JP2008306084A - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP2008306084A JP2008306084A JP2007153549A JP2007153549A JP2008306084A JP 2008306084 A JP2008306084 A JP 2008306084A JP 2007153549 A JP2007153549 A JP 2007153549A JP 2007153549 A JP2007153549 A JP 2007153549A JP 2008306084 A JP2008306084 A JP 2008306084A
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- Japan
- Prior art keywords
- discharge electrode
- heat
- cooled
- cooling
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】放電電極1と対向電極2との間に、高電圧を印加して、放電を起こし、イオン風を発生する。イオン風によって被冷却部である電球4を冷却する。電球4と放電電極1との間に、熱伝導部10を設け、電球4と放電電極1とは熱的に接続される。電球4からの熱が、熱伝導部10を通じて放電電極1に伝達し、放電電極1が加熱される。高湿度の環境になっても、放電電極1には水分が付着せず、安定した放電が起こる。
【選択図】図1
Description
2 対向電極
3 駆動部
10 熱伝導部
12 熱伝導体
13 断熱材
Claims (8)
- 放電電極と、放電電極に対向して配置された対向電極とを備え、両電極間での放電により発生したイオン風を利用して、被冷却部を冷却する冷却装置であって、被冷却部の熱を放電電極に伝えて、放電電極を加熱するための熱伝導部を備えたことを特徴とする冷却装置。
- 被冷却部は、イオン風の流れ方向において、放電電極よりも上流側に位置し、被冷却部から放電電極に通じる通風路が設けられたことを特徴とする請求項1記載の冷却装置。
- 熱伝導部は、被冷却部と放電電極とを電気的に絶縁することを特徴とする請求項1または2記載の冷却装置。
- 熱伝導部は、被冷却部と放電電極との間に介装された熱伝導体と、熱伝導体と被冷却部あるいは放電電極との間に介装された電気絶縁材とを有することを特徴とする請求項3記載の冷却装置。
- 熱伝導部が断熱材で覆われたことを特徴とする請求項3または4記載の冷却装置。
- 放電電極と対向電極との間に高電圧を印加する駆動部を備え、被冷却部の動作に連動して、駆動部が動作することを特徴とする請求項1〜5のいずれかに記載の冷却装置。
- 冷却用の送風ファンが設けられ、送風ファンによる冷却とイオン風による冷却のうち、いずれか一方が利用されることを特徴とする請求項1〜6のいずれかに記載の冷却装置。
- 被冷却部の温度を検出する温度センサが設けられ、所定の温度を超えたとき、送風ファンが動作することを特徴とする請求項7記載の冷却装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007153549A JP4728285B2 (ja) | 2007-06-11 | 2007-06-11 | 冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007153549A JP4728285B2 (ja) | 2007-06-11 | 2007-06-11 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008306084A true JP2008306084A (ja) | 2008-12-18 |
JP4728285B2 JP4728285B2 (ja) | 2011-07-20 |
Family
ID=40234503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007153549A Expired - Fee Related JP4728285B2 (ja) | 2007-06-11 | 2007-06-11 | 冷却装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4728285B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012026169A1 (ja) * | 2010-08-25 | 2012-03-01 | シャープ株式会社 | イオン検出装置、空調機器及びイオン計測器 |
JP2013225701A (ja) * | 2013-07-16 | 2013-10-31 | Toshiyuki Arai | 機器 |
KR101349835B1 (ko) | 2009-12-18 | 2014-01-09 | 엘지전자 주식회사 | 무소음 방열부를 구비한 조명 장치 |
JP2014132379A (ja) * | 2013-01-04 | 2014-07-17 | Fujitsu Ltd | モジュール型データセンタとその制御方法 |
WO2017084340A1 (zh) * | 2015-11-18 | 2017-05-26 | 乐视控股(北京)有限公司 | 一种用于液晶显示设备的散热结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020027A (ja) * | 1983-07-15 | 1985-02-01 | Mitsubishi Heavy Ind Ltd | 空気加熱・冷却装置 |
JPH0897582A (ja) * | 1994-09-29 | 1996-04-12 | Sanyo Electric Co Ltd | 冷却装置 |
JPH09252068A (ja) * | 1996-03-15 | 1997-09-22 | Yaskawa Electric Corp | イオン風冷却装置 |
JP2008078260A (ja) * | 2006-09-20 | 2008-04-03 | Notei Seimitsu Kogyo Kofun Yugenkoshi | イオン風を発生させるヒートシンク装置 |
-
2007
- 2007-06-11 JP JP2007153549A patent/JP4728285B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020027A (ja) * | 1983-07-15 | 1985-02-01 | Mitsubishi Heavy Ind Ltd | 空気加熱・冷却装置 |
JPH0897582A (ja) * | 1994-09-29 | 1996-04-12 | Sanyo Electric Co Ltd | 冷却装置 |
JPH09252068A (ja) * | 1996-03-15 | 1997-09-22 | Yaskawa Electric Corp | イオン風冷却装置 |
JP2008078260A (ja) * | 2006-09-20 | 2008-04-03 | Notei Seimitsu Kogyo Kofun Yugenkoshi | イオン風を発生させるヒートシンク装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101349835B1 (ko) | 2009-12-18 | 2014-01-09 | 엘지전자 주식회사 | 무소음 방열부를 구비한 조명 장치 |
US8641244B2 (en) | 2009-12-18 | 2014-02-04 | Lg Electronics Inc. | Lighting apparatus |
WO2012026169A1 (ja) * | 2010-08-25 | 2012-03-01 | シャープ株式会社 | イオン検出装置、空調機器及びイオン計測器 |
JP2012047538A (ja) * | 2010-08-25 | 2012-03-08 | Sharp Corp | イオン検出装置、空調機器及びイオン計測器 |
JP2014132379A (ja) * | 2013-01-04 | 2014-07-17 | Fujitsu Ltd | モジュール型データセンタとその制御方法 |
JP2013225701A (ja) * | 2013-07-16 | 2013-10-31 | Toshiyuki Arai | 機器 |
WO2017084340A1 (zh) * | 2015-11-18 | 2017-05-26 | 乐视控股(北京)有限公司 | 一种用于液晶显示设备的散热结构 |
Also Published As
Publication number | Publication date |
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JP4728285B2 (ja) | 2011-07-20 |
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