JP2008305924A - Printed wiring board, method of manufacturing printed wiring board, and printed wiring board manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-quality printed wiring board which hardly causes a positional deviation, wrinkling, etc. of a shield sheet, and to temporarily paste the shield sheet at a low temperature and prevent occurrence of a positional deviation, wrinkling, etc. of the shield sheet when pasting the shield sheet. <P>SOLUTION: In the printed wiring board Z1, a flexible portion F and rigid portions R and R have a multilayer structure, and the shield sheet d containing anisotropic conductive resin is pasted over the flexible portion F and the rigid portions R and R. The flexible portion F has a portion wherein a wiring pattern e1 consisting of a conductor foil such as copper is formed on an insulation film b formed of polyimide, etc. and a non-wiring region wherein no wiring pattern is formed. In manufacturing the printed wiring board Z1, the shield sheet d is temporarily thermo-compression-bonded (temporarily pasted) by a heating and pressing means to the non-wiring region as a temporary pasting area K, and then is pasted full-fledgedly. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention particularly relates to a printed wiring board manufacturing method, a printed wiring board manufacturing apparatus, and a printed wiring board suitable for a printed wiring board having a flexible portion and a rigid portion having a multilayer structure.

  Electronic devices such as portable information terminals are required to be flexible in shape in addition to downsizing, high performance, and thinning, and in order to meet the demands of these electronic devices, various module parts are flexibly connected. Wiring boards have been developed and commercialized. Of particular interest is the Flex-rigid printed wiring board, which has a rigid rigid part with excellent component mountability and a flexible part with flexible flexibility with excellent installation flexibility. Among them, those having a multilayer structure are used in various ways for the reason that interlayer connection is possible.

The printed wiring board is shielded with electromagnetic waves because electromagnetic waves generated in each circuit interfere with other circuits. As this electromagnetic wave shield, a conductive cloth is heat bonded to the flexible wiring board (flexible part). A method of applying heat with an adhesive (Patent Document 1), a method of applying a silver paste on the coverlay of a flexible wiring board (flexible part), and further applying a carbon black (Patent Document 2), an adhesive layer in advance Printed wiring that is heat-pressed by heating / pressurizing means with a shield sheet having a metal layer and a cover film on the surface opposite to the adhesive layer of the metal layer superimposed on a flexible wiring board (flexible part) A plate manufacturing method is known (Patent Document 3).
Japanese Patent No. 2850786 JP 2006-173200 A JP 2006-319216 A

  However, the shielding methods described in Patent Documents 1 to 3 all provide a shielding material for a flexible wiring board (flexible part), and the rigid wiring board (rigid part) is shielded separately in a separate process. The material is applied. The method of applying the shield paste described in Patent Document 2 is to apply the shield paste, but the shield paste tends to crack at the boundary (step) between the flexible part and the rigid part, and electrical connection occurs when the shield paste cracks. There is a problem in quality such as a defective or peeled shield paste becoming a conductive foreign substance and short-circuiting. Moreover, workability is poor because it is applied in a paste state. If the flexible part and the rigid part are both thermocompression-bonded simultaneously with the shield material by a method such as the thermocompression-bonding method of the shield material of Patent Documents 1 and 3, a short circuit occurs due to the displacement of the shield material during thermocompression bonding. There is a problem that the electrical signal flowing through the defect or the wiring or the circuit is disturbed.

  As a measure against this displacement, a method of temporarily pasting a shield material to the flexible portion and the rigid portion in advance can be considered. However, the rigid part is thicker than the flexible part for mounting electronic parts, and is made of a hard material (high density material) such as glass, so its heat capacity is large and its thermal conductivity is high. Because the wiring pattern with high copper foil is arranged, when trying to thermocompression the shield material to the rigid part during temporary attachment, the heat of the temporary attachment area of the shield material is dissipated to the rigid part (thermal diffusion) ), And the temperature of the temporary pasting area does not rise, and the temporary pasting is liable to occur. For this reason, if this thermocompression bonding is performed in the state of temporary sticking failure, a part of the shield material is displaced, causing wrinkles or misalignment. In addition, due to poor workability, if a temporary application tool such as a soldering iron is forcibly moved, the position where the temporary application tool such as a soldering iron is applied will be deviated from the original position, resulting in dents. Have.

  Accordingly, an object of the present invention is to provide a high-quality printed wiring board that is unlikely to cause a positional deviation or wrinkles of the shield material, and can be temporarily pasted at a low temperature when the shield material is pasted. Another object of the present invention is to provide a printed wiring board manufacturing method and a printed wiring board manufacturing apparatus that do not cause a positional deviation or wrinkles of the shield material.

  The printed wiring board of the present invention includes a rigid portion in which a wiring pattern is formed of a conductive foil on an insulating substrate, a flexible portion made of an insulating film, and a shield sheet bonded to the flexible portion, and the flexible portion is wired. A non-wiring area where a pattern is not formed is provided, and this non-wiring area is temporarily thermocompression bonded as a temporary bonding area for bonding the shield sheet by thermocompression bonding, and is removed from the printed wiring board after thermocompression bonding. And The printed wiring board is characterized in that the flexible portion and the rigid portion each have a multilayer structure, and a step is provided on the outer surface thereof. Here, the shield sheet is a functional resin sheet having a metal conductor such as an electromagnetic wave shield sheet or a magnetic shield sheet that shields electromagnetic waves from the outside, and a metal conductor such as a magnetic sheet for RFID (Radio Frequency Identification). It demonstrates below as what contains the functional resin sheet which has.

  According to the present invention, even if wrinkles or dents are generated in the temporary pasting area during temporary thermocompression bonding, since they are removed from the printed wiring board after thermocompression bonding, as a printed wiring board as a product, It becomes a high-quality printed wiring board. This printed wiring board is manufactured by the following manufacturing method and manufacturing apparatus.

  The printed wiring board manufacturing method of the present invention includes a rigid part in which a wiring pattern is formed of a conductive foil on an insulating substrate, a flexible part made of an insulating film, and a shield sheet bonded over the flexible part. A non-wiring area where a wiring pattern is not formed is provided in the portion, and the shield sheet is temporarily thermocompression-bonded by heating / pressurizing means using the non-wiring area as a temporary attachment area, and then the thermocompression bonding is performed.

  According to this invention, since the wiring pattern is not formed by the conductive foil in the non-wiring area of the flexible portion, the heat diffusibility is less than that of the rigid portion even if the shield sheet is thermocompression bonded. -The thermocompression bonding can be accurately performed at a low temperature by the pressurizing means.

  According to the present invention, in the printed wiring board, the flexible portion and the rigid portion each have a multilayer structure, and the outer surface of the flexible portion is formed at a position lower than the outer surface of the rigid portion. It is preferable to perform temporary thermocompression bonding by a pressure means. According to the present invention, temporary heating and press-bonding is performed on the flexible portion formed at the low position by the heating / pressurizing unit, so that it is difficult to cause a positional shift and temporary bonding can be performed.

  In the present invention, it is preferable that the temporary pasting area is removed after the final thermocompression bonding. According to the present invention, even if wrinkles or dents are generated in the temporary pasting area during temporary thermocompression bonding, since they are removed from the printed wiring board after thermocompression bonding, as a printed wiring board as a product, Manufactured as a high-quality printed wiring board.

  The printed wiring board manufacturing apparatus of the present invention heats and pressurizes a shield sheet on a printed wiring board having a rigid portion in which a wiring pattern is formed of a conductive foil on an insulating substrate and a flexible portion made of an insulating film. In the printed wiring board manufacturing apparatus for thermocompression bonding by means, a plurality of elastic heating and pressing means for heating and pressurizing the printed wiring board with elasticity is attached to the heating and pressing means. . The elastic heating / pressurizing unit is preferably configured by winding a coil spring around a pin, or configured by connecting a pin and a coil spring, and is connected to a heating unit of the heating / pressurizing unit.

  According to this invention, even if there is a difference in hardness as in the flexible part and the rigid part, the difference in rigidity is absorbed by the plurality of elastic heating and pressurizing means so as to be uniform as a whole. Temporary pasting) is possible.

  The printed wiring board has a multilayer structure composed of a flexible part and a rigid part, and the outer surface of the flexible part is formed at a position lower than the outer surface of the rigid part. It is preferable to be heated and pressurized.

  According to this invention, since the elastic heating and pressurizing means is temporarily thermocompression-bonded to the flexible portion formed at the low position, it is possible to temporarily attach without causing positional displacement. Further, the elastic heating and pressurizing means absorbs these differences even if there is a wiring pattern presence / absence due to the conductor foil and a difference in thickness or flexibility in the flexible portion, and is uniform as a whole. Temporary thermocompression bonding (temporary bonding) is performed.

  According to the method for manufacturing a printed wiring board of the present invention, a non-wiring area where a wiring pattern is not formed is provided in the flexible portion, and the shield sheet is temporarily heated by a heating / pressurizing unit using the non-wiring area as a temporary bonding area. After crimping, temporary thermocompression bonding at a low temperature is possible by performing thermocompression bonding, and a high-quality printed wiring board without wrinkles or dents can be manufactured. Further, according to the printed wiring board manufacturing apparatus of the present invention, since the plurality of elastic pressing means for pressing the printed wiring board with elastic force is attached to the heating / pressurizing means, Even if it is a rigid part, even if the flexible part is formed at a position lower than the outer surface of the rigid part, uniform thermocompression bonding can be performed. In addition, according to the printed wiring board of the present invention, it is possible to provide a high-quality printed wiring board free from wrinkles and dents by removing the temporary pasting area after the temporary thermocompression bonding.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
1A is a plan view of a printed wiring board Z1 to which the present invention is applied, FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A, and FIG. It is a BB sectional view taken on the line. In the printed wiring board Z1 of the present embodiment, the flexible part F and the rigid parts R and R have a multilayer structure, and the shield sheet d having an anisotropic conductive resin over the flexible part F and the rigid parts R and R. Are pasted together. The flexible portion F is provided with a portion where a wiring pattern e1 is formed of a conductive foil such as copper on an insulating film b such as polyimide and a non-wiring region where the wiring pattern is not formed. On the outside (surface layer side) of the wiring pattern e1, a coverlay film c made of an insulating film such as polyimide is disposed. Rigid portions R and R have wiring patterns e2 and e2 formed of conductive foil such as copper on insulating substrates a and a such as epoxy containing glass fiber. The flexible portion F and the rigid portions R and R have different numbers of layers, and the flexible portion F having flexibility is formed at a low position between the rigid portions R and R. In addition, the shield sheet d of the present embodiment is an electromagnetic wave shielding film that shields the wiring pattern from electromagnetic noise, and the temporary attachment surface (adhesion surface) of the shield sheet d is made of heat made of polyimide or epoxy in advance. A curable adhesive is printed or applied.

  In the method of manufacturing the printed wiring board Z1 of the present embodiment, the shield sheet d is temporarily thermocompression-bonded (temporarily affixed) by heating / pressurizing means with the non-wiring area as the temporary affixing area K, and then the thermocompression bonding is performed. . Temporary thermocompression bonding may be performed by pressurizers U1 and U2 and heating / pressurizing jigs T11 and T12, which will be described later. The case where the shield sheet d is temporarily pasted using a heating / pressurizing means) will be described. If the soldering iron is applied only to the temporary pasting area K of the flexible part F formed at a low position, the temporary pasting area K of the flexible part F is not formed with a wiring pattern by a conductive foil, and the shield Even if the sheet d is thermocompression-bonded, the heat diffusibility is less than that of the rigid parts R and R, so that the shield sheet d can be temporarily thermocompression-bonded at a low temperature. Further, since the soldering iron is applied only to the flexible portion F formed at a low position, there is little possibility of displacement. After the temporary thermocompression bonding (after temporary bonding), not only the flexible part F but also the rigid parts R and R are thermocompression bonded at once by the pressurizers U1 and U2 and heating / pressurizing jigs T11 and T12. In this case, it can be attached with a fear of displacement, wrinkles, dents and the like. Here, the temporary pasting area K may be left, but since it is not wired, it may be removed (cut). This is because the dent is generated in the temporary pasting area K, and if it is removed, the appearance problem of the dent can be solved.

(Second Embodiment)
FIG. 2 is a plan view of a laminated sheet 10 in which two printed wiring boards Z2 to which the present invention is applied are connected. FIG. 3A is a plan view of a printed wiring board Z2 to which the present invention is applied. Moreover, FIG.3 (b) is sectional drawing of Fig.3 (a). The present embodiment is a flex-rigid wiring board Z2 having a flexible portion F11 and rigid portions R11, R13 on which three-dimensional wiring is made (FIG. 3B). Positioning guide holes w are formed at the four corners of the laminated sheet 10 and are inserted through the guide pins gp of the base T13 of the heating / pressurizing means.

  One of the two printed wiring boards Z2 is connected to the laminated sheet 10 and other printed wiring boards Z2 at the temporary bonding areas K11 to K21, but the temporary bonding areas K11 to K21 are finally removed. One of them is separated from the laminated sheet 10 and the other printed wiring board Z2. The laminated structure of the flexible part F11 and the rigid parts R11, R13 and the protective structure of the flexible part F11 by the coverlay film c11 are the same as those in the first embodiment, but these are omitted in the drawing. The flexible part F1 is assumed to be provided with places where the wiring patterns e3, e4, e5 are formed by the conductor foil and a non-wiring area where the wiring pattern is not provided. All are the non-wiring regions, and are formed from the insulating film b1 or the coverlay film c11, and the conductive foil and the insulating substrates a11, a12, a13, a14 are not formed.

Next, the manufacturing method and manufacturing apparatus of the printed wiring board Z2 of this Embodiment are demonstrated using FIG. The first heating / pressurizing means G1 for temporary thermocompression bonding includes pressurizers U1, U2, a heating / pressurizing jig T11 provided with a heater H11, a pressing jig T12 for the laminated sheet 10, and a plurality of guide pins gp. And a base T13 provided (FIGS. 4A and 4B). Plural plungers S, which are elastic heating and pressing means, are attached to the heating / pressing jig T11. The plunger S is connected to the lower side of the heating / pressing jig T11 as shown in the right side of FIG. 4A, and a coil spring q is attached to the base end side of the pins p11 to p21. The tips of the pins p11 to p21 are in contact with the shield sheet d11 with elasticity. As the plunger S, a coil spring q may be wound around the pins p11 to p21. The attachment position of the plunger S is preferably arranged at a position corresponding to the temporary pasting areas K11 to K21 of the laminated sheet 10 from the viewpoint of preventing displacement. That is, it is used by changing the arrangement position according to the temporary pasting area of the printed wiring board. The holding jig T12 is formed with relief holes x (x11 to x21) for the plunger S so that the tips of the pins p11 to p21 abut against the shield sheet d11 with elastic force while holding the laminated sheet 10. It has become. Note that the pressure device U1, U2 and heating and compressing clamp T11, guide holes w to be inserted into the guide pin gp of the base T13 are formed. On the other hand, the second heating / pressurizing means G2 for performing the thermocompression bonding does not include the elastic heating / pressurizing means S, the guide holes w, and the guide pins gp of the first heating / pressurizing means G1. It has pressure machines U1, U2, a heating / pressurizing machine T14 equipped with a heater H14, and a base T15 equipped with a heater H15 (FIG. 4C).

  In the present embodiment, two printed wiring boards Z2 are connected in series, and a shield sheet d11 having an anisotropic conductive resin is bonded to the flexible part F11 and the rigid parts R11 and R13. The shield sheet d11 is provided with a transfer film, and the shield sheet d10 can peel off the transfer film fs11 (temporary protection sheet) for protecting the shield sheet d11 from foreign matter adhering to the shield sheet d11 in advance in the manufacturing process. The thermosetting adhesive is printed in advance on the temporary attachment surface (adhesion surface) of the laminated sheet 10 and the shield sheet d11 of the flex-rigid wiring board.

  As a manufacturing method of the printed wiring board Z2, first, the laminated sheet 10 is disposed through the guide hole w in accordance with the guide pin gp provided on the base T13, and then the shield sheet d10 with transfer film is disposed on the guide hole w. (Fig. 4 (a)). Then, a pressing jig T12 for uniformly pressing the shield sheet d10 with transfer film by its own weight is disposed, and a heating / pressing jig T11 provided with plungers p11 to p21 is disposed (FIG. 4A). .

  In a state where the laminated sheet 10 is uniformly pressed by the weight of the holding jig T12, the pins p11 to p21 of the plurality of plungers S are brought into contact with the temporary pasting areas K11 to K21 by pressing with the pressurizers U1 and U2. Then, while the pins p11 to p21 are in contact with the temporary bonding areas K11 to K21, which are non-wiring regions, heat from the heater H11 is transmitted to the temporary bonding areas K11 to K21 to heat and pressurize. That is, when the pins p11 to p21 are in contact with only a low step portion of the flexible part F11 formed at a low position (by temporary thermocompression bonding by the elastic heating and pressing means S), the low position is set. Only the flexible portion F11 formed on the thermosetting adhesive in the temporary attachment areas K11 to K21 is thermally cured, and the shield sheet d11 and the laminated sheet 10 of the flex-rigid wiring board are temporarily attached (FIG. 4 ( b)). Here, even in the flexible portion F11 formed at the same low position, there are differences in thickness, flexibility, etc. between the portion where the wiring pattern is formed by the conductive foil and the non-wiring region where the wiring pattern is not formed. Although it occurs, the elastic force of the coil springs q built in the plurality of plungers S works, and these differences are absorbed to perform uniform temporary thermocompression bonding (temporary bonding) as a whole. Even if the plunger S accidentally contacts the rigid parts R11 and R13, if the elastic force of the coil spring q is applied, the difference in rigidity between the flexible part F11 and the rigid parts R11 and R13, the presence or absence of the wiring pattern, etc. Since it is absorbed and uniform temporary thermocompression bonding (temporary bonding) is performed as a whole, workability problems do not occur. When the shield sheet d11 is temporarily pasted, the temporary pasting areas K11 to K21, which are non-wiring areas, have no wiring pattern, and therefore have less thermal diffusibility than the rigid portions R11 and R13, and are temporarily pasted at a lower temperature. The possibility of adverse effects due to high heat on the anisotropic conductive resin is low. In addition, since temporary heat pressure bonding is performed only on the flexible portion F11 formed at a low position by the elastic heating and pressurizing means S, it is difficult to cause a positional shift and accurate temporary bonding can be performed.

  Next, the heating / pressing jig T11 and the holding jig T12 provided with a plurality of plungers (elastic heating and pressing means) S are removed, and the elastic heating and pressing means S, the guide holes w, and the guide pins gp are not provided. As the heating / pressurizing means G2, a heating / pressurizing machine T14 having a flat heating / pressurizing surface and a base T15 are arranged, and the heating machines H1 and H2 are heated while being heated by the heaters H14 and H15 or the heater H14. By heating and pressurizing the insulating film b11 and the shield sheet d11, the insulating substrate a12 (a14) or the insulating substrate a11 (a13) and the shield sheet d11, a thermosetting adhesive other than the temporary pasting areas K11 to K21 Is thermally cured (FIG. 4C). A cushion material cu or a metal plate su may be appropriately inserted between the transfer film fs11 and the heating / pressurizing machine T14, or between the insulating substrate a11 and the heating / pressurizing machine T15. Examples of the cushion material cu include a Teflon (registered trademark) sheet, a silicone rubber sheet, an epoxy sheet, and a polyimide sheet. Examples of the metal plate su include an aluminum plate and a SUS plate. The cushion material cu and the metal plate su Insert in combination as appropriate. For example, as shown in FIG. 5C, the cushioning material cu and the transfer film fs11, the cushioning material cu and the insulating substrate a11 (a13) are in contact with each other, the metal plate su, the cushioning material cu, and the metal plate su are heated. -By arrange | positioning so that pressurization machine T14 (T15) may contact, the combination of the temporarily-attached shield sheet d10 with a transfer film and laminated sheet 10 can be laminated | stacked, and it can heat and press simultaneously. Then, by applying pressure and heat curing for a predetermined time, the laminated sheet 10 in which the shield sheet d10 with transfer film is adhered and bonded together is formed (FIG. 4D). Finally, the temporary pasting areas K11 to K21 are removed with a tool such as a mold or a router, and the transfer film fs11 is peeled off, whereby a printed wiring board Z2 having no wrinkles is manufactured (FIG. 4E).

Example 1
The present invention can also be applied to a method for manufacturing a printed wiring board using a commercially available soldering iron, but a commercially available soldering iron is pressed against the areas K11 to K21 of the printed board Z2 in FIG. I did it. That is, by pressing the tip temperature of about 140 ° C. to 170 ° C. aiming at the areas K11 to K21 and heating the temporary pasting areas K11 to K21 having a width of about 1 mm for about 10 to 30 seconds, The thermosetting adhesive layers in the temporary pasting areas K11 to K21 could be heat cured. Then, the temporary pasting areas K11 to K21 were removed. On the other hand, when using a conventional soldering iron (the tip temperature was often set at about 210 ° C.), temporary attachment at a high temperature is required because the rigid portion was temporarily attached. In addition, since it is difficult to adhere the rigid portion, it takes time to strongly press the soldering iron against the temporary attachment portion, and a dent (poor dent) is generated. These conventional dents, wrinkles, misalignment, and other defects occurred about 10%, but in this example 1, the defect rate due to dents, wrinkles, misalignment, etc. can be suppressed to about 3%. It was. In Example 1 of this time, by removing the temporary pasting areas K11 to K21, no dent defect occurred, and the defect rate could be substantially reduced to 3% or less.

(Example 2)
A flex-rigid wiring board Z2 was manufactured by the manufacturing method and manufacturing apparatus of the second embodiment of the present invention. The flex-rigid wiring board Z2 includes a flexible portion F11 made of a polyimide film b11 having a wiring pattern formed of copper foil, and a glass fiber-containing epoxy substrate (FR4) a11 in which the wiring pattern of the polyimide film b11 is formed of copper foil. Three-dimensional wiring by a rigid part R11 sandwiched by vias and the like sandwiched between a12 and a glass fiber epoxy board (FR4) a13 and a14 in which the polyimide film b11 is formed by a copper foil and sandwiched by vias And a rigid portion R13. As the shield sheet d10 with transfer film, an electromagnetic wave shielding film SF-PC5000 for FPC manufactured by Tatsuta System Electronics Co., Ltd. was bonded over the flexible part F11, the rigid part R11, and the rigid part R13. The number of flex-rigid wiring boards Z2 taken from the laminated sheet 10 was 21.

  The electromagnetic wave shielding film SF-PC5000 is composed of an anisotropic conductive adhesive layer (17 μm), a silver thin film layer (0.1 μm), and an insulating layer (5 μm) in order from the adhesive surface to the flexible part F11 and the rigid parts R11 and R13. A PET transfer film (50 μm) is detachably disposed above the insulating layer (5 μm). In addition, a protective film made of PET (120 μm) is disposed in advance on the adhesive surface of the electromagnetic wave shielding film SF-PC5000 so that the protective film made of PET (120 μm) is peeled off during the bonding operation. To use.

  The heater H11 of the heating / pressurizing jig T11 which is the first heating / pressurizing means G1 is set to about 170 ° C., the pin p of the plunger S is heated to 140 ° C. to 170 ° C., and the width is about 1 mm. The thermosetting adhesive layers of the temporary pasting areas K11 to K21 can be heated and cured by heating the temporary pasting areas K11 to K21 for about 5 to 10 seconds while pressurizing the temporary pasting areas K11 to K21 at 0.1 to 0.3 MPa. did it. And the heater H14 of the heating / pressurizing jig T14 which is the second heating / pressurizing means G2 is set to about 170 ° C., and the entire laminated sheet 10 is heated to 140 ° C. to 170 ° C. The entire thermosetting adhesive layer could be heat cured by heating for about 1 to 3 hours while pressing the entire 10 at 2 to 4 MPa. There was no misalignment, no wrinkles or dents.

  As described above, the present invention is not limited to the embodiment described above. For example, here, the base film b11 is a polyimide film, but there is no problem even if a liquid crystal polymer or the like is used. Moreover, in this Embodiment, although the shield sheet d10 with a transfer film was bonded together on one side, you may bond the shield sheet d10 with a transfer film on both surfaces. Furthermore, conventionally, it is possible to omit the cover lay film c11 for insulating protection of the wiring pattern arranged in the flexible portion F11.

  In the embodiment described above, the shield sheet d11 having an anisotropic conductive resin is used. However, the shield sheet d11 is not limited to an electromagnetic wave shield sheet, and is generally applied to functional resin sheets having a metal conductor including a magnetic sheet. It can be applied. Thus, it goes without saying that the present invention can be modified as appropriate without departing from the spirit of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the printed wiring board of 1st Embodiment to which this invention is applied, (a) is the top view, (b) is the sectional view on the AA line of (a), ( c) is a sectional view taken along line BB in FIG. It is a schematic diagram which shows the lamination sheet with which the printed wiring board of 2nd Embodiment to which this invention was applied was continued. It is a schematic diagram which shows the printed wiring board of the said 2nd Embodiment, (a) is the top view, FIG.3 (b) is sectional drawing of Fig.3 (a). It is a schematic diagram which shows the manufacturing method and manufacturing apparatus of the printed wiring board of the said 2nd Embodiment. It is a schematic diagram which shows the manufacturing apparatus of the other printed wiring board of the said 2nd Embodiment.

Explanation of symbols

Z1, Z2 printed wiring board (flexible rigid board),
b, b1, b11 insulating film,
a, a11,..., a14 insulating substrate,
c, c11 coverlay film,
d, d11 shield sheet,
e1,..., e5 wiring pattern (conductor foil),
F, F11 Flexible part (flexible substrate),
R, R11, R13 Rigid part (rigid substrate),
K, K11,..., K21 Temporary pasting area (non-wiring area),
U1, U2 pressurizer,
T11 heating / pressure jig,
T14 heating / pressurizing machine,
G1 first heating / pressurizing means,
G2, second heating / pressurizing means,
S elastic heating and pressing means (plunger),
q Coil spring

Claims (8)

  A rigid part in which a wiring pattern is formed of a conductive foil on an insulating substrate, a flexible part made of an insulating film, and a shield sheet that is bonded over the rigid part. A printed wiring board provided, wherein the non-wiring area is temporarily thermocompression bonded as a temporary attachment area for attaching a shield sheet, and is removed from the printed wiring board after thermocompression bonding.   In the printed wiring board, the flexible portion and the rigid portion each have a multilayer structure, and the outer surface of the flexible portion is formed at a position lower than the outer surface of the rigid portion, and the flexible portion is removed from the printed wiring board as the temporary pasting area. The printed wiring board according to claim 1, wherein the printed wiring board is formed.   A rigid part in which a wiring pattern is formed of a conductive foil on an insulating substrate, a flexible part made of an insulating film, and a shield sheet that is bonded over the rigid part. A method for producing a printed wiring board, wherein the shield sheet is temporarily thermocompression-bonded by a heating / pressurizing means, and then the thermocompression bonding is performed using the non-wiring area as a temporary attachment area.   In the printed wiring board, the flexible portion and the rigid portion each have a multilayer structure, and the outer surface of the flexible portion is formed at a position lower than the outer surface of the rigid portion. The flexible portion is temporarily heated by heating / pressurizing means. The printed wiring board manufacturing method according to claim 3, wherein the printed wiring board is crimped.   The method for manufacturing a printed wiring board according to claim 3 or 4, wherein the temporary pasting area is removed after the main thermocompression bonding.   A printed wiring board manufacturing apparatus that heat-presses a shield sheet by a heating / pressurizing means on a printed wiring board having a rigid part in which a wiring pattern is formed of a conductive foil on an insulating substrate and a flexible part made of an insulating film. The apparatus for manufacturing a printed wiring board according to claim 1, wherein a plurality of elastic heating and pressing means for heating and pressing the printed wiring board with elasticity is attached to the heating and pressing means.   In the printed wiring board, the flexible portion and the rigid portion each have a multilayer structure, and the outer surface of the flexible portion is formed at a position lower than the outer surface of the rigid portion. The flexible portion is temporarily heated by heating / pressurizing means. The printed wiring board manufacturing apparatus according to claim 6, wherein the printed wiring board is crimped.   The elastic heating and pressurizing means is configured by winding a coil spring around a pin, or is configured by connecting a pin and a coil spring, and is connected to a heating part of the heating / pressurizing means. The manufacturing apparatus of the printed wiring board of Claim 6 or 7.

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