JP6507302B1 - Transmission line, method of manufacturing transmission line, and apparatus for manufacturing transmission line - Google Patents

Abstract

An object of the present invention is to provide a thin transmission line having a structure in which shields are provided over the entire circumference by a configuration in which oppositely disposed copper-clad laminates are joined to each other. A transmission line (20) has a first conductor formed of a transmission line conductor (32) and a ground conductor adjacent to an input end and an output end of the transmission line conductor (32) on a first main surface of a first base material (34). The first main surface and the cover lay 35 of the first base 34, the surface of the base opposite to the first main surface, the side of the second main surface of the first shield 40, and the first main surface of the base And the side of the second main surface of the first shield 40 and the side of the cover lay 35 and the second main surface of the second shield 45 are thermocompression-bonded to each other, and the second conductor 41 and the second The three conductors 46 are ultrasonically bonded to each other, and the second conductor 41 and the third conductor 46 are disposed to surround the transmission line conductor 32. [Selected figure] Figure 6

Description

The present invention relates to a transmission line , a method of manufacturing the transmission line, and an apparatus for manufacturing the transmission line .

  In recent years, the development of high-density mounting technology in electronic devices has been remarkable, and the demand for thin transmission lines using copper clad laminates (CCLs) has been increasing more and more.

  Conventionally, a step of forming signal wiring and ground wiring by insulating and isolating each other on one side area to the central area of one main surface of the insulating layer made of liquid crystal polymer, the above-mentioned ground wiring on the other main surface of the insulating layer Positioning and laminating conductive foils having conductive projections connectable to each other, and pressing the laminate to integrate it, and electrically connecting the conductive projections through the insulator layer to the ground wiring And connecting the non-forming region along the outer side of the forming region of each wire, making the forming region surface and the non-forming region surface of each wire face each other and integrating them, and And a process of forming a conductive foil on the surface into a shield layer, and a method of manufacturing a flat type shielded cable is proposed (Patent Document 1: Patent 3497110).

  In addition, a flexible dielectric body (liquid crystal polymer), a linear signal line provided in the dielectric body, and the dielectric body provided on, and facing the signal line A ground conductor and an auxiliary ground conductor provided on the opposite side of the ground conductor with respect to the signal line in the normal direction of the main surface of the dielectric element, and viewed in plan from the normal direction And a bridge portion which connects the two main portions with the two main portions extending along the signal line and sandwiching the signal line. And a via conductor electrically connecting the auxiliary ground conductor to the ground conductor, and the signal line and the auxiliary ground conductor in the normal direction. And the distance between Serial high-frequency signal transmission line of smaller construction than the distance between the ground conductor has been proposed (Patent Document 2: JP Utility Model Registration No. 3173143).

  Then, ground conductors are disposed on the same plane as the signal conductor on both sides of the signal conductor, and the signal conductor and the ground conductor are covered with an electrically insulating thin film from both the upper and lower directions, and the surfaces provided with the conductive adhesive layer face each other Thus, a cable for signal transmission is proposed in which the outer side of the electrically insulating thin film is covered with a metal shielding layer (Patent Document 3: JP-A-2006-202714).

Patent 3497110 gazette Utility model registration 3173143 gazette JP, 2006-202714, A

  The transmission line is required to have a thin structure corresponding to space saving while maintaining the shielding performance to suppress the external noise. In addition, it is required of the manufacture of a transmission line to manufacture the transmission line or its intermediate in a short production time that can cope with the rapid expansion of demand for portable information terminals and the like.

  Here, the intermediate of the transmission line refers to a semi-finished product of the previous stage to be a transmission line, and in particular, refers to a semi-finished product in a state of shielding all around.

  With respect to the above problem, the transmission line of Patent Document 1 is difficult to reduce in thickness when shielding the entire circumference due to the structure in which the copper-clad laminate is bent. Moreover, since the transmission line of patent document 2 is not provided with the shield by the side, compared with the structure which shields all the circumferences, shielding performance is inferior. And since the transmission line of patent document 2 and patent document 3 thermosetting sets conductive pastes, such as a cream solder and a conductive adhesive, and connects a grand conductor and a shield conductor, the thermosetting time of a conductive paste is set. As a bottleneck, production time (tact time) can not be shorter than heat curing time. Moreover, the same problem occurs when bonding copper-clad laminates with an adhesive.

The present invention has been made in view of the above circumstances, and is a thin transmission line and a transmission line or an intermediate thereof, which has a structure in which opposingly disposed copper-clad laminates are shielded over the entire circumference by a structure of joining mutually. The production time (tact time) can be made shorter than the heat curing time of the conductive paste or the adhesive by manufacturing the production line and joining the copper-clad laminates without using the adhesive or the conductive paste. An object of the present invention is to provide a method of manufacturing a transmission line having a configuration and a manufacturing apparatus of the transmission line .

  In one embodiment, the problems are solved by the solutions disclosed below.

  In the transmission line of the present invention, the first conductor comprising the transmission line conductor and the ground conductor respectively adjacent to the input end and the output end of the transmission line conductor is in the form of a sheet, and the first main substrate is made of thermoplastic resin. A base formed on the surface, a sheet-like coverlay made of thermoplastic resin covering the transmission line conductor, and a second conductor formed on the second main surface of the second base made of thermoplastic resin in the form of a sheet The first main surface and the coverlay in the first base material, and the second shield formed on the third base material made of thermoplastic resin and having the third conductor in the form of a sheet. The surface of the base opposite to the first main surface, the side of the second main surface of the first shield, the surface of the base opposite to the first main surface, and the second main surface of the first shield Side, and the coverlay and the second sea The side of the second main surface of the diode is thermocompression-bonded to each other, and the second conductor and the third conductor are ultrasonically bonded to each other, and the transmission is performed by the second conductor and the third conductor. It is characterized in that it is disposed so as to surround the line conductor.

  According to this configuration, the entire second conductor of the first shield and the third conductor of the second shield, which are disposed opposite to each other with the base and the coverlay interposed therebetween, surround the transmission line conductor in a state of being ultrasonically bonded. It becomes a transmission line of a structure which shields over the circumference. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using the adhesive or the conductive paste, the thin structure can be obtained by at least the thickness of the adhesive or the conductive paste. .

  It is preferable that the cut surface in which both the longitudinal direction of the said 2nd conductor and the said 3rd conductor were cut | disconnected is formed. According to this configuration, the width dimension becomes constant by cutting both sides in the longitudinal direction.

In the method of manufacturing a transmission line according to the present invention, the first conductor comprising the transmission line conductor and the ground conductors respectively adjacent to the input end and the output end of the transmission line conductor is a first sheet of the sheet-like first substrate at a predetermined pitch. A base formed on the main surface, a sheet-like coverlay covering the transmission line conductor, a first shield having the second conductor formed on the second main surface of the sheet-like second base, and a third conductor A first thermocompression bonding step of thermocompression bonding the coverlay to the first main surface using a second shield formed on a sheet-like third base, and a first thermocompression bonding step of the coverlay An unnecessary area removing step of removing an unnecessary area between the transmission line conductor and the transmission line conductor to form a through hole penetrating the first intermediate body for an intermediate body, and the through hole being formed The first intermediate at the base relative to the second intermediate A second thermocompression bonding step of thermocompression bonding the side of the second main surface of the first shield to the surface opposite to the surface, and the exposed surface of the second conductor in a state where the first shield is thermocompression bonded And ultrasonically bonding the exposed surface of the third conductor.
In the apparatus for manufacturing a transmission line according to the present invention, the first conductor comprising the transmission line conductor and the ground conductor respectively adjacent to the input end and the output end of the transmission line conductor is a sheet-like first base material at a predetermined pitch. A base feeder for supplying a base formed on the main surface, a cover lay feeder for supplying a sheet-like coverlay covering the transmission line conductor, and a second main member of a second base material having a sheet-like second conductor A first shield feeder for supplying a first shield formed on the surface, a second shield feeder for supplying a second shield on which a third conductor is formed on a sheet-like third base, and a first main surface A first thermocompression bonding machine for thermocompression bonding the cover lay, and a first intermediate body to which the cover lay is thermocompression bonded, removing an unnecessary region between the transmission line conductor and the transmission line conductor; No need to form a through hole through the first intermediate And heat-press-bonding the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate body in which the through hole is formed. (2) A thermal bonding machine, and a first bonding machine for ultrasonically bonding an exposed surface of the third conductor to the exposed surface of the second conductor in a state in which the first shield is thermocompression bonded. Do.

  According to this configuration, by sending the base, the cover lay, the first shield, and the second shield at a predetermined pitch, the first thermocompression bonding step, the unnecessary area removing step, the second thermocompression bonding step, and the first bonding step are performed. Through this, it is possible to manufacture a thin transmission line or an intermediate thereof having a shield structure over the entire circumference on a consistent manufacturing line. Then, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using the adhesive or the conductive paste, the production time (tact time) of the conductive paste or the adhesive is thermally cured. It can be shorter than time and the required components are also minimized.

  The second thermocompression bonding step thermocompression-bonds the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate, and the cover Preferably, the side of the second main surface of the second shield is thermocompression-bonded to a ray. According to this configuration, the side of the second main surface of the first shield is thermocompression-bonded to the surface of the base opposite to the first main surface with respect to the second intermediate, and at the same time Since the side of the two main surfaces is thermocompression-bonded, generation of wrinkles of the first shield and the second shield can be prevented.

According to the transmission line of the present invention, since the second conductor of the first shield and the third conductor of the second shield are ultrasonically bonded without using the adhesive and the conductive paste, at least the adhesive and the conductive paste are used. The thin structure can be achieved by the thickness. Further, according to the method of manufacturing a transmission line and the manufacturing apparatus of the transmission line of the present invention, it is possible to manufacture a thin transmission line or an intermediate thereof having a structure of shielding all around the circumference on a consistent manufacturing line.

FIG. 1 is a block diagram schematically showing the arrangement of a transmission line manufacturing apparatus according to an embodiment of the present invention. FIG. 2A is a schematic plan view showing the base according to the present embodiment, and FIG. 2B is a schematic plan view showing the first intermediate body in which the cover lay according to the present embodiment is thermocompression-bonded to the base. These are schematic top views which show the 2nd intermediate body in which the through-hole which concerns on this embodiment was formed. FIG. 3A is a schematic plan view showing a fourth intermediate body on which the second shield according to the present embodiment is ultrasonically bonded, and FIG. 3B shows a sixth intermediate body in which the window portion according to the present embodiment is formed. It is a schematic plan view. FIG. 4A is a schematic plan view showing the transmission line according to the present embodiment, and FIG. 4B is a schematic side view showing the transmission line according to the present embodiment. FIG. 5A is a schematic cross-sectional view showing a base according to the present embodiment, and FIG. 5B is a schematic cross-sectional view showing a first intermediate body in which a coverlay according to the present embodiment is thermocompression-bonded to the base. These are schematic sectional drawing which shows the 2nd intermediate body in which the through-hole which concerns on this embodiment was formed. FIG. 6A is a schematic cross-sectional view showing a fourth intermediate body on which the second shield according to the present embodiment is ultrasonically bonded, and FIG. 6B is a schematic cross-sectional view showing a transmission line according to the present embodiment. FIG. 7A is a view schematically showing a first thermocompression bonding machine according to the present embodiment, FIG. 7B is a view schematically showing an unnecessary area removing machine according to the present embodiment, and FIG. 7C is a view showing the present embodiment. It is a figure which shows typically the 2nd thermocompression-bonding machine which concerns. FIG. 8A is a view schematically showing an ultrasonic bonding machine according to the present embodiment, FIG. 8B is a view schematically showing a laser processing machine according to the present embodiment, and FIG. 8C is an inspection according to the present embodiment It is a figure showing typically a machine. FIG. 9 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus according to the embodiment of the present invention. FIG. 10 is a flowchart showing the manufacturing procedure of the transmission line according to the embodiment of the present invention.

First Embodiment
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram schematically showing an example of a transmission line manufacturing apparatus 1 of the present embodiment, where the left side in the figure is the upstream side, and the right side in the figure is the downstream side. The transmission line manufacturing apparatus 1 includes, in order from the upstream side, a first thermocompression bonding machine 2, an unnecessary area removing machine 3, a second thermocompression bonding machine 4, a first bonding machine 5, a second bonding machine 6, a laser processing machine 7, An inspection machine 8, a division take-out machine 9, and a transfer machine 17 are provided, and a controller 10 for controlling them is provided. In all the drawings for describing the embodiments, members having the same function are denoted by the same reference numerals, and repeated description thereof may be omitted.

  A base feeder 11 and a tension adjuster 15, and a cover lay feeder 12 and a tension adjuster 15 are disposed upstream of the first thermocompression bonding machine 2, respectively. On the upstream side of the second thermocompression bonding machine 4, a first shield feeder 13 and a tension adjuster 15, and a second shield feeder 14 and a tension adjuster 15 are disposed. Here, the tension adjuster 15 has a tension roller as an example, and a sheet-like work (base 30, cover lay 35, first intermediate 51, first shield 40, second shield 45) according to the position of the tension roller. Is maintained within a certain range.

  The pitch feeder 16 is disposed upstream of the second thermocompression bonding machine 4, and the pitch feeder 16 is disposed upstream of the inspection machine 8. The pitch feeder 16 has a feed roller as an example, and the feed pitch of the sheet-like work (the first intermediate 52, the sixth intermediate 56) is maintained at a constant value by the feed amount of the feed roller.

  FIG. 7A is a view schematically showing the first thermocompression bonding machine 2. As an example, the first thermocompression bonding machine 2 has a press plate with a built-in heater, and presses and heats the base 30 and the cover lay 35 from above and below by the two press plates arranged opposite to each other. One intermediate 51 is formed.

  FIG. 7B is a view schematically showing the unnecessary area removing device 3. The unnecessary area removing device 3 has a punching blade and a pedestal for receiving the punching blade as an example, and the unnecessary area R1 is removed by punching out the unnecessary area R1 of the first intermediate 51 by the punching blade to remove the first intermediate A through hole U1 penetrating through 51 is formed, and a second intermediate 52 is formed. As a configuration other than the above, the unnecessary area removing machine 3 can apply a laser processing machine that removes the unnecessary area R1 by laser irradiation.

  FIG. 7C is a view schematically showing the second thermocompression bonding machine 4. As an example, the second thermocompression bonding machine 4 has a press plate with a built-in heater, and presses the first shield 40 and the second intermediate 52 from above and below by the two press plates arranged opposite to each other and applies pressure. The first shield 40 is thermocompression-bonded to the base 30 and at the same time the second shield 45 is thermocompression-bonded to the cover lay 35.

  Here, the 1st thermocompression-bonding machine 2 and the 2nd thermocompression-bonding machine 4 can be made into the same apparatus structure. This facilitates maintenance of the device.

  FIG. 8A is a view schematically showing a first bonding machine 5 (first ultrasonic bonding machine) or a second bonding machine 6 (second ultrasonic bonding machine). The first bonding machine 5 includes, as an example, a main body having a built-in vibrator, a head which is attached to the main body and is ultrasonically vibrated by the vibration transmitted from the vibrator, and a receiver for receiving the head Have. In the first bonding machine 5 (first ultrasonic bonding machine), the first shield 40 is thermocompression-bonded to the base 30 by the head portion and the receiving portion disposed opposite to each other, and the second shield 45 is formed on the cover lay 35 The work in the thermocompression-bonded state is sandwiched from above and below in the vertical direction, and the head portion is ultrasonically vibrated to form a fourth intermediate 54 by ultrasonic bonding.

  Alternatively, the first bonding machine 5 (first ultrasonic bonding machine) may be configured such that the second shield is attached to the third intermediate 53 in which the first shield 40 is thermocompression-bonded to the base 30 by the head portion and the receiving portion disposed opposite to each other. The fourth intermediate body 54 is formed by ultrasonically vibrating the head portion while ultrasonically vibrating the head portion while sandwiching and sandwiching a work in a state where the 45 overlaps 45 from above and below.

  Here, the fourth intermediate 54 is a semi-finished product of the previous stage to be the transmission line 20 and refers to a semi-finished product in a state in which the entire periphery is shielded.

  The second bonding machine 6 (second ultrasonic bonding machine) is, for example, a main body having a built-in vibrator and a head (horn) attached to the main body and ultrasonically vibrated by the vibration transmitted from the vibrator. The fourth intermediate 54 is sandwiched by the head portion and the receiving portion, which have the receiving portion for receiving the head portion, and are opposed to each other and sandwiching the fourth intermediate body 54 from above and below, and ultrasonically vibrating the head portion to perform ultrasonic bonding To form the fifth intermediate 55. Here, the first bonding machine 5 and the second bonding machine 6 can have the same device configuration. This facilitates maintenance of the device. Alternatively, there may be a configuration in which ultrasonic vibrating head portions are disposed to face each other to have both the functions of the first bonding machine 5 and the second bonding machine 6.

  FIG. 8B is a view schematically showing the laser processing machine 7. The laser processing machine 7 is configured to remove a predetermined region by laser irradiation to partially expose the third conductor 46 to form a sixth intermediate 56.

  FIG. 8C is a view schematically showing the inspection device 8. The inspection machine 8 inspects whether the transmission line conductor 32 is not broken or the conduction level is within the normal range by bringing a contact pin projecting downward at a predetermined interval into contact with the transmission line conductor 32 to energize it. Configuration. As a configuration other than the above, the inspection device 8 inspects the image of the transmission line conductor 32 with a camera and analyzes the image to inspect whether the transmission line conductor 32 is not broken or whether the conduction level is within the normal range. Or the inspection machine 8 is configured to perform both the electrical characteristic inspection by energizing the transmission line conductor 32 and the appearance characteristic inspection by imaging the transmission line conductor 32 and analyzing the image. May be.

  As shown in FIG. 1, on the downstream side of the inspection machine 8, there is disposed a dividing and extracting machine 9 for extracting the transmission line 20 from the sixth intermediate 56. The dividing and extracting machine 9 has a punching blade and a pedestal for receiving the punching blade as an example, and the punching blade separates the transmission line 20 by punching out the inline-tested sixth intermediate 56 along a predetermined cut line. Then, the transmission line 20 is taken out. As a configuration other than the above, the division and extraction machine 9 has a configuration in which the sixth intermediate 56 subjected to inline inspection is scribed along a predetermined cut line to separate the transmission line 20 and the transmission line 20 is extracted. Alternatively, the dividing and extracting unit 9 may be configured to separate the transmission line 20 by laser irradiation of the sixth intermediate 56 subjected to inline inspection along a predetermined cut line and to extract the transmission line 20. .

  Then, a tray 18 for storing the transmission line 20 is disposed downstream of the dividing and extracting unit 9. The transmission line 20 manufactured in the above-mentioned consistent manufacturing line and subjected to in-line inspection is transported by the transfer machine 17 in a vacuum-adsorbed state, for example, and stored in the tray 18.

  According to the present embodiment, the thin transmission line 20 having a shield structure over the entire circumference can be manufactured consistently in one manufacturing line. Then, since the transmission line 20 is manufactured by performing thermocompression bonding or ultrasonic bonding without using an adhesive or a conductive paste, the production time (tact time) should be shorter than the thermal curing time of the conductive paste or the adhesive. The required components are also minimized.

  As described above, the second thermocompression bonding machine 4 is configured to thermocompression-bond the first shield 40 to the base 30 and to thermocompression-bond the second shield 45. According to this configuration, since the first shield 40 and the second shield 45 are simultaneously thermocompression bonded simultaneously, it is possible to prevent the first shield 40 and the second shield 45 from being wrinkled at the time of thermocompression bonding.

  The above manufacturing apparatus is an example. The manufacturing apparatus 1 of a transmission line is not limited to the said embodiment. As a configuration other than the above, for example, there may be cases where manufacturing equipment, inspection equipment, etc. on the downstream side of the bonding machine 5 are omitted. In this case, the manufacturing of the transmission line in the manufacturing apparatus 1 is completed in the state of the fourth intermediate 54 having a shield structure over the entire circumference. Then, it is stored in a transport container or tray in a reel state, a strip state, an individualized state, etc., and shipped as a fourth intermediate 54, or the fourth intermediate 54 is post-processed in another manufacturing line Or the fourth intermediate 54 is assembled and processed in the assembly line of the electronic device to form the transmission line 20.

  As a configuration other than the above, for example, a solder bonding machine is disposed instead of the second ultrasonic bonding machine 6, and the fourth intermediate 54 is sandwiched from above and below by the head portion and the receiving portion arranged opposite to the solder bonding machine. There is a case in which the fifth intermediate body 55 is formed by solder jointing by sandwiching and supplying and heating solder from the head portion. Alternatively, instead of the second ultrasonic bonding machine 6, an adhesive bonding machine may be disposed, and the fifth intermediate 55 may be formed by bonding using an adhesive or a conductive paste.

  Also, as a configuration other than the above, for example, an etching processing machine is disposed instead of the laser processing machine 7, a predetermined region is removed by etching, and the third conductor 46 is partially exposed to form the sixth intermediate 56 May be.

  Subsequently, another example of the transmission line manufacturing apparatus 1 according to the present invention will be described below.

  FIG. 9 is a configuration diagram schematically showing an arrangement configuration of another example of the transmission line manufacturing apparatus 1 of the above embodiment. In the example of FIG. 9, the first shield feeder 13 and the tension adjuster 15 are disposed upstream of the second thermocompression bonding machine 4. Further, on the upstream side of the first bonding machine 5, a second shield feeder 14 and a tension adjuster 15 are disposed. In the case of this configuration, the first shield 40 is thermocompression-bonded to the base 30 by the second thermocompression bonding machine 4 to form a third intermediate 53. Then, the second shield 45 is ultrasonically welded to the work in a state in which the second shield 45 overlaps the third intermediate 53 by the first bonding machine 5 to form a fourth intermediate 54.

  According to this configuration, for example, when the size and heat capacity of the first shield 40 are larger than the size and heat capacity of the second shield 45, it becomes easy and reliable to thermocompression bond the first shield 40 to the base 30, and Ultrasonic welding of the second shield 45 to the base 30 is easy and reliable.

  The configuration of FIG. 1 or the configuration of FIG. 9 can be selected according to the standards such as the size and material of the transmission line 20 and the sizes and materials of the component parts. It is possible to add or omit equipment and inspection equipment as appropriate.

  Then, the manufacturing method of the transmission line 20 which concerns on this invention, and the transmission line 20 is demonstrated below.

  FIG. 10 is a flowchart showing the manufacturing procedure of the transmission line 20. As shown in FIG. The transmission line 20 is, as an example, a first thermocompression bonding step S1, an unnecessary area removing step S2, a second thermocompression bonding step S3, a first bonding step S4, a second bonding step S5, a laser processing step S6, an inspection step S7, a division step It is manufactured in order of S8.

  The above manufacturing procedure is an example. The manufacturing procedure of the transmission line 20 can perform simultaneously 1st joining step S4 and 2nd joining step S5 as a structure of that excepting the above, and it is possible to skip 2nd joining step S5. In addition to the above, the laser processing step S6 can be omitted, the inspection step S7 can be omitted, and the dividing step S8 can be omitted. Then, the fourth intermediate 54, the fifth intermediate 55, the sixth intermediate 56, or the transmission line 20 are shipped in a plurality in a sheet at a predetermined pitch in the longitudinal direction, and the electronic device of the next step In some cases, the sheet is divided at the assembly line, and the transmission line 20 is taken out and used.

  2A is a schematic plan view showing the base 30, FIG. 2B is a schematic plan view showing the first intermediate 51, and FIG. 2C is a schematic plan view showing the second intermediate 52. As shown in FIG. 3A is a schematic plan view showing the fourth intermediate 54, and FIG. 3B is a schematic plan view showing the sixth intermediate 56. As shown in FIG. 4A is a schematic plan view showing the transmission line 20, and FIG. 4B is a schematic side view showing the transmission line 20. As shown in FIG.

  5A is a schematic cross-sectional view showing the base 30 at the position of the transmission line conductor 32, and similarly, FIG. 5B is a schematic cross-sectional view showing the first intermediate 51, and FIG. 5C is a second intermediate 52 It is a schematic sectional view showing. 6A is a schematic sectional view showing the fourth intermediate 54, and FIG. 6B is a schematic sectional view showing the transmission line 20 at the position of the transmission line conductor 32. As shown in FIG.

  As shown in FIGS. 2A and 5A, the base 30 is made of a copper-clad laminate (CCL), and the first main surface 34a of the sheet-like first base 34 is formed of the first conductor 31 at a predetermined pitch P1 in the longitudinal direction. Is formed. The first conductor 31 is a transmission line conductor 32 formed in a straight line, and a ground conductor formed close to the input end and the output end of the transmission line conductor 32 and formed in a “U-shape” or “U-shape”. And 33. As an example, a connector is joined to the input end and the output end of the ground conductor 33 and the transmission line conductor 32 via a solder or a conductive paste as an example (not shown).

  In the base 30, a plurality of first conductors 31 are arranged at a predetermined pitch in the longitudinal direction on the sheet-like first base material 34, and in the state of FIG. 2A, between the transmission line conductor 32 and the transmission line conductor 32 There is an unnecessary area R1.

  The 1st conductor 31 consists of copper foils as an example. The first base 34 is made of, for example, a thermoplastic resin. The first substrate 34 is made of, for example, a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the sheet-like base 30 is attached to the base supply machine 11 in a reel state and is supplied so as to be able to be continuously processed.

  The first conductor 31 is, for example, a copper foil having a thickness of 5 μm to 25 μm. The first base 34 is, for example, a liquid crystal polymer (LCP) having a thickness of 50 μm to 150 μm. The first conductor 31 is formed by, for example, pattern etching a copper-clad laminate (CCL).

  As an example, as a pretreatment of the first thermocompression bonding step S1, the base 30 irradiates oxygen-containing plasma to the surface (first main surface 34a) on the side to which the first conductor 31 is bonded by a plasma irradiation apparatus. As well as reforming. By irradiating the oxygen-containing plasma, the degree of adhesion is improved at the time of the first thermocompression bonding. In addition to the above, there may be a case where the plasma irradiation apparatus is disposed on the upstream side of the first thermocompression bonding machine 2 and the first main surface 34 a is irradiated with the oxygen-containing plasma (not shown).

  The cover lay 35 is made of, for example, a thermoplastic resin. The coverlay 35 is made of, for example, a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the cover lay 35 is attached to the cover lay feeder 12 in a reel state, and is supplied for continuous processing.

  The cover lay 35 is, for example, a liquid crystal polymer (LCP) having a thickness of 25 μm or more and 125 μm or less.

  The first shield 40 is made of, for example, a copper-clad laminate (CCL), and the second conductor 41 is formed on the second major surface 42 a of the sheet-like second base material 42. The second conductor 41 may be bonded to the entire surface of the second base material 42 or may be bonded in a mesh shape.

  The 2nd conductor 41 consists of copper foils as an example. The second base 42 is made of, for example, a thermoplastic resin. The second base material 42 is made of, for example, a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the first shield 40 is attached to the first shield feeder 13 in a reel state and is supplied to be able to be processed continuously.

  The second conductor 41 is, for example, a copper foil having a thickness of 5 μm or more and 25 μm or less. The second base material 42 is, for example, polyimide (PI) having a thickness of 5 μm to 25 μm. As an example of the first shield 40, a copper-clad laminate (CCL) is used as it is.

  As an example, as a pretreatment of the second thermocompression bonding step S3, the first shield 40 irradiates the oxygen-containing plasma to the surface (second main surface 42a) on the side to which the second conductor 41 is bonded by a plasma irradiation apparatus. Remove the organic matter and reform it. By irradiating the oxygen-containing plasma, the degree of adhesion is improved at the time of the second thermocompression bonding. In addition to the above, there may be a case where the plasma irradiation apparatus is disposed on the upstream side of the second thermocompression bonding machine 4 and the oxygen-containing plasma is irradiated to the second main surface 42a (not shown).

  The second shield 45 is made of, for example, a copper-clad laminate (CCL), and the third conductor 46 is formed on one side of the sheet-like third base 47. The third conductor 46 may be bonded to the entire surface of the third base 47 or may be bonded in a mesh shape.

  The 3rd conductor 46 consists of copper foils as an example. The third base 47 is made of, for example, a thermoplastic resin. The third substrate 47 is made of, for example, a liquid crystal polymer (LCP), a polyimide (PI), a polyamide (PA), or a polyetheretherketone (PEEK). As an example, the second shield 45 is attached to the second shield feeder 14 in a reel state and is supplied to be able to be processed continuously.

  The third conductor 46 is, for example, a copper foil having a thickness of 5 μm or more and 25 μm or less. The third base 47 is, for example, polyimide (PI) having a thickness of 5 μm to 25 μm. For example, a copper clad laminate (CCL) is used as it is as the second shield 45. The second shield 45 is, for example, of the same material configuration as the first shield 40.

  As an example, as a pretreatment of the first bonding step S4, the second shield 45 irradiates oxygen-containing plasma to the surface on the side to which the third conductor 46 is bonded by a plasma irradiation apparatus to remove organic substances, Reform. By irradiating the oxygen-containing plasma, the degree of adhesion in the first bonding step S4 is improved. In addition to the above, a plasma irradiation apparatus may be disposed on the upstream side of the first bonding machine 5 and the oxygen-containing plasma may be irradiated on the surface on which the third conductor 46 is bonded (not shown).

  In the first thermocompression bonding step S1, as shown in FIGS. 2B and 5B, the cover lay 35 is thermocompression-bonded to the first major surface 34a of the first base material 34. As an example, the first base material 34 and the cover lay 35 are the same material, and the heating temperature is lower than the melting point of the first base material 34 and the cover lay 35, and plus or minus 50 around deflection temperature under load or deflection temperature under load. At a heating temperature within [° C.], heating and thermocompression bonding are performed while pressurizing at a predetermined pressure for a predetermined time, and a first intermediate 51 is obtained.

  The first thermocompression bonding step S1 is, as an example, a heating temperature of 180 ° C. or more and 280 ° C. or less, a pressing force of 10 MPa or more and 60 MPa or less, and 5 seconds or more and 240 seconds. Thermocompression bonding is performed for the following heating and pressurizing time. The thermocompression bonding is performed in the air as an example.

  In the unnecessary area removing step S2, as shown in FIGS. 2C and 5C, the first intermediate body 51 is removed by punching out the unnecessary area R1 between the transmission line conductor 32 and the transmission line conductor 32. A through hole U <b> 1 penetrating the first intermediate 51 is formed, and a second intermediate 52 is obtained. The through hole U1 has, for example, a rectangular shape or a rectangular shape with rounded corners.

  The second thermocompression bonding step S3 is, as shown in FIG. 3A and FIG. 6A, on the surface of the base 30 opposite to the first main surface 34a with respect to the second intermediate 52, the second main component of the first shield 40. The side of the surface 42a is thermocompression-bonded, and at the same time, the second shield 46 is thermocompression-bonded to the first major surface 34a of the base 30. As an example, the heating temperature is equal to or lower than the melting point of the first base material 34 by using the first base material 34 and the second base material 42 as different materials and using the second base material 42 and the third base material 47 as the same material. And, while heating under pressure at a predetermined pressure for a predetermined time at a heating temperature within plus or minus 50 [° C.] centering on the deflection temperature under load of the first base material 34 or the deflection temperature under load of the first base member 34, thermocompression bonding Do.

  Alternatively, in the second thermocompression bonding step S3, the side of the second main surface 42a of the first shield 40 is thermocompression bonded to the surface of the base 30 opposite to the first main surface 34a with respect to the second intermediate 52. As an example, the first base material 34 and the second base material 42 are different materials, and the heating temperature is lower than the melting point of the first base material 34, and the load deflection temperature of the first base material 34 or the first base material 34 Heat compression bonding at a heating temperature within plus or minus 50 [° C.] with the deflection temperature under load as the center, while pressurizing under a predetermined pressure for a predetermined time.

  The second thermocompression bonding step S3 is, as an example, a heating temperature of 180 ° C. or more and 280 ° C. or less, a pressing force of 10 MPa or more and 60 MPa or less, and 5 seconds or more and 240 seconds. Thermocompression bonding is performed for the following heating and pressurizing time. The thermocompression bonding is performed in the air as an example.

  Following the second thermocompression bonding step S3, in the first bonding step S4, the exposed surface of the third conductor 46 is ultrasonically bonded to the exposed surface of the second conductor 41. As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the pressure is 15 [kHz] or more and 200 or less while the pressure of the horn is 500 [N] or more and 2500 [N] or less. Ultrasonic bonding is performed by applying ultrasonic vibration of [kHz] or less, and a fourth intermediate 54 is obtained.

  As mentioned above, the fourth intermediate 54 manufactured on the consistent manufacturing line is shipped as the fourth intermediate 54 of the shielding structure all around, or the fourth intermediate 54 is another manufacturing line. , Or the fourth intermediate 54 is assembled and processed in the assembly line of the electronic device to form the transmission line 20.

  In the example of FIG. 10, a second bonding step S5 is performed subsequently to the first bonding step S4. In the second bonding step S <b> 5, the end of the third conductor 46 is ultrasonically bonded to the end of the ground conductor 33 with respect to the fourth intermediate body 54. Here, the end of the ground conductor 33 is each end on the transmission line conductor 32 side. Also, the ends of the third conductor 46 are both ends. As an example, the second conductor 41 and the third conductor 46 are made of the same material, and the pressure is 15 [kHz] or more and 200 or less while the pressure of the horn is 500 [N] or more and 2500 [N] or less. Ultrasonic bonding is performed by applying ultrasonic vibration of [kHz] or less, and a fifth intermediate 55 is obtained.

  In the example of FIG. 10, the laser processing step S6 is performed subsequently to the second bonding step S5. In the laser processing step S6, as shown in FIGS. 3B and 6B, a portion of the third conductor 46 opposite to the surface to be bonded to the ground conductor 33 with respect to the fifth intermediate 55 is partially irradiated by laser irradiation. The window portion V1 is formed by exposure to form a sixth intermediate 56. The window portion V1 is, for example, in a square shape or a rounded square shape, and a plurality of window portions V1 are formed at predetermined intervals. The laser irradiation is performed at a predetermined output for a predetermined time. Laser irradiation can apply a known installation and a known construction method. The laser processing step S6 may be omitted.

  In the example of FIG. 10, an inspection step S7 is performed subsequent to the laser processing step S6. In the inspection step S7, the transmission line conductor 32 is not broken by bringing the contact pin of the inspection machine 8 into contact with the transmission line conductor 32 and energizing the sixth intermediate 56, and the conduction level is within the normal range. Check that it is. Conduction inspection can apply a known installation and a known construction method. The inspection step S7 may not be performed here but may be performed on another manufacturing line.

  In the example of FIG. 10, the division step S8 is performed following the inspection step S7. In the dividing step S8, the punching blade of the dividing and extracting machine 9 separates out the transmission line 20 by punching out the inline-tested sixth intermediate 56 along a predetermined cut line. For the division and removal, known equipment and known construction methods can be applied. The division step S8 may not be performed here, but may be performed on another production line.

  Then, as described above, the transmission line 20 manufactured in a consistent manufacturing line and subjected to in-line inspection is transported by the transfer machine 17 in a vacuum-adsorbed state, for example, and stored in the tray 18.

  According to the present embodiment, by sending the base 30, the cover lay 35, the first shield 40, and the second shield 45 at the predetermined pitch P1, the first thermocompression bonding step S1, the unnecessary area removing step S2, the second thermocompression bonding Through the step S3 and the first bonding step S4, it is possible to manufacture the thin transmission line 20 having a structure which shields the entire circumference with a consistent line. Then, since the second conductor of the first shield 40 and the third conductor of the second shield are ultrasonically bonded without using the adhesive or the conductive paste, the production time (tact time) of the conductive paste or the adhesive is reduced. It can be shorter than the curing time and the required components are also minimized.

  Further, according to this configuration, in a state where the second conductor 41 and the third conductor 46 are ultrasonically bonded, the respective ground conductors 33 disposed close to the input end and the output end of the transmission line conductor 32 can be simultaneously It can be ultrasonically bonded to the conductor 46. Further, since the first shield 40 and the second shield 45 are an integral structure, it is possible to prevent the generation of wrinkles and stress distortion when simultaneously bonding the ground conductors 33 to the third conductor 46 simultaneously. Then, according to this configuration, since the third conductor 46 is an integral structure with the second shield 45, a part of the surface of the third conductor 46 opposite to the joint surface with the ground conductor 33 is laser-processed. It is possible to easily form the windows V1 to be exposed at predetermined intervals.

  By the manufacturing apparatus 1 of the transmission line and the manufacturing method of the transmission line of the embodiment described above, the transmission line 20 having a thin structure corresponding to the space saving is manufactured while maintaining the shielding performance to suppress the external noise.

  In the transmission line 20 of the present embodiment, a first base 31 formed of a thermoplastic resin is formed of a sheet-like first conductor 31 formed of the transmission line conductor 32 and the ground conductors 33 respectively approaching the input end and the output end of the transmission line conductor 32. The base 30 formed on the first main surface 34a of the material 34, the sheet-like coverlay 35 made of a thermoplastic resin covering the transmission line conductor 32, and the second conductor 41 made of a thermoplastic resin in the form of a sheet A first shield 40 formed on the second main surface 42a of the base material 42, and a second shield 45 formed on the third base material 47 of the third conductor 46 in the form of a sheet and made of a thermoplastic resin; The first main surface 34a and the cover lay 35 in the first base 34, the surface of the base 30 opposite to the first main surface 34a, and the second main surface 42a of the first shield 40, and the first main surface 34a in the base 30 Opposite of And the side of the second main surface 42a of the first shield 40, and the side of the cover lay 35 and the second main surface 42a of the second shield 45 are thermocompression-bonded to each other, and the second conductor 41 and the second conductor The three conductors 46 are ultrasonically bonded to each other, and the second conductor 41 and the third conductor 46 are disposed to surround the transmission line conductor 32.

  As shown in FIGS. 4A, 4B and 6B, according to the present embodiment, the second conductor 41 of the first shield 40 and the third conductor 45 of the first shield 40 disposed opposite to each other with the base 30 and the cover lay 35 interposed therebetween. The transmission line 20 is structured to be shielded over the entire circumference so as to surround the transmission line conductor 32 in a state of being ultrasonically bonded to the conductor 46. Then, since the second conductor 41 of the first shield 40 and the third conductor 46 of the second shield 45 are ultrasonically bonded without using the adhesive or the conductive paste, at least the thickness of the adhesive or the conductive paste It can be made thin.

  The end of the ground conductor 33 and the end of the third conductor 46 are ultrasonically bonded to each other. According to this configuration, external noise can be prevented by the shield effect on the input end and the output end of the transmission line conductor 32.

  In addition, a plurality of windows V1 are formed in the third base 47 at a predetermined interval, and a part of the third conductor 46 is exposed so as to be externally connectable by the windows V1. According to this configuration, as an example, it is easy to externally connect a part of the third conductor 46 exposed by the window V1 to the casing of the portable information terminal and the ground wiring to enhance the shielding performance. .

  As shown to FIG. 6B, the cut surface in which both the longitudinal direction of the 2nd conductor 41 and the 3rd conductor 46 were cut | disconnected is formed. According to this configuration, the width dimension becomes constant by cutting both sides in the longitudinal direction.

  As mentioned above, this invention is not limited to embodiment mentioned above. In the above-described example, the sheet-like base 30 is supplied in a reel state, but the invention is not limited thereto. Sheet-like sheets of a predetermined size are stacked in a magazine and supplied from the magazine to the manufacturing line It is also possible. Similarly, the cover lay 35, the first shield 40, and the second shield 45 can also be stacked in a magazine of a predetermined size and fed from the magazine to the manufacturing line by a feeding roller or the like.

1 Transmission Line Manufacturing Device 2 First Thermal Crimping Machine 3 Unwanted Region Removal Machine 4 Second Thermal Crimping Machine 5 Bonding Machine (First Ultrasonic Bonding Machine)
6 Bonding machine (2nd ultrasonic bonding machine)
DESCRIPTION OF SYMBOLS 7 Laser processing machine 8 Inspection machine 9 Division taking-out machine 10 Controller 11 Base supply machine 12 Cover lay supply machine 13 1st shield supply machine 14 2nd shield supply machine 15 Tension adjustment machine 16 Pitch feeder 17 Transfer machine 18 Tray 20 Transmission Line 30 base 31 first conductor 32 transmission line conductor 33 ground conductor 34 first base 34 a first main surface 35 cover lay 40 first shield 41 second conductor 42 second base 42 a second main surface 45 second shield 46 Third conductor 47 third base 51 first intermediate 52 second intermediate 53 third intermediate 54 fourth intermediate 55 fifth intermediate 56 sixth intermediate P1 pitch R1 unnecessary region U1 through hole V1 window

Claims (12)

A base formed on a first main surface of a first base material made of a thermoplastic resin and having a sheet-like first conductor comprising a transmission line conductor and a ground conductor respectively approaching the input end and the output end of the transmission line conductor; A sheet-like coverlay made of a thermoplastic resin covering the transmission line conductor, a first shield formed on a second main surface of a second base made of a thermoplastic resin, and a second conductor made of a thermoplastic resin; And 3) a second shield formed on a third base material made of a thermoplastic resin in the form of a sheet of three conductors,
The first main surface and the cover lay in the first base material, the surface of the base opposite to the first main surface, and the second main surface of the first shield, the first main in the base The surface opposite to the surface, the side of the second main surface of the first shield, and the side of the coverlay and the second main surface of the second shield are thermocompression-bonded to each other,
A transmission line, wherein the second conductor and the third conductor are ultrasonically bonded to each other, and the second conductor and the third conductor are disposed so as to surround the transmission line conductor. The transmission line according to claim 1, wherein both of the second conductor and the third conductor in the longitudinal direction are formed with cut surfaces cut. The transmission line according to claim 1 or 2, wherein an end of the ground conductor and an end of the third conductor are ultrasonically bonded to each other. 4. The window according to claim 1, wherein a plurality of windows are formed at predetermined intervals in the third base material, and a part of the third conductor is exposed for external connection by the windows. The transmission line according to any one of the preceding claims. A base on which a first conductor composed of a transmission line conductor and a ground conductor respectively approaching the input end and the output end of the transmission line conductor is formed on a first main surface of a sheet-like first base material at a predetermined pitch; A sheet-like coverlay covering the transmission line conductor, a first shield having the second conductor formed on the second main surface of the sheet-like second base, and a third conductor formed on the sheet-like third base Using the second shield
A first thermocompression bonding step of thermocompression bonding the cover layer to the first main surface;
The unnecessary area between the transmission line conductor and the transmission line conductor is removed from the first intermediate body on which the cover lay is thermocompression-bonded to form a through hole penetrating the first intermediate body. Step and
A second thermocompression bonding step of thermocompression bonding the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate body in which the through hole is formed; ,
And a first bonding step of ultrasonically bonding the exposed surface of the third conductor to the exposed surface of the second conductor in a state in which the first shield is thermocompression-bonded. . The second thermocompression bonding step thermocompression-bonds the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate, and the cover 6. The method of manufacturing a transmission line according to claim 5, wherein the side of the second main surface of the second shield is thermocompression-bonded to a ray. In the state where the second conductor and the third conductor are ultrasonically bonded, there is provided a second bonding step of ultrasonically bonding the end of the third conductor to the end of the ground conductor. 7. A method of manufacturing a transmission line according to item 5 or 6. 8. The transmission line according to claim 7, further comprising a laser processing step of exposing a part of the third conductor by laser irradiation in a state where the ground conductor and the third conductor are ultrasonically bonded. Production method. A first conductor composed of a transmission line conductor and a ground conductor respectively approaching the input end and the output end of the transmission line conductor supplies a base formed on a first main surface of a sheet-like first base material at a predetermined pitch. A base feeder, a cover lay feeder for supplying a sheet-like coverlay covering the transmission line conductor, and a first shield having a second conductor formed on a second main surface of a sheet-like second base material A second shield feeder for feeding a second shield in which a third conductor is formed on a sheet-like third base material;
A first thermocompression bonding machine for thermocompression-bonding the cover layer to the first main surface;
The unnecessary area between the transmission line conductor and the transmission line conductor is removed from the first intermediate body on which the cover lay is thermocompression-bonded to form a through hole penetrating the first intermediate body. Machine,
A second thermocompression bonding machine for thermocompression bonding the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate body in which the through hole is formed; ,
And a first bonding machine for ultrasonically bonding the exposed surface of the third conductor to the exposed surface of the second conductor in a state where the first shield is thermocompression-bonded.
A transmission line manufacturing apparatus characterized by The second thermocompression bonding machine thermocompression-bonds the side of the second main surface of the first shield to the surface of the base opposite to the first main surface with respect to the second intermediate, and the cover The side of the second main surface of the second shield is thermocompression-bonded to a ray
The manufacturing apparatus of the transmission line of Claim 9 characterized by these. A second bonding machine for ultrasonically bonding an end portion of the third conductor to an end portion of the ground conductor in a state in which the second conductor and the third conductor are ultrasonically bonded to each other.
The manufacturing apparatus of the transmission line of Claim 9 or 10 characterized by these. A laser processing machine is provided which exposes a part of the third conductor by laser irradiation in a state in which the ground conductor and the third conductor are ultrasonically bonded.
The manufacturing apparatus of the transmission line of Claim 11 characterized by these.