of ID = 30 mm and ID = 54 mm. Therefore, when performing surface polishing of the glass plate 2 of each size using the common polishing pad 18 without variation in polishing amount, it is preferable to use the polishing pad 18 having an outer diameter OD = 190 mm and an inner diameter ID = 54 mm.

  As described above, in the size setting method of the polishing pad 18 in the present embodiment, a plurality of polishing pads 18 in which the outer diameter OD is changed by fixing the inner diameter of the polishing pad 18 to the reference inner diameter ID0 are formed. The average polishing amount and the non-uniformity RNU of the polishing amount when the surface of the glass plate 2 is polished using the polishing pad 18 are calculated, and the non-uniformity RNU of the polishing amount is within a predetermined range (10% or less). Is set to the outer diameter of the polishing pad 18. Then, when the polishing pad 18 is fixed to the outer diameter ODe to form a plurality of polishing pads 18 having different inner diameter IDs, and the surface of the glass plate 2 is polished using each of these polishing pads 18. The average polishing amount and the nonuniformity RNU of the polishing amount are calculated, and the inner diameter IDe when the nonuniformity RNU of the polishing amount is within a predetermined range (10% or less) is set as the inner diameter of the polishing pad 18.

  Thus, since the inner diameter IDe and the outer diameter ODe of the polishing pad 18 capable of performing the surface polishing of the glass plate 2 without variation in polishing amount are set, the surface to be polished of the glass plate 2 is uniformly flattened. In addition, it is possible to set an optimum size of the polishing pad 18 capable of efficiently polishing the surface to be polished to a desired amount in a short time.

It is a front view which shows the CMP apparatus which is an example of the grinding | polishing apparatus which concerns on this invention. It is a figure which shows the outline | summary of the grinding | polishing apparatus and pad plate which comprise the said CMP apparatus, (a) The schematic diagram of a grinding | polishing apparatus, (b) The top view of a pad plate. It is a flowchart explaining the size setting method of the polishing pad which comprises the said pad plate. Simulation data that calculates the average polishing amount and non-uniformity of polishing amount RNU within the polished surface of a 127 × 127 mm glass plate each time (a) inner diameter ID or (b) outer diameter OD of the polishing pad is changed. FIG. Simulation data that calculates the average polishing amount and non-uniformity of polishing amount RNU within the polished surface of a 152 x 152 mm glass plate each time the (a) inner diameter ID or (b) outer diameter OD of the polishing pad is changed. FIG. Simulation data that calculates the average polishing amount and non-uniformity of polishing amount RNU within the polished surface of a 178 x 178 mm glass plate each time (a) inner diameter ID or (b) outer diameter OD of the polishing pad is changed. FIG. It is a figure which shows the simulation data which calculated nonuniformity RNU of the polishing amount in the to-be-polished surface of the glass plate of each size, whenever the outer diameter OD of a polishing pad was changed.

Explanation of symbols

ID ID (ID)
OD outer diameter (outer diameter)
1 CMP apparatus 2 Glass plate (object to be polished)
10 Polishing equipment (polishing equipment)
18 Polishing pad (polishing pad)
18s polished surface (donut-shaped polished surface)

Claims (8)

The polishing pad used in a polishing apparatus for polishing the surface of the rectangular polished surface by relatively moving both the donut-shaped polishing surface of the polishing pad and the rectangular polished surface of the polishing object in contact with each other Sizing method,
A plurality of polishing pads are formed by changing an inner diameter and an outer diameter of the doughnut-shaped polishing surface, and a polishing amount is measured when surface polishing of the rectangular polished surface is performed using each of the plurality of polishing pads. Then, the variation of the polishing amount on the surface of the rectangular polished surface is obtained for each measured polishing amount, and the inner diameter and the outer diameter of the doughnut-shaped polishing surface are set so that the variation of the polishing amount is within a predetermined range. A polishing pad size setting method, wherein the polishing pad size is set.   The plurality of polishing pads are formed by fixing one of an inner diameter and an outer diameter of the doughnut-shaped polishing surface and changing the other, and then forming the donut-shaped polishing surface by fixing the other and changing the one. 2. The polishing pad size setting method according to claim 1, wherein an inner diameter and an outer diameter of the polishing surface are set.   The variation in the polishing amount is defined by a difference between a maximum polishing amount and a minimum polishing amount with respect to an average polishing amount on the rectangular polished surface, and an inner diameter and an outer diameter of the donut-shaped polishing surface are set. The size setting method of the polishing pad according to claim 1 or 2.   4. The polishing pad size setting method according to claim 3, wherein an inner diameter and an outer diameter of the doughnut-shaped polishing surface are set so that a variation in the polishing amount is 10% or less. The polishing pad size setting method according to claim 1, wherein the object to be polished is a square glass plate made of SiO ₂ .   When the size of the glass plate is 127 mm × 127 mm, the inner diameter ID and outer diameter OD of the doughnut-shaped polished surface are set so as to satisfy the conditions of ID <89 mm and OD> 130 mm. The polishing pad size setting method according to claim 5.   When the size of the glass plate is 152 mm × 152 mm, the inner diameter ID and the outer diameter OD of the doughnut-shaped polishing surface are set so as to satisfy the conditions of ID <86 mm and OD> 150 mm. The polishing pad size setting method according to claim 5.   When the size of the glass plate is 178 mm × 178 mm, the inner diameter ID and the outer diameter OD of the doughnut-shaped polished surface are set so as to satisfy the conditions of ID <90 mm and OD> 175 mm. The polishing pad size setting method according to claim 5.

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